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INTEGRATED CIRCUITS
DATA SHEET
TDF8771A Triple 8-bit video Digital-to-Analog Converter (DAC)
Product specification 2003 Apr 29
Philips Semiconductors
Product specification
Triple 8-bit video Digital-to-Analog Converter (DAC)
FEATURES * 8-bit resolution * Sampling rate up to 35 MHz * Internal reference voltage regulator * No deglitching circuit required * Large output voltage range * 1 k output load * Power dissipation only 200 mW * Single 5 V power supply * 44-pin QFP package * Operating ambient temperature from -40 to +85 C. APPLICATIONS * General purpose high-speed digital-to-analog conversion * Digital TV * Graphic display * Desktop video processing. QUICK REFERENCE DATA SYMBOL VDDA VDDD IDDA IDDD Tamb INL DNL fclk(max) Ptot Note PARAMETER analog supply voltage digital supply voltage analog supply current digital supply current operating ambient temperature integral non-linearity differential non-linearity maximum clock frequency total power dissipation RL = 1 k; fclk = 35 MHz; note 1 fclk = 35 MHz; ramp input fclk = 35 MHz; ramp input RL = 1 k; note 1 fclk = 35 MHz CONDITIONS MIN. 4.5 4.5 10 - -40 - - 35 45 GENERAL DESCRIPTION
TDF8771A
The TDF8771A is a triple 8-bit video Digital-to-Analog Converter (DAC). It converts the digital input signals into analog voltage outputs at a maximum conversion rate of 35 MHz. The DACs are based on resistor-string architecture with integrated output buffers. The output voltage range is determined by a built-in reference source. The device is fabricated in a 5 V, CMOS process that ensures high functionality with low power dissipation.
TYP. 5.0 5.0 30 3 - 0.3 0.15 - 200
MAX. 5.5 5.5 45 10 +85 1 0.5 - 360
UNIT V V mA mA C LSB LSB MHz mW
1. Minimum and maximum data of current and power consumption are measured in worse case conditions: for minimum data, all digital inputs are at logic level 0 while for maximum data, all digital inputs are at logic level 1. ORDERING INFORMATION TYPE NUMBER TDF8771AH PACKAGE NAME QFP44 DESCRIPTION plastic quad flat package; 44 leads (lead length 1.3 mm); body 10 x 10 x 1.75 mm VERSION SOT307-2
2003 Apr 29
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Philips Semiconductors
Product specification
Triple 8-bit video Digital-to-Analog Converter (DAC)
BLOCK DIAGRAM
handbook, full pagewidth
TDF8771A
VDDA 32, 35, 39, 43 4 12 to 9
VDDD 7, 27 4
clock input 31 1 reference current input (IREF)
RED digital inputs (bits R0 to R3)
TDF8771A
LSB DECODER
RED digital inputs (bits R4 to R7)
4
8 5 to 3
4
MSB DECODER
RESISTOR STRING
44
RED analog output
GREEN digital inputs (bits G0 to G3)
4
20 to 17 4
LSB DECODER
GREEN digital inputs (bits G4 to G7)
4
16 to 13
4
MSB DECODER
RESISTOR STRING
40
GREEN analog output
BLUE digital inputs (bits B0 to B3)
4
30, 29 26, 25 4
LSB DECODER
BLUE digital inputs (bits B4 to B7)
4
24 to 21
4
MSB DECODER
RESISTOR STRING
36
BLUE analog output
BANDGAP REFERENCE 34, 37, 38, 41 not connected 33 2, 42 6, 28
MGX351
reference voltage decoupling input (VREF)
VSSA
VSSD
Fig.1 Block diagram.
2003 Apr 29
3
Philips Semiconductors
Product specification
Triple 8-bit video Digital-to-Analog Converter (DAC)
PINNING SYMBOL IREF VSSA1 R7 R6 R5 VSSD1 VDDD1 R4 R3 R2 R1 R0 G7 G6 G5 G4 G3 G2 G1 G0 B7 B6 B5 B4 B3 B2 VDDD2 VSSD2 B1 B0 CLK VDDA1 VREF n.c. VDDA2 OUTB n.c. n.c. VDDA3 OUTG 2003 Apr 29 PIN 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 36 37 38 39 40 analog supply ground 1 RED digital input data; bit 7 (MSB) RED digital input data; bit 6 RED digital input data; bit 5 digital supply ground 1 digital supply voltage 1 RED digital input data; bit 4 RED digital input data; bit 3 RED digital input data; bit 2 RED digital input data; bit 1 RED digital input data; bit 0 (LSB) GREEN digital input data; bit 7 (MSB) GREEN digital input data; bit 6 GREEN digital input data; bit 5 GREEN digital input data; bit 4 GREEN digital input data; bit 3 GREEN digital input data; bit 2 GREEN digital input data; bit 1 GREEN digital input data; bit 0 (LSB) BLUE digital input data; bit 7 (MSB) BLUE digital input data; bit 6 BLUE digital input data; bit 5 BLUE digital input data; bit 4 BLUE digital input data; bit 3 BLUE digital input data; bit 2 digital supply voltage 2 digital supply ground 2 BLUE digital input data; bit 1 BLUE digital input data; bit 0 (LSB) clock input analog supply voltage 1 decoupling input for reference voltage not connected analog supply voltage 2 BLUE analog output not connected not connected analog supply voltage 3 GREEN analog output 4 DESCRIPTION reference current input for output buffers
TDF8771A
Philips Semiconductors
Product specification
Triple 8-bit video Digital-to-Analog Converter (DAC)
SYMBOL n.c. VSSA2 VDDA4 OUTR PIN 41 42 43 44 not connected analog supply ground 2 analog supply voltage 4 RED analog output DESCRIPTION
TDF8771A
43 VDDA4
39 VDDA3
40 OUTG
44 OUTR
36 OUTB
handbook, full pagewidth
35 VDDA2
42 VSSA2
41 n.c.
38 n.c.
37 n.c.
IREF VSSA1 R7 R6 R5 VSSD1 VDDD1 R4 R3
1 2 3 4 5 6 7 8 9
34 n.c.
33 VREF 32 VDDA1 31 CLK 30 B0 29 B1
TDF8771A
28 VSSD2 27 VDDD2 26 B2 25 B3 24 B4 23 B5
R2 10 R1 11
G0 20
B7 21
R0 12
G7 13
G6 14
G5 15
G4 16
G3 17
G2 18
G1 19
B6 22
MGX352
Fig.2 Pin configuration.
2003 Apr 29
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Philips Semiconductors
Product specification
Triple 8-bit video Digital-to-Analog Converter (DAC)
LIMITING VALUES In accordance with the Absolute Maximum Rating System (IEC 60134). SYMBOL VDDA VDDD VDD Tstg Tamb Tj analog supply voltage digital supply voltage supply voltage difference between VDDA and VDDD storage temperature operating ambient temperature junction temperature PARAMETER MIN. -0.5 -0.5 -1.0 -55 -40 -
TDF8771A
MAX. +6.5 +6.5 +1.0 +150 +85 125
UNIT V V V C C C
THERMAL CHARACTERISTICS SYMBOL Rth(j-a) HANDLING Inputs and outputs are protected against electrostatic discharges in normal handling. However, to be totally safe, it is desirable to take normal precautions appropriate to handling integrated circuits. PARAMETER thermal resistance from junction to ambient in free air VALUE 75 UNIT K/W
2003 Apr 29
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Philips Semiconductors
Product specification
Triple 8-bit video Digital-to-Analog Converter (DAC)
TDF8771A
CHARACTERISTICS VDDA = VDDD = 4.5 to 5.5 V; VSSA and VSSD shorted together; VDDA - VDDD = -0.5 to +0.5 V; Tamb = -40 to +85 C; typical values measured at VDDA = VDDD = 5 V and Tamb = 25 C; unless otherwise specified. SYMBOL Supplies VDDA VDDD IDDA IDDD Inputs CLOCK INPUT (PIN 31) VIL VIH VIL VIH II fclk(max) tCPH tCPL tr tf tSU;DAT tHD;DAT LOW level input voltage HIGH level input voltage 0 2.0 - - - - 0.6 - - - - - - - 1.2 VDDD 1.2 VDDD 0.7 - - - 6 6 - - V V analog supply voltage digital supply voltage analog supply current digital supply current RL = 1 k; note 1 fclk = 35 MHz 4.5 4.5 10 - 5.0 5.0 30 3 5.5 5.5 45 10 V V mA mA PARAMETER CONDITIONS MIN. TYP. MAX. UNIT
R, G, B DIGITAL INPUTS (PINS 12 TO 8, 5 TO 3, 20 TO 13, 30, 29 AND 26 TO 21) LOW level input voltage HIGH level input voltage 0 2.0 - 35 9 9 - - 4 4 V V
REFERENCE CURRENT INPUT FOR OUTPUT BUFFERS (PIN 1) input current mA
Timing; see Fig.3 maximum clock frequency clock pulse width HIGH clock pulse width LOW clock rise time clock fall time input data set-up time input data hold time MHz ns ns ns ns ns ns
Voltage reference (pin 33, referenced to VSSA) VVREF Outputs OUTB, OUTG, OUTR ANALOG OUTPUTS (PINS 36, 40 AND 44, REFERENCED TO VSSA) FOR 1 k LOAD; see Table 1 FSR Vos VO(max) VO(min) THD ZL full-scale output voltage range offset of analog voltage output maximum output voltage minimum output voltage total harmonic distortion output load impedance data inputs = logic 1; note 2 data inputs = logic 0; note 2 fi = 4.43 MHz; fclk = 35 MHz 2.80 - 2.95 0.05 - 0.9 3.00 0.33 3.30 0.25 -47 1.0 3.18 - 3.52 0.45 - 1.1 V V V V dB k reference voltage 1.180 1.238 1.305 V
2003 Apr 29
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Philips Semiconductors
Product specification
Triple 8-bit video Digital-to-Analog Converter (DAC)
SYMBOL PARAMETER CONDITIONS MIN. - - -50 - full-scale change 10% to 90% of full-scale change to 1 LSB - - - - TYP. 0.3 0.15 - 1.0
TDF8771A
MAX. 1 0.5 - 2.8 - - - -
UNIT
Transfer function (fclk = 35 MHz) INL DNL ct MDAC td ts1 ts2 Vg Notes 1. Minimum and maximum data of current and power consumption are measured in worse case conditions: for minimum data, all digital inputs are at logic level 0 while for maximum data, all digital inputs are at logic level 1. 2. VO is directly proportional to VVREF. Table 1 Input coding and DAC output voltages (typical values) CODE 0 1 to 128 to 254 255 DAC OUTPUT VOLTAGES (V) OUTB, OUTR, OUTG RL = 1 k 0.262 0.273 to 1.731 to 3.188 3.200 integral non-linearity differential non-linearity crosstalk DAC to DAC DAC to DAC matching ramp input ramp input LSB LSB dB %
Switching characteristics (for 1 k output load); see Fig.4 input to 50% output delay time settling time settling time 12 15 50 ns ns ns
Output transients (glitches) area for 1 LSB change 1 LSBns
BINARY INPUT DATA (SYNC = BLANK = 0) 0000 0000 0000 0001 to 1000 0000 to 1111 1110 1111 1111
2003 Apr 29
8
Philips Semiconductors
Product specification
Triple 8-bit video Digital-to-Analog Converter (DAC)
TIMING
TDF8771A
handbook, full pagewidth
data input
,,,,, ,,,,,
t CPL
t SU; DAT
t HD; DAT
stable
,,,,, ,,,,,
MBB656 - 1
V IH 50 % V IL
clock input
50 % V IL t CPH
Fig.3 Input timing.
handbook, full pagewidth
clock input
50 % code 1023 code 0
input code (example of a full-scale input data transition)
714 mV (code 1023)
1 LSB 10 %
td
50 %
Vo
90 % 54 mV (code 0) t s1 t s2 1 LSB
MDB320
Fig.4 Switching timing.
2003 Apr 29
9
Philips Semiconductors
Product specification
Triple 8-bit video Digital-to-Analog Converter (DAC)
INTERNAL CIRCUITRY
TDF8771A
1/1 page = 296 mm (Datasheet)
V DDD V DDA
27 mm
GND
DACs resistor string V SSA
V SSD
(a)
(b)
V DDA
V DDA
V DDA V DD
V DD
V DD
V DD
125 (typ.) GND
V SSA
MBB658 - 1
(c)
(d)
(a) Digital inputs; pins 3 to 5, 8 to 26 and 29 to 31. (b) Pin VREF (pin 33). (c) Pin IREF (pin 1). (d) Pins OUTB, OUTG and OUTR (pins 36, 40 and 44).
Fig.5 Internal circuitry.
2003 Apr 29
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Philips Semiconductors
Product specification
Triple 8-bit video Digital-to-Analog Converter (DAC)
APPLICATION INFORMATION
TDF8771A
handbook, full pagewidth
5V VSSA OUTR 1 k 10 nF VSSA VDDA4 VSSA2 n.c. VSSA OUTG
5V VSSA 10 nF VSSA VDDA3 n.c. 40 39 38 n.c. 37 36 OUTB
5V
1 k
1 k
10 nF VSSA VDDA2 n.c.
VSSA 6.8 k
44 IREF 1
43
42
41
35
34 33 VREF
100 nF VSSA
VSSA1
2
32
VDDA1
5V 10 nF VSSA
R7
3
31
CLK
R6
4
30
B0
R5
5
29
B1
VSSD1 VDDD1 10 nF VSSD R4
6
TDF8771A
28
VSSD2 VDDD2
5V
7
27
5V 10 nF B2 VSSD
8
26
R3
9
25
B3
R2
10
24
B4
R1
11 12 13 14 15 16 17 18 19 20 21 22
23
B5
MGX353
R0
G7
G6
G5
G4
G3
G2
G1
G0
B7
B6
Analog and digital supplies should be separated and decoupled. Supplies are not connected internally. All ground pins must be connected. One ground plane is preferred although it depends on application. See Figs 7 and 9 for example of anti-aliasing filter.
Fig.6 Application diagram.
2003 Apr 29
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Philips Semiconductors
Product specification
Triple 8-bit video Digital-to-Analog Converter (DAC)
TDF8771A
handbook, full pagewidth
TDF8771A
125 OUTR (pin 44) and OUTG (pin 40) and OUTB (pin 36) 180
12 H 18 pF
12 H 18 pF
analog video output (R,G or B) 56 pF 820 2.4 V (p-p)
56 pF
150 pF
analog ground
MGX354
Fig.7 Example of anti-aliasing filter for 2.4 V output swing.
Characteristics of Fig.8
0 1/2 page (Datasheet) (dB) 40
MSA693
* Order 5; adapted CHEBYSHEV
22 mm
* Ripple 0.7 dB * f at -3 dB = 6.2 MHz * fNOTCH = 10.8 MHz.
80
120
160
0
10
20
30
f (MHz)
40
Fig.8 Frequency response for filter shown in Fig.7.
2003 Apr 29
12
Philips Semiconductors
Product specification
Triple 8-bit video Digital-to-Analog Converter (DAC)
TDF8771A
handbook, full pagewidth
TDF8771A
125 OUTR (pin 44) and OUTG (pin 40) and OUTB (pin 36) 500
27 H 6.8 pF
27 H 6.8 pF
analog video output (R,G or B) 27 pF 500 1.5 V (p-p)
27 pF
68 pF
analog ground
MGX355
Fig.9 Example of anti-aliasing filter for 1.5 V output swing.
Characteristics of Fig.10
0 1/2 page (Datasheet) (dB) 40
MSA694
* Order 5; adapted CHEBYSHEV
22 mm
* Ripple 0.25 dB * f at -3 dB = 5.6 MHz * fNOTCH = 11.7 MHz.
80
120
160
0
10
20
30 f i (MHz)
40
Fig.10 Frequency response for filter shown in Fig.9.
2003 Apr 29
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Philips Semiconductors
Product specification
Triple 8-bit video Digital-to-Analog Converter (DAC)
PACKAGE OUTLINE QFP44: plastic quad flat package; 44 leads (lead length 1.3 mm); body 10 x 10 x 1.75 mm
TDF8771A
SOT307-2
c
y X
A 33 34 23 22 ZE
e E HE wM bp pin 1 index 44 1 bp D HD wM 11 ZD B vM B vM A 12 detail X A A2 (A 3) Lp L
A1
e
0
2.5 scale
5 mm
DIMENSIONS (mm are the original dimensions) UNIT mm A max. 2.1 A1 0.25 0.05 A2 1.85 1.65 A3 0.25 bp 0.4 0.2 c 0.25 0.14 D (1) 10.1 9.9 E (1) 10.1 9.9 e 0.8 HD 12.9 12.3 HE 12.9 12.3 L 1.3 Lp 0.95 0.55 v 0.15 w 0.15 y 0.1 Z D (1) Z E (1) 1.2 0.8 1.2 0.8 10 0o
o
Note 1. Plastic or metal protrusions of 0.25 mm maximum per side are not included. OUTLINE VERSION SOT307-2 REFERENCES IEC JEDEC JEITA EUROPEAN PROJECTION
ISSUE DATE 97-08-01 03-02-25
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Philips Semiconductors
Product specification
Triple 8-bit video Digital-to-Analog Converter (DAC)
SOLDERING Introduction to soldering surface mount packages This text gives a very brief insight to a complex technology. A more in-depth account of soldering ICs can be found in our "Data Handbook IC26; Integrated Circuit Packages" (document order number 9398 652 90011). There is no soldering method that is ideal for all surface mount IC packages. Wave soldering can still be used for certain surface mount ICs, but it is not suitable for fine pitch SMDs. In these situations reflow soldering is recommended. Reflow soldering Reflow soldering requires solder paste (a suspension of fine solder particles, flux and binding agent) to be applied to the printed-circuit board by screen printing, stencilling or pressure-syringe dispensing before package placement. Several methods exist for reflowing; for example, convection or convection/infrared heating in a conveyor type oven. Throughput times (preheating, soldering and cooling) vary between 100 and 200 seconds depending on heating method. Typical reflow peak temperatures range from 215 to 250 C. The top-surface temperature of the packages should preferably be kept: * below 220 C for all the BGA packages and packages with a thickness 2.5mm and packages with a thickness <2.5 mm and a volume 350 mm3 so called thick/large packages * below 235 C for packages with a thickness <2.5 mm and a volume <350 mm3 so called small/thin packages. Wave soldering Conventional single wave soldering is not recommended for surface mount devices (SMDs) or printed-circuit boards with a high component density, as solder bridging and non-wetting can present major problems. To overcome these problems the double-wave soldering method was specifically developed.
TDF8771A
If wave soldering is used the following conditions must be observed for optimal results: * Use a double-wave soldering method comprising a turbulent wave with high upward pressure followed by a smooth laminar wave. * For packages with leads on two sides and a pitch (e): - larger than or equal to 1.27 mm, the footprint longitudinal axis is preferred to be parallel to the transport direction of the printed-circuit board; - smaller than 1.27 mm, the footprint longitudinal axis must be parallel to the transport direction of the printed-circuit board. The footprint must incorporate solder thieves at the downstream end. * For packages with leads on four sides, the footprint must be placed at a 45 angle to the transport direction of the printed-circuit board. The footprint must incorporate solder thieves downstream and at the side corners. During placement and before soldering, the package must be fixed with a droplet of adhesive. The adhesive can be applied by screen printing, pin transfer or syringe dispensing. The package can be soldered after the adhesive is cured. Typical dwell time is 4 seconds at 250 C. A mildly-activated flux will eliminate the need for removal of corrosive residues in most applications. Manual soldering Fix the component by first soldering two diagonally-opposite end leads. Use a low voltage (24 V or less) soldering iron applied to the flat part of the lead. Contact time must be limited to 10 seconds at up to 300 C. When using a dedicated tool, all other leads can be soldered in one operation within 2 to 5 seconds between 270 and 320 C.
2003 Apr 29
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Philips Semiconductors
Product specification
Triple 8-bit video Digital-to-Analog Converter (DAC)
Suitability of surface mount IC packages for wave and reflow soldering methods PACKAGE(1) BGA, LBGA, LFBGA, SQFP, TFBGA, VFBGA DHVQFN, HBCC, HBGA, HLQFP, HSQFP, HSOP, HTQFP, HTSSOP, HVQFN, HVSON, SMS PLCC(4), SO, SOJ LQFP, QFP, TQFP SSOP, TSSOP, VSO, VSSOP Notes not suitable not suitable(3)
TDF8771A
SOLDERING METHOD WAVE REFLOW(2) suitable suitable suitable suitable suitable
suitable not not recommended(4)(5) recommended(6)
1. For more detailed information on the BGA packages refer to the "(LF)BGA Application Note" (AN01026); order a copy from your Philips Semiconductors sales office. 2. All surface mount (SMD) packages are moisture sensitive. Depending upon the moisture content, the maximum temperature (with respect to time) and body size of the package, there is a risk that internal or external package cracks may occur due to vaporization of the moisture in them (the so called popcorn effect). For details, refer to the Drypack information in the "Data Handbook IC26; Integrated Circuit Packages; Section: Packing Methods". 3. These packages are not suitable for wave soldering. On versions with the heatsink on the bottom side, the solder cannot penetrate between the printed-circuit board and the heatsink. On versions with the heatsink on the top side, the solder might be deposited on the heatsink surface. 4. If wave soldering is considered, then the package must be placed at a 45 angle to the solder wave direction. The package footprint must incorporate solder thieves downstream and at the side corners. 5. Wave soldering is suitable for LQFP, TQFP and QFP packages with a pitch (e) larger than 0.8 mm; it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.65 mm. 6. Wave soldering is suitable for SSOP, TSSOP, VSO and VSSOP packages with a pitch (e) equal to or larger than 0.65 mm; it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm.
2003 Apr 29
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Philips Semiconductors
Product specification
Triple 8-bit video Digital-to-Analog Converter (DAC)
DATA SHEET STATUS LEVEL I DATA SHEET STATUS(1) Objective data PRODUCT STATUS(2)(3) Development DEFINITION
TDF8771A
This data sheet contains data from the objective specification for product development. Philips Semiconductors reserves the right to change the specification in any manner without notice. This data sheet contains data from the preliminary specification. Supplementary data will be published at a later date. Philips Semiconductors reserves the right to change the specification without notice, in order to improve the design and supply the best possible product. This data sheet contains data from the product specification. Philips Semiconductors reserves the right to make changes at any time in order to improve the design, manufacturing and supply. Relevant changes will be communicated via a Customer Product/Process Change Notification (CPCN).
II
Preliminary data Qualification
III
Product data
Production
Notes 1. Please consult the most recently issued data sheet before initiating or completing a design. 2. The product status of the device(s) described in this data sheet may have changed since this data sheet was published. The latest information is available on the Internet at URL http://www.semiconductors.philips.com. 3. For data sheets describing multiple type numbers, the highest-level product status determines the data sheet status. DEFINITIONS Short-form specification The data in a short-form specification is extracted from a full data sheet with the same type number and title. For detailed information see the relevant data sheet or data handbook. Limiting values definition Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 60134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended periods may affect device reliability. Application information Applications that are described herein for any of these products are for illustrative purposes only. Philips Semiconductors make no representation or warranty that such applications will be suitable for the specified use without further testing or modification. DISCLAIMERS Life support applications These products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. Philips Semiconductors customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips Semiconductors for any damages resulting from such application. Right to make changes Philips Semiconductors reserves the right to make changes in the products including circuits, standard cells, and/or software described or contained herein in order to improve design and/or performance. When the product is in full production (status `Production'), relevant changes will be communicated via a Customer Product/Process Change Notification (CPCN). Philips Semiconductors assumes no responsibility or liability for the use of any of these products, conveys no licence or title under any patent, copyright, or mask work right to these products, and makes no representations or warranties that these products are free from patent, copyright, or mask work right infringement, unless otherwise specified.
2003 Apr 29
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Philips Semiconductors
Product specification
Triple 8-bit video Digital-to-Analog Converter (DAC)
NOTES
TDF8771A
2003 Apr 29
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Philips Semiconductors
Product specification
Triple 8-bit video Digital-to-Analog Converter (DAC)
NOTES
TDF8771A
2003 Apr 29
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Philips Semiconductors - a worldwide company
Contact information For additional information please visit http://www.semiconductors.philips.com. Fax: +31 40 27 24825 For sales offices addresses send e-mail to: sales.addresses@www.semiconductors.philips.com.
(c) Koninklijke Philips Electronics N.V. 2003
SCA75
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner. The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license under patent- or other industrial or intellectual property rights.
Printed in The Netherlands
753504/01/pp20
Date of release: 2003
Apr 29
Document order number:
9397 750 10875

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