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 DISCRETE SEMICONDUCTORS
DATA SHEET
book, halfpage
M3D168
BAQ806 AM PIN diode
Product specification File under Discrete Semiconductors, SC10 1998 Aug 03
Philips Semiconductors
Product specification
AM PIN diode
FEATURES * Glass passivated * High maximum operating temperature * Low leakage current * Excellent stability * UL 94V-O classified plastic package * Shipped in 12 mm embossed tape. APPLICATIONS * RF attenuator with low distortion for frequencies above 100 kHz.
handbook, 4 columns
BAQ806
DESCRIPTION DO-214AC surface mountable package with glass passivated chip. The well-defined void-free case is of a transfer-moulded thermo-setting plastic.
cathode band k a
Top view
Side view
MSA474
Fig.1 Simplified outline (SOD106) and symbol.
LIMITING VALUES In accordance with the Absolute Maximum Rating System (IEC 134). SYMBOL VRRM VR Tstg Tj PARAMETER repetitive peak reverse voltage continuous reverse voltage storage temperature junction temperature MIN. - - -65 -65 MAX. 100 100 +175 +150 V V C C UNIT
1998 Aug 03
2
Philips Semiconductors
Product specification
AM PIN diode
ELECTRICAL CHARACTERISTICS Tj = 25 C unless otherwise specified. SYMBOL VF PARAMETER forward voltage CONDITIONS IF = 100 mA; see Figs 2 and 3 IF = 100 mA; Tj = Tj max; see Figs 2 and 3 IR reverse current charge carrier life time VR = 100 V; see Fig. 4 VR = 100 V; Tj = 125 C; see Fig. 4 when switched from IF = 10 mA to IR = 6 mA; measured at 10% of IR; see Fig. 13 f = 1 MHz; see Figs 5, 6, 7 and 8 VR = 0 V VR = 2 V rD diode forward resistance f = 100 kHz; see Figs 9 and 14 IF = 10 A IF = 100 A IF = 1 mA IF = 10 mA rs diode series resistance f = 100 kHz; see Figs 10, 11 and 12 VR = 0 V VR = 2 V f = 1 MHz; see Figs 10, 11 and 12 VR = 0 V VR = 2 V THERMAL CHARACTERISTICS SYMBOL Rth j-tp Rth j-a PARAMETER thermal resistance from junction to tie-point thermal resistance from junction to ambient note 1 note 2 Note CONDITIONS 25 100 50 250 1000 5000 2100 12000 - - - - 3300 560 62 7 - - 9 5 MIN. - - - - 15 TYP. 0.9 0.7 - - 25
BAQ806
MAX. 1.1 0.9 0.1 30 - V V
UNIT
A A s
Cd
diode capacitance
11 6 6000 900 90 10 - - - -
pF pF k k k k
VALUE 25 100 150
UNIT K/W K/W K/W
1. Device mounted on Al2O3 printed-circuit board, 0.7 mm thick; thickness of copper 35 m, see Fig. 15 2. Device mounted on epoxy-glass printed-circuit board, 1.5 mm thick; thickness of copper 40 m, see Fig. 15. For more information please refer to the `General Part of Handbook SC10'
1998 Aug 03
3
Philips Semiconductors
Product specification
AM PIN diode
GRAPHICAL DATA
MGG500
BAQ806
104 handbook, halfpage IF (mA) 103 102
104 handbook, halfpage IF (mA) 103 102
MGG501
10
10
1 10-1 10-2 0 0.4 0.8 1.2 1.6 VF (V) Dotted line: Tj = Tj max. Solid line: Tj = 25 C. 2.0
1 10-1 10-2 0 0.4 0.8 1.2 1.6 VF (V) 2.0
Dotted line: Tj = Tj max. Solid line: Tj = 25 C.
Fig.2
Forward current as a function of forward voltage; typical values.
Fig.3
Forward current as a function of forward voltage; maximum values.
102 handbook, halfpage IR (A) 10
MGG502
1
10-1
0
50
100
Tj (C)
150
VR = VRRMmax.
Fig.4
Reverse current as a function of junction temperature; maximum values.
1998 Aug 03
4
Philips Semiconductors
Product specification
AM PIN diode
BAQ806
MGM477
handbook, halfpage
10
handbook, halfpage
12
MGM478
Cd (pF)
8
Cd (pF) 0V 8
6
4 4 2
2V
0 0 2 4 6 8 VR (V) 10
0 10
102
103
f (kHz)
104
f = 1 MHz
Fig.5
Diode capacitance as a function of reverse voltage; typical values.
Fig.6
Diode capacitance as a function of frequency; typical values.
handbook, halfpage
40
MGM479
handbook, halfpage
6
MGM480
Cd (pF) 30
Cd (pF) 5
85 C 25 C -40 C
20 85 C 25 C -40 C
4
10
3
0 10
102
103
f (kHz)
104
2 10
102
103
f (kHz)
104
VR = 0 V.
VR = 2 V.
Fig.7
Diode capacitance as a function of frequency; typical values.
Fig.8
Diode capacitance as a function of frequency; typical values.
1998 Aug 03
5
Philips Semiconductors
Product specification
AM PIN diode
BAQ806
104 handbook, halfpage rD () 103
MGM481
105 handbook, halfpage rs (k) 104 0V VR = 2 V
MGM482
102
103
10
102
1 10
102
103
IF (A)
104
10 10
102
103
f (kHz)
104
f = 100 kHz; see Fig. 14.
Tj = 25 C.
Fig.9
Diode forward resistance as a function of forward current; typical values.
Fig.10 Diode series resistance as a function of frequency; typical values.
105 handbook, halfpage rs (k) 104 25 C 103 -40 C
MGM483
105 handbook, halfpage rs (k) 104
MGM484
-40 C 25 C 85 C
103
102
85 C
102
10 10
102
103
f (kHz)
104
10 10
102
103
f (kHz)
104
VR = 0 V.
VR = 2 V.
Fig.11 Diode series resistance as a function of frequency; typical values.
Fig.12 Diode series resistance as a function of frequency; typical values.
1998 Aug 03
6
Philips Semiconductors
Product specification
AM PIN diode
BAQ806
handbook, full pagewidth
10 IF (mA) 10 F
DUT
pulse f = 1 kHz
10 mA
10 0 10% IR (mA) 90% 6
t
MGG506
Input impedance oscilloscope: 1 M, 22 pF; tr 7 ns. Source impedance: 50 ; tr 15 ns.
Fig.13 Charge carrier life time test circuit and definition.
50
handbook, halfpage
50
R1
1 F
IF DUT
R2 4.5 11 V 50
MGG507
100 kHz
50
Vin
Vout
2.5
IF (mA) 0.1 1 10
R1 () 3000 300 30
R2 (k) 100 10 1 1.25
MSB213
Dimensions in mm.
Fig.14 Diode forward resistance test circuit.
Fig.15 Printed-circuit board for surface mounting.
1998 Aug 03
7
Philips Semiconductors
Product specification
AM PIN diode
PACKAGE OUTLINE Transfer-moulded thermo-setting plastic small rectangular surface mounted package; 2 connectors
BAQ806
SOD106
H D
A A1 c Q
E
b
(1)
0
2.5 scale
5 mm
DIMENSIONS (mm are the original dimensions) UNIT mm A 2.3 2.0 A1 0.05 b 1.6 1.4 c 0.2 D 4.5 4.3 E 2.8 2.4 H 5.5 5.1 Q 3.3 2.7
Note 1. The marking band indicates the cathode. OUTLINE VERSION SOD106 REFERENCES IEC JEDEC DO-214AC EIAJ EUROPEAN PROJECTION ISSUE DATE 97-06-09
1998 Aug 03
8
Philips Semiconductors
Product specification
AM PIN diode
DEFINITIONS Data Sheet Status Objective specification Preliminary specification Product specification Limiting values
BAQ806
This data sheet contains target or goal specifications for product development. This data sheet contains preliminary data; supplementary data may be published later. This data sheet contains final product specifications.
Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended periods may affect device reliability. Application information Where application information is given, it is advisory and does not form part of the specification. LIFE SUPPORT APPLICATIONS These products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. Philips customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such improper use or sale.
1998 Aug 03
9
Philips Semiconductors
Product specification
AM PIN diode
NOTES
BAQ806
1998 Aug 03
10
Philips Semiconductors
Product specification
AM PIN diode
NOTES
BAQ806
1998 Aug 03
11
Philips Semiconductors - a worldwide company
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For all other countries apply to: Philips Semiconductors, International Marketing & Sales Communications, Building BE-p, P.O. Box 218, 5600 MD EINDHOVEN, The Netherlands, Fax. +31 40 27 24825 (c) Philips Electronics N.V. 1998
SCA60
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner. The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license under patent- or other industrial or intellectual property rights.
Printed in The Netherlands
115104/00/01/pp12
Date of release: 1998 Aug 03
Document order number:
9397 750 03998


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