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(R) L3121B PROGRAMMABLE TRANSIENT VOLTAGE SUPPRESSOR FOR SLIC PROTECTION Application Specific Discretes A.S.D.TM FEATURES BIDIRECTIONAL FUNCTION WITH VOLTAGE PROGRAMMABILITY IN BOTH POSITIVE AND NEGATIVE POLARITIES. PROGRAMMABLE BREAKDOWN VOLTAGE UP TO 100 V. HOLDING CURRENT = 150 mA min. HIGH SURGE CURRENT CAPABILITY. IPP = 100A , 10/1000 s SIP4 DESCRIPTION This device has been especially designed to protect a subscriber line interface circuit (SLIC) with an integrated ring generator. Used with the recommended application circuit, each line (TIP and RING) is protected against positive and negative surges. In the positive polarity, the breakdown voltage is referenced to the + VB , and in the negative polarity, the breakdown voltage is referenced to the -Vbat . Its high surge current capability makes the L3121B a reliable protectiondevice for very exposed equipment, or when series resistors are very low. SCHEMATIC DIAGRAM Line Gate P Gate N GND CONNECTION DIAGRAM May 1999 - Ed:4A 1/7 L3121B Peak Surge Voltage (V) 4000 4000 4000 level 4 level 4 1500 800 1000 2500 1000 5000 Voltage Waveform (s) 10/700 10/700 1.2/50 10/700 1.2/50 10/160 10/560 9/720 2/10 10/1000 2/10 Current Waveform (s) 5/310 5/310 1/20 5/310 8/20 10/160 10/560 5/320 2/10 10/1000 2/10 Admissible Ipp (A) 100 100 100 100 100 200 100 25 250 100 250 Necessary Resistor () 10 COMPLIES WITH THE FOLLOWING STANDARDS: ITU-T K20 VDE0433 VDE0878 IEC1000-4-5 FCC Part 68, lightning surge type A FCC Part 68, lightning surge type B BELLCORE TR-NWT-001089 First level BELLCORE TR-NWT-001089 Second level ABSOLUTE MAXIMUM RATINGS (Tamb = 25C) Symbol IPP ITSM VMLG VMGL Tstg Tj TL Top Peak pulse current Non repetitive surge peak on-state current Maximum voltage LINE/GND. Maximum voltage GATE/LINE. Storage temperature range Maximum operating junction temperature Maximum lead temperature for soldering during 10s Operating temperature range (see note 1) Parameter 10/1000 s 2/10 s tp = 10 ms Value 100 250 50 100 80 - 40 to + 150 + 150 260 - 40 to + 85 Unit A A V V C C C C Note 1: Variation of electrical parameters is given by curves. Pulse waveform 10/1000s % IPP 100 50 0 tr tp t THERMAL RESISTANCE Symbol Rth (j-a) Junction-to-ambient Parameter Value 80 Unit C/W 2/7 L3121B ELECTRICAL CHARACTERISTICS (Tamb = 25 C) Symbol VRM IRM VBR VBO IH IBO IPP VGN IGN, IGP C Parameter Stand-off voltage Reverse leakage current Breakdown voltage Breakover voltage Holding current Breakover current Peak pulse current VRM VBR VBO IBO IH I IPP Gate voltage Triggering gate current Capacitance 1- OPERATION WITHOUT GATE IRM @ VRM Type max. VBR @ IR min. VBO max. @ typ. note 1 A L3121B IBO max. IH min. note 1 C max. note 2 pF 200 V 60 90 V 100 mA 1 V 180 mA 200 mA 500 mA 150 5 8 2- OPERATION WITH GATE VGN @ IGN = 200mA Type min. V L3121B IGN @ VAC = 60V min. mA 80 max. mA 200 IGP @ VAC = 60V max. mA 180 max. V 1.8 0.6 Note 1 :See the reference test circuits for IH, IBO and VBO parameters. Note 2 :VR = 5 V, F = 1MHz. 3/7 L3121B REFERENCE TEST CIRCUIT FOR IBO and VBO parameters: t p = 20ms Auto Transformer 220V/2A static relay. K R1 14 0 R2 240 220V Vout IBO , IH measure Transformer 220V/800V 5A D.U.T V BO measure TEST PROCEDURE : Pulse Test duration (tp = 20ms): - For Bidirectional devices = Switch K is closed - For Unidirectional devices = Switch K is open. VOUT Selection - Device with VBO < 200 Volt - VOUT = 250 VRMS, R1 = 140 . - Device with VBO 200 Volt - VOUT = 480 VRMS, R2 = 240 . FUNCTIONAL HOLDING CURRENT (IH) TEST CIRCUIT = GO - NOGO TEST. R D.U.T. V BAT = - 48 V Surge generator - VP This is a GO-NOGO Test which allows to confirm the holding current (IH) level in a functional test circuit. This test can be performed if the reference test circuit can't be implemented. TEST PROCEDURE : 1) Adjust the current level at the IH value by short circuiting the line and GND pins of the D.U.T. 2) Fire the D.U.T with a surge Current : Ipp = 10A , 10/1000 s. 3) The D.U.T will come back to the OFF-State within a duration of 50 ms max. 4/7 L3121B Fig. 1: Surge peak current versus overload duration (typical values). ITSM(A) 40 35 30 25 F=50H z Tj initial=25C Fig. 2: Typical relative variation of holding current versus ambient temperature. IH [Tamb] IH [Tamb = 25C] 1.45 1.30 1.15 20 15 10 5 0 1E-2 1.0 t(s) 1E-1 1E+0 1E+1 1E+2 1E+3 0.85 Tamb (C) 0.70 -40 -20 0 20 40 60 80 85 Fig. 3: Typical relative variation of breakdown voltage versus ambient temperature. VBR [Tamb] VBR [Tamb = 25C] 2.04 IR = 1 mA 2.00 1.06 1.02 0.98 0.94 Tamb (C) 0.90 -40 -20 0 20 40 60 80 85 Fig. 4: Junction capacitance versus reverse applied voltage. Fig. 5: Typical relative variation of leakage current versus ambient temperature. IR[Tj] / IR [Tj=25C] 1E+5 1E+4 1E+3 Fig. 6: Typical relative variation of peak pulse current (10/1000s) versus ambient temperature. Ipp[Tamb] / Ipp [25C] 1.10 1.05 1.00 1E+2 1E+1 Tj(C) 1E+0 25 50 75 100 125 0.95 Tamb(C) 0.90 -40 -30 -20 -10 0 10 20 30 40 50 60 70 80 5/7 L3121B Typical Slic Protection Concept. -Vbat +VB LINE R1 R3 TIP -Vbat GN L3121B GP 220nF +VB SLIC GND 220nF GN R2 L3121B GP R4 L3000N RING LINE GND ORDER CODE L3121B DEVICE CODE MARKING : Logo, Date Code, Part Number 6/7 L3121B PACKAGE MECHANICAL DATA SIP4 (Plastic) DIMENSIONS REF. B C Millimetres Min. Typ. Max. Min. 7.10 2.80 10.15 0.50 1.35 3.18 0.38 1.30 2.54 7.62 10.50 3.30 1.50 1.75 0.053 3.43 0.125 0.50 0.015 0.110 Inches Typ. Max. 0.280 A a1 I A B b1 0.400 0.020 0.069 0.135 0.020 0.051 0.100 0.200 0.413 0.130 0.059 a1 b1 b2 Z e c2 e3 L c1 b2 C c1 c2 e e3 I L Z Ordre code L3121B Marking Package SIP4 Weight 0.55 g Base qty Delivery mode Information furnished is believed to be accurate and reliable. However, STMicroelectronics assumes no responsibility for the consequences of use of such information nor for any infringement of patents or other rights of third parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of STMicroelectronics. Specifications mentioned in this publication are subject to change without notice. This publication supersedes and replaces all information previously supplied. STMicroelectronics products are not authorized for use as critical components in life support devices or systems without express written approval of STMicroelectronics. The ST logo is a registered trademark of STMicroelectronics (c) 1999 STMicroelectronics - Printed in Italy - All rights reserved. STMicroelectronics GROUP OF COMPANIES Australia - Brazil - Canada - China - France - Germany - Italy - Japan - Korea - Malaysia - Malta - Mexico - Morocco The Netherlands - Singapore - Spain - Sweden - Switzerland - Taiwan - Thailand - United Kingdom - U.S.A. http://www.st.com 7/7 |
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