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INTEGRATED CIRCUITS
DATA SHEET
TDA8042M Quadrature demodulator
Product specification File under Integrated Circuits, IC02 1997 Apr 11
Philips Semiconductors
Product specification
Quadrature demodulator
FEATURES * 5 V supply voltage * Internal voltage reference * 350 to 650 MHz input frequency range * On-chip 0 and 90 phase shifter * Symbol rate up to 45 Msymbols/s * High input sensitivity * Built-in voltage stabilizer * AGC amplifier with 21 dB control range * AGC detector. APPLICATION * Binary Phase-Shift Keying (BPSK) and Quadrature Phase-Shift Keying (QPSK) demodulation. GENERAL DESCRIPTION
TDA8042M
The TDA8042M is a monolitic bipolar IC dedicated for BPSK and QPSK demodulation. It is designed to be used together with the TDA8043 as part of a complete BPSK/QPSK satellite demodulator and decoder. The bandwidth of the TDA8042M allows symbol rates up to 45 Msymbols/s. It includes two matched mixers, an IF gain controlled amplifier, a symmetrical oscillator, a 0/90 phase shifter, two low-pass filters and two matched baseband amplifiers. The high input sensitivity makes interfacing with various sources easy. The input sensitivity can be adjusted by means of an internal AGC amplifier. The oscillator operates at half the IF frequency. The local oscillator signal driving the mixers is made by doubling the oscillator frequency by an internal frequency multiplier. The oscillator frequency can be set by the appropriate external LC tank circuit. The internal wideband phase shifter provides two oscillator signals which are 90 degrees out of phase to drive the mixers. An AGC detector at the I and Q outputs makes it possible to keep the I and Q signals at a constant level to drive the analog-to-digital converters of the TDA8043.
QUICK REFERENCE DATA SYMBOL VCC ICC Vi(RF) fi(RF) VolQ(p-p) E(I-Q) EG(I-Q) Gtilt supply voltage supply current operating input level RF input signal frequency I and Q output voltage (peak-to-peak value) phase matching error between I and Q channels gain matching error between I and Q channels gain tilt error between I and Q channels VCC = 5.0 V PARAMETER CONDITIONS MIN. 4.75 54 - 350 - - - - TYP. 5.0 67.5 57 - 0.8 0.7 0.15 0.3 MAX. 5.25 81 - 650 - 2 0.8 0.5 UNIT V mA dBV MHz V deg dB dB
ORDERING INFORMATION TYPE NUMBER TDA8042M PACKAGE NAME SSOP20 DESCRIPTION plastic shrink small outline package; 20 leads; body width 4.4 mm VERSION SOT266-1
1997 Apr 11
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Philips Semiconductors
Product specification
Quadrature demodulator
BLOCK DIAGRAM
TDA8042M
handbook, full pagewidth
IDET
1
DET
20
VTH
GND1
2 I
19
GND1
VAGC
3
VOLTAGE REFERENCE
18
VCC1 OSCDIS
IOUT
4
17
GND2
5
x
VCO 0 x2
16
OSCA
IFA
6
15
OSCB
IFB VCC2 QOUT
7
90
14
GND1
8
x
Q
13 32
FDIV(A)
9
12
FDIV(B)
10 GND1
11
VCC1
TDA8042M
MBH968
Fig.1 Block diagram.
1997 Apr 11
3
Philips Semiconductors
Product specification
Quadrature demodulator
PINNING SYMBOL IDET GND1 VAGC IOUT GND2 IFA IFB VCC2 QOUT GND1 VCC1 FDIV(B) FDIV(A) GND1 OSCB OSCA OSCDIS VCC1 GND1 VTH PIN 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 ground gain control input voltage I channel amplifier output ground IF input A IF input B supply voltage 2 Q channel amplifier output ground supply voltage 1 prescaler output B prescaler output A ground oscillator tank circuit B oscillator tank circuit A oscillator disable input supply voltage 1 ground AGC threshold voltage input
MBH967
TDA8042M
DESCRIPTION AGC detector output signal
handbook, halfpage
IDET 1 GND1 2 VAGC 3 IOUT 4 GND2 5
20 VTH 19 GND1 18 VCC1 17 OSCDIS 16 OSCA
TDA8042M
IFA 6 IFB 7 VCC2 8 QOUT 9 GND1 10 15 OSCB 14 GND1 13 FDIV(A) 12 FDIV(B) 11 VCC1
Fig.2 Pin configuration.
1997 Apr 11
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Philips Semiconductors
Product specification
Quadrature demodulator
LIMITING VALUES In accordance with the Absolute Maximum Rating System (IEC 134). SYMBOL VCC Vi Ptot Tstg Tj Tamb Note supply voltage input voltage on all pins total power dissipation IC storage temperature junction temperature operating ambient temperature PARAMETER MIN. -0.3 -0.3 - -55 - 0
TDA8042M
MAX. +6.0 VCC 470 +150 +150 +70(1) V V
UNIT
mW C C C
1. The operating ambient temperature can be extended up to +85 C providing the supply voltage remains lower or equal to 5.2 V in order to maintain the junction temperature below 150 C. QUALITY SPECIFICATION All pins withstand the ESD test in accordance with "UZW-BO/FQ-A302 (human body model)" and with "UZW-BO/FQ-B302 (machine model)". These numbers can be found in the "Quality reference Handbook". The handbook can be ordered using the code 9397 750 00192. THERMAL CHARACTERISTICS SYMBOL Rth j-a PARAMETER thermal resistance from junction to ambient in free air VALUE 120 UNIT K/W
1997 Apr 11
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Philips Semiconductors
Product specification
Quadrature demodulator
TDA8042M
CHARACTERISTICS VCC = 5 V; Tamb = 25 C; RL(IQ) = 1 k; measured in application circuit of Fig.4; unless otherwise specified. SYMBOL Supply VCC1 VCC2 ICC1 ICC2 AGC GCR GVAGC gain control range voltage gain control at pin 3 input level = Vi(RF)min input level = Vi(RF)max RiVAGC Vth input resistance at pin 3 AGC threshold voltage Vo = 1.6 V (peak-to-peak value) Vo = 0.8 V (peak-to-peak value) Vo = 0.4 V (peak-to-peak value) RiVTH Idet VTH input resistance maximum AGC detector output current (absolute value) note 3 note 2 - - - - - 3.6 2.4 1.8 10 1 - - - - - V V V k mA note 1 0.5 3.5 - - - 20 2 4.5 - V V k 21 29 - dB supply voltage supply voltage supply current supply current 4.75 4.75 VCC1 = VCC2 = 5.0 V 41 VCC1 = VCC2 = 5.0 V 13 5.0 5.0 51 16.5 5.25 5.25 61 20 V V mA mA PARAMETER CONDITIONS MIN. TYP. MAX. UNIT
QPSK demodulator fi(RF) Ri(RF) Xi(RF) Vi(RF) E(I-Q) EG(I-Q) Gtilt F RF input signal frequency RF input impedance (resistive part) RF input impedance (reactive part) operating RF input level phase matching error between I and Q channels gain tilt error between I and Q channels DSB noise figure fi(RF) = 480 MHz fi(RF) = 480 MHz note 1 note 4 350 - - 57 - - - - - 50 19 - 0.7 0.15 0.3 13 650 - - 78 2 0.8 0.5 17 MHz dBV deg dB dB dB
gain matching error between I and Q channels note 5 note 6 source impedance = 50 ; note 7 note 8
d3(IQ)
third-order intermodulation distortion in I and Q channels
-
50
-
dB
1997 Apr 11
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Philips Semiconductors
Product specification
Quadrature demodulator
TDA8042M
SYMBOL Oscillator fosc fosc Nosc Vosc(dis)
PARAMETER
CONDITIONS
MIN. - - - -
TYP.
MAX.
UNIT
oscillator frequency frequency drift oscillator phase noise oscillator disable voltage at pin 17 oscillator disabled oscillator enabled
note 9 note 10 VCC = 5% measured10 kHz from fosc; note 11
175 - - -
325 500 100 91
MHz kHz kHz dBc/Hz
- 4.0
- - - - 50 -50 - 450
1.0 - - 3.35 60 - - - - -
V V
Prescaler VOH VOL DIVspu(IQ) B-1 B-30 VO(IQ)(DC) Vo(IQ)(p-p) Vclip(p-p) RL(IQ) Ro(IQ) ct(I-Q) Notes 1. The voltage gain control range (GVAGC) is defined as the DC voltage to be applied on pin 3 to get a signal level of 800 mV (peak-to-peak value) at I and Q outputs. The lowest control voltage corresponds to the highest sensitivity and gain. 2. Vth is the level of voltage to be applied at pin 20 to get a current Idet of 0.5 mA at pin 1. This voltage depends on the amplitude of the signal at I and Q outputs. The AGC threshold voltage can be set by a resistive voltage divider connected at pin 20. Without the external resistors Vth is set at a value close to 2.35 V. 3. The current Idet increases when the output level (at pins 4 and 9) increases above the value set by the adjustment of Vth. 4. The phase error is defined as the phase quadrature imbalance between I and Q channels. 5. The gain error is defined as the phase quadrature imbalance between I and Q channels. 6. The tilt is defined as the difference between the maximum and the minimum channel gain measured in a frequency band of 30 MHz around fi(RF). The specified tilt is the maximum tilt value found in one of the I and Q channels. HIGH level output voltage LOW level output voltage output duty cycle output spurious voltage at I and Q outputs note 13 note 12 note 12 4.0 - 40 - V V % dB
I and Q internal filters bandwidth for 1 dB attenuation bandwidth for 30 dB attenuation 30 - - note 14 - 1.8 note 15 500 - 30 - 67 - - - - MHz MHz
I and Q output amplifiers I and Q channels DC output voltage I and Q channels output voltage (peak-to-peak value) I and Q output clipping level (peak-to-peak value) I and Q channels output load resistance I and Q channels output resistance crosstalk between I and Q channels 2.45 0.8 V V V dB
1997 Apr 11
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Philips Semiconductors
Product specification
Quadrature demodulator
TDA8042M
7. The specified noise figure is the maximum value obtained from I and Q channels noise measurement. The figure holds for the maximum gain (GVAGC = 0.5 V). 8. The specified intermodulation distortion is the minimum value obtained from intermodulation measurements in I and Q channels. The specified value is the minimum distance between wanted signal and intermodulation products measured at the output for a wanted output level of 0.8 V (peak-to-peak value). 9. The oscillator is tuned with an appropriate tank circuit designed for each frequency limit. 10. The drift of the oscillator frequency with temperature is defined for Tamb = 25 C. It is measured in the application circuit (see Fig.4) with a temperature compensated tank circuit. The temperature compensation used for this measurement is realized using the application which is depicted in Fig.3. 11. The phase noise is measured at the oscillator frequency (= 240 MHz). Due to the internal frequency doubler the phase noise at the input of the mixers will be 6 dB worse. 12. Measured with a high impedance load (RL > 5 k) connected at pins 12 and 13. 13. The prescaler output spurious voltage at I and Q outputs are measured with respect to an output level of 800 mV (peak-to-peak value). 14. Measured with an input signal fi(RF) + 500 kHz (i.e. 480.5 MHz). 15. The load should be AC-coupled.
handbook, full pagewidth
to pin 15 TOKO ref.: 100 082 93278 to pin 16
MBH969
8.2 pF NP0
2.2 pF NP0
6 pF N470
1 pF N470
Fig.3 Temperature compensation circuit.
1997 Apr 11
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Philips Semiconductors
Product specification
Quadrature demodulator
APPLICATION INFORMATION
TDA8042M
handbook, full pagewidth
5V 100 nF test point GND1 5 k IDET 1 20 VTH 100 nF GND1 1 k + 5V maximum
2
19
5V 1 k 100 nF 1 k 100 nF GND2 NOT ON THE TESTBOARD RF ANZAC 50 10 nF IFB 10 nF 5V 100 nF 1 k 100 nF GND1 10 11
MBH970
VAGC
3
18
VCC1 100 nF OSCDIS 100 nF OSCA 18 pF
5V
IOUT
4
17
5
16
TDA8042M
IFA 6 15
OSCB
TOKO ref.: 100 082 93278
H-183-4
7
14
GND1
VCC2
8
13
FDIV(A) 10 nF
470 to prescaler
QOUT
9
12
FDIV(B) 10 nF VCC1
470
100 nF
5V
Fig.4 Application diagram.
1997 Apr 11
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Philips Semiconductors
Product specification
Quadrature demodulator
PACKAGE OUTLINE SSOP20: plastic shrink small outline package; 20 leads; body width 4.4 mm
TDA8042M
SOT266-1
D
E
A X
c y HE vM A
Z
20
11
Q A2 pin 1 index A1 (A 3) Lp L A
1
e bp
10
detail X wM
0
2.5 scale
5 mm
DIMENSIONS (mm are the original dimensions) UNIT mm A max. 1.5 A1 0.15 0 A2 1.4 1.2 A3 0.25 bp 0.32 0.20 c 0.20 0.13 D (1) 6.6 6.4 E (1) 4.5 4.3 e 0.65 HE 6.6 6.2 L 1.0 Lp 0.75 0.45 Q 0.65 0.45 v 0.2 w 0.13 y 0.1 Z (1) 0.48 0.18 10 0o
o
Note 1. Plastic or metal protrusions of 0.20 mm maximum per side are not included. OUTLINE VERSION SOT266-1 REFERENCES IEC JEDEC EIAJ EUROPEAN PROJECTION
ISSUE DATE 90-04-05 95-02-25
1997 Apr 11
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Philips Semiconductors
Product specification
Quadrature demodulator
SOLDERING Introduction There is no soldering method that is ideal for all IC packages. Wave soldering is often preferred when through-hole and surface mounted components are mixed on one printed-circuit board. However, wave soldering is not always suitable for surface mounted ICs, or for printed-circuits with high population densities. In these situations reflow soldering is often used. This text gives a very brief insight to a complex technology. A more in-depth account of soldering ICs can be found in our "IC Package Databook" (order code 9398 652 90011). Reflow soldering Reflow soldering techniques are suitable for all SSOP packages. Reflow soldering requires solder paste (a suspension of fine solder particles, flux and binding agent) to be applied to the printed-circuit board by screen printing, stencilling or pressure-syringe dispensing before package placement. Several techniques exist for reflowing; for example, thermal conduction by heated belt. Dwell times vary between 50 and 300 seconds depending on heating method. Typical reflow temperatures range from 215 to 250 C. Preheating is necessary to dry the paste and evaporate the binding agent. Preheating duration: 45 minutes at 45 C. Wave soldering Wave soldering is not recommended for SSOP packages. This is because of the likelihood of solder bridging due to closely-spaced leads and the possibility of incomplete solder penetration in multi-lead devices.
TDA8042M
If wave soldering cannot be avoided, the following conditions must be observed: * A double-wave (a turbulent wave with high upward pressure followed by a smooth laminar wave) soldering technique should be used. * The longitudinal axis of the package footprint must be parallel to the solder flow and must incorporate solder thieves at the downstream end. Even with these conditions, only consider wave soldering SSOP packages that have a body width of 4.4 mm, that is SSOP16 (SOT369-1) or SSOP20 (SOT266-1). During placement and before soldering, the package must be fixed with a droplet of adhesive. The adhesive can be applied by screen printing, pin transfer or syringe dispensing. The package can be soldered after the adhesive is cured. Maximum permissible solder temperature is 260 C, and maximum duration of package immersion in solder is 10 seconds, if cooled to less than 150 C within 6 seconds. Typical dwell time is 4 seconds at 250 C. A mildly-activated flux will eliminate the need for removal of corrosive residues in most applications. Repairing soldered joints Fix the component by first soldering two diagonallyopposite end leads. Use only a low voltage soldering iron (less than 24 V) applied to the flat part of the lead. Contact time must be limited to 10 seconds at up to 300 C. When using a dedicated tool, all other leads can be soldered in one operation within 2 to 5 seconds between 270 and 320 C.
1997 Apr 11
11
Philips Semiconductors
Product specification
Quadrature demodulator
DEFINITIONS Data sheet status Objective specification Preliminary specification Product specification Limiting values
TDA8042M
This data sheet contains target or goal specifications for product development. This data sheet contains preliminary data; supplementary data may be published later. This data sheet contains final product specifications.
Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended periods may affect device reliability. Application information Where application information is given, it is advisory and does not form part of the specification. LIFE SUPPORT APPLICATIONS These products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. Philips customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such improper use or sale.
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Philips Semiconductors
Product specification
Quadrature demodulator
NOTES
TDA8042M
1997 Apr 11
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Philips Semiconductors
Product specification
Quadrature demodulator
NOTES
TDA8042M
1997 Apr 11
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Philips Semiconductors
Product specification
Quadrature demodulator
NOTES
TDA8042M
1997 Apr 11
15
Philips Semiconductors - a worldwide company
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For all other countries apply to: Philips Semiconductors, Marketing & Sales Communications, Building BE-p, P.O. Box 218, 5600 MD EINDHOVEN, The Netherlands, Fax. +31 40 27 24825 (c) Philips Electronics N.V. 1997
Internet: http://www.semiconductors.philips.com
SCA54
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner. The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license under patent- or other industrial or intellectual property rights.
Printed in The Netherlands
547047/1200/01/pp16
Date of release: 1997 Apr 11
Document order number:
9397 750 00909

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