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| CXA1851N Up/Down Converter for 900 MHz-Band Mobile Communications For the availability of this product, please contact the sales office. Description The CXA1851N is an up/down converter IC for 900 MHz-band mobile communications. This is suitable for 900 MHz-band digital cordless telephone (CT2) and digital cellular. 20 pin SSOP (Plastic) Features * * * * * Transmission/reception converter on a single chip Operating frequency: 800 to 900 MHz Supply voltage: 2.7 to 4.5 V Power saving function 20-pin SSOP package used for set size reduction Absolute Maximum Ratings (Ta=25C) * * * * Supply voltage Vcc 5 V Operating temperature Topr -20 to +75 C Storage temperature Tstg -65 to +150 C Allowable power dissipation PD 530 mW When mounted on a 505x0x1.6 mm copperfoiled glass epoxy board Applications * CT2 digital cordless telephone * Digital cellular Structure Bipolar silicon monolithic IC Recommended Operating Conditions Supply voltage Vcc 2.7 to 4.5 V Block Diagram and Pin Configuration LO IN (D) LO IN (U) MIX OUT2 11 10 IF OUT LO b (D) Vcc (D) LO b (U) 20 19 18 17 16 15 14 13 IF b MIX 12 OSC BUFFER AMP IF AMP MIX RF AMP 1 GND 2 RF b 3 RF IN 4 PEAKING OUT 5 P/S (D) 6 P/S (U) 7 Vcc (U) 8 RF OUT RF PRE AMP REG REG LNA GND IF IN 9 GND Sony reserves the right to change products and specifications without prior notice. This information does not convey any license by any implication or otherwise under any patents or other right. Application circuits shown, if any, are typical examples illustrating the operation of the devices. Sony cannot assume responsibility for any problems arising out of the use of these circuits. --1-- MIX OUT1 E93505-TE CXA1851N Pin Description Pin No. 1 2 3 Typical pin voltage (V) GND 0.0 RF BYPASS 1.1 Symbol RF INPUT 0.9 REG Equivalent circuit Description GND pin for the down converter. MIX input by-pass pin for the down converter. RF input pin for the down converter. Because of high impedance, a 4.7 nH external chip inductor should be used for impedance matching. Emitter pin for the low-noise amplifier. Connect an approximately 3 pF chip capacitor and an approximately 22 chip resistor in series to the GND. Power saving control pin for the down converter. OFF when Vp/s1.0 V; ON when Vp/s1.8 V Power saving control pin for the up converter. OFF when Vp/s1.0 V; ON when Vp/s1.8 V Power supply for the up converter. 2 4 PEAKING OUT 0.12 3 4 REG 5 P/S (for DOWN CONV.) 0 to 4.5 5 6 P/S (for UP CONV.) 0 to 4.5 6 7 VCC (for Up CONV.) RF OUTPUT 2.7 to 4.5 REG 8 8 2.7 (Vcc=2.7V) RF output pin for the up converter. Connect this pin to the Pin 7 power supply via the 15 nH chip inductor. GND pin for the up converter RF amplifier. 9 GND 0.0 --2-- CXA1851N Pin No. 10 11 Symbol MIX OUT1 MIX OUT2 Typical pin voltage (V) 2.3 2.3 Equivalent circuit 10 11 Description MIX output pin for the up converter. MIX output pin for the up converter. Connect an approximately 4.7 nH chip inductor and an approximately 3.5 pF chip capacitor between this pin and Pin 10 to form a tank circuit. GND pin for the oscillator buffer amplifier and mixer blocks of the up converter. IF input by-pass pin for the up converter. IF input pin for the up converter. Because of high impedance, an external matching circuit is necessary which consists of a 220 nH chip inductor and an approximately 1.5 pF chip capacitor. Oscillator input pin for the up converter. A matching circuit consisting of a 51 resistor is necessary. Oscillator input by-pass pin for the up converter. 12 GND 0.0 13 14 IF BYPASS IF INPUT 1.03 1.03 14 13 REG 15 OSC INPUT (for UP CONV.) OSC BYPASS (for UP CONV.) OSC BYPASS (for DOWN CONV.) OSC BYPASS (for DOWN CONV.) Vcc (for DOWN CONV.) IF OUTPUT 1.8 16 1.8 15 16 17 17 1.85 18 Oscillator input by-pass pin for the down converter. 18 1.85 19 2.7 to 4.5 Oscillator input pin for the down converter. A matching circuit consisting of a 51 resistor is necessary. Power supply for the down converter. 20 20 1.45 IF output pin for the down converter. --3-- CXA1851N Electrical Characteristics (Ta=25C, VCC=2.7V, ZL=ZS=50) Item Up Converter Block 1 Current consumption Conversion gain RF output power Noise figure Lo leak IF leak Standby current consumption Power saving control voltage Rise time Down Converter Block 3 Current consumption Conversion gain IF output power Third-order intermodulation distortion Noise figure Standby current consumption Power saving control voltage Rise time Symbol ICC CG Pout NF ISO (Lo) ISO (IF) ICC (PD) Vp/s (ON) Vp/s (OFF) Tup ICC CG Pout (IF) IM3 Conditions For no signal input Pin= - 40dBm Pin= -10dBm, 50 load DSB mode Pin= - 10dBm Pin= - 10dBm 6pin (P/S)<1.0V Min. 18.0 17.5 0 Typ. Max. Unit mA dB dBm dB dBm dBm A V V s 25.0 35.0 20.5 25.5 3 13 18 - 25.0 - 10 - 12.0 - 5 220 2 350 2 1.8 4.5 1.0 2.5 5.0 For no signal input 8.0 15.0 22.0 mA Pin= - 40dBm, 50 load 15.0 18.0 23.0 dB Pin= - 10dBm, 50 load - 4.5 - 2.0 dBm 49.0 dBc fRF1=866.4MHz, Pin1= - 40dBm 45 fRF2=866.8MHz, Pin2= - 40dBm NF DSB mode 7.5 10 dB ICC (PD) 5pin (P/S)1.0V 220 2 350 2 A Vp/s (ON) 1.8 4.5 V Vp/s (OFF) 1.0 V Tup 2.5 5.0 s 1: fIFin=150.05MHz, fRFout=864.05 to 868.05MHz fLoin=1014.10 to 1018.1MHz (- 9dBm) 2: These are the total values for the up and down converters. 3: fRFin=864.05 to 868.05MHz fLoin=1014.10 to 1018.1MHz (- 9dBm) Typical Reference characteristics (Ta=25C, VCC=2.7V, ZL=ZS=50) Item Up Converter Block Third-order intermodulation distortion Down Converter Block 1 dB compression Lo leak RF leak Symbol IM3 Conditions fIF1=150.4MHz, PIF1= - 30dBm fIF2=150.8MHz, PIF2= - 30dBm Output conversion, 50 load Pin= - 40dBm Pin= - 40dBm Typ. 39.0 Unit dBc P- 1dB ISO (Lo) ISO (RF) - 7.0 - 29.0 - 44.0 dBm dB dB --4-- GND 20 120p 1 IF OUT 1500p MIX 120p RF b 19 IF AMP Vcc (D) 30p 18 2 LNA 51 120p RF IN 3 4.7N PEAKING OUT 17 LO IN (D) LO b (D) 30p LO b (U) 30p 4 22 3p REG OSC BUFFER AMP 16 5 P/S (D) Electrical Characteristics Test Circuit 1 LO SG LO IN (U) 30p 15 6 REG RF AMP 180p 1500p P/S (U) --5-- 7 Vcc (U) 15n RF OUT IF IN 14 51 120p IF b 13 MIX 1.5p 120p GND 12 220n 8 120p GND RF PRE AMP 9 4.7N MIX OUT1 10 10p 4.7N MIX OUT2 11 IF SG CXA1851N Items: NF (D), NF (U) NF METER Electrical Characteristics Test Circuit 2 NOISE SOURCE GND 20 IF OUT 1500p Vcc (D) 30p LO IN (D) LO b (D) 30p LOSG 120p 1 MIX 120p RF b 19 IF AMP 51 2 LNA 18 120p RF IN 3 4.7N PEAKING OUT 17 4 22 REG 16 3p OSC BUFFER AMP LO b (U) 30p LO IN (U) 30p 5 P/S (D) 15 6 REG RF AMP 180n 1500p --6-- P/S (U) IF IN 14 7 Vcc (U) 15n RF OUT MIX 51 120p IF b 13 1.5p 120p GND 12 220n 8 120p GND RF PRE AMP 9 4.7N MIX OUT1 10 MIX OUT2 11 NF METER CXA1851N 10p 4.7N NOISE SOURCE Block diagram Digital cordless telephone chip set (CXA1744R/CXA1851N/CXA1852N) 10.7MHz RX FM DEMOD 150.05MHz 139.35MHz 27.87MHz PLL 1014 to 1018.2MHz PLL 300.1MHz RSSI x5 BIT STREAM 864 to 868.2MHz LNA RSSI FREE CH DETECTION 1 to 10mW SW CXA 1744R (IF A MP) --7-- I TX GCA F/F CXA 1851N (UP/DOWN CONV ERTER) 150.05MHz Q CXA 1852N (QUA DRA TURE MODULA TOR) CXA1851N CXA1851N (Down-Con) fRF vs. NF characteristics 15.0 Vcc=2.7V LO sweep (- 9dBm) Ta=25C Ta=80C Ta=-30C (Down-Con) fRF vs. CG characteristics 20.0 NF (dBm) 10.0 CG (dBm) 15.0 Vcc=2.7V LO sweep (- 9dBm) RF sweep (- 40dBm) IF=150MHz Ta=25C Ta=80C Ta=-30C 5.0 100 500 fRF (MHz) 1000 10.0 100 500 fRF (MHz) 1000 (Down-Con) Pin vs. Pout and IM3 characteristics 10 0 DS3 (Down-Con) LO input level vs. CG characteristics 25 Vcc=2.7V RF=866MHz (- 40dBm) LO=1016Hz (- 9dBm) Pout, 3rd order distortion (dBm) - 10 - 20 - 30 - 40 - 50 - 60 - 70 - 80 - 40 - 30 - 20 - 10 Pin (dBm) Ta=25C Ta=80C Ta=-30C Vcc=2.7V RF1=866.4MHz RF2=866.8MHz LO=1016Hz (- 9dBm) 20 CG (dB) 15 10 Ta=25C Ta=80C Ta=-30C 0 10 5 -27 - 24 - 21 - 18 - 15 - 12 - 9 - 6 LO Input level (dBm) -3 0 (Down-Con) fRF vs. NF characteristics 15.0 Vcc=4.5V LO sweep (- 9dBm) Ta=25C Ta=80C Ta=-30C (Down-Con) fRF vs. CG characteristics 25.0 NF (dBm) 10.0 CG (dBm) 20.0 15.0 Vcc=4.5V LO sweep (- 9dBm) RF sweep (- 40dBm) IF=150MHz Ta=25C Ta=80C Ta=-30C 5.0 100 500 fRF (MHz) 1000 10.0 100 500 fRF (MHz) 1000 --8-- CXA1851N (Down-Con) Pin vs. Pout and IM3 characteristics 10 0 (Down-Con) LO input level vs. CG characteristics 25 Pout, 3rd order distortion (dBm) - 10 - 20 - 30 - 40 - 50 - 60 - 70 - 80 - 40 - 30 - 20 - 10 Pin (dBm) Ta=25C Ta=80C Ta=-30C Vcc=4.5V RF1=866.4MHz RF2=866.8MHz LO=1016Hz (- 9dBm) 20 CG (dB) 15 Vcc=4.5V RF=866MHz (- 40dBm) LO=1016Hz (- 9dBm) 10 Ta=25C Ta=80C Ta=-30C 0 10 5 -27 - 24 - 21 - 18 - 15 - 12 - 9 - 6 LO input level (dBm) -3 0 (Down-Con) P/S voltage level vs. ICC characteristics 30.0 Vcc=2.7V No signal input (Down-Con) P/S voltage level vs ICC characteristics 30.0 Vcc=4.5V No signal input 25.0 25.0 20.0 20.0 Icc (mA) 15.0 Icc (mA) Ta=25C Ta=80C Ta=-30C 15.0 10.0 10.0 5.0 5.0 Ta=25C Ta=80C Ta=-30C 0 0 1.0 2.0 3.0 4.0 P/S voltage level (V) 5.0 0 0 1.0 2.0 3.0 P/S voltage level (V) 4.0 5.0 (Down-Con) Vcc vs. ICC characteristics 50 Vcc=VP/S No signal input (Up-Con) Vcc vs. ICC characteristics 50 Vcc=VP/S No signal input 40 Ta=25C Ta=80C Ta=-30C 40 Ta=25C Ta=80C Ta=-30C Icc (mA) Icc (mA) 30 30 20 20 10 Recommended operating range 10 Recommended operating range 0 0 1.0 2.0 2.7 3.0 Vcc (V) 4.0 4.5 5.0 0 0 1.0 2.0 2.7 3.0 4.0 4.5 5.0 Vcc (V) --9-- CXA1851N (Up-Con) Pin vs. Pout and IM3 characteristics 10 0 25 (Up-Con) LO input level vs. CG characteristics Pout, 3rd order distortion (dBm) - 10 - 20 - 30 - 40 - 50 - 60 - 70 - 80 - 40 - 30 - 20 - 10 Pin (dBm) Ta=25C Ta=80C Ta=-30C Vcc=2.7V IF1=150.4MHz IF2=150.8MHz LO=1016Hz (- 9dBm) 20 CG (dB) 15 Vcc=2.7V IF=150MHz (- 40dBm) LO=1016Hz 10 Ta=25C Ta=80C Ta=-30C 0 10 5 -27 - 24 - 21 - 18 - 15 - 12 - 9 - 6 LO input level (dBm) -3 0 (Up-Con) Pin vs. Pout and IM3 characteristics 10 0 25 (Up-Con) LO input level vs. CG characteristics Pout, 3rd order distortion (dBm) - 10 - 20 - 30 - 40 - 50 - 60 - 70 - 80 - 40 - 30 - 20 - 10 Pin (dBm) Ta=25C Ta=80C Ta=-30C Vcc=4.5V IF1=150.4MHz IF2=150.8MHz LO=1016Hz (- 9dBm) 20 CG (dB) 15 Vcc=2.7V IF=150MHz (- 40dBm) LO=1016Hz 10 Ta=25C Ta=80C Ta=-30C 0 10 5 -27 - 24 - 21 - 18 - 15 - 12 - 9 - 6 LO input level (dBm) -3 0 (Up-Con) P/S voltage level vs. ICC characteristics 50 Vcc=2.7V No signal input (Down-Con) P/S voltage level vs. ICC characteristics 50 Vcc=2.7V No signal input 40 40 Icc (mA) 20 Icc (mA) 30 30 20 Ta=25C Ta=80C Ta=-30C 10 Ta=25C Ta=80C Ta=-30C 10 0 0 1.0 2.0 3.0 P/S voltage level (V) 4.0 5.0 0 0 1.0 2.0 3.0 4.0 P/S voltage level (V) 5.0 --10-- CXA1851N Notes on Operation (1) Electrostatic sensitive diveces because of the high-frequency process. (2) Earth pattern should be as wide as possible and do not increase ground impedanse to prevent from the parasitic osellation. (3) Wire the GND pin as short as possible. (4) Connect a by-pass capacitor to the VCC pin. --11-- CXA1851N Package Outline Unit : mm 20PIN SSOP (PLASTIC) 7.0 MAX 20 11 4.4 0.1 1.0 0.1 + 0.10 0.15 - 0.05 6.4 0.2 A 1 0.65 10 + 0.10 0.22 - 0.05 0.10 M 1.5 0.1 1.8 MAX 0.1 0.1 0 to 10 0.575 MAX 0.15 DETAIL A PACKAGE STRUCTURE MOLDING COMPOUND SONY CODE EIAJ CODE JEDEC CODE SSOP-20P-L072 SSOP020-P-0225-BN LEAD TREATMENT LEAD MATERIAL PACKAGE WEIGHT EPOXY / PHENOL RESIN SOLDER PLATING COPPER ALLOY 0.1g --12-- 0.5 0.2 |
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