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Datasheet File OCR Text: |
MC14094B 8-Stage Shift/Store Register with Three-State Outputs The MC14094B combines an 8-stage shift register with a data latch for each stage and a three-state output from each latch. Data is shifted on the positive clock transition and is shifted from the seventh stage to two serial outputs. The QS output data is for use in high-speed cascaded systems. The QS output data is shifted on the following negative clock transition for use in low-speed cascaded systems. Data from each stage of the shift register is latched on the negative transition of the strobe input. Data propagates through the latch while strobe is high. Outputs of the eight data latches are controlled by three-state buffers which are placed in the high-impedance state by a logic Low on Output Enable. http://onsemi.com MARKING DIAGRAMS 16 PDIP-16 P SUFFIX CASE 648 MC14094BCP AWLYYWW 1 16 SOIC-16 D SUFFIX CASE 751B 1 16 TSSOP-16 DT SUFFIX CASE 948F 1 16 SOEIAJ-16 F SUFFIX CASE 966 1 A = Assembly Location WL or L = Wafer Lot YY or Y = Year WW or W = Work Week MC14094B AWLYWW 14 094B ALYW 14094B AWLYWW * Three-State Outputs * Capable of Driving Two Low-Power TTL Loads or One Low-Power * Input Diode Protection * Data Latch * Dual Outputs for Data Out on Both Positive and * * Negative Clock Transitions Useful for Serial-to-Parallel Data Conversion Pin-for-Pin Compatible with CD4094B Schottky TTL Load Over the Rated Temperature Range MAXIMUM RATINGS (Voltages Referenced to VSS) (Note 2.) Symbol VDD Vin, Vout Iin, Iout PD TA Tstg TL Parameter DC Supply Voltage Range Input or Output Voltage Range (DC or Transient) Input or Output Current (DC or Transient) per Pin Power Dissipation, per Package (Note 3.) Ambient Temperature Range Storage Temperature Range Lead Temperature (8-Second Soldering) Value - 0.5 to +18.0 - 0.5 to VDD + 0.5 10 500 - 55 to +125 - 65 to +150 260 Unit V V mA mW ORDERING INFORMATION C C C Device MC14094BCP MC14094BD MC14094BDR2 MC14094BDT MC14094BDTR2 MC14094BF Package PDIP-16 SOIC-16 SOIC-16 TSSOP-16 TSSOP-16 SOEIAJ-16 Shipping 2000/Box 48/Rail 2500/Tape & Reel 96/Rail 2500/Tape & Reel See Note 1. 2. Maximum Ratings are those values beyond which damage to the device may occur. 3. Temperature Derating: Plastic "P and D/DW" Packages: - 7.0 mW/_C From 65_C To 125_C This device contains protection circuitry to guard against damage due to high static voltages or electric fields. However, precautions must be taken to avoid applications of any voltage higher than maximum rated voltages to this high-impedance circuit. For proper operation, Vin and Vout should be constrained to the range VSS (Vin or Vout) VDD. Unused inputs must always be tied to an appropriate logic voltage level (e.g., either VSS or VDD). Unused outputs must be left open. v v 1. For ordering information on the EIAJ version of the SOIC packages, please contact your local ON Semiconductor representative. (c) Semiconductor Components Industries, LLC, 2000 1 March, 2000 - Rev. 3 Publication Order Number: MC14094B/D MC14094B PIN ASSIGNMENT STROBE DATA CLOCK Q1 Q2 Q3 Q4 VSS 1 2 3 4 5 6 7 8 16 15 14 13 12 11 10 9 VDD OUTPUT ENABLE Q5 Q6 Q7 Q8 QS QS Clock Output Enable 0 0 1 1 1 1 Parallel Outputs Strobe X X 0 1 1 1 Data X X X 0 1 1 Q1 Z Z No Chg. 0 1 No Chg. QN Z Z No Chg. QN-1 QN-1 No Chg. Serial Outputs QS * Q7 No Chg. Q7 Q7 Q7 No Chg. QS No Chg. Q7 No Chg. No Chg. No Chg. Q7 Z = High Impedance X = Don't Care * At the positive clock edge, information in the 7th shift register stage is transferred to Q8 and QS. http://onsemi.com 2 II IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII III II IIII I I II I I III IIIIIIIIIIIIIIIIIIIIIIIIIIIIIII II I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII III II IIII I I II I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII III I I I I I I I I I I I II I II I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIIIIIIIIIIIIIIIIIIIIIIIIIIIIII III I I I I I I I I I III II IIII I III II IIII I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIII II IIII I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII III II IIII I III II IIII I II II IIII I I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII III II IIII I III I I I I I I I I I III II IIII I I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIIIIIIIIIIIIIIIIIIIIIIIIIIIIII II II IIII I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII III II IIII I III II IIII I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII III I I I I I I I I I III II IIII I I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIIIIIIIIIIIIIIIIIIIIIIIIIIIIII II II IIII I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII III II IIII I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII III I I I I I I I I I III II IIII I II IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIIIIIIIIIIIIIIIIIIIIIIIIIIIIII II II IIII I I II IIII I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII III II IIII I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII III II IIII I I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII III II IIII I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII III II IIII I III II IIII I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII II I I I I I I I I I III I II I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII III II IIII I IIIIIII I I I I I I I III IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIIIIIIIIIIIIIIIIIIIIIIIIII IIIIIIIIIIIIIIIIIIIIIIIIIIIIIII I II IIII I I II I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII III II IIII I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII 4. Data labelled "Typ" is not to be used for design purposes but is intended as an indication of the IC's potential performance. 5. The formulas given are for the typical characteristics only at 25_C. 6. To calculate total supply current at loads other than 50 pF: where: IT is in A (per package), CL in pF, V = (VDD - VSS) in volts, f in kHz is input frequency, and k = 0.001. ELECTRICAL CHARACTERISTICS (Voltages Referenced to VSS) 3-State Output Leakage Current Total Supply Current (5.) (6.) (Dynamic plus Quiescent, Per Package) (CL = 50 pF on all outputs, all buffers switching) Quiescent Current (Per Package) Input Capacitance (Vin = 0) Input Current Output Drive Current (VOH = 2.5 Vdc) (VOH = 4.6 Vdc) (VOH = 9.5 Vdc) (VOH = 13.5 Vdc) Input Voltage "0" Level (VO = 4.5 or 0.5 Vdc) (VO = 9.0 or 1.0 Vdc) (VO = 13.5 or 1.5 Vdc) Output Voltage Vin = VDD or 0 (VOL = 0.4 Vdc) (VOL = 0.5 Vdc) (VOL = 1.5 Vdc) (VO = 0.5 or 4.5 Vdc) (VO = 1.0 or 9.0 Vdc) (VO = 1.5 or 13.5 Vdc) Vin = 0 or VDD Characteristic IT(CL) = IT(50 pF) + (CL - 50) Vfk "1" Level "1" Level "0" Level Source Sink Symbol VOH VOL IOH VIH IDD Cin IOL VIL ITL Iin IT VDD Vdc 5.0 10 15 5.0 10 15 5.0 10 15 5.0 5.0 10 15 5.0 10 15 5.0 10 15 5.0 10 15 5.0 10 15 15 15 -- http://onsemi.com - 3.0 - 0.64 - 1.6 - 4.2 4.95 9.95 14.95 0.64 1.6 4.2 Min 3.5 7.0 11 -- -- -- -- -- -- -- -- -- -- -- -- MC14094B - 55_C 3 0.1 0.1 0.05 0.05 0.05 Max 5.0 10 20 1.5 3.0 4.0 -- -- -- -- -- -- -- -- -- -- -- -- -- -- - 2.4 - 0.51 - 1.3 - 3.4 4.95 9.95 14.95 0.51 1.3 3.4 Min 3.5 7.0 11 IT = (4.1 A/kHz) f + IDD IT = (14 A/kHz) f + IDD IT = (140 A/kHz) f + IDD -- -- -- -- -- -- -- -- -- -- -- -- 0.00001 0.0001 Typ (4.) - 4.2 - 0.88 - 2.25 - 8.8 0.005 0.010 0.015 25_C 0.88 2.25 8.8 2.75 5.50 8.25 2.25 4.50 6.75 5.0 5.0 10 15 0 0 0 0.1 0.1 0.05 0.05 0.05 Max 5.0 10 20 7.5 1.5 3.0 4.0 -- -- -- -- -- -- -- -- -- -- -- -- -- - 1.7 - 0.36 - 0.9 - 2.4 4.95 9.95 14.95 0.36 0.9 2.4 Min 3.5 7.0 11 -- -- -- -- -- -- -- -- -- -- -- -- 125_C 3.0 1.0 0.05 0.05 0.05 150 300 600 1.5 3.0 4.0 -- -- -- -- -- -- -- -- -- -- -- -- -- -- Unit MaxIII mAdc mAdc Adc Adc Adc Vdc Vdc Vdc Vdc A pF III I I I I I I I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIII I II I I I I I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIIII I I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIIII I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIIII I IIIII I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIIII I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIIII I IIIII I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIIII I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIIII I IIIII I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIIII I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIIII I IIIII I I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIIII I III I I I I I IIIII I II IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIII I III I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIIII I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII III I I I I I I I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIII I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIIII I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIIII I IIIII I IIII I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIIII I I I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIIII I II I I I I I IIIII I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII III I I I I I IIIII I I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIII I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIIII I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIIII I IIIII I IIII I I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII I IIIII I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIIII I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII III I I I I I IIIII I I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIII I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII II I I I I I IIIII I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII I IIIII I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIIII I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIIII I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII 7. The formulas given are for the typical characteristics only at 25_C. 8. Data labelled "Typ" is not to be used for design purposes but is intended as an indication of the IC's potential performance. SWITCHING CHARACTERISTICS (7.) (CL = 50 pF, TA = 25_C) Strobe Pulse Width Clock Pulse Frequency Clock Rise and Fall Time Clock Pulse Width, High Hold Time Clock to Data Setup Time Data in to Clock Propagation Delay Time Clock to Serial out QS tPLH, tPHL = (0.90 ns/pF) CL + 305 ns tPLH, tPHL = (0.36 ns/pF) CL + 107 ns tPLH, tPHL = (0.26 ns/pF) C L + 82 ns Output Rise and Fall Time tTLH, tTHL = (1.35 ns/pF) CL + 33 ns tTLH, tTHL = (0.6 ns/pF) CL + 20 ns tTLH, tTHL = (0.4 ns/pF) CL + 20 ns Output Enable to Output tPHZ, tPZL = (0.90 ns/pF) CL + 95 ns tPHZ, tPZL = (0.36 ns/PF) CL + 57 ns tPHZ, tPZL = (0.26 ns/pF) CL + 42 ns Strobe to Parallel out tPLH, tPHL = (0.90 ns/pF) CL + 245 ns tPLH, tPHL = (0.36 ns/pF) C L + 127 ns tPLH, tPHL = (0.26 ns/pF) CL + 87 ns Clock to Parallel out tPLH, tPHL = (0.90 ns/pF) CL + 375 ns tPLH, tPHL = (0.35 ns/pF) CL + 177 ns tPLH, tPHL = (0.26 ns/pF) CL + 122 ns Clock to Serial out Q'S tPLH, tPHL = (0.90 ns/pF) CL + 350 ns tPLH, tPHL = (0.36 ns/pF) CL + 149 ns tPLH, tPHL = (0.26 ns/pF) CL + 62 ns tPLZ, tPZH = (0.90 ns/pF) CL + 180 ns tPLZ, tPZH = (0.36 ns/pF) CL + 77 ns tPLZ, tPZH = (0.26 ns/pF) CL + 57 ns Characteristic http://onsemi.com Symbol MC14094B tPHZ, tPZL tPLH, tPHL tTLH, tTHL tPLZ, tPZH tr(cl) tf(cl) tWH tWL tsu fcl th 4 VDD Vdc 5.0 10 15 5.0 10 15 5.0 10 15 5.0 10 15 5.0 10 15 5.0 10 15 5.0 10 15 5.0 10 15 5.0 10 15 5.0 10 15 5.0 10 15 5.0 10 15 5 10 15 Min 200 80 70 200 100 83 125 55 35 0 20 20 -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- Typ (8.) - 40 - 10 0 100 40 35 100 50 40 225 95 70 140 75 55 290 145 100 420 195 135 230 110 75 350 125 95 100 50 40 2.5 5.0 6.0 60 30 20 -- -- -- 1.25 2.5 3.0 Max 450 190 140 280 150 110 580 290 200 840 390 270 460 220 150 600 250 190 200 100 80 15 5.0 4.0 -- -- -- -- -- -- -- -- -- -- -- -- MHz Unit s ns ns ns ns ns ns MC14094B 3-STATE TEST CIRCUIT FOR tPHZ AND tPZH VSS FOR tPLZ AND tPZL VDD O.E. DATA ST CLOCK 1k OUTPUT 50 pF BLOCK DIAGRAM REGISTER STAGE 1 CLOCK 2 CLOCK LATCH 1 STROBE 3-STATE BUFFER 1 VDD * SERIAL DATA IN CLOCK CLOCK STROBE STROBE 4 Q1 CLOCK 15 CLOCK STROBE * 2 OUTPUT ENABLE 3 4 5 6 7 REGISTER STAGE 2 REGISTER STAGE 3 REGISTER STAGE 4 REGISTER STAGE 5 REGISTER STAGE 6 REGISTER STAGE 7 LATCH 2 LATCH 3 LATCH 4 LATCH 5 LATCH 6 LATCH 7 3-STATE BUFFER 2 3-STATE BUFFER 3 3-STATE BUFFER 4 3-STATE BUFFER 5 3-STATE BUFFER 6 3-STATE BUFFER 7 5 6 7 14 13 12 Q2 Q3 Q4 Q5 Q6 Q7 8 REGISTER STAGE 8 CLOCK CLOCK LATCH 8 STROBE STROBE CLOCK 3-STATE BUFFER 8 11 Q8 10 3 QS * CLOCK CLOCK CLOCK CLOCK CLOCK 1 * STROBE STROBE STROBE *Input Protection Diodes CLOCK 9 QS http://onsemi.com 5 MC14094B DYNAMIC TIMING DIAGRAM tWH tr 50% th 50% 90% 10% tsu 2 tf 3 CLOCK DATA IN tWL 1 STROBE 15 OUTPUT ENABLE tPLH tPHL 90% 10% tTHL tPLH 50% tPLH 50% tPHZ 90% 10% tPHL 50% tPLH tPZH tPLZ 50% tPZL 90% 10% N Q1 Q7 tTLH 90% 10% 9 QS tPHL 50% 10 QS 50% PACKAGE DIMENSIONS -A- 16 9 PDIP-16 P SUFFIX PLASTIC DIP PACKAGE CASE 648-08 ISSUE R B 1 8 NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. DIMENSION L TO CENTER OF LEADS WHEN FORMED PARALLEL. 4. DIMENSION B DOES NOT INCLUDE MOLD FLASH. 5. ROUNDED CORNERS OPTIONAL. DIM A B C D F G H J K L M S INCHES MIN MAX 0.740 0.770 0.250 0.270 0.145 0.175 0.015 0.021 0.040 0.70 0.100 BSC 0.050 BSC 0.008 0.015 0.110 0.130 0.295 0.305 0_ 10 _ 0.020 0.040 MILLIMETERS MIN MAX 18.80 19.55 6.35 6.85 3.69 4.44 0.39 0.53 1.02 1.77 2.54 BSC 1.27 BSC 0.21 0.38 2.80 3.30 7.50 7.74 0_ 10 _ 0.51 1.01 F S C L -T- H G D 16 PL SEATING PLANE K J TA M M 0.25 (0.010) M http://onsemi.com 6 MC14094B PACKAGE DIMENSIONS SOIC-16 D SUFFIX PLASTIC SOIC PACKAGE CASE 751B-05 ISSUE J NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETER. 3. DIMENSIONS A AND B DO NOT INCLUDE MOLD PROTRUSION. 4. MAXIMUM MOLD PROTRUSION 0.15 (0.006) PER SIDE. 5. DIMENSION D DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL BE 0.127 (0.005) TOTAL IN EXCESS OF THE D DIMENSION AT MAXIMUM MATERIAL CONDITION. MILLIMETERS MIN MAX 9.80 10.00 3.80 4.00 1.35 1.75 0.35 0.49 0.40 1.25 1.27 BSC 0.19 0.25 0.10 0.25 0_ 7_ 5.80 6.20 0.25 0.50 INCHES MIN MAX 0.386 0.393 0.150 0.157 0.054 0.068 0.014 0.019 0.016 0.049 0.050 BSC 0.008 0.009 0.004 0.009 0_ 7_ 0.229 0.244 0.010 0.019 -A- 16 9 -B- 1 8 P 8 PL 0.25 (0.010) M B S G F K C -T- SEATING PLANE R X 45 _ M D 16 PL M J 0.25 (0.010) TB S A S DIM A B C D F G J K M P R TSSOP-16 DT SUFFIX PLASTIC TSSOP PACKAGE CASE 948F-01 ISSUE O 16X K REF 0.10 (0.004) 0.15 (0.006) T U S M TU S V S K K1 16 NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETER. 3. DIMENSION A DOES NOT INCLUDE MOLD FLASH. PROTRUSIONS OR GATE BURRS. MOLD FLASH OR GATE BURRS SHALL NOT EXCEED 0.15 (0.006) PER SIDE. 4. DIMENSION B DOES NOT INCLUDE INTERLEAD FLASH OR PROTRUSION. INTERLEAD FLASH OR PROTRUSION SHALL NOT EXCEED 0.25 (0.010) PER SIDE. 5. DIMENSION K DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL BE 0.08 (0.003) TOTAL IN EXCESS OF THE K DIMENSION AT MAXIMUM MATERIAL CONDITION. 6. TERMINAL NUMBERS ARE SHOWN FOR REFERENCE ONLY. 7. DIMENSION A AND B ARE TO BE DETERMINED AT DATUM PLANE -W-. DIM A B C D F G H J J1 K K1 L M MILLIMETERS MIN MAX 4.90 5.10 4.30 4.50 --- 1.20 0.05 0.15 0.50 0.75 0.65 BSC 0.18 0.28 0.09 0.20 0.09 0.16 0.19 0.30 0.19 0.25 6.40 BSC 0_ 8_ INCHES MIN MAX 0.193 0.200 0.169 0.177 --- 0.047 0.002 0.006 0.020 0.030 0.026 BSC 0.007 0.011 0.004 0.008 0.004 0.006 0.007 0.012 0.007 0.010 0.252 BSC 0_ 8_ 2X L/2 J1 B -U- L PIN 1 IDENT. 1 8 SECTION N-N J N 0.25 (0.010) 0.15 (0.006) T U S A -V- N F DETAIL E C 0.10 (0.004) -T- SEATING PLANE H D G DETAIL E http://onsemi.com 7 CCC EE CCC EE M 9 -W- MC14094B PACKAGE DIMENSIONS SOEIAJ-16 F SUFFIX PLASTIC EIAJ SOIC PACKAGE CASE 966-01 ISSUE O LE Q1 E HE 1 8 16 9 M_ L DETAIL P Z D e A VIEW P NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETER. 3. DIMENSIONS D AND E DO NOT INCLUDE MOLD FLASH OR PROTRUSIONS AND ARE MEASURED AT THE PARTING LINE. MOLD FLASH OR PROTRUSIONS SHALL NOT EXCEED 0.15 (0.006) PER SIDE. 4. TERMINAL NUMBERS ARE SHOWN FOR REFERENCE ONLY. 5. THE LEAD WIDTH DIMENSION (b) DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL BE 0.08 (0.003) TOTAL IN EXCESS OF THE LEAD WIDTH DIMENSION AT MAXIMUM MATERIAL CONDITION. DAMBAR CANNOT BE LOCATED ON THE LOWER RADIUS OR THE FOOT. MINIMUM SPACE BETWEEN PROTRUSIONS AND ADJACENT LEAD TO BE 0.46 ( 0.018). DIM A A1 b c D E e HE L LE M Q1 Z MILLIMETERS MIN MAX --- 2.05 0.05 0.20 0.35 0.50 0.18 0.27 9.90 10.50 5.10 5.45 1.27 BSC 7.40 8.20 0.50 0.85 1.10 1.50 10 _ 0_ 0.70 0.90 --- 0.78 INCHES MIN MAX --- 0.081 0.002 0.008 0.014 0.020 0.007 0.011 0.390 0.413 0.201 0.215 0.050 BSC 0.291 0.323 0.020 0.033 0.043 0.059 10 _ 0_ 0.028 0.035 --- 0.031 c b 0.13 (0.005) M A1 0.10 (0.004) ON Semiconductor and are trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. 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