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| HI-SINCERITY MICROELECTRONICS CORP. Spec. No. : HE9028 Issued Date : 1994.01.25 Revised Date : 2001.12.19 Page No. : 1/3 HI10387 NPN EPITAXIAL PLANAR TRANSISTOR Description The HI10387 is designed for general-purpose amplifier and lowspeed switching applications. Absolute Maximum Ratings (Ta=25C) TO-251 * Maximum Temperatures Storage Temperature .............................................................................................. -55~+150 C Junction Temperature ....................................................................................... 150C Maximum * Maximum Power Dissipation Total Power Dissipation (Tc=25C) ..................................................................................... 65 W Total Power Dissipation (Ta=25C) ....................................................................................... 2 W * Maximum Voltages and Currents (Ta=25C) VCBO Collector to Base Voltage ......................................................................................... 80 V VCEO Collector to Emitter Voltage ...................................................................................... 80 V VEBO Emitter to Base Voltage .............................................................................................. 5 V IC Collector Current ............................................................................................................ 10 A Characteristics (Ta=25C) Symbol BVCEO ICBO IEBO ICEO ICEV VCE(sat)1 VCE(sat)2 VCE(sat)3 VBE(sat) VBE(on)1 VBE(on)2 VFEC hFE1 hFE2 Min. 80 2 100 Typ. Max. 100 2 1 300 2 3 1.5 2 2.8 4.5 3 20 Unit V uA mA mA uA V V V V V V V K Test Conditions IC=200mA VCB=160V VEB=5V VCE=80V VCE=80V, VBE(Off)=1.5V IC=5A, IB=10mA IC=10A, IB=100mA IC=5A, IB=2.5mA IC=5A, IB=5mA VCE=3V, IC=5A VCE=3V, IC=10A IC=5A IC=5A, VCE=3V VCE=3V, IC=10A Classification Of VCE(sat)1 Rank VCE(sat)1 KA <1.5, BVCEO>130V KB <1.1V KC <1.3V NORMAL <2V HI10387 HSMC Product Specification HI-SINCERITY MICROELECTRONICS CORP. Characteristics Curve Current Gain & Collector Current 10000 10000 Spec. No. : HE9028 Issued Date : 1994.01.25 Revised Date : 2001.12.19 Page No. : 2/3 Saturation Voltage & Collector Current hFE @ VCE=3V Saturation Voltage (mV) 1000 hFE 100 1000 VBE(sat) @ IC=100IB VCE(sat) @ IC=100IB 10 1 1 10 100 1000 10000 100 100 1000 10000 Collector Current (mA) Collector Current (mA) On Voltage & Collector Current 10000 Switching Time & Collector Current 10 VCC=30 V, IC=250IB1=-250IB2 Switching Times (us) On Voltage (mV) Tstg 1000 VBE(on) @ VCE=3V 1 Tf Ton 100 10 100 1000 10000 0.1 1 10 Collector Current (mA) Collector Current (A) Capacitance & Reverse-Biased Voltage 1000 10000 Safe Operating Area PT=1ms PT=100ms 1000 Collector Current (mA) Capacitance (pF) PT=1s 100 100 Cob 10 10 0.1 1 10 100 1 1 10 100 Reverse-Biased Voltage (V) Forward Voltage (V) HI10387 HSMC Product Specification HI-SINCERITY MICROELECTRONICS CORP. TO-251 Dimension Marking: HSMC Logo Part Number Date Code Spec. No. : HE9028 Issued Date : 1994.01.25 Revised Date : 2001.12.19 Page No. : 3/3 A B C D Product Series Rank Ink Mark F 3 I E K 2 1 G Style: Pin 1.Base 2.Collector 3.Emitter H J 3-Lead TO-251 Plastic Package HSMC Package Code: I *: Typical DIM A B C D E F Inches Min. Max. 0.0177 0.0217 0.0354 0.0591 0.0177 0.0236 0.0866 0.0945 0.2520 0.2677 0.2677 0.2835 Millimeters Min. Max. 0.45 0.55 0.90 1.50 0.45 0.60 2.20 2.40 6.40 6.80 6.80 7.20 DIM G H I J K Inches Min. Max. 0.2559 *0.1811 0.0354 0.0315 0.2047 0.2165 Millimeters Min. Max. 6.50 *4.60 0.90 0.80 5.20 5.50 Notes: 1.Dimension and tolerance based on our Spec. dated May. 24,1995. 2.Controlling dimension: millimeters. 3.Maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material. 4.If there is any question with packing specification or packing method, please contact your local HSMC sales office. Material: * Lead: 42 Alloy ; solder plating * Mold Compound: Epoxy resin family, flammability solid burning class: UL94V-0 Important Notice: * All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of HSMC. * HSMC reserves the right to make changes to its products without notice. * HSMC semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems. * HSMC assumes no liability for any consequence of customer product design, infringement of patents, or application assistance. Head Office And Factory: * Head Office (Hi-Sincerity Microelectronics Corp.): 10F.,No. 61, Sec. 2, Chung-Shan N. Rd. Taipei Taiwan R.O.C. Tel: 886-2-25212056 Fax : 886-2-25632712, 25368454 * Factory 1: No. 38, Kuang Fu S. Rd., Fu-Kou Hsin-Chu Industrial Park Hsin-Chu Taiwan. R.O.C Tel: 886-3-5983621~5 Fax: 886-3-5982931 HI10387 HSMC Product Specification |
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