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FDP7045L/FDB7045L January 2000 FDP7045L/FDB7045L General Description N-Channel Logic Level PowerTrench(R) MOSFET Features 100 A, 30 V. RDS(ON) = 0.0045 W @ VGS = 10 V RDS(ON) = 0.006 W @ VGS = 4.5 V. Critical DC electrical parameters specified at elevated temperature. Rugged internal source-drain diode can eliminate the need for an external Zener diode transient suppressor. High performance PowerTrench technology for extremely low RDS(ON). 175C maximum junction temperature rating. This N-Channel Logic Level MOSFET has been designed specifically to improve the overall efficiency of DC/DC converters using either synchronous or conventional switching PWM controllers. These MOSFETs feature faster switching and lower gate charge than other MOSFETs with comparable R DS(on) specifications resulting in DC/DC power supply designs with higher overall efficiency. D D G G D TO-220 S FDP Series G S TO-263AB FDB Series S Absolute Maximum Ratings Symbol VDSS VGSS ID Drain-Source Voltage Gate-Source Voltage Maximum Drain Current TC = 25C unless otherwise noted Parameter FDP7045L 30 20 FDB7045L Units V V A - Continuous - Pulsed (Note 1) (Note 1) 100 75 300 125 0.85 -65 to +175 PD TJ, TSTG RJC RJA Total Power Dissipation @ TC = 25C Derate above 25C Operating and Storage Junction Temperature Range W W/C C C/W C/W Thermal Characteristics Thermal Resistance, Junction-to-Case Thermal Resistance, Junction-to-Ambient 1.2 62.5 Package Outlines and Ordering Information Device Marking FDB7045L FDP7045L a1999 Fairchild Semiconductor Corporation Device FDB7045L FDP7045L Reel Size 13'' Tube Tape Width 24mm N/A Quantity 800 45 FDP7045L/FDB7045L Rev.C FDP7045L/FDB7045L Electrical Characteristics Symbol BVDSS BVDSS T J IDSS IGSSF IGSSR TC = 25C unless otherwise noted Parameter Test Conditions Min 30 Typ Max Units V Off Characteristics Drain-Source Breakdown VGS = 0 V, ID = 250 A Voltage Breakdown Voltage Temperature ID = 250 A, Referenced to 25C Coefficient Zero Gate Voltage Drain Current VDS = 24 V, VGS = 0 V Gate-Body Leakage Current, Forward Gate-Body Leakage Current, Reverse (Note 2) 22 1 100 -100 mV/C A nA nA VGS = 20 V, VDS = 0 V VGS = -20 V, VDS = 0 V On Characteristics VGS(th) VGS(th) T J RDS(on) Gate Threshold Voltage Gate Threshold Voltage Temperature Coefficient Static Drain-Source On-Resistance On-State Drain Current Forward Transconductance VDS = VGS, ID = 250 A ID = -250 A, Referenced to 25C VGS = 10 V, ID = 50 A, VGS = 10 V, ID = 50 A, TJ=125C VGS = 4.5 V,ID = 40 A VGS = 10 V, VDS = 10 V VDS = 5 V, ID = 50 A 1 1.5 -5 0.0039 0.0056 0.0048 3 V mV/C 0.0045 0.0070 0.0060 ID(on) gFS 50 120 A S Dynamic Characteristics Ciss Coss Crss Input Capacitance Output Capacitance Reverse Transfer Capacitance (Note 2) VDS = 15 V, VGS = 0 V, f = 1.0 MHz 5400 1170 530 pF pF pF Switching Characteristics td(on) tr td(off) tf Qg Qgs Qgd Turn-On Delay Time Turn-On Rise Time Turn-Off Delay Time Turn-Off Fall Time Total Gate Charge Gate-Source Charge Gate-Drain Charge VDD = 15 V, ID = 50 A, VGS = 10 V 14 114 105 115 30 160 150 160 70 ns ns ns ns nC nC nC VDS = 15 V, ID = 50 A, VGS = 5 V 50 16 16 Drain-Source Diode Characteristics and Maximum Ratings IS VSD Maximum Continuous Drain-Source Diode Forward Current Drain-Source Diode Forward Voltage V = 0 V, I = 50 A (Note 2) (Note 2) 75 0.95 1.2 A V Notes: 1. Calculated continuous current based on maximum allowable junction temperature. Actual maximum continuous current limited by package constraints to 75A. 2. Pulse Test: Pulse Width 300 ms, Duty Cycle 2.0% FDP7045L/FDB7045L Rev.C FDP7045L/FDB7045L Typical Characteristics 80 3.5V 3.0V 2.2 RDS(ON), NORMALIZED DRAIN-SOURCE ON-RESISTANCE VGS = 10V 4.5V ID, DRAIN-SOURCE CURRENT (A) 2 1.8 1.6 1.4 1.2 1 0.8 3.5V 4.0V 4.5V 5.0V 6.0V 7.0V 10V 60 V GS = 3.0V 40 2.5V 20 0 0 0.5 1 1.5 2 VDS, DRAIN-SOURCE VOLTAGE (V) 0 20 40 ID , DRAIN CURRENT (A) 60 80 Figure 1. On-Region Characteristics. Figure 2. On-Resistance Variation with Drain Current and Gate Voltage. 0.014 RDS(ON), ON-RESISTANCE (OHM) ID = 38A 0.012 0.01 0.008 TA = 125oC 0.006 0.004 0.002 0 2 4 6 8 10 VGS, GATE TO SOURCE VOLTAGE (V) 1.8 RDS(ON), NORMALIZED DRAIN-SOURCE ON-RESISTANCE 1.6 1.4 1.2 1 0.8 0.6 -50 -25 0 25 50 75 100 o ID = 50A VGS = 10V TA = 25oC 125 150 175 TJ, JUNCTION TEMPERATURE ( C) Figure 3. On-Resistance Variation with Temperature. 60 50 ID, DRAIN CURRENT (A) 40 30 20 TA = 125oC 10 0 1 1.5 2 2.5 3 3.5 4 VGS, GATE TO SOURCE VOLTAGE (V) 25oC -55oC Figure 4. On-Resistance Variation with Gate-to-Source Voltage. 100 IS, REVERSE DRAIN CURRENT (A) VDS = 5V VGS = 0V 10 1 0.1 0.01 0.001 0.0001 0 0.2 0.4 0.6 0.8 1 1.2 1.4 VSD, BODY DIODE FORWARD VOLTAGE (V) TA = 125oC 25oC -55oC Figure 5. Transfer Characteristics. Figure 6. Body Diode Forward Voltage Variation with Source Current and Temperature. FDP7045L/FDB7045L Rev.C FDP7045L/FDB7045L Typical Characteristics 10 ID = 50A 8 (continued) 7000 VDS = 5V 10V 15V 6000 CISS 5000 4000 3000 2000 f = 1MHz VGS = 0 V 6 4 2 1000 0 0 20 40 60 80 100 COSS CRSS 0 5 10 15 20 25 30 Qg, GATE CHARGE (nC) VDS, DRAIN TO SOURCE VOLTAGE (V) Figure 7. Gate-Charge Characteristics. Figure 8. Capacitance Characteristics. 1000 10s RDS(ON) LIMIT 100 100s 1ms 10ms 100ms 5000 SINGLE PULSE 4000 RJC = 1.2 C/W TC = 25 C 3000 o o 2000 10 VGS = 10V SINGLE PULSE RJC = 1.2 C/W TC = 25 C 1 0.1 1 10 100 o o 1000 0 0.01 0.1 1 10 100 1000 VDS, DRAIN-SOURCE VOLTAGE (V) SINGLE PULSE TIME (SEC) Figure 9. Maximum Safe Operating Area. Figure 10. Single Pulse Maximum Power Dissipation. 1 TRANSIENT THERMAL RESISTANCE r(t), NORMALIZED EFFECTIVE 0.5 0.3 0.2 0.1 0.05 D = 0.5 0.2 0.1 R JC (t) = r(t) * RJC R JC = 1.2 C/W P(pk) 0.05 0.02 t1 0.03 0.02 t2 0.01 Single Pulse TJ - TC = P * RJC (t) Duty Cycle, D = t 1 / t 2 0.1 0.5 1 5 t 1 ,TIME (ms) 10 50 100 500 1000 0.01 0.01 0.05 Figure 11. Transient Thermal Response Curve. Thermal characterization performed using the conditions described in Note 1. Transient themal response will change depending on the circuit board design. FDP7045L/FDB7045L Rev.C TO-220 Tape and Reel Data and Package Dimensions TO-220 Tube Packing Configuration: Figur e 1.0 Packaging Description: TO-220 parts are ship ped normally in tube. The tube is made of PVC plastic treated with anti -stati c agent.These tubes in standard option are placed inside a dissipative plastic bag, barcode labeled, and placed inside a box made of recyclable corrugated pa per. One box contains two ba gs maximum (see fig. 1.0). And one or several o f these boxes are placed inside a labeled shipp ing bo x whic h c omes in different sizes dependi ng on the nu mber of parts ship ped. The other option comes in bulk as described in the Packagin g Information table. The unit s in this option are placed inside a small box laid w ith antistatic bubble sheet. These smaller boxes are individually labeled and placed ins ide a larger box (see fig. 3.0). These larger or intermediate boxes then will b e placed finally inside a labeled shipping box whic h still comes in different sizes depending on the number of units shipped. 45 unit s per Tube 12 Tubes per Bag 2 bag s per Box Conduct ive Plasti c B ag 530mm x 130mm x 83mm Intermediate box TO-220 Packaging Information: Figure 2.0 TO-220 Packaging Information Packaging Option Packaging type Qty per Tube/Box Box Dimension (mm) Max qty per Box Weight per unit (gm) Note/Comments Standard (no f l ow code ) FSCINT Labe l samp le FAIRCHILD SEMICONDUCTOR CORPORATION 1080 uni ts maxi mum quant it y per bo x S62Z BULK 300 LOT: CBVK741B019 QTY: HTB:B 1080 NSID: FDP7060 SPEC: Rail/Tube 45 530x130x83 1,080 1.4378 D/C1: D9842 SPEC REV: QA REV: B2 114x102x51 1,500 1.4378 FSCINT Label (FSCINT) TO-220 bulk Packing Configuration: Figure 3.0 FSCINT Label An ti-stati c Bubbl e Sheet s 530mm x 130mm x 83mm Intermediate box 1500 uni ts maxi mum quant it y per intermediate box 300 units per EO70 box 114mm x 102mm x 51mm EO70 Immed iate Box 5 EO70 boxe s per per Interm ediate Bo x FSCINT Label TO-220 Tube Configuration: Figure 4.0 Note: All dim ensions are in inches 0.123 +0.001 -0.003 0.165 0.080 0.450 .030 1.300 .015 0.032 .003 0.275 F9852 NDP4060L F9852 NDP4060L F9852 NDP4060L F9852 NDP4060L F9852 NDP4060L F9852 NDP4060L F9852 NDP4060L F9852 NDP4060L F9852 NDP4060L F9852 NDP4060L F9852 NDP4060L F9852 NDP4060L 0.160 20.000 +0.031 -0.065 0.800 0.275 August 1999, Rev. B TO-220 Tape and Reel Data and Package Dimensions, continued TO-220 (FS PKG Code 37) 1:1 Scale 1:1 on letter size paper Dimensions shown below are in: inches [millimeters] Part Weight per unit (gram): 1.4378 September 1998, Rev. A TO-263AB/D2PAK Tape and Reel Data and Package Dimensions TO-263AB/D2PAK Packaging Configuration: Figure 1.0 Packaging Description: EL ECT ROST AT IC SEN SIT IVE DEVICES DO NO T SHI P OR STO RE N EAR ST RO NG EL ECT ROST AT IC EL ECT RO M AGN ETI C, M AG NET IC O R R ADIO ACT IVE FI ELD S TNR D ATE PT NUMB ER PEEL STREN GTH MIN ___ __ ____ __ ___gms MAX ___ ___ ___ ___ _ gms Antistatic Cover Tape ESD Label TO-263/D2PAK parts are shipped in tape. The carrier tape is made from a dissipative (carbon filled) polycarbonate resin. The cover tape is a multilayer film (Heat Activated Adhesive in nature) primarily composed of polyester film, adhesive layer, sealant, and anti-static sprayed agent. These reeled parts in standard option are shipped with 800 units per 13" or 330cm diameter reel. The reels are dark blue in color and is made of polystyrene plastic (antistatic coated). This and some other options are further described in the Packaging Information table. These full reels are individually barcode labeled, dry packed, and placed inside a standard intermediate box (illustrated in figure 1.0) made of recyclable corrugated brown paper. One box contains one reel maximum. And these boxes are placed inside a barcode labeled shipping box which comes in different sizes depending on the number of parts shipped. CAUTION Static Dissipative Embossed Carrier Tape Moisture Sensitive Label F63TNR Label Customized Label TO-263AB/D2PAK Packaging Information Packaging Option Packaging type Qty per Reel/Tube/Bag Reel Size Box Dimension (mm) Max qty per Box Weight per unit (gm) Weight per Reel Note/Comments Standard (no flow code) TNR 800 13" Dia 359x359x57 800 1.4378 1.6050 L86Z Rail/Tube 45 530x130x83 1,080 1.4378 - TO-263AB/D2PAK Unit Orientation 359mm x 359mm x 57mm Standard Intermediate box ESD Label F63TNR Label sample F63TNR Label LOT: CBVK741B019 FSID: FDB6320L QTY: 800 SPEC: DRYPACK Bag (F63TNR)3 D/C1: D9842 D/C2: QTY1: QTY2: SPEC REV: CPN: N/F: F TO-263AB/D2PAK Tape Leader and Trailer Configuration: Figure 2.0 Carrier Tape Cover Tape Components Trailer Tape 400mm minimum or 25 empty pockets Leader Tape 1520mm minimum or 95 empty pockets September 1999, Rev. B F9835 FDB603AL F9835 FDB603AL F9835 FDB603AL F9835 FDB603AL Moisture Sensitive Label TO-263AB/D2PAK Tape and Reel Data and Package Dimensions, continued TO-263AB/D2PAK Embossed Carrier Tape Configuration: Figure 3.0 P0 T E1 D0 F K0 Wc B0 E2 W Tc A0 P1 D1 User Direction of Feed Dimensions are in millimeter Pkg type TO263AB/ D2PAK (24mm) A0 10.60 +/-0.10 B0 15.80 +/-0.10 W 24.0 +/-0.3 D0 1.55 +/-0.05 D1 1.60 +/-0.10 E1 1.75 +/-0.10 E2 22.25 min F 11.50 +/-0.10 P1 16.0 +/-0.1 P0 4.0 +/-0.1 K0 4.90 +/-0.10 T 0.450 +/-0.150 Wc 21.0 +/-0.3 Tc 0.06 +/-0.02 Notes: A0, B0, and K0 dimensions are determined with respect to the EIA/Jedec RS-481 rotational and lateral movement requirements (see sketches A, B, and C). 10 deg maximum Typical component cavity center line 0.9mm maximum B0 10 deg maximum component rotation 0.9mm maximum Sketch A (Side or Front Sectional View) Component Rotation A0 Sketch B (Top View) Typical component center line Sketch C (Top View) Component lateral movement TO-263AB/D Figure 4.0 2PAK Reel Configuration: Component Rotation W1 Measured at Hub Dim A Max B Min Dim C Dim A max Dim N Dim D min DETAIL AA See detail AA W3 13" Diameter Option W2 max Measured at Hub Dimensions are in inches and millimeters Tape Size 24mm Reel Option 13" Dia Dim A 13.00 330 Dim B 0.059 1.5 Dim C 512 +0.020/-0.008 13 +0.5/-0.2 Dim D 0.795 20.2 Dim N 4.00 100 Dim W1 0.961 +0.078/-0.000 24.4 +2/0 Dim W2 1.197 30.4 Dim W3 (LSL-USL) 0.941 - 0.1.079 23.9 - 27.4 August 1999, Rev. B TO-263AB/D2PAK Tape and Reel Data and Package Dimensions, continued TO-263AB/D2PAK (FS PKG Code 45) 1:1 Scale 1:1 on letter size paper Dimensions shown below are in: inches [millimeters] Part Weight per unit (gram): 1.4378 August 1998, Rev. A TRADEMARKS The following are registered and unregistered trademarks Fairchild Semiconductor owns or is authorized to use and is not intended to be an exhaustive list of all such trademarks. ACExTM CoolFETTM CROSSVOLTTM E2CMOSTM FACTTM FACT Quiet SeriesTM FAST(R) FASTrTM GTOTM HiSeCTM DISCLAIMER ISOPLANARTM MICROWIRETM POPTM PowerTrench QFETTM QSTM Quiet SeriesTM SuperSOTTM-3 SuperSOTTM-6 SuperSOTTM-8 SyncFETTM TinyLogicTM UHCTM VCXTM FAIRCHILD SEMICONDUCTOR RESERVES THE RIGHT TO MAKE CHANGES WITHOUT FURTHER NOTICE TO ANY PRODUCTS HEREIN TO IMPROVE RELIABILITY, FUNCTION OR DESIGN. FAIRCHILD DOES NOT ASSUME ANY LIABILITY ARISING OUT OF THE APPLICATION OR USE OF ANY PRODUCT OR CIRCUIT DESCRIBED HEREIN; NEITHER DOES IT CONVEY ANY LICENSE UNDER ITS PATENT RIGHTS, NOR THE RIGHTS OF OTHERS. LIFE SUPPORT POLICY FAIRCHILD'S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF FAIRCHILD SEMICONDUCTOR CORPORATION. As used herein: 1. Life support devices or systems are devices or 2. A critical component is any component of a life support device or system whose failure to perform can systems which, (a) are intended for surgical implant into be reasonably expected to cause the failure of the life the body, or (b) support or sustain life, or (c) whose support device or system, or to affect its safety or failure to perform when properly used in accordance with instructions for use provided in the labeling, can be effectiveness. reasonably expected to result in significant injury to the user. PRODUCT STATUS DEFINITIONS Definition of Terms Datasheet Identification Advance Information Product Status Formative or In Design Definition This datasheet contains the design specifications for product development. Specifications may change in any manner without notice. This datasheet contains preliminary data, and supplementary data will be published at a later date. Fairchild Semiconductor reserves the right to make changes at any time without notice in order to improve design. This datasheet contains final specifications. Fairchild Semiconductor reserves the right to make changes at any time without notice in order to improve design. Preliminary First Production No Identification Needed Full Production Obsolete Not In Production This datasheet contains specifications on a product that has been discontinued by Fairchild semiconductor. The datasheet is printed for reference information only. Rev. D |
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