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RF COMMUNICATIONS PRODUCTS
OUTPUT/INPUT INPUT/OUTPUT
OUTPUT/INPUT
ENCH1
SA630 Single pole double throw (SPDT) switch
Product Specification Replaces data of October 10, 1991 IC17 Data Handbook 1997 Nov 07
Philips Semiconductors
Philips Semiconductors
Product specification
Single pole double throw (SPDT) switch
SA630
DESCRIPTION
The SA630 is a wideband RF switch fabricated in BiCMOS technology and incorporating on-chip CMOS/TTL compatible drivers. Its primary function is to switch signals in the frequency range DC 1GHz from one 50 channel to another. The switch is activated by a CMOS/TTL compatible signal applied to the enable channel 1 pin (ENCH1). The extremely low current consumption makes the SA630 ideal for portable applications. The excellent isolation and low loss makes this a suitable replacement for PIN diodes. The SA630 is available in an 8-pin dual in-line plastic package and an 8-pin SO (surface mounted miniature) package.
PIN CONFIGURATION
D and N Packages
VDD GND INPUT ENCH1 1 2 3 4 8 7 6 5 OUT1 AC GND GND OUT2
SR00578
Figure 1. Pin Configuration
FEATURES
*Wideband (DC - 1GHz) *Low through loss (1dB typical at 200MHz) *Unused input is terminated internally in 50 *Excellent overload capability (1dB gain compression point +18dBm *Low DC power (170A from 5V supply) *Fast switching (20ns typical) *Good isolation (off channel isolation 60dB at 100MHz)
at 300MHz)
*Low distortion (IP3 intercept +33dBm) *Good 50 match (return loss 18dB at 400MHz) *Full ESD protection *Bidirectional operation
APPLICATIONS
*Digital transceiver front-end switch *Antenna switch *Filter selection *Video switch *FSK transmitter
ORDERING INFORMATION
DESCRIPTION 8-Pin Plastic Dual In-Line Package (DIP) 8-Pin Plastic Small Outline (SO) package (Surface-mount) TEMPERATURE RANGE -40 to +85C -40 to +85C ORDER CODE SA630N SA630D DWG # SOT97-1 SOT96-1
BLOCK DIAGRAM
OUTPUT/INPUT INPUT/OUTPUT
OUTPUT/INPUT
ENCH1
SR00579
Figure 2. Block Diagram
RECOMMENDED OPERATING CONDITIONS
SYMBOL VDD TA TJ Supply voltage Operating ambient temperature range SA Grade Operating junction temperature range SA Grade PARAMETER RATING 3.0 to 5.5V -40 to +85 -40 to +105 UNITS V C C
1997 Nov 07
2
853-1577 18666
Philips Semiconductors
Product specification
Single pole double throw (SPDT) switch
SA630
EQUIVALENT CIRCUIT
VDD +5V 1 20k CONTROL LOGIC 50 7 2 50 6 AC BYPASS 8 OUT1
INPUT
3
20k 5 OUT2
ENCH1
4
SR00580
Figure 3. Equivalent Circuit
ABSOLUTE MAXIMUM RATINGS
SYMBOL VDD PD TJMAX PMAX TSTG Supply voltage Power dissipation, TA = 25oC (still air)1 8-Pin Plastic DIP 8-Pin Plastic SO Maximum operating junction temperature Maximum power input/output Storage temperature range PARAMETER RATING -0.5 to +5.5 1160 780 150 +20 -65 to +150 UNITS V mW mW C dBm C
NOTES: 1. Maximum dissipation is determined by the operating ambient temperature and the thermal resistance, JA: 8-Pin DIP: JA = 108C/W 8-Pin SO: JA = 158C/W
DC ELECTRICAL CHARACTERISTICS
VDD = +5V, TA = 25C; unless otherwise stated. LIMITS SYMBOL PARAMETER TEST CONDITIONS MIN IDD VT VIH VIL IIL IIH Supply current TTL/CMOS logic threshold Logic 1 level Logic 0 level ENCH1 input current ENCH1 input current voltage1 Enable channel 1 Enable channel 2 ENCH1 = 0.4V ENCH1 = 2.4V 40 1.1 2.0 -0.3 -1 -1 0 0 SA630 TYP 170 1.25 MAX 300 1.4 VDD 0.8 1 1 A V V V A A UNITS
NOTE: 1. The ENCH1 input must be connected to a valid Logic Level for proper operation of the SA630.
1997 Nov 07
3
Philips Semiconductors
Product specification
Single pole double throw (SPDT) switch
SA630
AC ELECTRICAL CHARACTERISTICS1 - D PACKAGE
VDD = +5V, TA = 25C; unless otherwise stated. LIMITS SYMBOL PARAMETER TEST CONDITIONS MIN S21, S12 Insertion loss (ON channel) DC - 100MHz 500MHz 900MHz 10MHz 100MHz 500MHz 900MHz DC - 400MHz 900MHz DC - 400MHz 900MHz 50% TTL to 90/10% RF 90%/10% to 10%/90% RF 70 24 SA630 TYP 1 1.4 2 80 60 50 30 20 12 17 13 20 5 165 DC - 1GHz 100MHz 100MHz 100MHz 900MHz +18 +33 +52 1.0 2.0 MAX dB 2.8 UNITS
S21, S12
Isolation (OFF channel)2
dB
S11, S22 S11, S22 tD tr, tf
Return loss (ON channel) Return loss (OFF channel) Switching speed (on-off delay) Switching speeds (on-off rise/fall time) Switching transients
dB dB ns ns mVP-P dBm dBm dBm dB
P-1dB IP3 IP2 NF
1dB gain compression Third-order intermodulation intercept Second-order intermodulation intercept Noise figure (ZO = 50 )
NOTE: 1. All measurements include the effects of the D package SA630 Evaluation Board (see Figure 4B). Measurement system impedance is 50. 2. The placement of the AC bypass capacitor is critical to achieve these specifications. See the applications section for more details.
AC ELECTRICAL CHARACTERISTICS1 - N PACKAGE
VDD = +5V, TA = 25C; all other characteristics similar to the D-Package, unless otherwise stated. LIMITS SYMBOL PARAMETER TEST CONDITIONS MIN S21, S12 Insertion loss (ON channel) DC - 100MHz 500MHz 900MHz 10MHz 100MHz 500MHz 900MHz 100MHz 900MHz SA630 TYP 1 1.4 2.5 68 50 37 15 1.0 2.5 MAX dB UNITS
S21, S12
Isolation (OFF channel)
58
dB
NF
Noise figure (ZO = 50 )
dB
NOTE: 1. All measurements include the effects of the N package SA630 Evaluation Board (see Figure 4C). Measurement system impedance is 50.
APPLICATIONS
The typical applications schematic and printed circuit board layout of the SA630 evaluation board is shown in Figure 4. The layout of the board is simple, but a few cautions need to be observed. The input and output traces should be 50. The placement of the AC bypass capacitor is extremely critical if a symmetric isolation between the two channels is desired. The trace from Pin 7 should be drawn back towards the package and then be routed downwards. The capacitor
should be placed straight down as close to the device as practical. For better isolation between the two channels at higher frequencies, it is also advisable to run the two output/input traces at an angle. This also minimizes any inductive coupling between the two traces. The power supply bypass capacitor should be placed close to the device. Figure 10 shows the frequency response of the SA630. The loss matching between the two channels is excellent to 1.2GHz as shown in Figure 13.
1997 Nov 07
4
Philips Semiconductors
Product specification
Single pole double throw (SPDT) switch
SA630
VDD +5V D and N Packages 0.1F 1 GND INPUT 0.01F 2 3 4 ENCH1 8 7 6 5 0.01F AC GND GND OUT2 0.01F 0.01F OUT1
a. Evaluation Board Schematic
b. 630 D-Package Board Layout
630N1 7/91
c. 630 N-Package Board Layout Figure 4. Board and Package Graphics 1997 Nov 07 5
SR00581
Philips Semiconductors
Product specification
Single pole double throw (SPDT) switch
SA630
The isolation and matching of the two channels over frequency is shown in Figures 15 and 17, respectively. The SA630 is a very versatile part and can be used in many applications. Figure 5 shows a block diagram of a typical Digital RF transceiver front-end. In this application the SA630 replaces the duplexer which is typically very bulky and lossy. Due to the low power consumption of the device, it is ideally suited for handheld applications such as in CT2 cordless telephones. The SA630 can also be used to generate Amplitude Shift Keying (ASK) or On-Off Keying (OOK) and Frequency Shift Keying (FSK) signals for digital RF communications systems. Block diagrams for these applications are shown in Figures 6 and 7, respectively. For applications that require a higher isolation at 1GHz than obtained from a single SA630, several SA630s can be cascaded as
shown in Figure 8. The cascaded configuration will have a higher loss but greater than 35dB of isolation at 1GHz and greater than 65dB @ 500MHz can be obtained from this configuration. By modifying the enable control, an RF multiplexer/ de-multiplexer or antenna selector can be constructed. The simplicity of SA630 coupled with its ease of use and high performance lends itself to many innovative applications. The SA630 switch terminates the OFF channel in 50. The 50 resistor is internal and is in series with the external AC bypass capacitor. Matching to impedances other than 50 can be achieved by adding a resistor in series with the AC bypass capacitor (e.g., 25 additional to match to a 75 environment).
5200
602A
IF OUT
630
MICRO CONTROLLER
KEYPAD & DISPLAY
Tx/Rx 5200 VCO MODULATION
SR00582
Figure 5. A Typical TDMA/Digital RF Transceiver System Front-End
ASK OUTPUT 630 630 IN/OUT 630
OUT1/IN1
OSCILLATOR
ENABLE CH1 TTL DATA
50
SR00583
Figure 6. Amplitude Shift Keying (ASK) Generator
630 OUT2/IN2
f1
FSK OUTPUT 630
ENABLE
SR00585
Figure 8.
ENABLE CH1 f2 TTL DATA
SR00584
Figure 7. Frequency Shift Keying (FSK) Gnerator
1997 Nov 07
6
Philips Semiconductors
Product specification
Single pole double throw (SPDT) switch
SA630
200 +85C 180 160 140 120 100 80 60 40 20 TA = +25C 0 3 3.5 4 4.5 5 5.5 6 SUPPLY VOLTAGE (V) -2 10 100 FREQUENCY (MHz) 1000 S21 (dB) 5V +25C -40C -1 4V
SUPPLY CURRENT ( A)
3V
SR00586
SR00588
Figure 9. Supply Current vs. VDD and Temperature
Figure 11. Loss vs. Frequency and VDD for D-Package-Expanded Detail0
0 5V
-2 -2 4V
3V S21 (dB) S21 (dB)
-4
-4
-6
CH2
-6
-8 VDD = 5V TA = +25C TA = +25C -10 10 100 FREQUENCY (MHz) 1000 2000 10 100 FREQUENCY (MHz) 1000 2000
-8
SR00587
SR00589
Figure 10.
Loss vs. Frequency and VDD for D-Package
Figure 12.
Loss Matching vs. Frequency for N-Package (DIP)
1997 Nov 07
7
Philips Semiconductors
Product specification
Single pole double throw (SPDT) switch
SA630
0 0 -1 -10 -2 -20 -3 S21 (dB) -30 S21 (dB) -4
-40
3V 4V
-5 CH1 -6 -60 -7 VDD = TA 5V = +25C -8 10 100 FREQUENCY (MHz) 1000 2000 -80 10 100 FREQUENCY (MHz) -70 TA = +25C -50 5V
1000
2000
SR00590
SR00592
Figure 13. Loss Matching vs. Frequency; CH1 vs. CH2 for D-Pakage
Figure 15. Isolation vs. Frequency and VDD for D-Package
0 -40C -1 +25C -2 +85C -3 S21 (dB) S21 (dB)
0
-10
-20
-30
-4
-40 CH2 -50
-5
-6
-60
-7 VDD = 5V -8 10 100 FREQUENCY (MHz) 1000 2000
-70 TA = +25C VDD = 5V -80 10 100 FREQUENCY (MHz) 1000 2000
SR00591
SR00593
Figure 14.
Loss vs. Frequency and Temperature for D-Package
Figure 16. Isolation Matching vs. Frequency for N-Package (DIP)
1997 Nov 07
8
Philips Semiconductors
Product specification
Single pole double throw (SPDT) switch
SA630
0
0
-10
-5
-20 -10 S22 (dB) CH2 -50 CH1 -60 -25 -70 VDD = +5V -80 10 100 FREQUENCY (MHz) TA = +25C 1000 2000 -30 10 100 FREQUENCY (MHz) 1000 2000 VDD = 5V TA = +25C -20 -30 S21 (dB)
-40
-15
SR00594
SR00597
Figure 17. Isolation Matching vs. Frequency; CH1 vs. CH2 for D-Package
Figure 19. Output Match On-Channel vs. Frequency
0
0
-5
-5
-10
-10 CH1: 3V S22 (dB)
S11 (dB)
-15
3V 4V
-15 CH1: 5V CH2: 5V
-20
5V
-20
-25 TA = +25C -30 10 100 FREQUENCY (MHz) 1000 2000
-25 TA = +25C -30 10 100 FREQUENCY (MHz) 1000 2000
SR00595
SR00597
Figure 18. Input Match On-Channel vs. Frequency and VDD
Figure 20. OFF-Channel Match vs. Frequency and VDD
1997 Nov 07
9
Philips Semiconductors
Product specification
Single pole double throw (SPDT) switch
SA630
0
60
-5
50 IP2 INTERCEPT POINT (dBm)
-10 S22 (dB)
40
+85C -15 +25C
30 IP3
-20 -40C
20
-25 VDD = 5V -30 10 100 FREQUENCY (MHz) 1000 2000
10 TA = +25C 0 3 3.5 4 4.5 5 SUPPLY VOLTAGE (V) 5.5 6
SR00598
SR00633
Figure 21.
OFF Channel Match vs. Frequency and Temperature
Figure 23.
Intercept Points vs.VDD
20 18 16 14 NOISE FIGURE (dB) 3V 12 P -1 (dBm) 10 8 6 4 2 TA = +25C 0 10 100 FREQUENCY (MHz) 1000 2000
5 4.5 TA = +25C 4 4V 3.5 3 2.5 2 1.5 4V 1 5V 0.5 0 10 100 FREQUENCY (MHz) 1000 2000 ZO = 50
5V
3V
SR00599
SR00634
Figure 22.
P-1 dB vs. Frequency and VDD
Figure 24. Noise Figure vs. Frequency and VDD for D-Package
1997 Nov 07
10
Philips Semiconductors
Product specification
Single pole double throw (SPDT) switch
SA630
ENCH1 (Pin4)
OUT1 (Pin 8)
SR00635
Figure 25.
Switching Speed; fIN = 100MHz at -6dBm, VDD = 5V
1997 Nov 07
11
Philips Semiconductors
Product specification
Single pole double throw (SPDT) switch
SA630
SO8: plastic small outline package; 8 leads; body width 3.9mm
SOT96-1
1997 Nov 07
12
Philips Semiconductors
Product specification
Single pole double throw (SPDT) switch
SA630
DIP8: plastic dual in-line package; 8 leads (300 mil)
SOT97-1
1997 Nov 07
13
Philips Semiconductors
Product specification
Single pole double throw (SPDT) switch
SA630
DEFINITIONS
Data Sheet Identification
Objective Specification
Product Status
Formative or in Design
Definition
This data sheet contains the design target or goal specifications for product development. Specifications may change in any manner without notice. This data sheet contains preliminary data, and supplementary data will be published at a later date. Philips Semiconductors reserves the right to make changes at any time without notice in order to improve design and supply the best possible product. This data sheet contains Final Specifications. Philips Semiconductors reserves the right to make changes at any time without notice, in order to improve design and supply the best possible product.
Preliminary Specification
Preproduction Product
Product Specification
Full Production
Philips Semiconductors and Philips Electronics North America Corporation reserve the right to make changes, without notice, in the products, including circuits, standard cells, and/or software, described or contained herein in order to improve design and/or performance. Philips Semiconductors assumes no responsibility or liability for the use of any of these products, conveys no license or title under any patent, copyright, or mask work right to these products, and makes no representations or warranties that these products are free from patent, copyright, or mask work right infringement, unless otherwise specified. Applications that are described herein for any of these products are for illustrative purposes only. Philips Semiconductors makes no representation or warranty that such applications will be suitable for the specified use without further testing or modification. LIFE SUPPORT APPLICATIONS Philips Semiconductors and Philips Electronics North America Corporation Products are not designed for use in life support appliances, devices, or systems where malfunction of a Philips Semiconductors and Philips Electronics North America Corporation Product can reasonably be expected to result in a personal injury. Philips Semiconductors and Philips Electronics North America Corporation customers using or selling Philips Semiconductors and Philips Electronics North America Corporation Products for use in such applications do so at their own risk and agree to fully indemnify Philips Semiconductors and Philips Electronics North America Corporation for any damages resulting from such improper use or sale. Philips Semiconductors 811 East Arques Avenue P.O. Box 3409 Sunnyvale, California 94088-3409 Telephone 800-234-7381 (c) Copyright Philips Electronics North America Corporation 1997 All rights reserved. Printed in U.S.A.
Philips Semiconductors
1997 Nov 07 14

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