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ICX238AKE
Diagonal 3mm (Type 1/6) CCD Image Sensor for NTSC Color Cameras
Description The ICX238AKE is an interline CCD solid-state image sensor suitable for NTSC small color cameras. High resolution is achieved through the use of Ye, Cy, Mg, and G complementary color mosaic filters. This chip features a field period readout system and an electronic shutter with variable charge-storage time. The package is a small 12-pin SON(LCC). Features * High sensitivity and low smear * Horizontal register: 3.3 to 5.0V drive * Reset gate: 3.3 to 5.0V drive * No voltage adjustment (Reset gate and substrate bias are not adjusted.) * Low dark current and excellent antiblooming characteristics * Continuous variable-speed shutter * Recommended range of exit pupil distance: -10mm to - * Ye, Cy, Mg, and G complementary color mosaic filters on chip * 12-pin ceramic SON(LCC) package Device Structure * Interline CCD image sensor * Image size: * Number of effective pixels: * Total number of pixels: * Chip size: * Unit cell size: * Optical black: * Number of dummy bits: * Substrate material: 12 pin SON (Ceramic)
Pin 1 2
V
12 3 Pin 7 H 40
Optical black position (Top View) Diagonal 3mm (Type 1/6) 768 (H) x 494 (V) approx. 380K pixels 811 (H) x 508 (V) approx. 410K pixels 3.30mm (H) x 2.95mm (V) 3.200m (H) x 3.725m (V) Horizontal (H) direction: Front 3 pixels, rear 40 pixels Vertical (V) direction: Front 12 pixels, rear 2 pixels Horizontal 22 Vertical 1 (even fields only) Silicon
Sony reserves the right to change products and specifications without prior notice. This information does not convey any license by any implication or otherwise under any patents or other right. Application circuits shown, if any, are typical examples illustrating the operation of the devices. Sony cannot assume responsibility for any problems arising out of the use of these circuits.
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E98X19A99-PS
ICX238AKE
VOUT
GND
V2
V3
6
5
V1
4
3
2
Cy
Ye G Ye Mg Ye G
Cy Mg Cy G Cy Mg
Ye G Ye Mg Ye G
Vertical register
Mg Cy G Cy Mg
Note)
Horizontal register Note) : Photo sensor
7
8
9
10
11
12
Pin Description Pin No. 1 2 3 4 5 6 Symbol V4 V3 V2 V1 GND VOUT Description
SUB
VDD
Pin No. 7 8 9 10 11 12
H1
H2
RG
VL
V4
1
Block Diagram and Pin Configuration (Top View)
Symbol VDD SUB VL RG H1 H2
Description Supply voltage Substrate clock Protective transistor bias Reset gate clock Horizontal register transfer clock Horizontal register transfer clock
Vertical register transfer clock Vertical register transfer clock Vertical register transfer clock Vertical register transfer clock GND Signal output
Absolute Maximum Ratings Item VDD, VOUT, RG - SUB Against SUB V1, V3 - SUB V2, V4, VL - SUB H1, H2, GND - SUB VDD, VOUT, RG - GND Against GND V1, V2, V3, V4 - GND H1, H2 - GND Against VL V1, V3 - VL V2, V4, H1, H2, GND - VL Voltage difference between vertical clock input pins Between input clock pins Storage temperature Operating temperature 1 +24V (Max.) when clock width < 10s, clock duty factor < 0.1%. -2- H1 - H2 H1, H2 - V4 Ratings -40 to +8 -50 to +15 -50 to +0.3 -40 to +0.3 -0.3 to +20 -10 to +18 -10 to +6 -0.3 to +28 -0.3 to +15 to +15 -6 to +6 -14 to +14 -30 to +80 -10 to +60 Unit V V V V V V V V V V V V C C 1 Remarks
ICX238AKE
Bias Conditions Item Supply voltage Protective transistor bias Substrate clock Reset gate clock Symbol VDD VL SUB RG Min. 14.55 Typ. 15.0 1 2 2 Max. 15.45 Unit V Remarks
1 VL setting is the VVL voltage of the vertical transfer clock waveform, or the same power supply as the VL power supply for the V driver should be used. 2 Do not apply a DC bias to the substrate clock and reset gate clock pins, because a DC bias is generated within the CCD.
DC Characteristics Item Supply current Symbol IDD Min. Typ. 3.5 Max. 5.5 Unit mA Remarks
Clock Voltage Conditions Item Readout clock voltage Symbol VVT VVH1, VVH2 VVH3, VVH4 VVL1, VVL2, VVL3, VVL4 VV Vertical transfer clock voltage VVH3 - VVH VVH4 - VVH VVHH VVHL VVLH VVLL Horizontal transfer clock voltage VH VHL VRG Reset gate clock voltage VRGLH - VRGLL VRGL - VRGLm Substrate clock voltage VSUB 21.5 22.5 3.0 -0.05 3.0 3.3 0 3.3 Min. 14.55 -0.05 -0.2 -8.0 6.8 -0.25 -0.25 Typ. 15.0 0 0 -7.5 7.5 Max. 15.45 0.05 0.05 -7.0 8.05 0.1 0.1 0.3 0.3 0.3 0.3 5.25 0.05 5.5 0.4 0.5 23.5 Unit V V V V V V V V V V V V V V V V V Waveform diagram 1 2 2 2 2 2 2 2 2 2 2 3 3 4 4 4 5 Input through 0.1F capacitance Low-level coupling Low-level coupling High-level coupling High-level coupling Low-level coupling Low-level coupling VVL = (VVL3 + VVL4)/2 VV = VVHn - VVLn (n = 1 to 4) VVH = (VVH1 + VVH2)/2 Remarks
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ICX238AKE
Clock Equivalent Circuit Constant Item Capacitance between vertical transfer clock and GND Capacitance between vertical transfer clocks Capacitance between horizontal transfer clock and GND Capacitance between horizontal transfer clocks Capacitance between reset gate clock and GND Capacitance between substrate clock and GND Vertical transfer clock series resistor Vertical transfer clock ground resistor Horizontal transfer clock series resistor Reset gate clock series resistor Symbol CV1, CV3 CV2, CV4 CV12, CV34 CV23, CV41 CV13, CV24 CH1, CH2 CHH CRG CSUB R1, R2, R3, R4 RGND RH RRG
V2 CV12
Min.
Typ. 680 220 91 75 30 13 34 5 180 120 15 15 51
Max.
Unit pF pF pF pF pF pF pF pF pF
Remarks
V1
R1
R2 RH H1 RH H2 CHH CV23 CV13 CH1 CH2
CV1 CV41 CV24
CV2
CV4 RGND CV3 R4 CV34 R3
V4
V3
Vertical transfer clock equivalent circuit
Horizontal transfer clock equivalent circuit
RRG RG
CRG
Reset gate clock equivalent circuit -4-
ICX238AKE
Drive Clock Waveform Conditions (1) Readout clock waveform
100% 90%
II II
M M 2 tf 0V
VVT 10% 0% tr twh
(2) Vertical transfer clock waveform
V1 V3
VVH1
VVHH
VVH VVHL
VVHH VVHH VVHL VVHL VVH3 VVHH
VVH
VVHL
VVL1
VVLH
VVL3
VVLH
VVLL VVL VVL
VVLL
V2 VVHH VVHH
V4 VVHH VVHH
VVH VVHL
VVH
VVH2 VVHL
VVHL VVH4
VVHL
VVL2
VVLH
VVLH
VVLL VVL VVL4
VVLL VVL
VVH = (VVH1 + VVH2)/2 VVL = (VVL3 + VVL4)/2 VV = VVHn - VVLn (n = 1 to 4) -5-
ICX238AKE
(3) Horizontal transfer clock waveform
tr twh tf
90%
VH 10% VHL
twl
(4) Reset gate clock waveform
tr twh tf VRGH twl
Point A RG waveform VRGLH VRGL VRGLL VRGLm H1 waveform VH/2 [V] VRG
VRGLH is the maximum value and VRGLL is the minimum value of the coupling waveform during the period from Point A in the above diagram until the rising edge of RG. In addition, VRGL is the average value of VRGLH and VRGLL. VRGL = (VRGLH + VRGLL)/2 Assuming VRGH is the minimum value during the interval twh, then: VRG = VRGH - VRGL Negative overshoot level during the falling edge of RG is VRGLm. (5) Substrate clock waveform
100% 90%
M VSUB 10% 0% VSUB (A bias generated within the CCD) M 2 tf
tr
twh
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ICX238AKE
Clock Switching Characteristics Item Readout clock Vertical transfer clock Horizontal transfer clock During imaging Symbol VT V1, V2, V3, V4 H1 H2 26 28.5 26 28.5 5.38 5.38 11 13 51 26 28.5 26 28.5 6.5 9.5 6.5 9.5 0.01 0.01 3 0.5 twh twl tr tf Unit Remarks s During readout
Min. Typ. Max. Min. Typ. Max. Min. Typ. Max. Min. Typ. Max. 2.3 2.5 0.5 15 0.5
250 ns 1 6.5 9.5 6.5 9.5 0.01 0.01 3 0.5 ns s During drain charge s ns 2
During H1 parallel-serial H2 conversion RG SUB
Reset gate clock Substrate clock
1.5 1.8
1 When vertical transfer clock driver CXD1267AN is used. 2 When VH = 3.0V. tf tr - 2ns, and the cross-point voltage (VCR) for the H1 rising side of the H1 and H2 waveforms must be at least VH/2 [V].
Item Horizontal transfer clock
Symbol H1, H2
two Min. 22 Typ. 26 Max.
Unit ns
Remarks 3
3 The overlap period for twh and twl of horizontal transfer clocks H1 and H2 is two.
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ICX238AKE
Image Sensor Characteristics Item Sensitivity Sensitivity ratio Saturation signal Smear Video signal shading Uniformity between video signal channels Dark signal Flicker Y Flicker R-Y Flicker B-Y Line crawl R Line crawl G Line crawl B Line crawl W Symbol S RMgG RYeCy Ysat Sm SHy Sr Sb Ydt Fy Fcr Fcb Lcr Lcg Lcb Lcw Min. 240 0.93 1.15 600 0.009 0.015 20 25 10 10 2 2 5 5 3 3 3 3 Typ. 300 1.35 1.48 mV % % % % % mV % % % % % % % Max. Unit mV Measurement method 1 2 2 3 4 5 5 6 6 7 8 8 8 9 9 9 9
(Ta = 25C) Remarks
Ta = 60C
Zone 0 and I Zone 0 to II'
Ta = 60C
Zone Definition of Video Signal Shading
768 (H) 14 14 12 H 8 V 10 H 8
494 (V)
Zone 0, I Zone II, II' V 10
10
Ignored region Effective pixel region
[Y] LPF1 (3dB down 6.3MHz) Y signal output
Measurement System
[A] CCD signal output
CCD
C.D.S
AMP SH LPF2 SH (3dB down 1MHz) [C] Chroma signal output
Note) Adjust the amplifier gain so that the gain between [A] and [Y] , and between [A] and [C] equals 1.
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ICX238AKE
Image Sensor Characteristics Measurement Method Measurement conditions 1) In the following measurements, the device drive conditions are at the typical values of the bias and clock voltage conditions. 2) In the following measurements, spot blemishes are excluded and, unless otherwise specified, the optical black level (OB) is used as the reference for the signal output, which is taken as the value of Y signal output or chroma signal output of the measurement system. Color coding of this image sensor & Composition of luminance (Y) and chroma (color difference) signals As shown in the left figure, fields are read out. The charge is mixed by pairs such as A1 and A2 in the A field. (pairs such as B in the B field) As a result, the sequence of charges output as signals from the horizontal shift register (Hreg) is, for line A1, (G + Cy), (Mg + Ye), (G + Cy), and (Mg + Ye).
Cy G B Cy Mg
Ye Mg Ye G
Cy G Cy Mg
Ye A1 Mg Ye A2 G
Hreg
Color Coding Diagram These signals are processed to form the Y signal and chroma (color difference) signal. The Y signal is formed by adding adjacent signals, and the chroma signal is formed by subtracting adjacent signals. In other words, the approximation: Y = {(G + Cy) + (Mg + Ye)} x 1/2 = 1/2 {2B + 3G + 2R} is used for the Y signal, and the approximation: R - Y = {(Mg + Ye) - (G + Cy)} = {2R - G} is used for the chroma (color difference) signal. For line A2, the signals output from Hreg in sequence are (Mg + Cy), (G + Ye), (Mg + Cy), (G + Ye). The Y signal is formed from these signals as follows: Y = {(G + Ye) + (Mg + Cy)} x 1/2 = 1/2 {2B + 3G + 2R} This is balanced since it is formed in the same way as for line A1. In a like manner, the chroma (color difference) signal is approximated as follows: - (B - Y) = {(G + Ye) - (Mg + Cy)} = - {2B - G} In other words, the chroma signal can be retrieved according to the sequence of lines from R - Y and - (B - Y) in alternation. This is also true for the B field.
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ICX238AKE
Definition of standard imaging conditions 1) Standard imaging condition I: Use a pattern box (luminance 706cd/m2, color temperature of 3200K halogen source) as a subject. (Pattern for evaluation is not applicable.) Use a testing standard lens with CM500S (t = 1.0mm) as an IR cut filter and image at F5.6. The luminous intensity to the sensor receiving surface at this point is defined as the standard sensitivity testing luminous intensity. 2) Standard imaging condition II: Image a light source (color temperature of 3200K) with a uniformity of brightness within 2% at all angles. Use a testing standard lens with CM500S (t = 1.0mm) as an IR cut filter. The luminous intensity is adjusted to the value indicated in each testing item by the lens diaphragm. 3) Standard imaging condition III: Image a light source (color temperature of 3200K) with a uniformity of brightness within 2% at all angles. Use a testing standard lens (exit pupil distance -33mm) with CM500S (t = 1.0mm) as an IR cut filter. The luminous intensity is adjusted to the value indicated in each testing item by the lens diaphragm.
1. Sensitivity Set to standard imaging condition I. After selecting the electronic shutter mode with a shutter speed of 1/250s, measure the Y signal (Ys) at the center of the screen and substitute the value into the following formula. S = Ys x 250 [mV] 60
2. Sensitivity ratio Set to standard imaging condition II. Adjust the luminous intensity so that the average value of the Y signal output is 200mV, and then measure the Mg signal output (SMg [mV]) and G signal output (SG [mV]), and Ye signal output (SYe [mV]) and Cy signal output (SCy [mV]) at the center of the screen with frame readout method. Substitute the values into the following formula. RMgG = SMg/SG RYeCy = SYe/SCy 3. Saturation signal Set to standard imaging condition II. After adjusting the luminous intensity to 10 times the intensity with average value of the Y signal output, 200mV, measure the minimum value of the Y signal. 4. Smear Set to standard imaging condition II. With the lens diaphragm at F5.6 to F8, adjust the luminous intensity to 500 times the intensity with average value of the Y signal output, 200mV. When the readout clock is stopped and the charge drain is executed by the electronic shutter at the respective H blankings, measure the maximum value YSm [mV] of the Y signal output and substitute the value into the following formula. Sm = 1 YSm 1 x x x 100 [%] (1/10V method conversion value) 10 200 500
5. Video signal shading Set to standard imaging condition III. With the lens diaphragm at F5.6 to F8, adjust the luminous intensity so that the average value of the Y signal output is 200mV. Then measure the maximum (Ymax [mV]) and minimum (Ymin [mV]) values of the Y signal and substitute the values into the following formula. SHy = (Ymax - Ymin)/200 x 100 [%] - 10 -
ICX238AKE
6. Uniformity between video signal channels Set to standard imaging condition II. Adjust the luminous intensity so that the average value of the Y signal output is 200mV, and then measure the maximum (Crmax, Cbmax [mV]) and minimum (Crmin, Cbmin [mV]) values of the R - Y and B - Y channels of the chroma signal and substitute the values into the following formula. Sr = | (Crmax - Crmin)/200 | x 100 [%] Sb = | (Cbmax - Cbmin)/200 | x 100 [%] 7. Dark signal Measure the average value of the Y signal output (Ydt [mV]) with the device ambient temperature 60C and the device in the light-obstructed state, using the horizontal idle transfer level as a reference. 8. Flicker 1) Fy Set to standard imaging condition II. Adjust the luminous intensity so that the average value of the Y signal output is 200mV, and then measure the difference in the signal level between fields (Yf [mV]). Then substitute the value into the following formula. Fy = (Yf/200) x 100 [%] 2) Fcr, Fcb Set to standard imaging condition II. Adjust the luminous intensity so that the average value of the Y signal output is 200mV, insert an R or B filter, and then measure both the difference in the signal level between fields of the chroma signal (Cr, Cb) as well as the average value of the chroma signal output (CAr, CAb). Substitute the values into the following formula. Fci = (Ci/CAi) x 100 [%] (i = r, b) 9. Line crawls Set to standard imaging condition II. Adjust the luminous intensity so that the average value of the Y signal output is 200mV, and then insert a white subject and R, G, and B filters and measure the difference between Y signal lines for the same field (Ylw, Ylr, Ylg, Ylb [mV]). Substitute the values into the following formula. Lci = (Yli/200) x 100 [%] (i = w, r, g, b)
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Drive Circuit
15V 20 100k 19 18 17 16 CXD1267AN 15 14 13 12 11 22/16V 1/35V 0.1 3.3/16V -7.5V
1
2
3
XSUB
4
XV2
5
XV1
6
XSG1
7
XV3
8
XSG2
9
10
XV4
V4
V3
V2
V1
GND
VOUT
12
H2
11
H1
10
RG
9
VL
8
SUB
7 2200p 0.01 3.3/20V 1M
H2
H1
0.1
RG
VDD
- 12 -
1 2 3 4 5 ICX238 (BOTTOM VIEW)
22/20V
6
100 2SK523 CCD OUT 3.9k
ICX238AKE
ICX238AKE
Spectral Sensitivity Characteristics (excludes both lens characteristics and light source characteristics)
1.0 Ye 0.8 Cy
Relative Response
G 0.6
0.4 Mg 0.2
0.0 400
450
500
550 Wave Length [nm]
600
650
700
Sensor Readout Clock Timing Chart
V1 V2 Odd Field V3 V4 33.5 1.6
2.5
2.5 2.5 2.5
0.2 V1 V2 Even Field V3 V4 Unit : s
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Drive Timing Chart (Vertical Sync)
FLD
VD
BLK
HD
10
15
20
520
525 1 2 3 4 5
265
270
275
- 14 -
246 135 246 135 494 493
V1
V2
V3
V4 135 246
CCD OUT
493 494
260
135 246
280
ICX238AKE
Drive Timing Chart (Horizontal Sync)
HD
BLK
H1
1 2 3 5 40 10 30 20 22 1 2 3 1 2 3 10 20
H2
10
RG
V1
- 15 -
V2
V3
V4
SUB
760
768 1 2 3 5
20
ICX238AKE
ICX238AKE
Notes on Handling 1) Static charge prevention CCD image sensors are easily damaged by static discharge. Before handling be sure to take the following protective measures. a) Either handle bare handed or use non-chargeable gloves, clothes or material. Also use conductive shoes. b) When handling directly use an earth band. c) Install a conductive mat on the floor or working table to prevent the generation of static electricity. d) Ionized air is recommended for discharge when handling CCD image sensor. e) For the shipment of mounted substrates, use boxes treated for the prevention of static charges. 2) Soldering a) Make sure the upper surface of ceramic package temperature does not exceed 80C. b) Solder dipping in a mounting furnace causes damage to the glass and other defects. Use a ground 30W soldering iron and solder each pin in less than 2 seconds. For repairs and remount, cool sufficiently. c) To dismount an image sensor, do not use a solder suction equipment. When using an electric desoldering tool, use a thermal controller of the zero cross On/Off type and connect it to ground. 3) Dust and dirt protection Image sensors are packed and delivered by taking care of protecting its glass plates from harmful dust and dirt. Clean glass plates with the following operation as required, and use them. a) Perform all assembly operations in a clean room (class 1000 or less). b) Do not either touch glass plates by hand or have any object come in contact with glass surfaces. Should dirt stick to a glass surface, blow it off with an air blower. (For dirt stuck through static electricity ionized air is recommended.) c) Clean with a cotton bud and ethyl alcohol if the grease stained. Be careful not to scratch the glass. d) Keep in a case to protect from dust and dirt. To prevent dew condensation, preheat or precool when moving to a room with great temperature differences. 4) Installing (attaching) a) If a load is applied to the entire surface by a hard component, bending stress may be generated and the package may fracture, etc., depending on the flatness of the bottom of the package. Therefore, for installation, use either an elastic load, such as a spring plate, or an adhesive. b) The adhesive may cause the marking on the rear surface to disappear. c) If the metal, etc., clash or rub against the package, the dust may be generated by the fragments of package. d) Acrylate anaerobic adhesives are generally used to attach CCD image sensors. In addition, cyanoacrylate instantaneous adhesives are sometimes used jointly with acrylate anaerobic adhesives. (reference) 5) Others a) Do not expose to strong light (sun rays) for long periods, color filters will be discolored. When high luminance objects are imaged with the exposure level control by electronic-iris, the luminance of the image-plane may become excessive and discolor of the color filter will possibly be accelerated. In such a case, it is advisable that taking-lens with the automatic-iris and closing of the shutter during the power-off mode should be properly arranged. For continuous using under cruel condition exceeding the normal using condition, consult our company. b) Exposure to high temperature or humidity will affect the characteristics. Accordingly avoid storage or usage in such conditions. - 16 -
Package Outline
Unit: mm
9.25 0.2 3.36
12pin SON
11 1.0
7 12 D A 1.8 7 2.30 0.3
3.53 5.52
Pilot pin Guide pin
+0.13
12
1.0 - 0
B
90
8.00 0.2
6.82
V
1 120.60 0.50 0.40
6
2o 1.0 (Recommendatory pin size) 6 1
4.11
12 1.35
- 17 -
C
8.22 (Recommendatory pin pitch)
1. "A" is the center of the effective image area. 2. The straight line "B" which passes through the center of the pilot pin and the middle point of the width of the notch for the guide pin is the reference axis of vertical direction (V). The straight line "C" which passes through the center of the pilot pin at right angle to vertical reference line"B" is the reference axis of horizontal direction (H). 3. The bottom "D" of the package is the height reference. 4. The center of the effective image area, relative to"B" and "C" is (H, V) = (4.11,0) 0.15mm. 5. The rotation angle of the effective image area relative to the line"B" is 1. 6. The height from the bottom "D" to the effective image area is 1.03 0.15mm. 7. The tilt of the effective image area relative to the bottom"D" is less than 25m. 8. The thickness of the cover glass is 0.5mm, and the refractive index is 1.5. 9. Notches for the pilot pin and the guide pin must not be used for fixing.
ICX238AKE
10 - 1.27
PACKAGE STRUCTURE
PACKAGE MATERIAL
Ceramic
LEAD TREATMENT
GOLD PLATING
LEAD MATERIAL
PACKAGE WEIGHT
0.44g
1.5
H
2.43
2.43 4.0

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