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 DISCRETE SEMICONDUCTORS
DATA SHEET
book, halfpage
M3D088
PMBD2837; PMBD2838 High-speed double diodes
Product specification Supersedes data of April 1996 1996 Sep 18
Philips Semiconductors
Product specification
High-speed double diodes
FEATURES * Small plastic SMD package * High switching speed: max. 4 ns * Continuous reverse voltage: max. 30 V and 50 V respectively * Repetitive peak reverse voltage: max. 35 V and 75 V respectively * Repetitive peak forward current: max. 450 mA.
handbook, 4 columns
PMBD2837; PMBD2838
PINNING MARKING CODE pA5 pA6 PIN 1 2 3 DESCRIPTION anode (a1) anode (a2) common cathode
MARKING TYPE NUMBER PMBD2837 PMBD2838
2
1
APPLICATIONS * High-speed switching in e.g. surface mounted circuits. DESCRIPTION The PMD2837, PMD2838 consist of two high-speed switching diodes with common cathodes, fabricated in planar technology, and encapsulated in small plastic SMD SOT23 packages.
Top view
2 3 3
MAM108
1
Fig.1 Simplified outline (SOT23) and symbol.
1996 Sep 18
2
Philips Semiconductors
Product specification
High-speed double diodes
LIMITING VALUES In accordance with the Absolute Maximum Rating System (IEC 134). SYMBOL Per diode VRRM repetitive peak reverse voltage PMBD2837 PMBD2838 VR continuous reverse voltage PMBD2837 PMBD2838 IF continuous forward current PARAMETER CONDITIONS
PMBD2837; PMBD2838
MIN.
MAX.
UNIT
- - - - single diode loaded; see Fig.2; note 1 double diode loaded; see Fig.2; note 1 - -
35 75 30 50 215 125 450
V V V V mA mA mA
IFRM IFSM
repetitive peak forward current non-repetitive peak forward current square wave; Tj = 25 C prior to surge; see Fig.4 t = 1 s t = 1 ms t=1s - - - - -65 -
4 1 0.5 250 +150 150
A A A mW C C
Ptot Tstg Tj Note
total power dissipation storage temperature junction temperature
Tamb = 25 C; note 1
1. Device mounted on an FR4 printed-circuit board.
1996 Sep 18
3
Philips Semiconductors
Product specification
High-speed double diodes
ELECTRICAL CHARACTERISTICS Tj = 25 C; unless otherwise specified. SYMBOL Per diode VF forward voltage see Fig.3 IF = 1 mA IF = 10 mA IF = 50 mA IF = 150 mA IR reverse current PMBD2837 PMBD2838 Cd trr diode capacitance reverse recovery time see Fig.5 VR = 30 V VR = 30 V; Tj = 150 C VR = 50 V VR = 50 V; Tj = 150 C f = 1 MHz; VR = 0; see Fig.6 PARAMETER CONDITIONS
PMBD2837; PMBD2838
MIN.
MAX.
UNIT
- - - - - - - - - -
715 855 1 1.25 100 40 100 50 2.5 4
mV mV V V nA A nA A pF ns
when switched from IF = 10 mA to IR = 10 mA; RL = 100 ; measured at IR = 1 mA; see Fig.7 when switched from IF = 10 mA; tr = 20 ns; see Fig.8
Vfr
forward recovery voltage
-
1.75
V
THERMAL CHARACTERISTICS SYMBOL Rth j-tp Rth j-a Note 1. Device mounted on an FR4 printed-circuit board. PARAMETER thermal resistance from junction to tie-point thermal resistance from junction to ambient note 1 CONDITIONS VALUE 360 500 UNIT K/W K/W
1996 Sep 18
4
Philips Semiconductors
Product specification
High-speed double diodes
GRAPHICAL DATA
PMBD2837; PMBD2838
300 IF (mA) 200
MBD033
handbook, halfpage
300
MBG382
IF (mA)
(1) (2) (3)
single diode loaded
200
double diode loaded 100 100
0 0 100 T amb ( oC) 200
0
0
1
VF (V)
2
Device mounted on an FR4 printed-circuit board.
(1) Tj = 150 C; typical values. (2) Tj = 25 C; typical values. (3) Tj = 25 C; maximum values.
Fig.2
Maximum permissible continuous forward current as a function of ambient temperature.
Fig.3
Forward current as a function of forward voltage.
102 handbook, full pagewidth IFSM (A)
MBG704
10
1
10-1 1 10
102
103
tp (s)
104
Based on square wave currents. Tj = 25 C prior to surge.
Fig.4 Maximum permissible non-repetitive peak forward current as a function of pulse duration.
1996 Sep 18
5
Philips Semiconductors
Product specification
High-speed double diodes
PMBD2837; PMBD2838
105 handbook, halfpage IR (nA) 10
4
MBG375
handbook, halfpage
0.8
MBG446
Cd (pF) 0.6
103
(1)
(2)
(3)
0.4
10
2
0.2
10
0 0 100 Tj (oC) 200 0 4 8 12 VR (V) 16
(1) VR = 50 V; maximum values. (2) VR = 50 V; typical values. (3) VR = 30 V; typical values.
f = 1 MHz; Tj = 25 C.
Fig.5
Reverse current as a function of junction temperature.
Fig.6
Diode capacitance as a function of reverse voltage; typical values.
1996 Sep 18
6
Philips Semiconductors
Product specification
High-speed double diodes
PMBD2837; PMBD2838
handbook, full pagewidth
tr D.U.T. 10% SAMPLING OSCILLOSCOPE R i = 50 VR 90%
tp t
RS = 50 V = VR I F x R S
IF
IF
t rr t
(1)
MGA881
input signal
output signal
(1) IR = 1 mA.
Fig.7 Reverse recovery voltage test circuit and waveforms.
I
1 k
450
I 90%
V
R = 50 S
D.U.T.
OSCILLOSCOPE R i = 50 10%
MGA882
V fr
t tr tp
t
input signal
output signal
Fig.8 Forward recovery voltage test circuit and waveforms.
1996 Sep 18
7
Philips Semiconductors
Product specification
High-speed double diodes
PACKAGE OUTLINE
PMBD2837; PMBD2838
full pagewidth
3.0 2.8 0.150 0.090 1.9 0.95 2 0.1 max 10 o max 3 1.1 max 30 o max 0.48 0.38 TOP VIEW 0.1 M A B 1 B A 0.2 M A
0.55 0.45
10 o max
1.4 1.2
2.5 max
MBC846
Dimensions in mm.
Fig.9 SOT23.
DEFINITIONS Data Sheet Status Objective specification Preliminary specification Product specification Limiting values Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended periods may affect device reliability. Application information Where application information is given, it is advisory and does not form part of the specification. LIFE SUPPORT APPLICATIONS These products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. Philips customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such improper use or sale. This data sheet contains target or goal specifications for product development. This data sheet contains preliminary data; supplementary data may be published later. This data sheet contains final product specifications.
1996 Sep 18
8


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