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| S13MD01 S13MD01 s Features 1. Compact 8-pin dual-in-line package 2. RMS ON-state current (IT : 0.3Arms) 3. Repetitive peak OFF-state voltage is high. 4. Isolation voltage between input and output (Viso : 4000Vrms) 5. Recognized by UL (No. E94758) 6. Approved by CAS (No. LR63705) 8-pin DIP Type SSR for Low Power Control s Outline Dimensions Internal connection diagram 8 6 5 1 2 3 4 5 6 8 (Unit : mm) 1 2 3 4 Cathode Anode Cathode Cathode G T1 T2 2.54 0.25 s Application 1. Oil fan heaters 2. Microwave ovens 3. Refrigerators Anode mark 8 6 5 6.5 0.5 4 1.2 0.3 7.62 0.3 0.5 TYP. 3.5 0.5 S13MD01 1 2 3 9.66 0.5 3.1 0.5 3.4 0.5 0.5 0.1 0.26 0.1 : 0 to 13 * (Note) Terminals 1 , 3 and 4 are common ones of cathode. To radiate the heat, solder all of the lead pins on the pattern of PWB. s Absolute Maximum Ratings Parameter Forward current Reverse voltage RMS ON-state current *1 Peak one cycle surge current Repetitive peak OFF-state voltage *2 Isolation voltage Operating temperature Storage temperature *3 Soldering temperature Symbol IF VR IT Isurge VDRM Viso Topr Tstg Tsol Rating 50 6 0.3 3 400 4 000 - 25 to +80 - 40 to +125 260 (Ta = 25C ) Unit mA V Arms A V Vrms C C C Input Output *1 50Hz sine wave *2 40 to 60% RH, AC for 1 minute, f=60Hz *3 For 10 seconds " In the absence of confirmation by device specification sheets, SHARP takes no responsibility for any defects that occur in equipment using any of SHARP's devices, shown in catalogs, data books, etc. Contact SHARP in order to obtain the latest version of the device specification sheets before using any SHARP's device." S13MD01 s Electro-optical Characteristics Parameter Symbol Forward voltage VF Reverse current IR Repetitive peak OFF-state current IDRM ON-state voltage VT Holding current IH Critical rate of rise of OFF-state voltage dv/dt Minimum trigger current IFT Insulation resistance RISO Turn-on time ton Conditions IF = 20mA VR = 3V VDRM = Rated IT = 0.3A VD = 6V VDRM = (1/ 2 ) * Rated VD = 6V, RL = 100 DC500V, 40 to 60% RH VD = 6V, RL = 100 IF = 20mA MIN. TYP. 1.2 100 5 x 10 10 1 x 10 11 MAX. 1.4 10 100 3.0 25 10 100 (Ta=25C) Unit V A A V mA V/ s mA s Input Output Transfer characteristics Fig. 1 RMS ON-state Current vs. Ambient Temperature 0.8 0.7 Fig. 2 Forward Current vs. Ambient Temperature 60 RMS ON-state current IT (Arms) 50 Forward current IF (mA) 0 25 50 60 75 80 100 0.6 0.5 0.4 0.3 0.2 0.1 0 - 25 40 30 20 10 0 - 25 0 25 50 55 75 80 100 Ambient temperature Ta (C) Ambient temperature Ta (C) S13MD01 Fig. 3 Forward Current vs. Forward Voltage 50C 25C 0C 200 100 Fig. 4 Minimum Trigger Current vs. Ambient Temperature (S13MD01) 12 VD = 6V RL= 100 25C 10 - 25C Forward current IF (mA) Ta = - 50 Minimum trigger current IFT (mA) 2.0 2.5 3.0 8 20 10 5 6 4 2 1 0 2 0.5 1.0 1.5 0 - 30 0 20 40 60 80 100 Forward voltage VF (V) Ambient Temperature Ta (C) Fig. 5 ON-State Voltage vs. Ambient Temperature (S13MD01) 1.4 I T = 0.3A Fig. 6 Relative Holding Current vs. Ambient Temperature (S13MD01) Relative holding current IH (tC)/IH (25C) x100% 103 V D = 6V 1.3 ON-state voltage VT (V) 1.2 1.1 102 1.0 0.9 0.8 - 30 0 20 40 60 80 100 10 - 30 0 20 40 60 80 100 Ambient Temperature Ta (C) Ambient temperature Ta (C) Fig. 7 ON-State Current vs. ON-State Voltage (S13MD01) 0.5 IF = 20mA Ta = 25C 0.4 ON-state current IT (A) Fig. 8 Turn-on Time vs. Forward Current (S13MD01) 100 VD = 6V RL= 100 Ta= 25C 0.3 Turn-on time ton ( s) 10 0.2 0.1 0 0 0.5 1.0 1.5 1 10 20 30 40 50 100 ON-state voltage VT (V) Forward current IF (mA) S13MD01 s Basic Operation Circuit R1 + VCC D1 3 V1 Tr1 Zs : Surge absorption circuit 2 SSR 6 8 ZS Load AC 100V ( S13MD01 ) (1) DC Drive AC supply voltage Input signal Load current (for resistance load) (2) Pulse Drive (3) Phase Control Notes (1) If large amount of surge is loaded onto Vcc or the driver circuit, add a diode D1 between terminals 2 and 3 to prevent reverse bias from being applied to the infrared LED. (2) Be sure to install a surge absorption circuit. An appropriate circuit must be chosen according to the load (for CR, choose its constant). This must be carefully done especially for an inductive load. (3) For phase control, adjust such that the load current immediately after the input signal is applied will be more than 30mA. s Precautions for Use (1) All pins must be soldered since they are also used as heat sinks (heat radiation fins). In designing, consider the heat radiation from the mounted SSR. (2) For higher radiation efficiency that allows wider thermal margin, secure a wider round pattern for Pin No. 8 when designing mounting pattern. The rounded part of Pin No. 5 (gate) must be as small as possible. Pulling the gate pattern around increases the change of being affected by external noise. q As for other general cautions, refer to the chapter "Precautions for Use" (Page 78 to 93). |
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