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| SHINDENGEN General Purpose Rectifiers SIL Bridges D25XB60 600V 25A OUTLINE DIMENSIONS Case : 5S Unit : mm "A'* FEATURES *oeSingle In-Line Package Thin *oe High current capacity with Small Package *oe High IFSM *oe Superior Thermal Conductivity APPLICATION *oewitching power supply S *oe Home Appliances, Office Equipment *oe Factory Automation, Inverter RATINGS *oeAbsolute Maximum Ratings (If not specified Tc=25*Z) Item Symbol Conditions RatingsUnit Storage Temperature Tstg -40*150*Z Operating Junction Temperature Tj 150 *Z V Maximum Reverse Voltage 600 V RM IO 50Hz sine Average Rectified Forward Current wave, R-load With heatsink25 Tc=98*Z A 50Hz sine wave, R-load Without heatsink Ta=25*Z 3.5 IFSM Peak Surge Forward Current sine wave, Non-repetitive 1cycle peak value, Tj=25 50Hz 350 A 2 It Current Squared Time2 1ms*...t*10ms*@Tj=25*Z 300 As Dielectric Strength Vdis Terminals to case, AC 1 minute 2.5 kV Mounting Torque TOR* ecommended torque : 0.5Nm*j R i 0.8 Nm *oeElectrical Characteristics (If not specified Tc=25*Z) Item Symbol Conditions RatingsUnit V I =12.5A, Pulse measurement, Rating Max.1.05V Forward Voltage of per diode FF IR V=V,M Reverse Current Max.10EA R R Pulse measurement, Rating of per diode AEjcjunction to case *@*@With heatsinkMax.1.0 Thermal Resistance AEjljunction to lead *@ *@ Without heatsink *Z/W Max.5 AEja junction to ambient Without heatsink ax.22 M Copyright & Copy;2000 Shindengen Electric Mfg.Co.Ltd D25XBx 100 Forward Voltage 10 Forward Current IF [A] Tc=150C [TYP] Tc=25C [TYP] 1 Pulse measurement per diode 0.1 0 0.2 0.4 0.6 0.8 1 1.2 1.4 1.6 Forward Voltage VF [V] D25XBx 80 70 Forward Power Dissipation Forward Power Dissipation PF [W] 60 50 40 30 20 10 0 SIN 0 5 10 15 20 25 30 Average Rectified Forward Current IO [A] Tj = 150C Sine wave D25XBx 35 Derating Curve Heatsink Tc Tc Average Rectified Forward Current IO [A] 30 SIN 25 20 15 10 5 0 80 90 100 110 120 130 140 150 160 Case Temperature Tc [C] Sine wave R-load with heatsink D25XBx 5 Derating Curve Average Rectified Forward Current IO [A] 4 SIN PCB Glass-epoxy substrate Soldering land 5mm 3 2 1 0 0 20 40 60 80 100 120 140 160 Ambient Temperature Ta [C] Sine wave R-load Free in air D25XBx 400 Peak Surge Forward Capability IFSM 350 10ms 10ms 1 cycle Peak Surge Forward Current IFSM [A] 300 non-repetitive, sine wave, Tj=25C before surge current is applied 250 200 150 100 50 0 1 2 5 10 20 50 100 Number of Cycles [cycles] |
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