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 OKI Semiconductor MK70110/MK70120
Bluetooth Module
PEDLMK70-02
Issue Date: Apr. 24, 2002
Preliminary
GENERAL DESCRIPTION
The MK70110 and MK70120 are Bluetooth modules that operate in the 2.4 GHz band. Mounted on the board of each of these modules are Bluetooth baseband & RF transceiver IC, RF filter, flash memory, and TCXO. Lower protocol stacks up to the HCI are already installed in these modules as software. These modules can be connected to user's board product by using the connector the modules have. Since the modules are provided not only with the UART and USB interfaces as communication control interfaces but with a PCM interface as a voice control interface, they can cope with any application for data and voice communication. The MK70110 is equipped with an RF coaxial connector, and the MK70120 has a chip antenna built-in. By utilizing the MK70110/MK70120, the development TAT for products equipped with Bluetooth can be shortened very effectively.
FEATURES
* * * * * * Conforms to the Bluetooth Specification Version 1.1 Optimized design where originally developed LSI chips and authorized Oki software are used HCI full module includes Bluetooth baseband IC & RF transceiver IC, flash memory and TCXO RF output power: Class 2 RF I/O: MK70110: RF coaxial connector / MK70120: Internal chip antenna Interfaces provided UART interface* (up to 921.6 kbps) USB interface* (USB1.1-conformed) PCM interface (selectable between PCM Linear/A-law/-law) * Supports HCI commands.
BLUETOOTH is a trademark owned by Bluetooth SIG, Inc. and licensed to Oki Electric Industry. The information contained herein can change without notice owing to the product being under development.
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PEDLMK70-02
OKI Semiconductor
MK70110/MK70120
BLOCK DIAGRAM
20-Pin Connector Voltage Regulator BB_LSI ML70Q511LA CPU ARM7TDMI ANT Connector MK70110 BPF 4 Mbit Flash ROM RF_LSI ML7050LA Baseband Core GND VDD RESET ** XCLK
(32 kHz 200 ppm)
ANT Chip MK70120
PCM I/F
~
Osc. 13 MHz
32 KB SRAM
PCM I/F
VBUS TEST1 PCM_IN PCM_OUT PCM_CLK PCM_SYNC UART_RD UART_TD * UART_CTS * UART_RTS USB_D+ USB_D-
USB I/F
Note: * indicates that the pin will be supported later. ** XCLK is optional
ABSOLUTE MAXIMUM RATINGS
Parameter Power supply voltage Input voltage Input RF power Storage temperature Symbol VDD VIN -- Tstg Condition Ta = 25C Ta = 25C Ta = 25C -- Rating -0.3 to 4.5 -0.3 to 4.5 20 -20 to +70 Unit V V dBm C
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PEDLMK70-02
OKI Semiconductor
MK70110/MK70120
RECOMMENDED OPERATING CONDITIONS
Parameter Power supply voltage "H" level input voltage "L" level input voltage Operating temperature Symbol VDD Vih Vil TOP Condition -- -- -- -- Min. 3.2 2.2 0 0 Typ. -- -- -- 25 Max. 3.45 3.6 0.8 50 Unit V V V C
ELECTRICAL CHARACTERISTICS
Specifications in this section are fulfilled under the conditions that VDD = 3.3 V 0.1 V, Ta = 0 to 50C. Values of the RF characteristics represent those specified at the edge of the module for both the MK70110 and the MK70120. General Specifications
Items Conformance Specifications Power Class Frequency range Number of channels Channel separation Modulation method RF input-output impedance Symbol Rate Specification Bluetooth Specification Version 1.1 Class 2 2,402 to 2,480 MHz 79ch 1 MHz GFSK Nominal 50 1 Mbps Note -- -- -- -- -- -- 2,402 to 2,480 MHz --
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OKI Semiconductor
MK70110/MK70120
DC Characteristics Output voltage (Applies to digital pins except USB ports)
Parameter "H" level output voltage "L" level output voltage Symbol Voh Vol Min. 2.4 -- Typ. -- -- Max. -- 0.4 Unit V V
Output voltage (Applies to USB ports (USB_D+, USB_D-))
Parameter "H" level output voltage "L" level output voltage Symbol Voh Vol Min. 2.8 -- Typ. -- -- Max. 3.6 0.3 Unit V V
Power consumption (UART interface, with 32 kHz XCLK)
Mode Initialize (Stop mode) Idle (Cold standby) Hold mode (Slave) Sniff mode (Slave) ACL connection DH1 SCO connection HV1 Typ. 10 6 40 40 103 113 Max. -- -- -- -- 125 135 Unit mA mA mA mA mA mA
RF Transmission Characteristics
Parameter Output power Frequency deviation Frequency drift DH1 DH3, DH5 Frequency shift f1avg: payload = 11110000 f2max: payload = 1010... f2avg/f1avg 20 dB band width In-band spurious emission Freq. offset = 2 MHz Freq. offset 3 MHz Out-of-band spurious emission 30 MHz f < 1GHz 1 GHz f 12.75 GHz 1.8 GHz f 1.9 GHz 5.15 GHz f 5.30 GHz -- -- -- -- -36 -30 -47 -47 dBm dBm dBm dBm -- -- -20 -40 dBm dBm 140 115 80 -- 175 -- -- 1 kHz kHz % MHz Measured by peak detection -25 -40 +25 +40 kHz kHz Min. -6 -50 Max. +4 +50 Unit dBm kHz Remarks
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PEDLMK70-02
OKI Semiconductor
MK70110/MK70120
Reception Characteristics
Parameter Reception sensitivity C/I characteristics Co-channel Adjacent channel C/I = 1 MHz Adjacent channel C/I = 2 MHz Adjacent channel C/I 3 MHz Image frequency
*2
Min. -- -- -- -- -- -- --
Max. 0.1 14 4 -30*1 -40*1 -6 -16
Unit % dB dB dB dB dB dB
Remarks at -70 dBm input Specification at ordinary temperature (Bluetooth Ver.1.1 Test Specification)
Image frequency 1 MHz*2 Out-of-band blocking 30 MHz f < 2,000 MHz 2,000 MHz f 2,399 MHz 2,498 MHz f < 3,000 MHz 3,000 MHz f 12.75 GHz Intermodulation characteristic Maximum input level Limit of collateral radio waves 30 MHz f < 1 GHz 1 GHz f 12.75 GHz
Specification at ordinary temperature -10 -27 -27 -10 -25 -- -- -- -- -- -- 0.1 dBm dBm dBm dBm dB % Specification at ordinary temperature Specification at ordinary temperature, at -20 dBm input Spurious emission during inquiry scan operation
-- --
-57 -47
dBm dBm
*1 Relaxed C/I specification On five spurious response frequencies with a distance of 2 MHz from the wanted signal (except for image frequency and image 1 MHz), a relaxed interference requirement C/I = -17 dB is applied. (According to Bluetooth Specification 1.1, Part A Radio Specification) *2 Image Frequencies and adjacent interference to image Image frequency = Co-channel -4 MHz 1 MHz adjacent interference to image frequency = Co-channel -3 MHz, Co-channel -5 MHz
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PEDLMK70-02
OKI Semiconductor
MK70110/MK70120
MECHANICAL CHARACTERISTICS
Weight Specifications
Model Name MK70120 (antenna built-in type) MK70110 (RF coaxial connector type) Weight 3.6 g (Max.) 3.5 g (Max.)
RF I/O Pin Specifications The following chip antenna and RF coaxial connector are mounted:
Model Name MK70120 MK70110 RF I/O Type Chip antenna RF coaxial connector Manufacturer / Model Name MURATA MFG. / ANCM12G45 HIROSE ELECTRIC / U.FL-R-SMT
Connector Specifications The following board-to-board connector is mounted:
Interface Type Board-to-board connector Manufacturer / Series Name Matsushita Electric Works / AXK6F20345
A header is mounted on the module side. It is therefore recommended that a 2.0 mm high socket (AXK5F20545) be used against the socket insertion side of the connector.
Board-to-board Connector Detail
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PEDLMK70-02
OKI Semiconductor
MK70110/MK70120
CONNECTOR PIN DESCRIPTIONS
Pin 5, 6, 7 15, 16 1 19 2 20 12 9 Symbol VDD GND UART_RTS UART_CTS UART_TD UART_RD USB_D+ USB_D- Type -- -- O I O I I/O I/O Power supply pin Ground pin UART Ready To Send (transmission data ready) UART Clear To Send (transmission ready) UART transmission data UART receive data USB Data + USB Data - HCI transport selection pin 13 VBUS I H: USB is used as HCI L: UART is used as HCI adhering to the above logic at power-on 4 17 3 18 8 14 11 10 PCM_OUT PCM_IN PCM_CLK PCM_SYNC RESET XCLK TEST1 N.C
*6 *2 *2 *1
Description
If Not Used -- -- Pull_up or VDD Pull_down or GND Pull_up or VDD Pull_up or VDD Open Open
--
O I O O I I I --
PCM data output PCM data input
*5 *5 *5
Open Open Open Open Pull_up GND Open Open
PCM clock output (64 kHz/128 kHz)
PCM synchronous signal input (8 kHz) Reset signal input pin Reset = L Effective reset pulse width > 10 sec Subclock input pin 32 kHz*3 Test pin for our company's use*4 N.C.
*1 Mount an approximately 10 F tantalum or electrolytic capacitor to the power supply input pin. The capacitor should be mounted as close to the power supply pin of the module as possible. *2 At present, this pin is not supported. Must be left open. *3 At present, this pin does not support a 32 kHz sub-clock. Connect to GND. *4 Test pin for our company's use. Must be left open. *5 The PCM_IN, CLK, and SYNC pins are pulled-down internally. *6 Setting the reset signal input pin RESET to a "L" level can reset the LSI. The reset state of the LSI is held for a duration of 10 msec even after the reset signal is switched to a "H" level.
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PEDLMK70-02
OKI Semiconductor
MK70110/MK70120
INTERFACE SPECIFICATIONS
USB Interface * Conforms to USB1.1 * Supports 12 Mbps
Parameter Rise time Fall time Output signal crossover voltage Driver output resistance Data rate Symbol TR TF VCRS ZDRV TDRATE Condition [1], [2], [3] CL = 50 pF CL = 50 pF When being driven in a steady state Average bit rate (12 Mbps 0.25%) Min. 4 4 1.3 28 11.97 Typ. -- -- -- -- -- Max. 20 20 2 44 12.03 Unit ns V Mbps
[1]
TR and TF are the intervals of the transition time from 10% to 90% (TR) or from 90% to 10% (TF) of an amplitude.
[2] Input signal crossover point (When USB connector is not attached)
VDD 0.8VDD 0.2VDD 0.8VDD 0.2VDD
0V
UART Interface Various settings can be made for the UART interface by using the Vendor specific command (refer to the ML70110/MK70120 User's Manual). The default values are as follows: * Baud rate: 115.2 kbps * Parity: Non-parity * Data length: 8 bits * Stop bit: 1 bit * Flow control: off
PCM Interface * Application format PCM linear (8, 16 bits/sample, 64 kHz sampling frequency)/A-law/-law * Bluetooth format CVSD/A-law/-law
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PEDLMK70-02
OKI Semiconductor
MK70110/MK70120
8 bits or 16 bits
PCMCLK (64kHz or 128kHz) LSB PCMOUT Data is output at the timing of CLK rise. PCMSYNC MSB DATA DATA DATA LSB MSB DATA
125 s (8 kHz)
PCM Output Timing
8 bits or 16 bits
PCMCLK (64kHz or 128kHz) LSB PCMIN Data is captured at the timing of CLK fall. PCMSYNC MSB DATA DATA DATA LSB MSB DATA
125 s (8 kHz)
PCM Input Timing
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PEDLMK70-02
OKI Semiconductor
MK70110/MK70120
PCM Timing Specifications
Parameter PCMIN setup time to PCMCLK (input) fall PCMIN hold time to PCMCLK (input) fall PCMOUT setup time to PCMCLK (input) rise PCMOUT hold time to PCMCLK (input) rise PCMSYNC (input) setup time to PCMCLK (input) rise PCMSYNC (input) hold time to PCMCLK (input) rise Delay time from PCMCLK (input) rise to PCMSYNC (output) PCMIN setup time to PCMCLK (output) fall PCMIN hold time to PCMCLK (output) fall PCMOUT setup time to PCMCLK (output) rise PCMOUT hold time to PCMCLK (output) rise PCMSYNC (input) setup time to PCMCLK (output) rise PCMSYNC (input) hold time to PCMCLK (output) rise Delay time from PCMCLK (output) rise to PCMSYNC (output) Symbol Condition tPC0 tPC1 tPC2 tPC3 tPC4 tPC5 tPC6 tPC7 tPC8 tPC9 tPC10 tPC11 tPC12 tPC13 CL = 50 pF Min. 500 500 500 500 500 500 -- 500 500 500 500 500 500 -- Typ. -- -- -- -- -- -- -- -- -- -- -- -- -- -- Max. -- -- -- -- -- -- 500 -- -- -- -- -- -- 500 ns Unit
PCMCLK (input) PCMIN
tPC0
PCMOUT
tPC1 tPC2 tPC3
tPC2
PCMSYNC (input)
tPC3 tPC5 tPC6
tPC4
PCMSYNC (output)
tPC4
tPC5
PCMCLK (output) PCMIN
tPC7
PCMOUT
tPC8 tPC9 tPC11 tPC10 tPC12
tPC9
PCMSYNC (input)
tPC10 tPC12 tPC13
tPC11
PCMSYNC (output)
PCM Timing
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PEDLMK70-02
OKI Semiconductor
MK70110/MK70120
MOUNTING MODULE
Recommended Module Fixing Method When this module is fixed on a product, our recommended method is to fit the module board-to-board connector (header) into the board-to-board connector (socket) mounted on the product board, and to solder the module shielding case to the product board.
Soldering Pattern
25.1 3.6 Pad dimension 4.0
13.2
4.2
9.5
Pattern inhibiting zone
17.5
3.0
Unit: [mm] 11.7 30.5 Board-to-board connector (AXK5F20545)
The pattern inhibiting zone is applied to the MK70120 (antenna built-in type).
1.5 mm maximum (three soldering points)
29.4 26.4
: Soldering points
7.9 4.9
Unit: [mm]
Soldering points in the shielding case for fixation on a product board
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PEDLMK70-02
OKI Semiconductor
MK70110/MK70120
Notes on Mounting the Module 1. This module is not adaptable to reflow mounting. When soldering the shielding case to a product board, use a soldering iron. 2. If metal is placed around the antenna, the antenna characteristics may deteriorate. Do not place copper foil in the pattern inhibiting zone shown in the above section. Do not place metal around the antenna if possible. (Only for MK70120). 3. The shielding case is connected to GND in the module. For mounting the module, when pattern wiring that touches the shielding case is carried out on the product board, do not cause a short-circuit between the shielding case and the pattern. For example, apply resist on the entire surface that touches the shielding case. 4. The effects of noise on a product board depend on the connection of GND/NC to the fixation pads. Select the connection with better electrical characteristics in the module mounted state.
CAUTIONS IN USE
This module consists of precision electronic components. Therefore, note the following when handling the module: 1. In a case of decomposition or recomposition of this module, the operations in these specifications are not assured. 2. This module is not waterproof or drip-proof. Do not use the module in wet locations. 3. Do not use this module under high temperature or high humidity conditions, in direct sunlight, or in dusty places.
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OKI Semiconductor
Outline of MK70110
MODULE OUTLINE
Board to Board Connector Assignment
Case
Board to Board Connector
Lot No.
Label
RF Coaxial Connector
PEDLMK70-02
MK70110/MK70120
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OKI Semiconductor
Outline of MK70120
Board to Board Connector Assignment
Chip Antenna
Case
Board to Board Connector
Lot No.
Label
PEDLMK70-02
MK70110/MK70120
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PEDLMK70-02
OKI Semiconductor
MK70110/MK70120
REVISION HISTORY
Document No. PEDLMK70-01 Page Date Previous Edition - Current Edition - Description
Aug. 2001
Preliminary edition 1 Preliminary edition 2
PEDLMK70-02
Apr. 24, 2002
-
-
Owing to the device name change from MK70 Series to MK70110/MK70120, the contents have been changed throughout the document.
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PEDLMK70-02
OKI Semiconductor
MK70110/MK70120
NOTICE 1. The information contained herein can change without notice owing to product and/or technical improvements. Before using the product, please make sure that the information being referred to is up-to-date. 2. The outline of action and examples for application circuits described herein have been chosen as an explanation for the standard action and performance of the product. When planning to use the product, please ensure that the external conditions are reflected in the actual circuit, assembly, and program designs. When designing your product, please use our product below the specified maximum ratings and within the specified operating ranges including, but not limited to, operating voltage, power dissipation, and operating temperature. Oki assumes no responsibility or liability whatsoever for any failure or unusual or unexpected operation resulting from misuse, neglect, improper installation, repair, alteration or accident, improper handling, or unusual physical or electrical stress including, but not limited to, exposure to parameters beyond the specified maximum ratings or operation outside the specified operating range. Neither indemnity against nor license of a third party's industrial and intellectual property right, etc. is granted by us in connection with the use of the product and/or the information and drawings contained herein. No responsibility is assumed by us for any infringement of a third party's right which may result from the use thereof. The products listed in this document are intended for use in general electronics equipment for commercial applications (e.g., office automation, communication equipment, measurement equipment, consumer electronics, etc.). These products are not authorized for use in any system or application that requires special or enhanced quality and reliability characteristics nor in any system or application where the failure of such system or application may result in the loss or damage of property, or death or injury to humans. Such applications include, but are not limited to, traffic and automotive equipment, safety devices, aerospace equipment, nuclear power control, medical equipment, and life-support systems. Certain products in this document may need government approval before they can be exported to particular countries. The purchaser assumes the responsibility of determining the legality of export of these products and will take appropriate and necessary steps at their own expense for these. No part of the contents contained herein may be reprinted or reproduced without our prior permission. Copyright 2002 Oki Electric Industry Co., Ltd.
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