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Surface Mount Microwave Schottky Mixer Diodes Technical Data
HSMS-8101 Single HSMS-8202 Series Pair HSMS-8207 Ring Quad HSMS-8209 Crossover Quad
Features
* Optimized for use at 10-14 GHz * Low Capacitance * Low Conversion Loss * Low RD * Low Cost Surface Mount Plastic Package
Plastic SOT-23 Package
Package Lead Code Identification (Top View)
SINGLE 3 SERIES 3
1
#1
2
1
#2
2
Plastic SOT-143 Package Description/Applications
These low cost microwave Schottky diodes are specifically designed for use at X/Ku-bands and are ideal for DBS and VSAT downconverter applications. They are available in SOT-23 and SOT-143 standard package configurations. Note that Agilent's manufacturing techniques assure that dice found in pairs and quads are taken from adjacent sites on the wafer, assuring the highest degree of match.
RING QUAD 3 4
CROSS-OVER QUAD 3 4
1
#7
2
1
#9
2
Absolute Maximum Ratings [1], TA = +25C
Symbol Parameter PT PIV TJ TSTG, Top Total Device Dissipation[2] Peak Inverse Voltage Junction Temperature Storage and Operating Temperature Unit mW V C C Min. -- -- -- -65 Max. 75 4 +150 +150 Notes: 1. Operation in excess of any one of these conditions may result in permanent damage to the device. 2. Measured in an infinite heat sink at TCASE = 25C. Derate linearly to zero at 150C per diode.
ESD WARNING: Handling Precautions Should Be Taken To Avoid Static Discharge.
2
DC Electrical Specifications, TA = 25C
Symbol Parameters and Test Conditions VBR CT C T RD RD VF VF Breakdown Voltage IR = 10 A Total Capacitance VR = 0 V, f = 1 MHz Capacitance Difference VR = 0 V, f = 1 MHz Dynamic Resistance IF = 5 mA Dynamic Resistance Difference IF = 5 mA Forward Voltage IF = 1 mA Forward Voltage Difference IF = 1 mA Lead Code Package Marking Code in White where x is date code
HSMS-8101 Units Min. Max. V pF pF mV mV 1 R1x 250 4 0.26 -- 14 -- 350 --
HSMS-8202 Min. Max. 4 0.26 0.04 14 2 250 350 20 2 2Rx
HSMS-8207 Min. Max. 4 0.26 0.04 14 2 250 350 20 7 R7x
HSMS-8209 Min. Max. 4 0.26 0.04 14 2 250 350 20 9 R9x
RF Electrical Parameters, TA = 25C
Symbol Lc Z IF SWR Parameter Conversion Loss at 12 GHz IF Impedance SWR at 12 GHz Units dB Typical 6.3 150 1.2
Note: DC Load Resistance = 0 ; LO Power = 1 mW.
SPICE Parameters
IS = 4.6 E-8 RS = 6 N = 1.09 BV = 7.3 IBV = 10E-5 EG = 0.69 CJO = 0.18 E-12 PB (VJ) = 0.5 M = 0.5 FC = 0.5 TT = 0
Linear Equivalent Circuit
0.08 pF
1.0 nH
1.3 nH
6
0.17 pF
Rj
Self Bias
Rj 1 mA 263 2.5 mA 142
3
Typical Performance, TC = 25C
VF - FORWARD VOLTAGE DIFFERENCE (mV)
100
IF - FORWARD CURRENT (mA) FORWARD CURRENT (mA)
30 IF (Left Scale) 10
30
9
10
10
CONVERSION LOSS (dB)
8
1
0.1
TA = +125C TA = +25C TA = -55C
VF (Right Scale) 1 1
7
0.01
0
0.2
0.4
0.6
0.8
0.3 0.3 0.20 0.25 0.30 0.35 0.40 0.45 0.50 0.55 V - FORWARD VOLTAGE (V)
6 -7 -5 -3 -1 1
3
5
7
9
11 13
FORWARD VOLTAGE (V)
LOCAL OSCILLATOR POWER (dBm)
Figure 1. Typical Forward Current vs. Forward Voltage at Three Temperatures.
Figure 2. Typical VF Match, HSMS820X Pairs and Quads.
Figure 3. Typical Conversion Loss vs. Local Oscillator Power.
Ordering Information
Specify part number followed by option. For example: HSMS - 8101 - XXX Bulk or Tape and Reel Option Part Number Surface Mount Schottky
Profile Option Descriptions
-BLK = Bulk -TR1 = 3K pc. Tape and Reel, Device Orientation Figures 4, 5 -TR2 = 10K pc. Tape and Reel, Device Orientation Figures 4, 5 Tape and Reeling conforms to Electronic Industries RS-481, "Taping of Surface Mounted Components for Automated Placement."
TOP VIEW 4 mm END VIEW
Device Orientation
REEL
8 mm
CARRIER TAPE USER FEED DIRECTION COVER TAPE
Figure 4. Option -TR1/-TR2 for SOT-23 Packages.
4 mm
8 mm
Figure 5. Option -TR1/-TR2 for SOT-143 Packages.
Package Characteristics
Lead Material ...................................................................................... Alloy 42 Lead Finish ............................................................................ Tin-Lead 85-15% Maximum Soldering Temperature .............................. 260C for 5 seconds Minimum Lead Strength .......................................................... 2 pounds pull Typical Package Inductance .................................................................. 2 nH Typical Package Capacitance .............................. 0.08 pF (opposite leads)
Package Dimensions Outline 23 (SOT-23)
1.02 (0.040) 0.89 (0.035) * 1.03 (0.041) 0.89 (0.035) PACKAGE MARKING CODE (XX) 3 1.40 (0.055) 1.20 (0.047) 2 2.65 (0.104) 2.10 (0.083) 0.54 (0.021) 0.37 (0.015) DATE CODE (X)
XXX
1 0.60 (0.024) 0.45 (0.018)
*
2.04 (0.080) 1.78 (0.070) 2.05 (0.080) 1.78 (0.070) TOP VIEW 3.06 (0.120) 2.80 (0.110) 1.04 (0.041) 0.85 (0.033)
* 0.180 (0.007) 0.085 (0.003)
0.152 (0.006) 0.086 (0.003)
0.10 (0.004) 0.013 (0.0005) SIDE VIEW
0.69 (0.027) 0.45 (0.018) END VIEW
* THESE DIMENSIONS FOR HSMS-280X AND -281X FAMILIES ONLY.
DIMENSIONS ARE IN MILLIMETERS (INCHES)
Outline 143 (SOT-143)
0.92 (0.036) 0.78 (0.031) DATE CODE (X) E PACKAGE MARKING CODE (XX) C 1.40 (0.055) 1.20 (0.047) E 0.60 (0.024) 0.45 (0.018) 2.04 (0.080) 1.78 (0.070) 3.06 (0.120) 2.80 (0.110) 1.04 (0.041) 0.85 (0.033) 0.10 (0.004) 0.013 (0.0005) DIMENSIONS ARE IN MILLIMETERS (INCHES) 0.69 (0.027) 0.45 (0.018) 2.65 (0.104) 2.10 (0.083)
XXX
B
0.54 (0.021) 0.37 (0.015)
0.15 (0.006) 0.09 (0.003)
www.semiconductor.agilent.com Data subject to change. Copyright (c) 2001 Agilent Technologies, Inc. Obsoletes 5968-3886E July 10, 2001 5988-3328EN

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