 |
|
| If you can't view the Datasheet, Please click here to try to view without PDF Reader . |
|
|
|
| If you can't view the Datasheet, Please click here to try to view without PDF Reader . |
|
|
| Datasheet File OCR Text: |
| FLLD261 HIGH CONDUCTANCE LOW LEAKAGE DIODE PD . . . .350 mW @ TA = 25 Deg C BV . . . .200 V (MIN) @ IR = 5 uA ABSOLUTE MAXIMUM RATINGS (NOTE 1) TEMPERATURES Storage Temperature Operating Junction Temperature -55 to +150 Degrees C -55 to +150 Degrees C PACKAGE TO-236AB (Low) 3 P8A 1 2 CONNECTION DIAGRAMS 3 POWER DISSIPATION (NOTES 2 & 3) Total Device Dissipation at TA = 25 Deg C Derating Factor per Degree C 350 mW 2.8 mW 1 2 VOLTAGES & CURRENTS WIV Working Inverse Voltage IO Average Rectified Current IF DC Forward Current if Recurrent Peak Forward Current if (surge) Peak Forward Surge Current Pulse width = 1 second Pulse width = 1 microsec 100 V 250 mA 600 mA 700 mA 1.0 A 3.0 A ELECTRICAL CHARACTERISTICS (25 Degrees C Ambient Temperature unless otherwise stated) SYM BV IR VF CT TRR TFR VFM CHARACTERISTICS Breakdown Voltage Reverse Voltage Leakage Current Forward Voltage Diode Capacitance Reverse Recovery Time Forward Recovery Time Peak Forward Voltage MIN 200 MAX UNITS V TEST CONDITIONS IR = 5.0 uA TA = 150 Deg C 5.0 5.0 1.40 4.0 400 10 0.9 Typ nA uA V pF ns ns V VR = 100 V VR = 100 V IF = VR = 200 mA 1.0 V f = 1.0 MHZ IF = IR = 50 to 400 mA IRR = 10% IR RL = 100 ohms IF = 10 mA IF = 10 mA Rise Time = 5 ns +/-20% NOTES: 1. These ratings are limiting values above which the serviceability of any semiconductor device may be impaired. 2. These are steady state limits. The factory should be consulted on applications involving pulsed or low duty cycle operations. 0.019 (0.483) 0.015 (0.381) 3 0.098 (2.489) 0.083 (2.108) 3 CHARACTERS MAX 0.055 (1.397) 0.047 (1.194) 1 2 0.024 (0.810) 0.018 (0.457) 0.040 (1.016) 0.035 (0.889) 0.080 (2.032) 0.070 (1.778) 0.120 (3.048) 0.110 (2.794) LOW PROFILE (49) 0.041 (1.041) 0.030 (0.762) LOW PROFILE (49) 0.0040 (0.102) 0.0005 (0.013) 0.0059 (0.150) 0.0035 (0.089) SOT-23 (DIODE) TO-236AB (LOW PROFILE) 11-March-1997 0.030" +/- 0.005" (0.762 +/- 0.127) 0.120" MINIMUM (3.048) 0.035" TYPICAL (0.889) 0.060" +/- 0.005" (1.524 +/- 0.127) RECOMMENDED SOLDER PADS FOR SOT-23 0.031" +/- 0.005" (0.800 +/- 0.127) 0.039" +/- 0.005" (1.000 +/- 0.127) 0.099" +/- 0.005" (2.524 +/- 0.127 ) 0.037" +/- 0.005" (0.950 +/- 0.127 ) 0.060" +/- 0.005" (1.524 +/- 0.127) RECOMMENDED SOLDER PADS FOR U.S., European & Japanese (SC-59) SOT-23 TRADEMARKS The following are registered and unregistered trademarks Fairchild Semiconductor owns or is authorized to use and is not intended to be an exhaustive list of all such trademarks. ACExTM BottomlessTM CoolFETTM CROSSVOLTTM DenseTrenchTM DOMETM EcoSPARKTM E2CMOSTM EnSignaTM FACTTM FACT Quiet SeriesTM DISCLAIMER FAST FASTrTM FRFETTM GlobalOptoisolatorTM GTOTM HiSeCTM ISOPLANARTM LittleFETTM MicroFETTM MICROWIRETM OPTOLOGICTM OPTOPLANARTM PACMANTM POPTM PowerTrench QFETTM QSTM QT OptoelectronicsTM Quiet SeriesTM SILENT SWITCHER SMART STARTTM StealthTM SuperSOTTM-3 SuperSOTTM-6 SuperSOTTM-8 SyncFETTM TinyLogicTM UHCTM UltraFET VCXTM FAIRCHILD SEMICONDUCTOR RESERVES THE RIGHT TO MAKE CHANGES WITHOUT FURTHER NOTICE TO ANY PRODUCTS HEREIN TO IMPROVE RELIABILITY, FUNCTION OR DESIGN. FAIRCHILD DOES NOT ASSUME ANY LIABILITY ARISING OUT OF THE APPLICATION OR USE OF ANY PRODUCT OR CIRCUIT DESCRIBED HEREIN; NEITHER DOES IT CONVEY ANY LICENSE UNDER ITS PATENT RIGHTS, NOR THE RIGHTS OF OTHERS. LIFE SUPPORT POLICY FAIRCHILD'S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF FAIRCHILD SEMICONDUCTOR CORPORATION. As used herein: 1. Life support devices or systems are devices or 2. A critical component is any component of a life support device or system whose failure to perform can systems which, (a) are intended for surgical implant into be reasonably expected to cause the failure of the life the body, or (b) support or sustain life, or (c) whose support device or system, or to affect its safety or failure to perform when properly used in accordance with instructions for use provided in the labeling, can be effectiveness. reasonably expected to result in significant injury to the user. PRODUCT STATUS DEFINITIONS Definition of Terms Datasheet Identification Advance Information Product Status Formative or In Design Definition This datasheet contains the design specifications for product development. Specifications may change in any manner without notice. This datasheet contains preliminary data, and supplementary data will be published at a later date. Fairchild Semiconductor reserves the right to make changes at any time without notice in order to improve design. This datasheet contains final specifications. Fairchild Semiconductor reserves the right to make changes at any time without notice in order to improve design. Preliminary First Production No Identification Needed Full Production Obsolete Not In Production This datasheet contains specifications on a product that has been discontinued by Fairchild semiconductor. The datasheet is printed for reference information only. Rev. H2 |
Price & Availability of FLLD261
 |
|
|
|
|
All Rights Reserved © IC-ON-LINE 2003 - 2022 |
| [Add Bookmark] [Contact Us] [Link exchange] [Privacy policy] |
|
Mirror Sites : [www.datasheet.hk]
[www.maxim4u.com] [www.ic-on-line.cn]
[www.ic-on-line.com] [www.ic-on-line.net]
[www.alldatasheet.com.cn]
[www.gdcy.com]
[www.gdcy.net] |