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| OKI Semiconductor MBF9041BB SAW Antenna Duplexer (700 to 1000 MHz) FEDW9041BB-02 Issue Date: May 20. 2002 GENERAL DESCRIPTION The MBF9041BB is the SAW antenna duplexer for the frequency range of 700 to 1000 MHz. This SAW Duplexer integrates RF filters at Tx and Rx side, and matching circuit into PKG. This helps to save the space and weight greatly in the target application such as mobile telephone. This SAW Duplexer has very low insertion loss by using high quality package. Due to high harmonics characteristics, total number of components at RF circuit can be minimized. Thanks to high isolation performance, high sensitivity can be expected. Low insertion loss at Tx saves the power consumption of mobile telephone which prolong the battery life. FEATURES * Complying Standard AMPS, IS-95, IS-136 * Thin package: less than 1.5 mm in height * PKG I/O Impedance: 50 PRODUCT DESCRIPTION Package Type MBF9041BB OKI Rx 041BB YZZZ Tx ANT 1/11 FEDW9041BB-02 OKI Semiconductor MBF9041BB PIN ASSIGNMENT & DESCRIPTION Top view (12) (11) (10) (9) (8) (13) (14) (15) OKI (7) (6) (5) 041BB YZZZ (1) (2) (3) (16) (4) Bottom view (16) (1) (2) (3) (4) (15) (14) (13) (17) (5) (6) (7) This number is for OKI production purpose only. (12) (11) (10) (9) (8) Pin No. 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 Name GND ANT GND GND GND Tx GND GND GND GND GND GND GND Rx GND GND GND Description Ground Pin Antenna Pin Ground Pin No Connection * Ground Pin Transmitting Terminal Pin Ground Pin No Connection * Ground Pin Ground Pin Ground Pin No Connection * Ground Pin Receiving Terminal Pin Ground Pin No Connection * Ground Pin Note) Pin No. 4, 8, 12 and 16 are for manufacturer's internal use. Do not solder to the PCB. 2/11 FEDW9041BB-02 OKI Semiconductor MBF9041BB ABSOLUTE MAXIMUM RATINGS Parameter Operating Temperature Storage Temperature Maximum Input Power Symbol Ta TSTG PIN Rating Min. -30 -40 -- Max. +85 +85 2.0 Unit C C W RECOMMENDED OPERATING CONDITIONS Parameter Operating Temperature Symbol Ta Rating Min. -30 Max. +85 Unit C 3/11 FEDW9041BB-02 OKI Semiconductor MBF9041BB ELECTRICAL CHARACTERISTICS Parameter Tx Antenna a) b) c) d) Insertion loss Passband ripple VSWR Absolute attenuation 824 to 849 MHz 824 to 849 MHz 824 to 849 MHz 869 to 894 MHz 1648 to 1698 MHz 2472 to 2547 MHz Antenna Rx a) b) c) Insertion loss Passband ripple VSWR 869 to 894 MHz 869 to 894 MHz 869 to 894 MHz 824 to 849 MHz d) Absolute attenuation 930 to 1200 MHz 1200 to 1500 MHz 1500 to 1800 MHz Isolation TX RX a) a) Absolute attenuation Average power 824 to 849 MHz -- 55 -- -- -- -- 2 dB W Input Power -- -- -- 50 33 40 40 3.4 1.4 1.8 53 38 45 45 3.8 2.0 2.1 -- -- -- -- dB dB dB dB dB dB -- -- -- 40 30 30 2.4 1.0 1.7 42 33 33 2.8 1.5 2.0 -- -- -- dB dB dB dB dB Condition Mini. Typ. (Ta = -30 to +85C) Max. Unit/Notes Note: Electrical characteristics described above is guaranteed by the following measurement and equipment condition. 1) Test board: See next page 2) Measurement machine : Network analyzer 4/11 FEDW9041BB-02 OKI Semiconductor MBF9041BB Test Board 5/11 FEDW9041BB-02 OKI Semiconductor MBF9041BB MARKING Company Logo Part Symbol OKI 041BB YZZZ Lot Number Antenna Index Note) Lot Number Y: ZZZ: Last number of year Serial number 6/11 FEDW9041BB-02 OKI Semiconductor MBF9041BB REFLOW TEMPERATURE PROFILE The figure below shows recommended temperature profile of infrared reflow and air reflow. Other type of reflow is not recommended. The maximum reflow count is 2 times. Washing of this device after reflow process is prohibited. 250 1 to 4C/sec. Package surface Temperature (C) 200 Preheat temperature: 120 to 150C 150 20 sec.max 235 to 240C, 20 sec. max. 1 to 4C/sec. 40 to 60 sec. 100 50 2 to 5C/sec. Time (sec.) 7/11 FEDW9041BB-02 OKI Semiconductor MBF9041BB PACKAGE DIMENTION Unit: mm General tolerance: 0.15 9.5 0.2 OKI 041BB YZZZ 7.5 0.6 (0.8) (2.21) 3.0 1.5 12 - R0.2 1.27 2.54 (2.48) TYP. (1.3 typ.) 1.5max 5.08 (0.8) TYP. 2.54 4.9 2.45 11-0.8 4 - R0.15 1.1 0.2 8/11 FEDW9041BB-02 OKI Semiconductor MBF9041BB RECOMMENDATION FOR SOLDER PAD PATTERN The solder pad pattern should be designed by customers because it depends on the electrical performance of the customers' system. Following is an example of solder pad pattern which is used in OKI's package evaluation board. Please be noted that this is for reference purpose only. 25 m 0.1 mm 0.1 mm 25 m 0.5 mm 0.1 mm PCB pad pattern Metal mask pattern Pad of Device Please pay attention to the following items to maintain electrical performance. (1) Metal mask pattern for cream solder should be 25 m smaller on each side. Metal mask is 0.15 mm in thickness. (2) As the impedance of Tx, Rx, ANT is designed for 50 , please consider this for the design of mother board. (3) The performance of these devices is assured when GND pad (Pin 17) is connected. GND pad (Pin 17) should be soldered in the same way as above. 9/11 FEDW9041BB-02 OKI Semiconductor MBF9041BB REVISION HISTORY Document No. FEDW9041BB-01 Date April 2000 Page Previous Current Edition Edition - - - - 1 Final edition 1 Final edition 2 Description FEDW9041BB-02 May20, 2002 1 Partially changed the content of "PRODUCT DESCRIPTION". 10/11 |
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