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Balanced Three-chip MicroCapacitance (MC) SIDACtor Device Balanced Three-chip MicroCapacitance (MC) SIDACtor Device 1 3 The balanced three-chip TO-220 MC SIDACtor solid state device protects telecommunication equipment in high-speed applications that are sensitive to load values and that require a lower capacitance. CO values for the MC are 40% lower than a standard AC part. This MC SIDACtor series is used to enable equipment to meet various regulatory requirements including GR 1089, ITU K.20, K.21, and K.45, IEC 60950, UL 60950, and TIA-968-A (formerly known as FCC Part 68) without the need of series resistors. 2 Electrical Parameters Part Number * P1553AC MC P1803AC MC P2103AC MC P2353AC MC P2703AC MC P3203AC MC P3403AC MC P5103AC MC VDRM Volts 130 150 170 200 230 270 300 420 VS Volts 180 210 250 270 300 350 400 600 VDRM Volts 130 150 170 200 230 270 300 420 VS Volts 180 210 250 270 300 350 400 600 VT Volts 8 8 8 8 8 8 8 8 IDRM Amps 5 5 5 5 5 5 5 5 IS mAmps 800 800 800 800 800 800 800 800 IT Amps 2.2 2.2 2.2 2.2 2.2 2.2 2.2 2.2 IH mAmps 150 150 150 150 150 150 150 150 CO pF 40 40 40 40 30 30 30 30 Pins 1-2, 2-3 Pins 1-3 * For surge ratings, see table below. General Notes: * All measurements are made at an ambient temperature of 25 C. IPP applies to -40 C through +85 C temperature range. * IPP is a repetitive surge rating and is guaranteed for the life of the product. * Listed SIDACtor devices are bi-directional. All electrical parameters and surge ratings apply to forward and reverse polarities. * VDRM is measured at IDRM. * VS is measured at 100 V/s. * Special voltage (VS and VDRM) and holding current (IH) requirements are available upon request. * Off-state capacitance (CO) is measured between Pins 1-2 and 3-2 at 1 MHz with a 2 V bias. * Device is designed to meet balance requirements of GTS 8700 and GR 974. Surge Ratings IPP 2x10 s Amps 500 IPP 8x20 s Amps 400 IPP 10x160 s Amps 200 IPP 10x560 s Amps 150 IPP 10x1000 s Amps 100 ITSM 60 Hz Amps 50 di/dt Amps/s 500 Series C http://www.littelfuse.com +1 972-580-7777 2 - 36 (c) 2004 Littelfuse, Inc. SIDACtor(R) Data Book and Design Guide Balanced Three-chip MicroCapacitance (MC) SIDACtor Device Thermal Considerations Package Modified TO-220 Symbol TJ TS RJA Parameter Operating Junction Temperature Range Storage Temperature Range Thermal Resistance: Junction to Ambient Value -40 to +150 -65 to +150 50 Unit C C C/W PIN 1 PIN 2 PIN 3 +I +I IPP - Peak Pulse Current - %IPP tr = rise time to peak value td = decay time to half value IT IT IS S IH IDRM -V -V VT VT VDRM VDRM VS V S 100 Peak Value Waveform = tr x td +V +V 50 Half Value 0 0 tr td t - Time (s) -I -I V-I Characteristics tr x td Pulse Wave-form 14 Percent of VS Change - % 10 IH (TC = 25 C) 12 8 6 4 2 0 -4 -6 -8 -40 -20 0 20 40 60 80 100 120 140 160 2.0 1.8 1.6 1.4 1.2 1.0 0.8 0.6 0.4 -40 -20 0 20 40 60 80 100 120 140 160 IH 25 C 25 C Ratio of Case Temperature (TC) - C Junction Temperature (TJ) - C Normalized VS Change versus Junction Temperature Normalized DC Holding Current versus Case Temperature (c) 2004 Littelfuse, Inc. SIDACtor(R) Data Book and Design Guide 2 - 37 http://www.littelfuse.com +1 972-580-7777 Data Sheets |
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