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Wireless Components Mixer and IF Vector Modulator PMB 2208 Version V1.2 Specification August 1999 preliminary CONFIDENTIAL Revision History: Current Version: 08.99 Previous Version:Data Sheet Page (in previous Version) Page (in current Version) Subjects (major changes since last revision) ABM(R), AOP(R), ARCOFI(R), ARCOFI(R)-BA, ARCOFI(R)-SP, DigiTape(R), EPIC(R)-1, EPIC(R)-S, ELIC(R), FALC(R)54, FALC(R)56, FALC(R)-E1, FALC(R)-LH, IDEC(R), IOM(R), IOM(R)-1, IOM(R)-2, IPAT(R)-2, ISAC(R)-P, ISAC(R)-S, ISAC(R)-S TE, ISAC(R)-P TE, ITAC(R), IWE(R), MUSAC(R)-A, OCTAT(R)-P, QUAT(R)-S, SICAT(R), SICOFI(R), SICOFI(R)2, SICOFI(R)-4, SICOFI(R)-4C, SLICOFI(R) are registered trademarks of Infineon Technologies AG. ACETM, ASMTM, ASPTM, POTSWIRETM, QuadFALCTM, SCOUTTM are trademarks of Infineon Technologies AG. Edition 03.99 Published by Infineon Technologies AG i. Gr., SC, Balanstrae 73, 81541 Munchen (c) Infineon Technologies AG i. Gr. 30.08.99. All Rights Reserved. Attention please! As far as patents or other rights of third parties are concerned, liability is only assumed for components, not for applications, processes and circuits implemented within components or assemblies. The information describes the type of component and shall not be considered as assured characteristics. Terms of delivery and rights to change design reserved. Due to technical requirements components may contain dangerous substances. For information on the types in question please contact your nearest Infineon Technologies Office. Infineon Technologies AG is an approved CECC manufacturer. Packing Please use the recycling operators known to you. We can also help you - get in touch with your nearest sales office. By agreement we will take packing material back, if it is sorted. You must bear the costs of transport. For packing material that is returned to us unsorted or which we are not obliged to accept, we shall have to invoice you for any costs incurred. Components used in life-support devices or systems must be expressly authorized for such purpose! Critical components1 of the Infineon Technologies AG, may only be used in life-support devices or systems2 with the express written approval of the Infineon Technologies AG. 1 A critical component is a component used in a life-support device or system whose failure can reasonably be expected to cause the failure of that lifesupport device or system, or to affect its safety or effectiveness of that device or system. 2 Life support devices or systems are intended (a) to be implanted in the human body, or (b) to support and/or maintain and sustain human life. If they fail, it is reasonable to assume that the health of the user may be endangered. PMB 2208 preliminary Confidential Product Info Product Info General Description Package The PMB 2208 contains a direct quadrature modulator and an up/downconversion mixer with corresponding bias circuitry. s Features Direct quadrature modulator and up/down-conversion mixer on one chip Modulator: LO input frequency range from 200MHz to 550MHz corresponds to an output frequency range from 100MHz to 275MHz Generation of orthogonal carriers without external elements and without trimming typ. 48dB carrier suppression with 1Vpp baseband level typ. 49dB SSB suppression with 1Vpp baseband level typ. 51dB rejection of third-order intermodulation products with 1Vpp baseband level Low output noise floor s - - s Mixer: Double-balanced Gilbert cell RF and IF frequency range from DC to 2.5GHz typ 39dB carrier suppression Low noise Supply voltage range from 2.7 to 4.5V Power-down mode Temperature range -30 to 85C Analog systems with FM and AM modulation Space- and power-saving optimizations of existing discrete transmitter circuits - s - s s Application s Vector-modulated digital mobile cellular systems, such as GSM, PDC-800, PDC-1.5, PHS, DAMPS, DCS1800, WLAN, etc. Various modulation schemes, such as PM, PSK, FSK, QAM, QPSK, GMSK, etc. s s s Ordering Information Type PMB 2208 Ordering Code Package P-TSSOP-24 Wireless Components Product Info Specification, August 1999 1 Table of Contents 1 2 2.1 2.2 2.3 2.4 3 3.1 3.2 3.3 3.4 3.5 4 4.1 4.2 5 5.1 5.1.1 5.1.2 5.1.3 5.2 5.2.1 5.2.2 5.2.3 5.3 Table of Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-1 Product Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-1 Overview. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-2 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-2 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-3 Package Outlines . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-3 Functional Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-1 Pin Configuration . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-2 Pin Definition and Function. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-3 Internal Input/Output Circuits . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-4 Functional Block Diagram. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-5 Circuit Description. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-6 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-1 Circuits . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-2 Hints . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-3 Reference . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-1 Electrical Data. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-2 Absolute Maximum Ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-2 Operating Range . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-3 AC/DC Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-4 S-Parameters and Input/Output Impedances . . . . . . . . . . . . . . . . . . . 5-7 Mixer Input RX/RFX . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-8 Mixer Input IF/IFX . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-9 Mixer Output MO/MOX . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-10 Test Circuit . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-11 2 Product Description Contents of this Chapter 2.1 2.2 2.3 2.4 Overview. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-2 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-2 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-3 Package Outlines . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-3 PMB 2208 preliminary Confidential Product Description 2.1 Overview The PMB 2208 contains a direct quadrature modulator and an up/down-conversion mixer with corresponding bias circuitry. The modulator splits the signal at the LO/LOX input into two orthogonal carriers. The frequency of these carriers is half of the LO/LOX input frequency. The carriers are multiplied with the baseband modulation signals at the A/AX and B/BX inputs. The outputs of the multipliers are added and amplified by a linear output stage. The modulated signal is available at the E/EX output. A reference voltage is available at the TREF output, which can be used to bias the baseband inputs. The mixer combines the signals at the RF/RFX and IF/IFX inputs; the resulting signal is available at the MO/MOX output. The IF/IFX input is suitable for the lower-frequency signal because of its linear transfer function to the output. The higher-frequency signal is applied to the RF/RFX input, which operates in switched mode. In a typical application, the output signal of the modulator is band-pass filtered and then fed to the IF/IFX input of the mixer. The modulator and mixer have separate power supplies, and can be powered down independently. The power-down concept enables the modulator to be used with or without the mixer. 2.2 Features s s Direct quadrature modulator and up/down-conversion mixer on one chip Modulator: LO input frequency range from 200MHz to 550MHz corresponds to an output frequency range from 100MHz to 275MHz Generation of orthogonal carriers without external elements and without trimming typ. 48dB carrier suppression with 1Vpp baseband level typ. 49dB SSB suppression with 1Vpp baseband level typ. 51dB rejection of third-order intermodulation products with 1V pp baseband level Low output noise floor Mixer: Double-balanced Gilbert cell RF and IF frequency range from DC to 2.5GHz typ 39dB carrier suppression Low noise s - Wireless Components 2-2 Specification, August 1999 PMB 2208 preliminary Confidential Product Description s s s s Supply voltage range from 2.7 to 4.5V Power-down mode P-TSSOP-24 package Temperature range -30 to 85C 2.3 Applications s Vector-modulated digital mobile cellular systems, such as GSM, PDC-800, PDC-1.5, PHS, DAMPS, DCS1800, WLAN, etc. Various modulation schemes, such as PM, PSK, FSK, QAM, QPSK, GMSK, etc. Analog systems with FM and AM modulation Space- and power-saving optimizations of existing discrete transmitter circuits s s s 2.4 Package Outlines P-TSSOP-24 Wireless Components 2-3 Specification, August 1999 3 Functional Description Contents of this Chapter 3.1 3.2 3.3 3.4 3.5 Pin Configuration . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-2 Pin Definition and Function. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-3 Internal Input/Output Circuits . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-4 Functional Block Diagram. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-5 Circuit Description. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-6 PMB 2208 preliminary Confidential Functional Description 3.1 Pin Configuration RF VCC2 MOX MO GND GND LOX LO PD1 TREF A AX 1 2 3 4 5 6 7 8 9 10 11 12 24 23 22 21 20 RFX GND IF IFX PD2 GND E EX VCC1 GND B BX PMB 2208 19 18 17 16 15 14 13 Pin_config.wmf Figure 3-1 Pin Configuration Wireless Components 3-2 Specification, August 1999 PMB 2208 preliminary Confidential Functional Description 3.2 Pin Definition and Function Table 3-1 Pin Definition and Function Pin No. 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 Symbol RF VCC2 MOX MO GND GND LOX LO PD1 TREF A AX BX B GND VCC1 EX E GND PD2 IFX IF GND RFX Function RF input (base) Mixer supply voltage Inverted mixer output (open collector) Mixer output (open collector) Ground Ground Inverting modulator LO input Modulator LO input Modulator power-down Reference voltage output (DC bias for A, AX, B, BX) Modulation input A Inverting modulation input A Inverting modulation input B Modulation input B Ground Modulator supply voltage Inverted modulator output (open collector) Modulator output (open collector) Ground Mixer power-down Inverting IF input (emitter) IF input (emitter) Ground Inverting RF input (base) Wireless Components 3-3 Specification, August 1999 PMB 2208 preliminary Confidential Functional Description 3.3 Internal Input/Output Circuits RF VCC2 MOX MO 1 2k 2k RFX bias2 800 GND IF IFX 800 GND GND LOX LO PD1 TREF A AX 200k 200k PD2 GND E EX VCC1 GND B BX 200k 200k 7k bias1 Wireless Components 3-4 Specification, August 1999 PMB 2208 preliminary Confidential Functional Description 3.4 Functional Block Diagram 1 RF RFX VCC2 GND MOX IF MO mixer IFX mixer bias GND PD2 GND GND LOX input buffer E LO EX PD1 modulator bias output stage VCC1 TREF GND A / 2 AX mixer frequency divider mixer B BX Funct_block.wmf Figure 3-2 Functional Block Diagram Wireless Components 3-5 Specification, August 1999 PMB 2208 preliminary Confidential Functional Description 3.5 Circuit Description The modulator performs a direct quadrature modulation. The LO signal is connected to an emitter-coupled transistor pair. The LO signal is split internally into two orthogonal carriers at half of the LO/LOX input frequency. The accuracy of the internal 90 phase shift requires a balanced input signal and depends on the accuracy of the 50% duty cycle of the LO/LOX signal. The modulator has two Gilbert cell mixers, in which the baseband modulation signals at the A/AX and B/BX inputs are multiplied with the orthogonal carriers. The outputs of the two Gilbert cells are added and amplified by a linear output stage. The modulated transmit signal is available at the high-impedance, open-collector output E/EX. It can be band-pass filtered and fed to the IF/IFX input of the mixer. At the TREF output, a reference voltage is available, which should be capacitively decoupled to ground. TREF can be used to set the DC bias of the baseband inputs using external resistors. Alternatively, the DC level can be set independently of TREF, provided it is within the specified operational range. The up/down-conversion mixer is a fully-balanced Gilbert cell. The transfer function from the low-impedance emitter input IF/IFX to the output is linear for input levels below the 1dB compression point. For improved intermodulation, the mixer current can be increased with external resistors to ground at IF/IFX. The high-impedance input RF/RFX is directly connected to the bases of the switching transistors. The input level should be high enough to ensure proper switching. The output signal of the mixer is available at the high-impedance, open-collector outputs MO/MOX. The modulator and the mixer have separate supply and power-down pins: VCC1, PD1 for the modulator and VCC2, PD2 for the mixer. Applying a logic LOW to PD1 or PD2 powers down the corresponding part of the chip, including its bias circuitry. Depending on the application, the power-down pins can be combined or separately fixed to supply rails. Wireless Components 3-6 Specification, August 1999 4 Applications Contents of this Chapter 4.1 4.2 Circuits . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-2 Hints . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-3 PMB 2208 preliminary Confidential Applications 4.1 Circuits Appl_circuit.eps Figure 4-1 Application Circuit Wireless Components 4-2 Specification, August 1999 PMB 2208 preliminary Confidential Applications 4.2 Hints Wireless Components 4-3 Specification, August 1999 5 Reference Contents of this Chapter 5.1 5.1.1 5.1.2 5.1.3 5.2 5.2.1 5.2.2 5.2.3 5.3 Electrical Data. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-2 Absolute Maximum Ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-2 Operating Range . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-3 AC/DC Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-4 S-Parameters and Input/Output Impedances . . . . . . . . . . . . . . . . . . . 5-7 Mixer Input RX/RFX . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-8 Mixer Input IF/IFX . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-9 Mixer Output MO/MOX . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-10 Test Circuit . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-11 PMB 2208 preliminary Confidential Reference 5.1 Electrical Data 5.1.1 Absolute Maximum Ratings WARNING The maximum ratings may not be exceeded under any circumstances, not even momentarily and individually, as permanent damage to the IC will result. Table 5-1 Absolute Maximum Ratings Parameter Symbol 9CC 9I 9IF ,IF 9I - 9IX 9TREF 9MO 9E 7j 7S 5thJL 9ESD -1000 -55 -2 -0.5 -0.5 9CC-1.0 Limit Values min Supply voltage Input voltage (except IF, IFX) Input voltage IF, IFX Input current IF, IFX Differential input voltage Output voltage TREF Output voltage MO, MOX Output voltage E, EX Junction temperature Storage temperature Thermal resistance (junction to lead) ESD integrity * -0.5 -0.5 max 5.0 9CC+0.5 5.0 2 10 2 9CC+0.5 5.0 9CC+1.0 5.5 9CC+1.0 5.5 125 125 140 1000 V V V mA V V V V C C K/W V according MIL-STD 883D, method 3015.7 and EOS/ESD assn. standard S5.1 - 1993 9CC 4.5V 9CC > 4.5V 9CC 4.5V 9CC > 4.5V 9CC 4.5V 9CC > 4.5V 9CC 4.5V 9CC > 4.5V Unit Remarks * The RF pins 3, 4, 17 and 18 are not protected against voltage stress > 300V (versus VS or GND). The high frequency performance prohibits the use of adequate protective structures. Wireless Components 5-2 Specification, August 1999 PMB 2208 preliminary Confidential Reference 5.1.2 Operating Range Table 5-2 Operating Range, Supply voltage VCC=2.7V to 4.5 V, ambient temperature TA= -30 to 85C Parameter Symbol Limit Values min Control inputs PD1, PD2 LOW input voltage HIGH input voltage Mixer RF, RFX input frequency RF, RFX input level IF, IFX input frequency IF, IFX input level MO, MOX output frequency Minimum resistive load at IF, IFX to GND Modulator LO, LOX input frequency LO, LOX input level Suppression of the even harmonics at the LO, LOX input A, AX, B, BX input frequency A, AX, B, BX input level A-AX, B-BX differential input signal level Decoupling capacitance at TREF Load current at TREF ILO 3LO DHn2 IA-AX IB-BX 9A 9AX 9B 9BX 9A-AX 9B-BX CTREF ITREF 1RWH 1 1.0 200 -15 -10 40 0 1.4 10 9CC- 0.6 1 550 0 0 MHz dBm dBm dB MHz V Vpp nF mA Unit Remarks Item max 9IL 9IH IRF 3RF IIF 3IF IMO R2, R3 in Test Circuit 1 0 2.1 0.8 9CC V V 1 2 DC 2.5 0 GHz dBm GHz dBm GHz 3 4 5 6 7 8 DC 2.5 0 DC 33 2.5 9 fLO=200MHz fLO=550MHz 10 11 12 DC AC 13 14 15 16 3RZHU OHYHOV DUH UHIHUUHG WR DQ LPSHGDQFH RI Wireless Components 5-3 Specification, August 1999 PMB 2208 preliminary Confidential Reference 5.1.3 AC/DC Characteristics AC/DC characteristics involve the spread of values guaranteed within the specified supply voltage and ambient temperature range. Typical characteristics are the median of the production. Table 5-3 AC/DC Characteristics with TA =+25 C, VCC =2.7 to 4.5V Symbol min Supply Currents Supply current when all powered up ,VCC1 ,E+,EX ,VCC2 ,MO+,MOX1) ,VCC1 ,E+,EX ,VCC2 ,MO+,MOX ,IL ,IH WPU2) 9 10 0.3 5 11 12 0.6 7 14 16 1.0 9 2 2 2 2 mA mA mA mA A A A A PD1,PD2=H 1 Limit Values typ max Unit Test Conditions L Item Supply current when all powered down PD1,PD2=L 2 Control inputs PD1, PD2 LOW input current HIGH input current Power-up settling time for modulator Mixer input IF/IFX Internal DC voltage Mixer input RF/RFX Internal DC voltage Mixer output MO/MOX: Output power 3MO -12 -9 -6 dBm PRFIN = -5dBm fRFIN = 1.4GHz PIFIN = -5dBm fIFIN = 400MHz Application Circuit s s 2 9 2 4 18 A A s 9IL=0.8V 9IH=2.1V 1nF at TREF * 3 4 5 9IF3) 9RF 0.3 V 6 2.0 V 7 8 Gain with power matching 1dB compression point Noise figure Carrier suppression *MO4) 3IF1dB4) 1IF4) DC 25 +3 -7 8 39 dB dBm dB dB 9 10 11 12 PRFIN > -4dBm Application Circuit DSB noise, I =1GHz Application Circuit PRFIN = -5dBm fRFIN = 1.4GHz PIFIN = -5dBm fIFIN = 400MHz s Wireless Components 5-4 Specification, August 1999 PMB 2208 preliminary Confidential Reference Table 5-3 AC/DC Characteristics with TA =+25 C, VCC =2.7 to 4.5V (continued) Symbol min Limit Values typ max Unit Test Conditions L Item Modulator inputs A/AX and B/BX: 9A = 9AX = 9B = 9BX = 1.75V Differential input Resistance Differential input Capacitance Input DC current Differential input offset current Modulator inputs LO/LOX: Differential input Resistance Differential input Capacitance 5LO-LOX &LO-LOX 4 0.4 k pF I/2 =350MHz I/2 =350MHz s s 5A-AX 5B-BX &A-AX &B-BX ,A ,AX ,B ,BX ,OSA ,OSB 2.5 -1 250 1 5.0 10 1 k pF A A I =100kHz I =100kHz Differential input voltage = 0V s 13 14 15 16 s 17 18 Reference voltage output TREF for A/AX and B/BX inputs: Output voltage 9TREF 1.65 1.75 1.85 V 19 Modulator output E/EX: 3LO = -10dBm, IA-AX = IB-BX = 455kHz, 9A-AX = 9B-BX = 1Vpp, 90 phase shift Output power Output power with power matching Carrier suppression Single sideband supression Suppression of third order intermodulation products Output noise floor Differential output resistance Differential output capacitance RMS phase error of output signal * guaranteed by design 3E 3E4) DC6) DSSB DIM37) 3N5) 5E-EX &E-EX e 33 35 45 -7 -4 0 48 49 51 -144 20 0.4 0.4 1.0 -1 dBm dBm dB dB dB dBc/ Hz k pF Degree 20 Application circuit s 21 22 23 24 20MHz from carrier Application circuit I( =175MHz I( =175MHz s s s 25 26 27 28 s This value is only measured in lab. Wireless Components 5-5 Specification, August 1999 PMB 2208 preliminary Confidential Reference 1) The mixer current decreases when no external resistors to ground are connected at IF and IFX. In this case the typical value of ,MO+,MOX is 1mA. Design hint. The settling time is determined by the time required to charge the external capacitors. Note: There are external resistors (82 Ohms) at IF and IFX to ground. Application hint Design hint The carrier suppression can be optimized for a particular application using offset voltages at the baseband inputs A/AX and B/BX. The optimum values can be found iteratively by adjusting the A/AX and B/BX offsets alternately until the carrier disappears into the noise floor. If the actual offset voltages differ from their optimum values by 926$ and 926%, the carrier suppression in dB is given by 2) 3) 4) 5) 6) where 9P is the peak value of the signal voltage at A/AX and B/BX. DIM3 can be increased by reducing the amplitude of the modulator inputs VA-AX and VB-BX. Vm a c = 20 log 10 -----------------------------------------------------------2 2 ( V OSA ) + ( V OSB ) 7) Wireless Components 5-6 Specification, August 1999 PMB 2208 preliminary Confidential Reference 5.2 S-Parameters and Input/Output Impedances The S-parameters provided in this section are based on measurements at the supply voltage of VCC = 3.6V. Via the internal bias tees of the NWA the capacitive coupling is done and the open collector pins are connected to VCC. The S-parameters have to be considered as application hints. Table 5-4 Test RF-Input impedance IF-Input impedance MO-Output impedance Frequency [MHz] 50 - 2500 50 - 2500 50 - 2500 Port 1 RF IF MO Port 2 RFX IFX MOX Output levels -5 dBm -30 dBm -30 dBm The input/output impedances are calculated from these parameters. The impedances are given as equivalent circuit with lumped elements for differential and single ended in-/outputs. As equivalent circuit for these in-/outputs a resistor Rp parallel to a capacitance Cp is derived: Rpd Cpd Rps single ended Cps differential S_Parameter.wmf The IF-Input impedance is given as a equivalent circuit of a resistor Rs serial to a inductivity Ls: Rsd Rss Lsd differential single ended Lss S_Parameter_2.wmf Wireless Components 5-7 Specification, August 1999 PMB 2208 preliminary Confidential Reference 5.2.1 Mixer Input RX/RFX Circuit for measurement: '& 6XSSO\ S S 9&& ,) ,); 3' 02 02; 5) 5); Q) Q) '87 3 1:$ 3 Mixer Input RF/RFX S-Parameters: f MHz 50 250 500 750 1000 1250 1500 1750 2000 2250 2500 S11 mag 0.943 0.941 0.920 0.896 0.866 0.832 0.795 0.747 0.701 0.647 0.586 ang -1.8 -8.9 -18.2 -28.4 -39.4 -51.5 -61.5 -71.2 -80.4 -92.4 -109.3 S21 mag 0.027 0.029 0.063 0.099 0.137 0.161 0.192 0.220 0.250 0.284 0.297 ang 0.4 57.9 69.5 66.1 59.4 54.0 47.9 41.9 34.8 24.8 12.3 S12 mag 0.006 0.032 0.057 0.094 0.132 0.158 0.195 0.230 0.265 0.301 0.317 ang 48.4 49.0 73.0 70.9 66.3 62.7 56.2 50.7 42.5 31.4 21.4 S22 mag 0.965 0.939 0.921 0.902 0.878 0.852 0.839 0.817 0.786 0.746 0.682 ang -1.5 -8.4 -17.5 -27.7 -38.9 -50.9 -62.2 -73.7 -85.6 -100.6 -120.6 Mixer Input RX/RFX Impedances: 5SG 5SV u P x A v A S A A v A 8 &SG &SV sAvAHC sAvAHC Wireless Components 5-8 Specification, August 1999 PMB 2208 preliminary Confidential Reference 5.2.2 Mixer Input IF/IFX Circuit for measurement: Drhy 7vhAUrr '& 6XSSO\ 7vhAUrr 3 9&& 3' ,) ,); 1:$ 3 '87 5) 02 02; 7vhAUrr 5); Q) Q) Mixer Input IF/IFX S-Parameters: f MHz 50 250 500 750 1000 1250 1500 1750 2000 2250 2500 S11 mag 0.443 0.317 0.289 0.294 0.312 0.330 0.344 0.370 0.413 0.472 0.515 S21 mag 0.310 0.403 0.421 0.418 0.399 0.383 0.365 0.337 0.300 0.263 0.255 S12 mag 0.253 0.398 0.421 0.418 0.401 0.388 0.372 0.347 0.318 0.290 0.271 S22 mag 0.406 0.310 0.286 0.288 0.298 0.310 0.322 0.338 0.367 0.407 0.441 ang 172.5 149.8 143.0 138.2 134.0 129.4 123.6 116.4 107.3 96.4 86.7 ang 10.8 11.4 4.1 0.6 -1.4 -3.2 -5.4 -7.2 -7.7 -3.7 -1.0 ang 11.8 11.5 4.6 1.2 -0.6 -2.3 -4.0 -5.5 -6.1 -4.4 -5.0 ang 168.2 150.9 144.7 141.0 137.5 133.8 128.0 122.3 113.0 102.3 93.2 Mixer Input IF/IFX Impedances: u P A v A S C A v A G /VG /VV 5VG 5VV sAvAHC sAvAHC Wireless Components 5-9 Specification, August 1999 PMB 2208 preliminary Confidential Reference 5.2.3 Mixer Output MO/MOX Circuit for measurement: 7vhAUrr ,) ,); 7vhAUrr 9&& 3' Drhy '87 02 02; 5) 5); Q) Q) 3 3 7vhAUrr 1:$ 3RZHU 6XSSO\ 9 Mixer Output MO/MOX S-Parameters: f MHz 50 250 500 750 1000 1250 1500 1750 2000 2250 2500 S11 mag 1.041 0.987 0.971 0.958 0.935 0.919 0.900 0.892 0.881 0.864 0.797 angle -1.5 -6.9 -13.7 -22.1 -31.3 -41.2 -50.0 -57.4 -64.2 -72.0 -81.1 S21 mag 0.005 0.010 0.037 0.056 0.076 0.088 0.092 0.093 0.074 0.050 0.103 angle 52.7 97.3 101.9 96.4 90.4 87.0 86.5 84.1 85.4 119.9 159.3 S12 mag 0.014 0.015 0.034 0.054 0.080 0.091 0.097 0.103 0.089 0.074 0.092 angle -38.3 117.8 107.5 108.0 94.1 90.8 92.3 89.1 89.7 108.5 145.8 S22 mag 1.032 0.992 0.967 0.939 0.926 0.903 0.869 0.855 0.843 0.816 0.761 angle 0.4 -6.9 -13.4 -22.0 -30.7 -40.9 -50.1 -58.2 -66.3 -76.2 -89.1 Mixer Output MO/MOX Impedances: u P x A v A S 5SG 5SV A A v A 8 &SG &SV sAvAHC sAvAHC Wireless Components 5 - 10 Specification, August 1999 PMB 2208 preliminary Confidential Reference 5.3 Test Circuit 27 R1 RFIN TR4 C7 1nF C8 1nF VCC2 W88! BI9 SA SAY C20 1nF 27 R4 82 R3 C9 1nF TR1 MOUT C10 1nF HPY DA TR5 C21 1nF C22 1nF IFIN HP DAY 82 R2 BI9 Q9! C23 1nF PD2 BI9 BI9 100 R8 LOIN TR2 100 R7 PD1 C15 1nF C16 1nF Q9 W88 C13 1nF GPY @ C24 1nF TR6 C25 1nF EOUT C14 1nF GP @Y VCC1 C26 1nF TREF C18 22nF TR3 R6 220 C17 22nF US@A BI9 C28 22nF 6 7 2.2k A AIN AX R12 R11 2.2k 2.2k B R9 2.2k BIN BX R5 220 C27 22nF TR7 C19 22nF 6Y 7Y C29 22nF R10 Figure 5-1 Test Circuit Wireless Components 5 - 11 Specification, August 1999 |
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