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FEDL2500-01
FEDL2500-01 This version: Jul. 2000 ML2500 Previous version: Jun. 1999
Semiconductor ML2500
Semiconductor
Analog-Storage Single-chip Record/Playback LSI with 1M Bit-Cell Flash Memory This document contains minimum specifications. For full specifications, please contact your nearest Oki office or representative.
GENERAL DESCRIPTION
Thanks to newly developed Analog Multi-Level Storage technology, ML2500 stores noncompressed analog source signal directly into on-chip 1M Bit-Cell Flash memory. The result is superb sound quality without noise and distortions introduced through coding/decoding, and impressive long-time record/playback capability up to 256 sec. ML2500 is fully controllable by an external MCU via the industry's standard Serial Peripheral Interface. In addition, no backup requirement and low operating voltage (2.7 to 3.3 V) make the LSI an ideal choice for compact, handy and portable terminals. ML2500 is a true shingle-chip solution to record/playback subsystem for use with today's size-critical electronic products.
FEATURES
* On-chip non-volatile 1M bit-cell Flash memory Program/Erase Cycles : 10,000 cycles Data Retention : 10 years * MCU Interface Serial Peripheral Interface (SPI; Mode 0) * Record/Playback Time Length (With the int. Osc. or ext. clock at 8.192 MHz) ap. 160 sec (At fsam = 6.4 kHz) ap. 190 sec (At fsam = 5.3 kHz) ap. 256 sec (At fsam = 4.0 kHz) * Selectable Sampling Frequencies 4.0 kHz, 5.3 kHz, 6.4 kHz * Maximum number of recording phrases: 320 phrases * Phrase Control Fully controllable with user-definable Start, Stop addresses * Built-in LPF/Smoothing Filter (LPF attenuation -40dB/oct) * Built-in Oscillation Circuit (8.192 MHz), No oscillator required Optional external clock input (Clock Frequency 4.0 MHz to 8.192 MHz) * Power Supply : 2.7 to 3.3 V * Operating Temperature: -10 to +70C (guaranteed for both function and voice quality) -40 to +85C (guaranteed for function only) *Notice *Notice The voice quality can deteriorate at temperatures beyond the range of -10 to +70C. DC and AC characteristics in this data sheet are specified for -10 to +70C operating temperature range. * Package: 32-pin Plastic TSOP (TSOPI32-P-814-0.50-1K) (Product name: ML2500TA)
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FEDL2500-01 Semiconductor ML2500
BLOCK DIAGRAM
LOUT
LIN LPF AOUT
SG
SG Analog Write & Read Circuits 1M Bit Cell Analog Storage Flash Memory Array Address Decoder
ROSC
Internal Oscillator
TEST1
EXTCLK
MUX
Serial Peripheral Interface & Controller
Power Supplies
AVDD AGND
RESET
CS
SCK
DI
DO
MON
DVDD DGND
PIN CONFIGURATION (TOP VIEW)
1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 32 31 30 29 28 27 26 25 24 23 22 21 20 19 18 17
DVDD RESET CS SCK DI DO MON EXTCLK NC NC TEST2 NC TEST2 NC ROSC DGND
AVDD LIN LOUT TEST2 TEST2 AOUT SG NC TEST1 NC TEST2 NC TEST2 NC TEST2 AGND
NC: No connection. Keep NC pins open. 32-Pin Plastic TSOP (Type 1)
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FEDL2500-01 Semiconductor ML2500
PIN DESCRIPTIONS
Pin 5 6 4 3 2 Symbol DI DO SCK CS RESET Type I O I I I Serial output pin for status data. Shift clock input pin for the DI and the DO pins. Chip select pin. "L" level input enables data input/output through the serial interface. RESET input pin, resetting the serial interface circuit only. "L" level input to this pin initializes the serial interface. Must input "L" pulse after each power-on. Insert a 30 kW resistor (Precision within 1%) between this pin and the DGND pin. 15 ROSC I The same resistor should also be inserted if an external clock is used. The resistor value determines the frequency of the clock for control in this device. External clock input pin. Allowable clock frequency range is 4.0 MHz to 8.192 8 7 26 EXTCLK MON SG I O O MHz. When external clock is unused and internal oscillation clock in used, connect this pin to the DGND. Output "H" level during recording/playback operation. Analog reference voltage (Signal Ground Voltage) output pin. It is recommendable to insert a capacitor smaller than 3300 pF between this pin and the AGND pin. Loads except for capacitors should not be connected to this pin. 31 30 27 11, 13, 18, 20, 22, 28, 29 24 1 16 32 17 LIN LOUT AOUT TEST2 TEST1 DVDD DGND AVDD AGND I O O O I -- -- -- -- Inverting input pin for the internal OP amplifier. Non-inverting input pin is internally connected to SG voltage. Output pin from the internal OP amplifier. Analog waveform output. Connect to an amplifier to drive a SP. Pins for testing the LSI. Must be held "OPEN". LSI's testing pin. Must be connected to DGND. Digital power supply pin. Insert a 0.1 mF or larger by-pass capacitor between this pin and the DGND pin . Digital Ground pin. Analog power supply pin. Insert a 0.1 mF or larger by-pass capacitor between this pin and the AGND pin. Analog Ground pin. Description Serial input pin for command data.
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FEDL2500-01 Semiconductor ML2500
ABSOLUTE MAXIMUM RATINGS
Parameter Power Supply Voltage Input Voltage Storage Temperature Symbol VDD VIN TSTG Condition Ta = 25C -- Rating -0.3 to +5.0 -0.3 to VDD+0.3 -55 to +150 Unit V V C
RECOMMENDED OPERATING CONDITIONS
Parameter Power Supply Voltage Operating Temperature External Clock Frequency 1 External Clock Frequency 2
*1 *1
Symbol VDD Top fEXTCLK1 fEXTCLK2
Condition DGND = AGND = 0V -- Min. -- -- 3.85 7.70
Range 2.7 to 3.3 -10 to +70 Typ. 4.096 8.192 Max. 4.34 8.68
Unit V C MHz MHz
*1: Applicable only with external clock
ELECTRICAL CHARACTERISTICS
DC Characteristics
DVDD = AVDD = 2.7 V to 3.3 V, DGND = AGND = 0 V, Ta = -10 to +70C Parameter "H" Input Voltage "L" Input Voltage "H" Output Voltage "L" Output Voltage "H" Input Current "L" Input Current
*1 *1 *2 *2 *1 *1
Symbol VIH VIL VOH VOL IIH IIL IDD1 IDD2 IDD3 IDDS
Condition DGND = AGND = 0V -- IOH = -40mA IOL = 2mA VIH = VDD VIL = 0V In Recording Operation In Playback Operation In Command-Wait State --
Min. 0.8 VDD -- VDD - 0.3 -- -- -10 -- -- -- --
Typ. -- -- -- -- -- -- 30 20 5 --
Max. -- 0.2 VDD -- 0.45 10 -- 45 30 10 10
Unit V V V V mA mA mA mA mA mA
Operating Current Consumption 1 Operating Current Consumption 2 Operating Current Consumption 3 Powerdown Current Consumption
*1: Applied to logic input pins (DI, SCK, CS, RESET and EXTCLK) except ROSC and TEST1 pins. *2: Applied to logic output pins (DO and MON) except TEST2 pin.
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FEDL2500-01 Semiconductor ML2500
APPLICATION CIRCUITS
Power Supply (+3V) 0.1mF 0.1mF
DVDD
AVDD
RESET CS MCU DI AOUT DO SCK MSC1157
LOUT
170KW 51pF
0.47mF LIN LINE IN 30KW TEST1 EXCLK
ROSC
DGND 30KW
SG
ML2500TA
AGND 3300pF
MON
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FEDL2500-01 Semiconductor ML2500
PACKAGE DIMENSIONS
(Unit : mm)
TSOPI32-P-814-0.50-1K
Mirror finish
Oki Electric Industry Co., Ltd.
Package material Lead frame material Pin treatment Package weight (g) Rev. No./Last Revised
Epoxy resin 42 alloy Solder plating (5 mm) 0.27 TYP. 3/Dec. 10, 1996
Notes for Mounting the Surface Mount Type Package The SOP, QFP, TSOP, SOJ, QFJ (PLCC), SHP and BGA are surface mount type packages, which are very susceptible to heat in reflow mounting and humidity absorbed in storage. Therefore, before you perform reflow mounting, contact Oki's responsible sales person for the product name, package name, pin number, package code and desired mounting conditions (reflow method, temperature and times).
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FEDL2500-01 Semiconductor ML2500
NOTICE
1. The information contained herein can change without notice owing to product and/or technical improvements. Before using the product, please make sure that the information being referred to is up-to-date. The outline of action and examples for application circuits described herein have been chosen as an explanation for the standard action and performance of the product. When planning to use the product, please ensure that the external conditions are reflected in the actual circuit, assembly, and program designs. When designing your product, please use our product below the specified maximum ratings and within the specified operating ranges including, but not limited to, operating voltage, power dissipation, and operating temperature. Oki assumes no responsibility or liability whatsoever for any failure or unusual or unexpected operation resulting from misuse, neglect, improper installation, repair, alteration or accident, improper handling, or unusual physical or electrical stress including, but not limited to, exposure to parameters beyond the specified maximum ratings or operation outside the specified operating range. Neither indemnity against nor license of a third party's industrial and intellectual property right, etc. is granted by us in connection with the use of the product and/or the information and drawings contained herein. No responsibility is assumed by us for any infringement of a third party's right which may result from the use thereof. The products listed in this document are intended for use in general electronics equipment for commercial applications (e.g., office automation, communication equipment, measurement equipment, consumer electronics, etc.). These products are not authorized for use in any system or application that requires special or enhanced quality and reliability characteristics nor in any system or application where the failure of such system or application may result in the loss or damage of property, or death or injury to humans. Such applications include, but are not limited to, traffic and automotive equipment, safety devices, aerospace equipment, nuclear power control, medical equipment, and life-support systems. Certain products in this document may need government approval before they can be exported to particular countries. The purchaser assumes the responsibility of determining the legality of export of these products and will take appropriate and necessary steps at their own expense for these. No part of the contents contained herein may be reprinted or reproduced without our prior permission. MS-DOS is a registered trademark of Microsoft Corporation.
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Copyright 2000 Oki Electric Industry Co., Ltd.
Printed in Japan
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