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| CXG1077TN High Power SPDT Switch Description The CXG1077TN is a SPDT (Single Pole Dual Throw) antenna switch MMIC used in personal communication handsets such as JCDMA. This IC is designed using the Sony's GaAs J-FET process. Features * Low control voltage * Low control current * Low insertion loss * High power handling * High intercept point * Small package 10 pin (Plastic) Vctl (H) =2.8 V Ictl=30 A (Typ.) @2.8 V 0.35 dB (Typ.) @900 MHz P1dB: 33 dBm (Typ.) @900 MHz Ip3=60 dBm (Typ.) TSSOP-10pin Absolute Maximum Ratings (Ta=25 C) * Control voltage Vctl 7 * Operating temperature Topr -35 to +85 * Storage temperature Tstg -65 to +150 Operating Condition Control voltage V C C Application SPDT switch for digital cellular telephones such as JCDMA handsets. Structure GaAs J-FET MMIC CTL (H) CTL (L) 2.5 to 5 0 to 0.5 V V Sony reserves the right to change products and specifications without prior notice. This information does not convey any license by any implication or otherwise under any patents or other right. Application circuits shown, if any, are typical examples illustrating the operation of the devices. Sony cannot assume responsibility for any problems arising out of the use of these circuits. --1-- E99408-TE CXG1077TN Block Diagram RF3 RF1 RF2 VCTLA High Low VCTLB Low High RF1-RF2 ON RF1-RF3 OFF RF1-RF2 OFF RF1-RF3 ON Electrical Characteristics Symbol Insertion loss Isolation VSWR Output harmonics Input IP3 Input power for 1 dB compression Switching speed TSW Control current IL ISO VSWR 2fo, 3fo IIP3 P1dB TSW I CTL Condition 1 2 1 2 1, 2 1 2 3 1 2 Min. Typ. 0.35 0.5 22 17 1.2 Max. 0.6 0.8 (Ta=25 C) Unit dB dB dB dB dBm dBm dBm dBm dBm ns A 20 15 28 28 60 33 33 100 30 1.4 -30 -30 54 300 50 1 Pin=25 dBm, 900 MHz, CW, 0/2.8 V Control 2 Pin=25 dBm, 1.8 GHz, CW, 0/2.8 V Control 3 Pin=21 dBm (900 MHz) +21 dBm (901 MHz), 0/2.8 V Control --2-- CXG1077TN Package Outline/Pin Configuration Unit : mm RF2 GND GND GND RF3 10 10pin TSSOP (PLASTIC) 1 CTLA GND RF1 GND CTLB Recommended Circuit Rctl 1k RF2 C2 100pF 6 5 C1 100pF CTLA 7 4 8 CXG1077TN 3 51k C2 100pF RF1 9 2 Rctl 1k RF3 C2 100pF 10 1 C1 100pF CTLB When using the CXG1077TN, the following external components should be used: C1: This is used for signal line filtering. 100 pF is recommended. C2: This is used for RF De-coupling and must be used in all applications. 100 pF is recommended. Rctl: This resistor is used to give improved ESD performance. --3-- CXG1077TN Package Outline Unit : mm 10PIN TSSOP(PLASTIC) 1.2MAX 2.8 0.1 10 6 0.1 2.2 0.1 + 0.15 0.1 - 0.05 3.2 0.2 1 5 0.5 0.25 0 to 10 + 0.08 0.22 - 0.07 0.1 M (0.2) + 0.08 0.22 - 0.07 DETAIL A NOTE: Dimension "" does not include mold protrusion. PACKAGE STRUCTURE PACKAGE MATERIAL SONY CODE EIAJ CODE JEDEC CODE TSSOP-10P-L01 LEAD TREATMENT LEAD MATERIAL PACKAGE MASS EPOXY RESIN SOLDER PLATING COPPER ALLOY 0.02g --4-- (0.1) + 0.025 0.12 - 0.015 A 0.45 0.15 |
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