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E2A0027-16-X1 Semiconductor
Semiconductor MSM6889
Multi-Function Telecommunication LSI
This version: Jan. 1998 MSM6889 Previous version: Nov. 1996
GENERAL DESCRIPTION
The MSM6889 is best suited to be used as a signal transmitter/receiver LSI for a telemetering system that employs a no-ringing communication system. The meter terminal of a telemetering system consists of this device, meter, NCU, and communication controller. The MSM6889 contains a PB tone detector, a call progress tone (CPT) detector, a PB tone generator, and a 300-bps full-duplex modem conforming to ITU-T V.21.
FEATURES
* Power supply : +5 V 10%, +2.5 V or higher for digital interface. * Power consumption Operating mode : 9 mA Typ., 12 mA Max. Power down mode : 0.1 mA Max. * The operating mode can be selected from PB tone transmit, PB tone detect, and FSK modem (answer/originate). The FSK modem cannot be operated concurrently with other functions. Modem test modes are also available. * The call progress tone (CPT) detector operates in PB tone transmit mode or in FSK modem mode. * PB receiver output is 3-state, and externally connectable to 4-bit input for PB tone generator through the bus line. * Modem transmit/receive data, carrier detect, request to send, and call progress tone detect have their dedicated pins. * Prefilter and smoothing filter are provided in analog input and output. * On-chip 3.579545 MHz crystal oscillator * 3.579545 MHz master clock output pin (CMOS compatible) * Power down mode * Modem : Conforms to ITU-T V.21 (300 bps, full-duplex) * Transmit analog signals (modem signal, DTMF tone) : Level is independently adjustable externally. Carrier detect level is also adjustable externally. * Package options: 42-pin plastic DIP (DIP42-P-600-2.54) (Product name : MSM6889RS) 56-pin plastic QFP (QFP56-P-1519-1.00-K) (Product name : MSM6889GS-K)
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PB-Tone Receiver PB3 PB2 PB1 SP DET + Carrier Detect RD FSK Modem * * TD RS CLK X2 * * PB Tone Generator * * * * X'tal Microcontroller CD CP TIMING STATUS I/O CONTROL 400 Hz
8 PB4
Note) PB1 to PB4: 3-State Outputs *With pull-up resistor
AIN+
Pre-LPF
2765 Hz
+
AIN-
-
Semiconductor
BLOCK DIAGRAM
GAR
SG
+-
SMOOTH AO
SG LPF
GAT2
GAT1
PB MOD
VR2
VR1
X1 3.58 MHz MODE1 MODE2 MODE3 ICT1 ICT2 ICT3
Vref MODE SELECT & TEST
*
PON VA AG VD DG
Power ON +5 V (A) 0 V (A) +5 V (D) 0 V (D)
VD2
Digital Interface
* * * * *
TEN PBG1 PBG2 PBG3 PBG4
MSM6889
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Semiconductor
MSM6889
PIN CONFIGURATION (TOP VIEW)
VA 1 GAR 2 AIN+ 3 AIN- 4 AO 5 SG 6 GAT1 7 GAT2 8 MOD 9 PB 10 VR1 11 VR2 12 AG 13 PBG1 14 PBG2 15 PBG3 16 PBG4 17 TEN 18 TD 19 RS 20 DG 21 42-Pin Plastic DIP
42 VD 41 VD2 40 NC 39 PON 38 SP 37 PB4 36 PB3 35 PB2 34 PB1 33 CP 32 CD 31 RD 30 CLK 29 X2 28 X1 27 MODE3 26 MODE2 25 MODE1 24 ICT3 23 ICT2 22 ICT1
NC : No connect pin
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Semiconductor
MSM6889
56 PBG3
54 PBG2
53 PBG1
45 GAT2
44 GAT1
46 MOD
51 VR2
50 VR1
55 NC
49 NC
48 NC
52 AG
NC 1 PBG4 2 TEN 3 TD 4 NC 5 RS 6 DG 7 ICT1 8 ICT2 9 NC 10 ICT3 11 MODE1 12 MODE2 13 MODE3 14
43 SG
42 NC 41 AO 40 AIN- 39 AIN+ 38 NC 37 GAR 36 NC 35 VA 34 VD 33 NC 32 VD2 31 PON 30 SP 29 NC
NC 15
X1 16
X2 17
NC 18
CLK 19
RD 20
NC 21
CD 22
CP 23
NC 24
47 PB
PB1 25
PB2 26
PB3 27
56-Pin Plastic QFP
NC : No connect pin
PB4 28
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Semiconductor
MSM6889
PIN DESCRIPTION
Pin Number RS GS Name I/O Description +5 V Power Supply (Analog Circuit). 1 35 VA -- When power is turned on or the power down mode is released, the device must be put into the PB tone transmit mode or PB tone detect mode. 2 3 4 5 6 7 8 9 10 11 37 39 40 41 43 44 45 46 47 50 GAR AIN+ AIN- AO SG GAT1 GAT2 MOD PB VR1 O I I O O I O O O O Output, non-inverting input and inverting input pins of on-chip operational amplifier. No hybrid transformer is required by use of these pins. (See Fig. 2.) Analog signal output. PB tone or modem transmit signal is output from this pin. On-chip signal ground, having a potential of about +2.5 V. PB is the PB tone output and MOD is the modem signal output. By connecting external resistors to GAT1 and GAT2 pins, signal level can be set at required values for the modem signal and the PB tone that are output from AO, independently. (See Fig. 3.) These pins are used to externally adjust the received carrier detect(CD) signal level. The potential of VR1 to SG is about +1.1 V. The carrier detect level can be set at the required value by a on-chip resistor 12 13 14 15 16 17 51 52 53 54 56 2 VR2 AG PBG1 PBG2 PBG3 PBG4 I -- I* I* I* I* divider between VR1 and SG. The given potential to VR2 is set about +0.88 V with high resistance inside the IC. (See Fig. 4.) Analog Ground, 0 V. Inputs used to specify PB tone to be sent. PB1 to PB4 can be connected externally like 4-bit bus line. Data is latched at the falling edge of TEN. (See Fig. 7 and Fig. 8.)
* Digital input pulled up by a high resistance inside the IC.
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Semiconductor
MSM6889
Pin Number RS GS Name I/O PB tone transmit enable. 18 3 TEN I* PBG1 to PBG4 data are latched at the falling edge of TEN, and PB tone is generated at digital "0" level. (See Fig. 7.) Modem transmit serial data input. 19 4 TD I* Data stream less than 300 bps should be input. Digital "1" and "0" correspond to "Mark" and "Space" respectively. 20 21 22 23 24 25 26 27 28 29 30 31 6 7 8 9 11 12 13 14 16 17 19 20 RS DG ICT1 ICT2 ICT3 MODE1 MODE2 MODE3 X1 X2 CLK RD I* -- I* I* I* I* I* I* I O O O Request to send data input . While RS is at digital "0" level, modem transmit is enabled. Digital Ground, 0 V. Input used to select call progress tone (CPT) detect output waveform. (See Fig. 9.) Used to check performance characteristics of the IC. Independent of operating mode. Leave these pins open. Inputs used to specify operating mode. (See Table 1.) 3.579545 MHz crystal resonator should be connected to X1 and X2. When applying external clock to the device, it should be connected to X2 through the AC coupling capacitor of 100 pF and X1 has to be open. 3.579545 MHz clock output. Modem receive serial data output. Digital "1" and "0" correspond to "Mark" and "Space" respectively. When CD (Carrier Detect) is off, RD is hold at "Mark" state. 32 22 CD O Carrier Detect output. Digital "0" and "1" represent "Detect" and "No-detect" respectively. Description
* Digital input pulled up by a high resistance inside the IC.
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Semiconductor
MSM6889
Pin Number RS GS Name I/O Description Call progress tone (CPT) detect output. 33 34 35 36 37 38 23 25 26 27 28 30 CP PB1 PB2 PB3 PB4 SP O O O O O O When a CPT is detected, the waveform selected by ICT1 is output. (See Fig. 9. ) Receive PB tone code outputs. The output impedance of these pins becomes high except when the device operates as PB tone receiver. (See Fig. 7 and Fig. 8. ) PB tone receive data present. Digital "1" represents that this pin is receiving the PB tone. (See Fig. 8. ) 39 40 31 -- PON NC I -- Power down mode select. Digital "1" on this pin puts the whole circuit of the device into the power down state. No connection. Power supply for digital interface output. The supply voltage from +2.5 V to VD is possible for VD2. For example, when the device interfaces to the MCU working on +3 V 41 32 VD2 -- supply, the +3 V supply has to be applied to the VD2 pin. Note that this function is effective to all of digital output pins except X1, X2, and CLK. There is no restriction regarding the power supplies (VD and VD2) applying procedure. +5 V power supply (digital circuit). 42 34 VD -- When power is turned on or the power down mode is released, the device must be put into the PB tone transmit mode or PB tone detect mode.
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Semiconductor
MSM6889
ABSOLUTE MAXIMUM RATINGS
Parameter Power Supply Voltage Input Pin Voltage Storage Temperature Pin Soldering Temperature Symbol VA, VD VD2
Ta = 25C with respect to AG and DG
Condition
Rating -0.3 to 7 -0.3 to VD -0.3 to VA(VD) + 0.3 -65 to 150 260
Unit V
-- Within 10 sec
C
RECOMMENDED OPERATING CONDITIONS
Parameter Power Supply Voltage Digital Input Voltage Digital Output Current Operating Temperature Input Clock Frequency Bypass Capacitance Frequency Deviation Temperature Symbol VA, VD VD2 VIH VIL IOH IOL Top fCLK VA VD, VD2 Condition -- -- When VD2 = VD (excluding) X2 -- -- -- At 25C 5C At -40C to 85C -- -- Min. 4.5 2.5 2.0 0 -0.05 -- -40 -0.1 0.1 + 10 1 -100 -50 -- -- Typ. 5.0 -- -- -- -- -- -- -- -- -- -- -- -- 16 Max. 5.5 VD VD 0.8 -- 0.4 +85 +0.1 -- -- +100 +50 50 -- ppm Unit V V mA C % mF
Crystal
Characteristics Equivalent Series Resistance Load Capacitance
W pF
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Semiconductor
MSM6889
ELECTRICAL CHARACTERISTICS
DC and Digital Interface Characteristics
(VA, VD, VD2 = +5 V 10%, Ta = -40C to +85C) Parameter Power Supply Current Digital Input Current* Digital Output Voltage Symbol IAD IPD IIH IIL VOH VOL VD2 = VD Condition IA + ID + ID2 (VD2 = VD) PON = "0" PON = "1" VI = VIH Max. VI = VIL Min. IO = IOH Min. IO = IOL Max. Min. -- -- -10 -100 2.4 0 Typ. 9 0.01 -- -- -- -- Max. 12 0.1 10 10 VD2 0.4 Unit mA mA A V
* Internal pull-up resistor
Analog Interface and Dynamic Characteristics
(VD = VA = 5 V 10%, Ta = -40C to +85C) Parameter Modem Transmit Level PB Tone Send Level Output Voltage Swing Output Load Resistance Signal Level Relative Value MOD PB Condition RL 20 kW "Mark" and "Space" Signals RL 20 kW Low-Group Tone High-Group Tone Min. -3 1.55 -8.5 -7.5 2.2 20 -2 0 VA - 0.1 2 "1" TD "0" "1" "0" 976 1176 1646 1846 -- -- -- -1.5 -- 250 250 Typ. -1 1.95 -6.5 -5.5 3 -- 0 1 VA 2 980 1180 1650 1850 -- -- -- -- -- -- -- Max. +1 2.46 -4.5 -3.5 -- -- 2 2 VA + 0.1 2 984 1184 1654 1854 P-20 P-40 P-60 +1.5 -23 -- -- dB dB dB % dB ns ns Hz Unit dBm VP-P dBm dBm Vp-p kW dB dB V
RL 20 kW AO MOD, PB, GAT2, AO MODEM "Mark" & "Space" Signals PB Tone High-Gr. Tone & Low-Gr. Tone MOD, PB AO (When GAT1 and GAT2 are connected) Originate MARK Mode SPACE Answer Mode MARK SPACE
Output DC Voltage
Modem Transmit Carrier Frequency
Out-of-band Energy
4 to 8 kHz P : In-band Signal Energy (0.3 kHz to 3.4 kHz) 8 to 12 kHz Measured at primary side 12 kHz to of transformer line. With respect to nominal frequency Harmonics/Fundamental TPBGS, Fig. 7 TPBGH, Fig. 7
PB Tone Frequency PB Tone Distortion PBG1 to PBG4 Input Data Setup Time PBG1 to PBG4 Input Data Hold Time
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Semiconductor
MSM6889
Analog Interface and Dynamic Characteristics (Continued)
(VD = VA = 5 V 10%, Ta = -40C to +85C) Parameter Input Impedance Modem Receive Signal Level Carrier Detect (CD) Signal Level CD Level Hysteresis CD Delay Time CD Hold Time Demod. Data Bias Distortion NRTS Signal-to-Modem Receive Signal Ratio CPT Detect Level CPT Non-detect Level CPT Detect Frequency CPT Non-detect Frequency CPT Detect Delay Time CPT Detect Hold Time PB Tone Detect Amplitude Detect Frequency Non-detect Frequency Allowable twist Allowable Noise Level Dial Tone Rejection Ratio Signal Repetition Time Time to Receive Invalid Tone Duration Output Delay Time Interdigit Pause Acceptable Drop Out SP Delay Time Output Trailing edge Delay Condition AIN+, 0 to 10 kHz AIN+, FSK Demodulator Signal VR2; Open Answer mode: 1080 Hz Originate mode: 1750 Hz ONAEOFF Answer mode: 1080 Hz Originate mode: 1750 Hz -60 dBm AE -20 dBm Step -20 dBm AE -60 dBm Step 300 bps, 1/0 Alternative Pattern vNRTS/v Receive Modem Signal NRTS: 2765 Hz 30 Hz 400 Hz 400 Hz R > 20% (square waves output) (See Fig. 9) R > 20% (square waves output) (See Fig. 9) -- -- For Each Signal Tone With respect to Nominal Frequency With respect to Nominal Frequency High-Gr. Tone/Low-Gr. Tone Noise (0.3 kHz to 3.4 kHz) Level/Tone Level 380 Hz to 420 Hz TC Ts TI TG TP TB TSP TD Fig. 1 -48 1 10 0 -- -- -40 -- 380 500 -- -- -- -46 -- -- 3.8 -6 -- 37 120 49 -- 24 30 -- 6 21 -- -- -- -- -- -- -- -- -- -- -- 20 20 -- -- -- -- -- -12 -- -- -- -- 39 -- -- 8 28 -- -- 40 40 10 -2 -6 -60 420 -- 300 -- -- -6 -60 1.5 -- +6 -- -- -- -- 24 49 -- 2 10 35 dBm dB ms ms % dB dBm dBm Hz Hz ms ms dBm dBm % % dB dB dB ms ms ms ms ms ms ms ms OFFAEON Min. 20 -- -- Typ. -- -- -- Max. -- -6 -42 Unit kW dBm dBm
PB Tone Non-detect Amplitude For Each Signal Tone
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Semiconductor
MSM6889
TC TS TP TB
AIN Signal
TG PB1 to PB4 TD
SP
TSP
Figure 1
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Semiconductor FUNCTIONAL DESCRIPTION AND APPLICATION Resistance Hybrid Condition (Ideal Condition)
MSM6889
600 W : 600 W RL VT VR
C1 3 2.2 mF VT1,VR1 R3 R1 600 W R2 4 2
AIN+ AIN- GAR
+ -
VT2,VR2
+ VAO - 5
AO
R2,R3 20 kW
Figure 2 C1 is an ignorable impedance in the voice frequency band; therefore, if a line transformer and phone line impedance are ideal (RL = 600 W pure resistance), the signal levels at each point are as shown below. VT, VR VT1, VR1 VAO VT2 VR2 : : : : : Transmit at 2W on phone line, receive signal level (balanced) Transmit at pin 3 (AIN+), receive signal level (unbalanced) Transmit signal level at pin 5 (AO) (unbalanced) Leaking of transmit signal into receive circuit (unbalanced) Receive signal level of the device (unbalanced)
1) VT = VT1 = 1/2 VAO The transmit signal level (voltage) on phone line is half the level at the output pin (AO) of the device. (600 W : a 600 W line transformer is used) 2) VR1 = VR 3) VT2 = VT1 (1+
R3 R3 ) + VAO (- ) R2 R2
= 1 VAO (1+ R3 ) - VAO R3 = 1 VAO (1- R3 ) 2 R2 R2 2 R2
Then, where R2 = R3 (e.g., 51 kW), VT2 = 0. This means that the transmit signal is no longer leaking into the receive circuit. 4) VR2 = VR1 (1+ R3 ) , where R2 = R3, VR2 = 2 VR1 = 2 VR R2
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Semiconductor Setup of Transmit Signal Levels
MSM6889
LPF VAO 5 AO
+ _
8 R4 7 R5 R6 VP 10
GAT2 GAT1 PB PB Tone Generator Modulator
VM
9
MOD
R4,R5,R6 20 kW
Figure 3 The modulation analog signal and PB tone from the modem are not sent at a time. The signal to be sent is determined by the operating mode specified. This device is provided with the pins for specifying levels of these transmit signals independently. The answer tones, which are generated from MODULATOR, are handled as modem signals. VM : Modem signal level (voltage) at MOD (pin 9) VP : PB tone level (voltage) at PB (pin 10) When the external resistors are R4, R5 and R6, the signal levels at AO (pin 5) are as shown below. VAO (modem) = VAO (PB) = R4 VM R5 R4 VP R6 Note : R4, R5, R6 20 kW
As described in "Resistance Hybrid Condition", signal levels actually sent over a phone line will be half the above mentioned values under the ideal condition.
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Semiconductor External Setup of Carrier Detect Level
MSM6889
11 R1 12 R2 6
VR1 VR2 SG r1 r2
VREF
COMP
R1//r1 + R2//r2 20 kW r1: 250 kW, r2 : 1 MW
Figure 4
Operating Mode Table 1 Operating Mode Table
Mode Select Operating Mode 1 0 1 0 1 0 1 0 1 2 0 0 1 1 0 0 1 1 3 0 0 0 0 1 1 1 1 PB Tone Transmit PB Tone Detect Originate Mode Modem (O) Answer Mode Modem (A) Analog Loop Back Test (ALB) Remote Digtal Loop Back Test (RDLB) O A O A PB GEN. * * PB REC.
Functional Block FSK CPT REC. * * * * * * * * * * * * * MODEM ICT1 = "1" ICT1 = "0"
* : Active When power is turned on or the power down mode is released, put the device into the PB tone transmit mode or PB tone detect mode.
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Semiconductor Signal flow concept for the modem normal operating mode is shown in Fig. 5.
MSM6889
AIN Line AO
Receive Filter
Demodulator
RD
Receive Data
Transmit Filter
TD Modulator
Transmit Data
Figure 5
In the test modes, signal flow shown in Fig. 6 is used. O/(originate)/A(answer) in the test mode is the expression where the modulator side is referred to as the basis.
AIN [ALB]
Receive Filter
Demodulator
RD
Receive Data
AO
Transmit Filter
Modulator
TD
Transmit Data
AIN [RDLB] AO
Receive Filter
Demodulator
RD
Receive Data
Transmit Filter
Modulator
TD
Transmit Data
Figure 6
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Semiconductor
MSM6889
PB Tone Transmit Mode and PB Tone Detect Mode When PBG1 to PBG4 are externally connected to PB1 to PB4 so as to use them as 4-bit bus lines, their tone generation timings are as shown below. 1) PB Tone Transmit Mode When TEN is in the digital "0" state, PB tone is generated according to Table 2.
TEN TPBGS TPBGH PBG1/PB1
PBG2/PB2
PBG3/PB3
PBG4/PB4
PB 941 Hz + 1477 Hz
Figure 7
2)
PB Tone Detect Mode
941 Hz + 1477 Hz AIN TG PB1/PBG1 "0" PB2/PBG2 "1" "1" "0" TD "1" 852 Hz + 1209 Hz
PB3/PBG3
"1" "0"
PB4/PBG4
"1"
SP
TSP
Figure 8 16/21
Semiconductor Table 2 PB Tone Code Table
Button 1 2 3 4 5 6 7 8 9 0 * # A B C D * * * * Low-Group Freq. (Hz) 697 * * * * * * * * * * * * * * * * * * * * * * * * * 770 852 941 High-Group Freq. (Hz) 1209 * * * 1336 1477 1633 PB4/ PB3/
MSM6889
PB2/
PB1/
PBG4 PBG3 PBG2 PBG1 0 0 0 1 0 0 0 0 0 0 1 1 1 1 1 1 1 1 0 0 0 1 1 1 1 0 0 0 0 1 1 1 1 0 1 1 0 0 1 1 0 0 1 1 0 0 1 1 0 0 1 0 1 0 1 0 1 0 1 0 1 0 1 0
Call Progress Tone (CPT) Detect Mode
400 Hz AIN
R = TW/(TD + TW) 100 [%] CP ICT1 = "1" TW TD
CP ICT1 = "0"
Figure 9
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Semiconductor
MSM6889
APPLICATION CIRCUIT
Pin Connection
MSM6889RS
1 R3 C1 C2
+ -
VA GAR AIN+ AIN- AO SG GAT1 GAT2 MOD PB VR1 VR2 AG PBG1 PBG2 PBG3 PBG4 TEN TD RS DG
VD VD2 NC PON SP PB4 PB3 PB2 PB1 CP CD RD CLK X2 X1 MODE3 MODE2 MODE1 ICT3 ICT2 ICT1
42 41 40 39 38 37 36 35 34 33 32 31 30 29 28 27 26 25 24 23 22 3.579545 MHz
2 3 4
R1
R2
5
+ -
6 7
R4 R5 R6
8 9 10 11 12 C3
+ -
13 14 15 16 17 18 19 20 21
R1 = 600 W, R2 = R3 = R4 = R5 = R6 = 51 kW C1 = 2 mF, C2 = C3 = 10 mF
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Semiconductor Bypass Capacitor Connections The MSM6889 contains analog circuits.
MSM6889
Note that noise occurred in the power supply by trouble in other circuits may cause degradation in characteristics of the device. The examples of connected bypass capacitors of the MSM6889 are shown below.
MSM6889 VA, VD 10 mF to 47 mF SG AG, DG
MSM6889 VA, VD 1 mF 10 mF to 47 mF 1 mF AG, DG SG
MSM6889 VA, VD 10 mF 10 mF to 47 mF *1 mF 10 mF AG, DG SG
* Laminated ceramic capacitor
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Semiconductor
MSM6889
PACKAGE DIMENSIONS
(Unit : mm)
DIP42-P-600-2.54
Package material Lead frame material Pin treatment Solder plate thickness Package weight (g)
Epoxy resin 42 alloy Solder plating 5 mm or more 6.20 TYP.
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Semiconductor
MSM6889
(Unit : mm)
QFP56-P-1519-1.00-K
Mirror finish
Package material Lead frame material Pin treatment Solder plate thickness Package weight (g)
Epoxy resin 42 alloy Solder plating 5 mm or more 1.46 TYP.
Notes for Mounting the Surface Mount Type Package The SOP, QFP, TSOP, SOJ, QFJ (PLCC), SHP and BGA are surface mount type packages, which are very susceptible to heat in reflow mounting and humidity absorbed in storage. Therefore, before you perform reflow mounting, contact Oki's responsible sales person for the product name, package name, pin number, package code and desired mounting conditions (reflow method, temperature and times).
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