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19-3197; Rev 0; 2/04 KIT ATION EVALU E AILABL AV Dual, 10-Bit, 165Msps, Current-Output DAC General Description The MAX5854 dual, 10-bit, 165Msps digital-to-analog converter (DAC) provides superior dynamic performance in wideband communication systems. The device integrates two 10-bit DAC cores, and a 1.24V reference. The MAX5854 supports single-ended and differential modes of operation. The dynamic performance is maintained over the entire 2.7V to 3.6V power-supply operating range. The analog outputs support a -1.0V to +1.25V compliance voltage. The MAX5854 can operate in interleaved data mode to reduce the I/O pin count. This allows the converter to be updated on a single, 10-bit bus. The MAX5854 features digital control of channel gain matching to within 0.4dB in sixteen 0.05dB steps. Channel matching improves sideband suppression in analog quadrature modulation applications. The onchip 1.24V bandgap reference includes a control amplifier that allows external full-scale adjustments of both channels through a single resistor. The internal reference can be disabled and an external reference may be applied for high-accuracy applications. The MAX5854 features full-scale current outputs of 2mA to 20mA and operates from a 2.7V to 3.6V single supply. The DAC supports three modes of power-control operation: normal, low-power standby, and complete power-down. In power-down mode, the operating current is reduced to 1A. The MAX5854 is packaged in a 40-pin thin QFN with exposed paddle (EP) and is specified for the extended (-40C to +85C) temperature range. Pin-compatible, lower speed, and lower resolution versions are also available. Refer to the MAX5853 (10-bit, 80Msps), the MAX5852** (8-bit, 165Msps), and the MAX5851** (8-bit, 80Msps) data sheets for more information. See Table 4 at the end of the data sheet. o 10-Bit, 165Msps Dual DAC o Low Power 190mW with IFS = 20mA at fCLK = 165MHz o 2.7V to 3.6V Single Supply o Full Output Swing and Dynamic Performance at 2.7V Supply o Superior Dynamic Performance 73dBc SFDR at fOUT = 40MHz UMTS ACLR = 65.5dB at fOUT = 30.7MHz o Programmable Channel Gain Matching o Integrated 1.24V Low-Noise Bandgap Reference o Single-Resistor Gain Control o Interleaved Data Mode o Single-Ended and Differential Clock Input Modes o Miniature 40-Pin Thin QFN Package, 6mm x 6mm o EV Kit Available--MAX5854 EV Kit Features MAX5854 Ordering Information PART MAX5854ETL *EP = Exposed paddle. TEMP RANGE -40C to +85C PIN-PACKAGE 40 Thin QFN-EP* Pin Configuration OUTNA OUTNB OUTPA OUTPB TOP VIEW AGND AVDD AGND AVDD 40 39 38 37 36 35 34 33 32 31 REFO 30 CVDD 29 CGND 28 CLK 27 CVDD 26 CLKXN 25 CLKXP 24 DCE 23 CW 22 DB0 21 DB1 DA9/PD DA8/DACEN DA7/IDE DA6/REN DA5/G3 DA4/G2 DA3/G1 DA2/G0 DA1 DA0 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 EP Applications Communications SatCom, LMDS, MMDS, HFC, DSL, WLAN, Point-to-Point Microwave Links Wireless Base Stations Quadrature Modulation Direct Digital Synthesis (DDS) Instrumentation/ATE MAX5854 DB9 DB7 DB6 DB5 DB4 DB3 REFR **Future product--contact factory for availability. THIN QFN ________________________________________________________________ Maxim Integrated Products DGND DVDD DB8 DB2 1 For pricing, delivery, and ordering information, please contact Maxim/Dallas Direct! at 1-888-629-4642, or visit Maxim's website at www.maxim-ic.com. Dual, 10-Bit, 165Msps, Current-Output DAC MAX5854 ABSOLUTE MAXIMUM RATINGS AVDD, DVDD, CVDD to AGND, DGND, CGND .........-0.3V to +4V DA9-DA0, DB9-DB0, CW, DCE to AGND, DGND, CGND .......................................................-0.3V to +4V CLKXN, CLKXP to CGND.........................................-0.3V to +4V OUTP_, OUTN_ to AGND.......................-1.25V to (AVDD + 0.3V) CLK to DGND ..........................................-0.3V to (DVDD + 0.3V) REFR, REFO to AGND .............................-0.3V to (AVDD + 0.3V) AGND to DGND, DGND to CGND, AGND to CGND..................................................-0.3V to +0.3V Maximum Current into Any Pin (excluding power supplies) ............................................50mA Continuous Power Dissipation (TA = +70C) 40-Pin Thin QFN-EP (derate 23.3mW/C above +70C)...............................................................1.860W Operating Temperature Range ...........................-40C to +85C Storage Temperature Range .............................-65C to +150C Junction Temperature ......................................................+150C Stresses beyond those listed under "Absolute Maximum Ratings" may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. ELECTRICAL CHARACTERISTICS (AVDD = DVDD = CVDD = 3V, AGND = DGND = CGND = 0, fDAC = 165Msps, differential clock, external reference, VREF = 1.2V, IFS = 20mA, output amplitude = 0dB FS, differential output, TA = TMIN to TMAX, unless otherwise noted. TA +25C guaranteed by production test. TA < +25C guaranteed by design and characterization. Typical values are at TA = +25C.) PARAMETER STATIC PERFORMANCE Resolution Integral Nonlinearity Differential Nonlinearity Offset Error Gain Error (See Also Gain Error Definition Section) Gain-Error Temperature Drift DYNAMIC PERFORMANCE fCLK = 165MHz, AOUT = -1dBFS Spurious-Free Dynamic Range to Nyquist SFDR fCLK = 100MHz, AOUT = -1dBFS fCLK = 25MHz, AOUT = -1dBFS fOUT = 10MHz fOUT = 20MHz fOUT = 40MHz fOUT = 10MHz fOUT = 20MHz fOUT = 30MHz fOUT = 1MHz 69.4 78 77 73 77 77 76 79 83 84 82 74 dBc dBc dBc N INL DNL VOS GE Internal reference (Note1) External reference Internal reference External reference RL = 0 Guaranteed monotonic, RL = 0 10 -1.0 -0.5 -0.5 -11.0 -6.25 0.25 0.2 0.1 1.5 0.7 150 100 +1.0 +0.5 +0.5 +6.8 +4.10 Bits LSB LSB LSB %FSR ppm/C SYMBOL CONDITIONS MIN TYP MAX UNITS fCLK = 165MHz, fOUT = 10MHz, AOUT = -1dBFS, span = 10MHz Spurious-Free Dynamic Range Within a Window SFDR fCLK = 100MHz, fOUT = 5MHz, AOUT = -1dBFS, span = 4MHz fCLK = 25MHz, fOUT = 1MHz, AOUT = -1dBFS, span = 2MHz Multitone Power Ratio to Nyquist MTPR 8 tones at 400kHz spacing, fCLK = 78MHz, fOUT = 15MHz to 18.2MHz 2 _______________________________________________________________________________________ Dual, 10-Bit, 165Msps, Current-Output DAC ELECTRICAL CHARACTERISTICS (continued) (AVDD = DVDD = CVDD = 3V, AGND = DGND = CGND = 0, fDAC = 165Msps, differential clock, external reference, VREF = 1.2V, IFS = 20mA, output amplitude = 0dB FS, differential output, TA = TMIN to TMAX, unless otherwise noted. TA +25C guaranteed by production test. TA < +25C guaranteed by design and characterization. Typical values are at TA = +25C.) PARAMETER Multitone Spurious-Free Dynamic Range Within a Window Adjacent Channel Power Ratio with UMTS ACLR SYMBOL CONDITIONS 8 tones at 2.1MHz spacing, fCLK = 165MHz, fOUT = 28.3MHz to 45.2MHz, span = 50MHz fOUT = 30.72MHz, RBW = 30kHz, fCLK = 122.88MHz fCLK = 165MHz, AOUT = -1dBFS Total Harmonic Distortion to Nyquist (2nd- Through 8th-Order Harmonics Included) THD fCLK = 100MHz, AOUT = -1dBFS fCLK = 25MHz, AOUT = -1dBFS Output Channel-to-Channel Isolation Channel-to-Channel Gain Mismatch Channel-to-Channel Phase Mismatch fOUT = 10MHz fOUT = 10MHz, G[3:0] = 1000 fOUT = 10MHz fCLK = 165MHz, fOUT = 10MHz, IFS = 20mA Signal-to-Noise Ratio to Nyquist SNR fCLK = 165MHz, fOUT = 10MHz, IFS = 5mA fCLK = 65MHz, fOUT = 10MHz, IFS = 20mA fCLK = 65MHz, fOUT = 10MHz, IFS = 5mA Maximum DAC Conversion Rate Glitch Impulse Output Settling Time Output Rise Time Output Fall Time ANALOG OUTPUT Full-Scale Output Current Range Output Voltage Compliance Range Output Leakage Current REFERENCE Internal-Reference Output Voltage VREFO REN = 0 1.13 1.24 1.32 V Shutdown or standby mode IFS 2 -1.00 -5 20 +1.25 +5 mA V A tS To 0.1% error band (Note 3) 10% to 90% (Note 3) 90% to 10% (Note 3) fDAC Interleaved mode disabled, IDE = 0 Interleaved mode enabled, IDE = 1 165 82.5 fOUT = 10MHz fOUT = 20MHz fOUT = 40MHz fOUT = 10MHz fOUT = 20MHz fOUT = 30MHz fOUT = 1MHz MIN TYP 70 MAX UNITS dBc MAX5854 65.5 -76 -74 -71 -75 -74 -73 -76 90 0.025 0.05 60.5 61 62 62 200 100 5 12 2.2 2.2 dB dBc dB dB Degrees dB Msps pV-s ns ns ns _______________________________________________________________________________________ 3 Dual, 10-Bit, 165Msps, Current-Output DAC MAX5854 ELECTRICAL CHARACTERISTICS (continued) (AVDD = DVDD = CVDD = 3V, AGND = DGND = CGND = 0, fDAC = 165Msps, differential clock, external reference, VREF = 1.2V, IFS = 20mA, output amplitude = 0dB FS, differential output, TA = TMIN to TMAX, unless otherwise noted. TA +25C guaranteed by production test. TA < +25C guaranteed by design and characterization. Typical values are at TA = +25C.) PARAMETER Internal-Reference Supply Rejection Internal-Reference OutputVoltage Temperature Drift Internal-Reference Output Drive Capability External-Reference Input Voltage Range Current Gain IFS/IREF 0.65 x DVDD 0.3 x DVDD -1 3 0.65 x CVDD 0.3 x CVDD -1 3 0.9 x CVDD 0.1 x CVDD +1 +1 LOGIC INPUTS (DA9-DA0, DB9-DB0, CW) Digital Input-Voltage High Digital Input-Voltage Low Digital Input Current Digital Input Capacitance VIH VIL IIN CIN V V A pF TCVREFO SYMBOL CONDITIONS AVDD varied from 2.7V to 3.6V REN = 0 REN = 0 REN = 1 0.10 MIN TYP 0.5 50 50 1.2 32 1.32 MAX UNITS mV/V ppm/C A V mA/mA SINGLE-ENDED CLOCK INPUT/OUTPUT AND DCE INPUT (CLK, DCE) Digital Input-Voltage High Digital Input-Voltage Low Digital Input Current Digital Input Capacitance Digital Output-Voltage High Digital Output-Voltage Low VIH VIL IIN CIN VOH VOL DCE = 1 DCE = 1 DCE = 1 DCE = 1 DCE = 0, ISOURCE = 0.5mA, Figure 1 DCE = 0, ISINK = 0.5mA, Figure 1 V V A pF V V DIFFERENTIAL CLOCK INPUTS (CLKXP/CLKXN) Differential Clock Input Internal Bias Differential Clock Input Swing Clock Input Impedance POWER REQUIREMENTS Analog Power-Supply Voltage Digital Power-Supply Voltage Clock Power-Supply Voltage AVDD DVDD CVDD 2.7 2.7 2.7 3 3 3 3.6 3.6 3.6 V V V Measured single ended 0.5 5 CVDD/2 V V k 4 _______________________________________________________________________________________ Dual, 10-Bit, 165Msps, Current-Output DAC ELECTRICAL CHARACTERISTICS (continued) (AVDD = DVDD = CVDD = 3V, AGND = DGND = CGND = 0, fDAC = 165Msps, differential clock, external reference, VREF = 1.2V, IFS = 20mA, output amplitude = 0dB FS, differential output, TA = TMIN to TMAX, unless otherwise noted. TA +25C guaranteed by production test. TA < +25C guaranteed by design and characterization. Typical values are at TA = +25C.) PARAMETER SYMBOL CONDITIONS IFS = 20mA (Note 2), single-ended clock mode Analog Supply Current IAVDD IFS = 20mA (Note 2), differential clock mode IFS = 2mA (Note 2), single-ended clock mode IFS = 2mA (Note 2), differential clock mode Digital Supply Current IDVDD IFS = 20mA (Note 2), single-ended clock mode IFS = 20mA (Note 2), differential clock mode Clock Supply Current Total Standby Current Total Shutdown Current ICVDD ISTANDBY ISHDN Single-ended clock mode (DCE = 1) (Note 2) Differential clock mode (DCE = 0) (Note 2) IAVDD + IDVDD+ ICVDD IAVDD + IDVDD + ICVDD Single-ended clock mode (DCE = 1) Total Power Dissipation PTOT Differential clock mode (DCE = 0) Standby Shutdown TIMING CHARACTERISTICS (Figure 5, Figure 6) Propagation Delay DAC Data to CLK Rise/Fall Setup Time DAC Data to CLK Rise/Fall Hold Time Control Word to CW Rise Setup Time Control Word to CW Rise Hold Time CW High Time CW Low Time DACEN = 1 to VOUT Stable Time (Coming Out of Standby) tDCS tDCH tCS tCW tCWH tCWL tSTB Single-ended clock mode (DCE = 1) (Note 4) Differential clock mode (DCE = 0) (Note 4) Single-ended clock mode (DCE = 1) (Note 4) Differential clock mode (DCE = 0) (Note 4) 1.2 2.7 0.8 -0.5 2.5 2.5 5 5 3 1 Clock cycles ns ns ns ns ns ns s IFS = 20mA (Note 2) IFS = 2mA (Note 2) IFS = 20mA (Note 2) IFS = 2mA (Note 2) MIN TYP 43.2 43.2 5 5 6.2 6.2 13.7 24 3.1 1 190 75 220 106 9.3 0.003 11.1 mW 210 3.7 16.5 mA mA A 7.5 mA MAX 46 mA UNITS MAX5854 _______________________________________________________________________________________ 5 Dual, 10-Bit, 165Msps, Current-Output DAC MAX5854 ELECTRICAL CHARACTERISTICS (continued) (AVDD = DVDD = CVDD = 3V, AGND = DGND = CGND = 0, fDAC = 165Msps, differential clock, external reference, VREF = 1.2V, IFS = 20mA, output amplitude = 0dB FS, differential output, TA = TMIN to TMAX, unless otherwise noted. TA +25C guaranteed by production test. TA < +25C guaranteed by design and characterization. Typical values are at TA = +25C.) PARAMETER PD = 0 to VOUT Stable Time (Coming Out of Power-Down) Maximum Clock Frequency at CLKXP/CLKXN Input Clock High Time Clock Low Time CLKXP Rise to CLK Output Rise Delay CLKXP Fall to CLK Output Fall Delay SYMBOL tSHDN fCLK tCXH tCXL tCDH tCDL CLKXP or CLKXN input CLKXP or CLKXN input DCE = 0 DCE = 0 165 CONDITIONS MIN TYP 500 200 1.5 1.5 2.7 2.7 MAX UNITS s MHz ns ns ns ns Note 1: Note 2: Note 3: Note 4: Including the internal reference voltage tolerance and reference amplifier offset. fDAC = 165Msps, fOUT = 10MHz. Measured single-ended with 50 load and complementary output connected to AGND. Guaranteed by design, not production tested. 0.5mA TO OUTPUT PIN 5pF 1.6V 0.5mA Figure 1. Load Test Circuit for CLK Outputs 6 _______________________________________________________________________________________ Dual, 10-Bit, 165Msps, Current-Output DAC MAX5854 Typical Operating Characteristics (AVDD = DVDD = CVDD = 3V, AGND = DGND = CGND = 0, external reference, differential clock, IFS = 20mA, differential output, TA = +25C, unless otherwise noted.) SPURIOUS-FREE DYNAMIC RANGE vs. OUTPUT FREQUENCY (fCLK = 165MHz) MAX5854 toc01 SPURIOUS-FREE DYNAMIC RANGE vs. OUTPUT FREQUENCY (fCLK = 100MHz) MAX5854 toc02 SPURIOUS-FREE DYNAMIC RANGE vs. OUTPUT FREQUENCY (fCLK = 25MHz) 85 80 75 SFDR (dBc) 70 65 60 55 50 45 40 35 30 1 0dBFS MAX5854 toc03 90 85 80 75 SFDR (dBc) 70 65 60 55 50 45 40 35 30 0 -6dBFS -12dBFS 0dBFS 90 85 80 75 SFDR (dBc) 70 65 60 55 50 45 40 35 30 -12dBFS 90 0dBFS -6dBFS -12dBFS -6dBFS 10 20 30 40 50 60 70 80 90 0 5 10 15 20 25 30 35 40 45 50 3 5 7 fOUT (MHz) 9 11 13 fOUT (MHz) fOUT (MHz) SPURIOUS-FREE DYNAMIC RANGE vs. OUTPUT FREQUENCY (fCLK = 200MHz) 90 85 80 75 70 65 60 55 50 45 40 35 30 0 10 20 30 40 50 60 70 80 90 100 fOUT (MHz) SFDR (dBc) 0dBFS 90 85 80 75 SFDR (dBc) 70 65 60 55 50 45 40 35 30 MAX5854 toc04 SPURIOUS-FREE DYNAMIC RANGE vs. OUTPUT FREQUENCY (fCLK = 165MHz) IOUT = 20mA IOUT = 5mA 90 85 80 75 SFDR (dBc) 70 65 60 55 50 45 40 35 30 MAX5854 toc05 SPURIOUS-FREE DYNAMIC RANGE vs. OUTPUT FREQUENCY (fCLK = 165MHz) AVDD = DVDD = CVDD = 3.3V AVDD = DVDD = CVDD = 3.6V MAX5854 toc06 -12dBFS -6dBFS IOUT = 10mA AVDD = DVDD = CVDD = 2.7V AVDD = DVDD = CVDD = 3V 0 10 20 30 40 50 60 70 80 90 0 10 20 30 40 50 60 70 80 90 fOUT (MHz) fOUT (MHz) SFDR vs. TEMPERATURE (fCLK = 165MHz, fOUT = 10MHz, AOUT = 0dBFS) MAX5854 toc07 TWO-TONE INTERMODULATION DISTORTION (fCLK = 165MHz, 1MHz WINDOW) -10 -20 AMPLITUDE (dB) -30 -40 -50 -60 -70 -80 -90 -100 2fOUT1 - fOUT2 2fOUT2 - fOUT1 fOUT2 fOUT1 fOUT1 = 4.8541MHz fOUT2 = 5.0555MHz MAX5854 toc08 80.0 79.5 79.0 78.5 SFDR (dBc) 78.0 77.5 77.0 76.5 76.0 75.5 75.0 -40 -15 10 35 60 0 85 4.5 4.6 4.7 4.8 4.9 5.0 5.1 5.2 5.3 5.4 5.5 fOUT (MHz) TEMPERATURE (C) _______________________________________________________________________________________ 7 Dual, 10-Bit, 165Msps, Current-Output DAC MAX5854 Typical Operating Characteristics (continued) (AVDD = DVDD = CVDD = 3V, AGND = DGND = CGND = 0, external reference, differential clock, IFS = 20mA, differential output, TA = +25C, unless otherwise noted.) 8-TONE SFDR PLOT (fCLK = 165MHz, 35MHz WINDOW) MAX5854 toc09 SINGLE-TONE SFDR (fCLK = 100MHz, 4MHz WINDOW) MAX5854 toc11 SINGLE-TONE SFDR (fCLK = 165MHz, 10MHz WINDOW) -10 -20 AMPLITUDE (dB) -30 -40 -50 -60 -70 -80 -90 -100 fOUT1 = 9.1040MHz AOUT = -1dBFS MAX5854 toc10 0 -10 -20 AMPLITUDE (dB) -30 -40 -50 -60 -70 -80 -90 -100 4.7 9.7 14.7 19.7 24.7 fOUT (MHz) 29.7 34.7 fT3 fT2 fT1 fT4 fT5 fT6 0 -10 -20 AMPLITUDE (dB) -30 -40 -50 -60 -70 -80 -90 -100 fOUT1 = 5.0533MHz AOUT = -1dBFS 0 fT7 fT8 39.7 3.0 3.5 4.0 4.5 5.0 5.5 fOUT (MHz) 6.0 6.5 7.0 4 5 6 7 8 9 10 11 12 13 14 fOUT (MHz) fT1 = 17.493MHz fT2 = 18.997MHz fT3 = 20.200MHz fT4 = 21.253MHz fT5 = 24.035MHz fT6 = 25.087MHz fT7 = 26.741MHz fT8 = 27.869MHz SINGLE-TONE SFDR (fCLK = 25MHz, 2MHz WINDOW) MAX5854 toc12 SINGLE-TONE SFDR (fCLK = 78MHz, 20MHz WINDOW) -10 -20 AMPLITUDE (dB) -30 -40 -50 -60 -70 -80 -90 -100 fOUT = 11.0333MHz AOUT = -1dBFS MAX5854 toc13 0 -10 -20 AMPLITUDE (dB) -30 -40 -50 -60 -70 -80 -90 -100 0 fOUT = 1.0152MHz AOUT = -1dBFS 0.1 0.4 0.6 0.9 1.1 1.4 fOUT (MHz) 1.6 1.9 1.0 5.0 13.0 9.0 fOUT (MHz) 17.0 21.0 SINGLE-TONE FFT PLOT (fCLK = 165MHz, fOUT = 10MHz, AOUT = 0dBFS, NYQUIST WINDOW) MAX5854 toc14 INTEGRAL NONLINEARITY vs. DIGITAL INPUT CODE 0.4 0.3 0.2 INL (LSB) 0.1 0 -0.1 -0.2 -0.3 -0.4 -0.5 MAX5854 toc15 0 -10 -20 AMPLITUDE (dB) -30 -40 -50 -60 -70 -80 -90 -100 0.5 8.2MHz/div fOUT (MHz) 0.5 82.5 0 150 300 450 600 750 900 1050 DIGITAL INPUT CODE 8 _______________________________________________________________________________________ Dual, 10-Bit, 165Msps, Current-Output DAC MAX5854 Typical Operating Characteristics (continued) (AVDD = DVDD = CVDD = 3V, AGND = DGND = CGND = 0, external reference, differential clock, IFS = 20mA, differential output, TA = +25C, unless otherwise noted.) DIFFERENTIAL NONLINEARITY vs. DIGITAL INPUT CODE 0.4 0.3 0.2 DNL (LSB) 0.1 0 -0.1 -0.2 -0.3 -0.4 -0.5 0 150 300 450 600 750 900 1050 DIGITAL INPUT CODE 160 150 20 45 70 95 fCLK (MHz) 120 145 170 MAX5854 toc16 POWER DISSIPATION vs. CLOCK FREQUENCY (fOUT = 10MHz, AOUT = 0dBFS) MAX5854 toc17 POWER DISSIPATION vs. SUPPLY VOLTAGES (fCLK = 165MHz, fOUT = 10MHz) 280 POWER DISSIPATION (mW) 260 240 220 200 180 160 160 2.70 2.85 3.00 3.15 3.30 3.45 3.60 SUPPLY VOLTAGES (V) SINGLE-ENDED CLOCK DRIVE DIFFERENTIAL CLOCK DRIVE MAX5854 toc18 MAX5854 toc21 0.5 230 220 POWER DISSIPATION (mV) 210 200 190 180 170 SINGLE-ENDED CLOCK DRIVE DIFFERENTIAL CLOCK DRIVE 300 REFERENCE VOLTAGE vs. SUPPLY VOLTAGES (fCLK = 165MHz, fOUT = 10MHz) 1.22230 REFEENCE VOLTAGE (V) 1.22230 1.22200 1.22190 1.22180 1.22170 1.22160 1.22150 2.70 2.85 3.00 3.15 3.30 3.45 3.60 SUPPLY VOLTAGES (V) MAX5854 toc19 REFERENCE VOLTAGE vs. TEMPERATURE MAX5854 toc20 DYNAMIC RESPONSE RISE TIME 1.22230 1.25 1.24 REFERENCE VOLTAGE (V) 1.23 1.22 1.21 1.20 1.19 -40 -15 10 35 60 100mV/div 85 10ns/div TEMPERATURE (C) DYNAMIC RESPONSE FALL TIME MAX5854 toc22 ACLR PLOT (fCLK = 122.88MHz, fOUT = 30.72MHz) -20 -30 -40 -50 AMPLITUDE (dB) -60 -70 -80 -90 -100 -110 -120 -130 -140 23.38 ACLR = 65.5dB 90 85 80 75 SFDR (dBc) 70 65 60 55 50 45 40 35 30 MAX5854 toc23 SPURIOUS-FREE DYNAMIC RANGE vs. OUTPUT FREQUENCY (fCLK = 165MHz) 0dBFS MAX5854 toc24 100mV/div -6dBFS -12dBFS SINGLE-ENDED CLOCK DRIVE 0 10 20 30 40 50 60 70 80 90 10ns/div 1.468MHz/div fOUT (MHz) 38.06 fOUT (MHz) _______________________________________________________________________________________ 9 Dual, 10-Bit, 165Msps, Current-Output DAC MAX5854 Pin Description PIN 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 NAME DA9/PD DA7/IDE DA6/REN DA5/G3 DA4/G2 DA3/G1 DA2/G0 DA1 DA0 DB9 DB8 DB7 DB6 DB5 DVDD DGND DB4 DB3 DB2 DB1 DB0 CW DCE FUNCTION Channel A Input Data Bit 9 (MSB)/Power-Down Channel A Input Data Bit 7/Interleaved Data Enable Channel A Input Data Bit 6/Reference Enable. Setting REN = 0 enables the internal reference. Setting REN = 1 disables the internal reference. Channel A Input Data Bit 5/Channel A Gain Adjustment Bit 3 Channel A Input Data Bit 4/Channel A Gain Adjustment Bit 2 Channel A Input Data Bit 3/Channel A Gain Adjustment Bit 1 Channel A Input Data Bit 2/Channel A Gain Adjustment Bit 0 Channel A Input Data Bit 1 Channel A Input Data Bit 0 (LSB) Channel B Input Data Bit 9 (MSB) Channel B Input Data Bit 8 Channel B Input Data Bit 7 Channel B Input Data Bit 6 Channel B Input Data Bit 5 Digital Power Input. See the Power Supplies, Bypassing, Decoupling, and Layout section for more details. Digital Ground Channel B Input Data Bit 4 Channel B Input Data Bit 3 Channel B Input Data Bit 2 Channel B Input Data Bit 1 Channel B Input Data Bit 0 (LSB) Active-Low Control Word Write Pulse. The control word is latched on the rising edge of CW. Active-Low Differential Clock Enable Input. Drive DCE low to enable the differential clock inputs CLKXP and CLKXN. Drive DCE high to disable the differential clock inputs and enable the singleended CLK input. Positive Differential Clock Input. With DCE = 0, CLKXP and CLKXN are enabled. With DCE = 1, CLKXP and CLKXN are disabled. Connect CLKXP to CGND when the differential clock is disabled. Negative Differential Clock Input. With DCE = 0, CLKXP and CLKXN are enabled. With DCE = 1, CLKXP and CLKXN are disabled. Connect CLKXN to CVDD when the differential clock is disabled. Clock Power Input. See the Power Supplies, Bypassing, Decoupling, and Layout section for more Single-Ended Clock Input/Output. With the differential clock disabled (DCE = 1), CLK becomes a single-ended conversion clock input. With the differential clock enabled (DCE = 0), CLK is a singleended output that mirrors the differential clock inputs CLKXP and CLKXN. See the Clock Modes section for more information on CLK. Clock Ground Reference Input/Output. REFO serves as a reference input when the internal reference is disabled. If the internal 1.24V reference is enabled, REFO serves as an output for the internal reference. When the internal reference is enabled, bypass REFO to AGND with a 0.1F capacitor DA8/DACEN Channel A Input Data Bit 8/DAC Enable Control 25 26 27, 30 CLKXP CLKXN CVDD 28 CLK 29 31 CGND REFO 10 ______________________________________________________________________________________ Dual, 10-Bit, 165Msps, Current-Output DAC Pin Description (continued) PIN 32 33, 39 34 35 36, 40 37 38 -- NAME REFR AVDD OUTNB OUTPB AGND OUTNA OUTPA EP FUNCTION Full-Scale Current Adjustment. To set the output full-scale current, connect an external resistor RSET between REFR and AGND. The output full-scale current is equal to 32 x VREFO/RSET. Analog Power Input. See the Power Supplies, Bypassing, Decoupling, and Layout section for more details. Channel B Negative Analog Current Output Channel B Positive Analog Current Output Analog Ground Channel A Negative Analog Current Output Channel A Positive Analog Current Output Exposed Paddle. Connect EP to the common point of all ground planes. MAX5854 Detailed Description DVDD DGND CW DA0 DA1 DA2/G0 DA3/G1 DA4/G2 DA5/G3 DA6/REN DA7/IDE DA8/DACEN DA9/PD DIGITAL POWER MANAGEMENT ANALOG POWER MANAGEMENT AVDD AGND MAX5854 DACA INPUT REGISTER CONTROL WORD 10-BIT DACA OUTPA OUTNA CHANNEL A GAIN CONTROL INPUT DATA INTERLEAVER G0 G1 G2 G3 The MAX5854 dual, high-speed, 10-bit, current-output DAC provides superior performance in communication systems requiring low-distortion analog-signal reconstruction. The MAX5854 combines two DACs and an onchip 1.24V reference (Figure 2). The current outputs of the DACs can be configured for differential or singleended operation. The full-scale output current range is adjustable from 2mA to 20mA to optimize power dissipation and gain control. The MAX5854 accepts an input data and a DAC conversion rate of 165MHz. The inputs are latched on the rising edge of the clock whereas the output latches on the following rising edge. The MAX5854 features three modes of operation: normal, standby, and power-down (Table 2). These modes allow efficient power management. In power-down, the MAX5854 consumes only 1A of supply current. Wake-up time from standby mode to normal DAC operation is 3s. IDE DB0 DB1 DB2 DB3 DB4 DB5 DB6 DB7 DB8 DB9 DCE CLKXP CLKXN CLK CVDD CGND DACB INPUT REGISTER OPERATING MODE CONTROLLER DACEN PD OUTPB OUTNB Programming the DAC 10-BIT DACB REFO CLOCK DISTRIBUTION 1.24V REFERENCE AND CONTROL AMPLIFIER REFR CLOCK POWER MANAGEMENT RSET REN AGND An 8-bit control word routed through channel A's data port programs the gain matching, reference, and the operational mode of the MAX5854. The control word is latched on the rising edge of CW. CW is independent of the DAC clock. The DAC clock can always remain running, when the control word is written to the DAC. Table 1 and Table 2 represent the control word format and function. The gain on channel A can be adjusted to achieve gain matching between two channels in a user's system. The gain on channel A can be adjusted from -0.4dB to 0.35dB in steps of 0.05dB by using bits G3 to G0 (see Table 3). Figure 2. Simplified Diagram ______________________________________________________________________________________ 11 Dual, 10-Bit, 165Msps, Current-Output DAC MAX5854 Table 1. Control Word Format and Function MSB PD DACEN IDE REN G3 G2 FUNCTION Power-Down. The part enters power-down mode if PD = 1. DAC Enable. When DACEN = 0 and PD = 0, the part enters standby mode. Interleaved Data Mode. IDE = 1 enables the interleaved data mode. In this mode, digital data for both channels is applied through channel A in a multiplexed fashion. Channel B data is written on the falling edge of the clock signal and channel A data is written on the rising edge of the clock signal. Reference Enable Bit. REN = 0 activates the internal reference. REN = 1 disables the internal reference and requires the user to apply an external reference between 0.1V to 1.32V. Bit 3 (MSB) of Gain Adjust Word Bit 2 of Gain Adjust Word Bit 1 of Gain Adjust Word Bit 0 (LSB) of Gain Adjust Word G1 G0 X LSB X CONTROL WORD PD DACEN IDE REN G3 G2 G1 G0 Table 2. Configuration Modes MODE Normal operation; noninterleaved inputs; internal reference active Normal operation; noninterleaved inputs; internal reference disabled Normal operation; interleaved inputs; internal reference disabled Standby Power-down Power-up PD DACEN IDE REN Device Power-Up and States of Operation At power-up, the MAX5854's default configuration is internal reference noninterleaved input mode with a gain of 0dB and a fully operational converter. In shutdown, the MAX5854 consumes only 1A of supply current, and in standby the current consumption is 3.1mA. Wake-up time from standby mode to normal operation is 3s. 0 1 0 0 0 1 0 1 Clock Modes The MAX5854 allows both single-ended CMOS and differential clock mode operation, and supports update rates of up to 165Msps. These modes are selected through an active-low control line called DCE. In singleended clock mode (DCE = 1), the CLK pin functions as an input, which accepts a user-provided single-ended clock signal. Data is written to the converter on the rising edge of the clock. The DAC outputs (previous data) are updated simultaneously on the same edge. If the DCE pin is pulled low, the MAX5854 will operate in differential clock mode. In this mode, the clock signal has to be applied to differential clock input pins CLKXP/CLKXN. The differential input accepts an input range of 0.5VP-P and a common-mode range of 1V to (CVDD - 0.5V), making the part ideal for low- input amplitude clock drives. CLKXP/CLKXN also help to minimize the jitter, and allow the user to connect a crystal oscillator directly to MAX5854. 0 0 1 0 1 0 X 1 1 X X X 1 X X X X = Don't care. Table 3. Gain Difference Setting GAIN ADJUSTMENT ON CHANNEL A (dB) +0.4 0 -0.35 G3 0 1 1 G2 0 0 1 G1 0 0 1 G0 0 0 1 12 ______________________________________________________________________________________ Dual, 10-Bit, 165Msps, Current-Output DAC MAX5854 AVDD OPTIONAL EXTERNAL BUFFER FOR HEAVIER LOADS 10F 1.24V BANDGAP REFERENCE REFO CCOMP* REFR AGND IREF = VREF RSET AGND REFR RSET AGND CURRENTSOURCE ARRAY IFS AGND REN = 0 AVDD 1.24V BANDGAP REFERENCE REFO CURRENTSOURCE ARRAY IFS REN = 1 0.1F MAX4040 MAX6520 IREF EXTERNAL 1.2V REFERENCE IREF MAX5854 RSET MAX5854 *COMPENSATION CAPACITOR (CCOMP 100nF). AGND Figure 3. Setting IFS with the Internal 1.24V Reference and the Control Amplifier Figure 4. MAX5854 with External Reference The CLK pin now becomes an output, and provides a single-ended replica of the differential clock signal, which may be used to synchronize the input data. Data is written to the device on the rising edge of the CLK signal. External Reference To disable the internal reference of the MAX5854, set REN = 1. Apply a temperature-stable, external reference to drive the REFO pin and set the full-scale output (Figure 4). For improved accuracy and drift performance, choose a fixed output voltage reference such as the 1.2V, 25ppm/C MAX6520 bandgap reference. Internal Reference and Control Amplifier The MAX5854 provides an integrated 50ppm/C, 1.24V, low-noise bandgap reference that can be disabled and overridden with an external reference voltage. REFO serves either as an external reference input or an integrated reference output. If REN =0, the internal reference is selected and REFO provides a 1.24V (50A) output. Buffer REFO with an external amplifier, when driving a heavy load. The MAX5854 also employs a control amplifier designed to simultaneously regulate the full-scale output current (I FS ) for both outputs of the devices. Calculate the output current as: IFS = 32 IREF where I REF is the reference output current (I REF = VREFO / RSET) and IFS is the full-scale output current. R SET is the reference resistor that determines the amplifier output current of the MAX5854 (Figure 3). This current is mirrored into the current-source array where IFS is equally distributed between matched current segments and summed to valid output current readings for the DACs. Detailed Timing The MAX5854 accepts an input data and the DAC conversion rate of up to 165Msps. The input latches on the rising edge of the clock, whereas the output latches on the following rising edge. Figure 5 depicts the write cycle of the two DACs in noninterleaved mode. The MAX5854 can also operate in an interleaved data mode. Programming the IDE bit with a high level activates this mode (Tables 1 and 2). In interleaved mode, data for both DAC channels is written through input port A. Channel B data is written on the falling edge of the clock signal and then channel A data is written on the following rising edge of the clock signal. Both DAC outputs (channel A and B) are updated simultaneously on the next following rising edge of the clock. In interleaved data mode, the maximum input data rate per channel is half of the rate in noninterleaved mode. The interleaved data mode is attractive for applications where lower data rates are acceptable and interfacing on a single 10-bit bus is desired (Figure 6). 13 ______________________________________________________________________________________ Dual, 10-Bit, 165Msps, Current-Output DAC MAX5854 tCXH CLKXN CLKXP tCDL tCDH CLK OUTPUT CW tCXL tCWL tDCS tDCH tCS tCW DA0-DA9 DACA - 1 DACA DACA + 1 DACA + 2 CONTROL WORD DACA + 3 OUTNA DACA - 1 OUTPA tDCS DB0-DB9 DACB - 1 tDCH DACB + 1 DACB + 2 XXXX DACB + 3 DACA DACA + 1 DACA + 2 XXXX (CONTROL WORD DATA) DACA + 3 DACB OUTNB DACB - 1 OUTPB DACB DACB + 1 DACB + 2 XXXX DACB + 3 Figure 5. Timing Diagram for Noninterleaved Data Mode (IDE = 0) tCXL CLKXN CLKXP tCDH tCDL tCXH CLK OUTPUT CW tCWL tDCS tDCH tDCS tDCH tCS tCW DA0-DA9 DACA DACB + 1 DACA + 1 CONTROL WORD DACB + 2 DACA + 2 OUTNA DACA - 1 OUTPA OUTNB DACB - 1 OUTPB DACB DACB + 1 DACA DACA + 1 Figure 6. Timing Diagram for Interleaved Data Mode (IDE = 1) 14 ______________________________________________________________________________________ Dual, 10-Bit, 165Msps, Current-Output DAC MAX5854 AVDD DVDD CVDD 50 OUTPA DA0-DA9 AVDD DVDD CVDD VOUTA, SINGLE ENDED DA0-DA9 100 50 OUTPA 1/2 MAX5854 1/2 MAX5854 OUTNA 50 10 10 OUTNA 50 50 OUTPB DB0-DB9 VOUTB, SINGLE ENDED DB0-DB9 50 OUTPB 1/2 100 1/2 MAX5854 OUTNB 50 10 MAX5854 OUTNB 50 AGND DGND CGND 10 AGND DGND CGND Figure 7. Application with Output Transformer Performing Differential-to-Single-Ended Conversion Figure 8. Application with DC-Coupled Differential Outputs Applications Information Differential-to-Single-Ended Conversion The MAX5854 exhibits excellent dynamic performance to synthesize a wide variety of modulation schemes, including high-order QAM modulation with OFDM. Figure 7 shows a typical application circuit with output transformers performing the required differential-to-single-ended signal conversion. In this configuration, the MAX5854 operates in differential mode, which reduces even-order harmonics, and increases the available output power. extend from 10MHz down to several hundred kilohertz. DC-coupling is desirable to eliminate long discharge time constants that are problematic with large, expensive coupling capacitors. Analog quadrature upconverters have a DC common-mode input requirement of typically 0.7V to 1.0V. The MAX5854 differential I/Q outputs can maintain the desired full-scale level at the required 0.7V to 1.0V DC common-mode level when powered from a single 2.85V (5%) supply. The MAX5854 meets this low-power requirement with minimal reduction in dynamic range while eliminating the need for level-shifting resistor networks. Differential DC-Coupled Configuration Figure 8 shows the MAX5854 output operating in differential, DC-coupled mode. This configuration can be used in communications systems employing analog quadrature upconverters and requiring a baseband sampling, dual-channel, high-speed DAC for I/Q synthesis. In these applications, information bandwidth can Power Supplies, Bypassing, Decoupling, and Layout Grounding and power-supply decoupling strongly influence the MAX5854 performance. Unwanted digital crosstalk can couple through the input, reference, power-supply, and ground connections, which can affect dynamic specifications, like signal-to-noise ratio 15 ______________________________________________________________________________________ Dual, 10-Bit, 165Msps, Current-Output DAC or spurious-free dynamic range. In addition, electromagnetic interference (EMI) can either couple into or be generated by the MAX5854. Observe the grounding and power-supply decoupling guidelines for highspeed, high-frequency applications. Follow the power supply and filter configuration to realize optimum dynamic performance. Use of a multilayer printed circuit (PC) board with separate ground and power-supply planes is recommended. Run high-speed signals on lines directly above the ground plane. The MAX5854 has separate analog and digital ground buses (AGND, CGND, and DGND, respectively). Provide separate analog, digital, and clock ground sections on the PC board with only one point connecting the three planes. The ground connection points should be located underneath the device and connected to the exposed paddle. Run digital signals above the digital ground plane and analog/clock signals above the analog/clock ground plane. Digital signals should be kept away from sensitive analog, clock, and reference inputs. Keep digital signal paths short and metal trace lengths matched to avoid propagation delay and data skew mismatch. The MAX5854 includes three separate power-supply inputs: analog (AV DD ), digital (DV DD ), and clock (CVDD). Use a single linear regulator power source to branch out to three separate power-supply lines (AVDD, DV DD , CV DD ) and returns (AGND, DGND, CGND). Filter each power-supply line to the respective return line using LC filters comprising ferrite beads and 10F capacitors. Filter each supply input locally with 0.1F ceramic capacitors to the respective return lines. Note: To maintain the dynamic performance of the Electrical Characteristics, ensure the voltage difference between DV DD , AV DD , and CV DD does not exceed 150mV. In this package, the data converter die is attached to an EP leadframe with the back of this frame exposed at the package bottom surface, facing the PC board side of the package. This allows a solid attachment of the package to the PC board with standard infrared (IR) flow soldering techniques. A specially created land pattern on the PC board, matching the size of the EP (4.1mm 4.1mm), ensures the proper attachment and grounding of the DAC. Designing vias* into the land area and implementing large ground planes in the PC board design allows for highest performance operation of the DAC. Use an array of 3 3 vias (0.3mm diameter per via hole and 1.2mm pitch between via holes) for this 40-pin thin QFN-EP package (package code: T4066-1). MAX5854 Dynamic Performance Parameter Definitions Adjacent Channel Leakage Ratio (ACLR) Commonly used in combination with wideband codedivision multiple-access (WCDMA), ACLR reflects the leakage power ratio in dB between the measured power within a channel relative to its adjacent channel. ACLR provides a quantifiable method of determining out-of-band spectral energy and its influence on an adjacent channel when a bandwidth-limited RF signal passes through a nonlinear device. Total Harmonic Distortion (THD) THD is the ratio of the RMS sum of all essential harmonics (within a Nyquist window) of the input signal to the fundamental itself. This can be expressed as: 2 2 2 2 V2 + V3 + V4 ... + ...VN THD = 20 x log V1 Thermal Characteristics and Packaging Thermal Resistance 40-lead thin QFN-EP: JA = 38C/W The MAX5854 is packaged in a 40-pin thin QFN-EP package, providing greater design flexibility, increased thermal efficiency, and optimized AC performance of the DAC. The EP enables the implementation of grounding techniques, which are necessary to ensure highest performance operation. where V1 is the fundamental amplitude, and V2 through VN are the amplitudes of the 2nd through Nth order harmonics. The MAX5854 uses the first seven harmonics for this calculation. Spurious-Free Dynamic Range (SFDR) SFDR is the ratio of RMS amplitude of the carrier frequency (maximum signal component) to the RMS value of their next-largest spectral component. SFDR is usually measured in dBc with respect to the carrier frequency amplitude or in dBFS with respect to the DAC's full-scale range. Depending on its test condition, SFDR is observed within a predefined window or to Nyquist. *Vias connect the land pattern to internal or external copper planes. 16 ______________________________________________________________________________________ Dual, 10-Bit, 165Msps, Current-Output DAC Multitone Power Ratio (MTPR) A series of equally spaced tones are applied to the DAC with one tone removed from the center of the range. MTPR is defined as the worst-case distortion (usually a 3rd-order harmonic product of the fundamental frequencies), which appears as the largest spur at the frequency of the missing tone in the sequence. This test can be performed with any number of input tones; however, four and eight tones are among the most common test conditions for CDMA- and GSM/EDGE-type applications. Gain Error A gain error is the difference between the ideal and the actual full-scale output current on the transfer curve, after nullifying the offset error. This error alters the slope of the transfer function and corresponds to the same percentage error in each step. The ideal current is defined by reference voltage at VREFO / IREF x 32. Settling Time The settling time is the amount of time required from the start of a transition until the DAC output settles to its new output value to within the converter's specified accuracy. Glitch Impulse A glitch is generated when a DAC switches between two codes. The largest glitch is usually generated around the midscale transition, when the input pattern transitions from 011...111 to 100...000. This occurs due to timing variations between the bits. The glitch impulse is found by integrating the voltage of the glitch at the midscale transition over time. The glitch impulse is usually specified in pV-s. MAX5854 Intermodulation Distortion (IMD) The two-tone IMD is the ratio expressed in dBc of either output tone to the worst 3rd-order (or higher) IMD products. Static Performance Parameter Definitions Integral Nonlinearity (INL) Integral nonlinearity (INL) is the deviation of the values on an actual transfer function from a line drawn between the end points of the transfer function, once offset and gain errors have been nullified. For a DAC, the deviations are measured at every individual step. Differential Nonlinearity (DNL) Differential nonlinearity (DNL) is the difference between an actual step height and the ideal value of 1 LSB. A DNL error specification no more negative than -1 LSB guarantees monotonic transfer function. Table 4. Part Selection Table PART MAX5851 MAX5852 MAX5853 MAX5854 SPEED (Msps) 80 165 80 165 RESOLUTION 8-bit, dual 8-bit, dual 10-bit, dual 10-bit, dual Offset Error Offset error is the current flowing from positive DAC output when the digital input code is set to zero. Offset error is expressed in LSBs. Chip Information TRANSISTOR COUNT: 9,035 PROCESS: CMOS ______________________________________________________________________________________ 17 Dual, 10-Bit, 165Msps, Current-Output DAC MAX5854 Package Information (The package drawing(s) in this data sheet may not reflect the most current specifications. For the latest package outline information, go to www.maxim-ic.com/packages.) QFN THIN 6x6x0.8.EPS E2 L e D2 D D/2 k C L b D2/2 E/2 E2/2 E (NE-1) X e C L k e (ND-1) X e L C L C L L e A1 A2 A PACKAGE OUTLINE 36,40L THIN QFN, 6x6x0.8 mm 21-0141 D 1 2 NOTES: 1. DIMENSIONING & TOLERANCING CONFORM TO ASME Y14.5M-1994. 2. ALL DIMENSIONS ARE IN MILLIMETERS. ANGLES ARE IN DEGREES. 3. N IS THE TOTAL NUMBER OF TERMINALS. 4. THE TERMINAL #1 IDENTIFIER AND TERMINAL NUMBERING CONVENTION SHALL CONFORM TO JESD 95-1 SPP-012. DETAILS OF TERMINAL #1 IDENTIFIER ARE OPTIONAL, BUT MUST BE LOCATED WITHIN THE ZONE INDICATED. THE TERMINAL #1 IDENTIFIER MAY BE EITHER A MOLD OR MARKED FEATURE. 5. DIMENSION b APPLIES TO METALLIZED TERMINAL AND IS MEASURED BETWEEN 0.25 mm AND 0.30 mm FROM TERMINAL TIP. 6. ND AND NE REFER TO THE NUMBER OF TERMINALS ON EACH D AND E SIDE RESPECTIVELY. 7. DEPOPULATION IS POSSIBLE IN A SYMMETRICAL FASHION. 8. COPLANARITY APPLIES TO THE EXPOSED HEAT SINK SLUG AS WELL AS THE TERMINALS. 9. DRAWING CONFORMS TO JEDEC MO220. 10. WARPAGE SHALL NOT EXCEED 0.10 mm. PACKAGE OUTLINE 36, 40L THIN QFN, 6x6x0.8 mm 21-0141 D 2 2 Maxim cannot assume responsibility for use of any circuitry other than circuitry entirely embodied in a Maxim product. No circuit patent licenses are implied. Maxim reserves the right to change the circuitry and specifications without notice at any time. 18 ____________________Maxim Integrated Products, 120 San Gabriel Drive, Sunnyvale, CA 94086 408-737-7600 (c) 2004 Maxim Integrated Products Printed USA is a registered trademark of Maxim Integrated Products. |
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