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MOTOROLA SEMICONDUCTOR TECHNICAL DATA Dual D Flip-Flop with Set and Reset with LSTTL Compatible Inputs High-Performance Silicon-Gate CMOS The MC74HCT74A is identical in pinout to the LS74. This device may be used as a level converter for interfacing TTL or NMOS outputs to High Speed CMOS inputs. This device consists of two D flip-flops with individual Set, Reset, and Clock inputs. Information at a D-input is transferred to the corresponding Q output on the next positive going edge of the clock input. Both Q and Q outputs are available from each flip-flop. The Set and Reset inputs are asynchronous. * * * * * * Output Drive Capability: 10 LSTTL Loads TTL NMOS Compatible Input Levels Outputs Directly Interface to CMOS, NMOS, and TTL Operating Voltage Range: 4.5 to 5.5 V Low Input Current: 1.0 A In Compliance with the Requirements Defined by JEDEC Standard No. 7A * Chip Complexity: 136 FETs or 34 Equivalent Gates LOGIC DIAGRAM RESET 1 DATA 1 1 2 5 14 MC74HCT74A N SUFFIX PLASTIC PACKAGE CASE 646-06 1 14 1 D SUFFIX SOIC PACKAGE CASE 751A-03 ORDERING INFORMATION MC54HCTXXAJ MC74HCTXXAN MC74HCTXXAD Ceramic Plastic SOIC PIN ASSIGNMENT RESET 1 DATA 1 CLOCK 1 SET 1 Q1 1 2 3 4 5 6 7 14 13 12 11 10 9 8 VCC RESET 2 DATA 2 CLOCK 2 SET 2 Q2 Q2 Q1 Q1 GND CLOCK 1 SET 1 RESET 2 DATA 2 3 4 6 Q1 FUNCTION TABLE 13 12 9 Inputs Set Reset Clock Data Q2 L H L H H H H H H L L H H H H H X X X X X X H L X X X Outputs Q Q H L L H H* H* H L L H No Change No Change No Change CLOCK 2 SET 2 11 10 PIN 14 = VCC PIN 7 = GND 8 Q2 L H 10/95 (c) Motorola, Inc. 1995 IIIIIIIIIIIIII II III I I IIIIIIIIIIIIII II IIIIIIIIIIIIII I III I II IIIIIIIIIIIIII II IIIIIIIIIIIIII II IIIIIIIIIIIIII II IIIIIIIIIIIIII II IIIIIIIIIIIIII II IIIIIIIIIIIIII IIIIIIIIIIII I IIIIIIIIIIIIII II IIIIIIIIIIIIII II IIIIIIIIIIIIII II IIIIIIIIIIIIII II IIIIIIIIIIIIII II IIIIIIIIIIIIII II IIIIIIIIIIIIII II IIIIIIIIIIIIII IIIIIIIIIIII I IIIIIIIIIIIIII II IIIIIIIIIIIIII II Design Criteria Value 34 Units ea. ns Internal Gate Count* Internal Gate Propagation Delay Internal Gate Power Dissipation Speed Power Product 1.5 5.0 W pJ .0075 * Equivalent to a two-input NAND gate. 1 * Both outputs will remain high as long as Set and Reset are low, but the output states are unpredictable if Set and Reset go high simultaneously. REV 6 IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII I III I I III I III I I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII I III I I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII I II I I II I I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII I III I I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII I III I I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII I I I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII I II I I I I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII I IIIIIIIIIIIIIIIIIIIIIIIIIIII II I I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIII II I I I I III I I I I I I I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII I I I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII I I II I I I III I I I I I I II I I I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII I I II I I I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII I I II I I I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII I I II I I I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII I I II I I I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII I I II I I I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIIIIIIIIIIIIIIIIIIIIIIIIIIIIII I II I I I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII I I II I I I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII I I II I I I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII I I II I I I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII I I II I I I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII I I II I I I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII I I II I I I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII I I II I I I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII I I II I I I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII I I II I I I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII I I II I I I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII I I II I I I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII I I II I I I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII I I II I I I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII I I II I I I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII I I II I I I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII I I II I I I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII I I II I I I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII I I II I I I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII I I II I I I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII I I II I I I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII I I II I I I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII I I II I I I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII I I II I I I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII I I II I I I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII I I II I I I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII I I II I I I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII I I II I I I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII I I II I I I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII I I II I I I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII I I II I II I I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII I I I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIIIIII IIIIIIIIIIII I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII I II I I I III IIIIII I I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII I II I IIIII I I I IIIIIIIIIIIIIIIIIIIIIII I IIIIIIIIIIIIIIIIIIIIIII III I III I I III I IIIIIIIIIIIIIIIIIIIIIII III I IIIIIIIIIIIIIIIIIIIIIII III I IIIIIIIIIIIIIIIIIIIIIII III I IIIIIIIIIIIIIIIIIIIIIII III I IIIIIIIIIIIIIIIIIIIIIII III I IIIIIIIIIIIIIIIIIIIIIII III I IIIIIIIIIIIIIIIIIIIIIII III I IIIIIIIIIIIIIIIIIIIIIII III I IIIIIIIIIIIIIIIIIIIIIII III I IIIIIIIIIIIIIIIIIIIIIII IIIIIIIIIIIIIIIIIIIII II I IIIIIIIIIIIIIIIIIIIIIII III I IIIIIIIIIIIIIIIIIIIIIII III I IIIIIIIIIIIIIIIIIIIIIII IIIIIIIIIIIIIIIIIIIII II I IIIIIIIIIIIIIIIIIIIIIII III I IIIIIIIIIIIIIIIIIIIIIII III I * Maximum Ratings are those values beyond which damage to the device may occur. Functional operation should be restricted to the Recommended Operating Conditions. Derating -- Plastic DIP: -10mW/_C from 65_ to 125_C SOIC Package: -7mW/_C from 65_ to 125_C For high frequency or heavy load considerations, see Chapter 2 of the Motorola High-Speed CMOS Data Book (DL129/D). NOTE: Information on typical parametric values can be found in Chapter 2 of the Motorola High-Speed CMOS Data Book (DL129/D). IIIIIIIIIIIIIIIIIIIIIII I I I IIIIIIIIIIIIIIIIIIIIIII I I I III I I I IIIIIIIIIIIIIIIIIIIIIII I I I IIIIIIIIIIIIIIIIIIIIIII I I I IIIIIIIIIIIIIIIIIIIIIII I I I IIIIIIIIIIIIIIIIIIIIIII I I I IIIIIIIIIIIIIIIIIIIIIII I I I IIIIIIIIIIIIIIIIIIIIIII I I I IIIIIIIIIIIIIIIIIIIIIII I I I IIIIIIIIIIIIIIIIIIIIIII I I I IIIIIIIIIIIIIIIIIIIIIII I I I IIIIIIIIIIIIIIIIIIIIIII I I I IIIIIIIIIIIIIIIIIIIIIII I I I III I I I IIIIIIIIIIIIIIIIIIIIIII I I I IIIIIIIIIIIIIIIIIIIIIII I I I IIIIIIIIIIIIIIIIIIIIIII I I I IIIIIIIIIIIIIIIIIIIIIII I I I IIIIIIIIIIIIIIIIIIIIIII I I I IIIIIIIIIIIIIIIIIIIIIII I I I IIIIIIIIIIIIIIIIIIIIIII I I I IIIIIIIIIIIIIIIIIIIIIII I I I IIIIIIIIIIIIIIIIIIIIIII I I I IIIIIIIIIIIIIIIIIIIIIII I I I IIIIIIIIIIIIIIIIIIIIIII I I I IIIIIIIIIIIIIIIIIIIIIII I I I IIIIIIIIIIIIIIIIIIIIIII I I I IIIIIIIIIIIIIIIIIIIIIII I I I IIIIIIIIIIIIIIIIIIIIIII I I I IIIIIIIIIIIIIIIIIIIIIII I I I IIIIIIIIIIIIIIIIIIIIIII I I I IIIIIIIIIIIIIIIIIIIIIII I I I IIIIIIIIIIIIIIIIIIIIIII I I I IIIIIIIIIIIIIIIIIIIIIII I I I IIIIIIIIIIIIIIIIIIIIIII I I I IIIIIIIIIIIIIIIIIIIIIII IIIIIIIIIIIIIIIIIIIII I I IIIIIIIIIIIIIIIIIIIIIII I I I IIIIIIIIIIIIIIIIIIIIIII I IIIIIIII I I I IIIIIIIIIIIIIIIIIIIIIII IIIIIIIIIIIIIIIIIIIII IIIIIIIIIIIIIIII I IIIIIIIIIIIIIIIIIIIIIII IIIIIIIIIIIIIIIIIIIII I I IIIIIIIIIIIIIIIIIIIIIII III IIIIIIIIIIIIIIIIIIIIIII I I IIIIIIIIIIIIIIIIIIIIIII MAXIMUM RATINGS* MOTOROLA DC ELECTRICAL CHARACTERISTICS (Voltages Referenced to GND) RECOMMENDED OPERATING CONDITIONS MC74HCT74A Symbol Vin, Vout Symbol Symbol VCC Vout Tstg ICC Iout VCC Vin PD ICC TL VOH tr, tf Iin VOL ICC TA VIH VIL Iin Lead Temperature, 1 mm from Case for 10 Seconds (Plastic DIP or SOIC Package) Storage Temperature Power Dissipation in Still Air DC Supply Current, VCC and GND Pins DC Output Current, per Pin DC Input Current, per Pin DC Output Voltage (Referenced to GND) DC Input Voltage (Referenced to GND) DC Supply Voltage (Referenced to GND) Input Rise and Fall Time (Figure 1) Operating Temperature, All Package Types DC Input Voltage, Output Voltage (Referenced to GND) DC Supply Voltage (Referenced to GND) Additional Quiescent Supply Current Maximum Quiescent Supply Current (per Package) Maximum Input Leakage Current Maximum Low-Level Output Voltage Minimum High-Level Output Voltage Maximum Low-Level Input Voltage Minimum High-Level Input Voltage Parameter Parameter Parameter Plastic DIP SOIC Package Vin = VIH or VIL |Iout| 4.0 mA Vin = VIH or VIL |Iout| 20 A Vin = VIH or VIL |Iout| 4.0 mA Vin = VIH or VIL |Iout| 20 A Vin = 2.4 V, Any One Input Vin = VCC or GND, Other Inputs lout = 0 A Vin = VCC or GND Iout = 0 A Vin = VCC or GND Vout = 0.1 V or VCC - 0.1 V |Iout| 20 A Vout = 0.1 V or VCC - 0.1 V |Iout| 20 A v v v v v v Test Conditions - 0.5 to VCC + 0.5 - 1.5 to VCC + 1.5 - 65 to + 150 - 0.5 to + 7.0 2 - 55 Min 4.5 Value 0 0 50 25 20 260 750 500 + 125 VCC Max 500 5.5 VCC V 5.5 5.5 5.5 4.5 4.5 5.5 4.5 4.5 5.5 4.5 5.5 4.5 5.5 Unit Unit mW mA mA mA _C _C _C ns V V V V V - 55 to 25_C 0.1 0.26 3.98 - 55_C 2.0 0.1 0.1 4.4 5.4 0.8 0.8 2.0 2.0 2.9 This device contains protection circuitry to guard against damage due to high static voltages or electric fields. However, precautions must be taken to avoid applications of any voltage higher than maximum rated voltages to this high-impedance circuit. For proper operation, Vin and Vout should be constrained to the range GND (Vin or Vout) VCC. Unused inputs must always be tied to an appropriate logic voltage level (e.g., either GND or VCC). Unused outputs must be left open. Guaranteed Limit v 85_C v 125_C High-Speed CMOS Logic Data DL129 -- Rev 6 1.0 0.33 3.84 0.1 0.1 4.4 5.4 0.8 0.8 2.0 2.0 20 25_C to 125_C v 2.4 1.0 0.4 0.1 0.1 3.7 4.4 5.4 0.8 0.8 2.0 2.0 80 v Unit mA A A V V V V IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII II I I I I I I I IIII I I I I I I I I II I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII I I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII II I I I I I I I IIII I I I I I I II I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII II I I I I I I I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII II I I I I I I I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII II I I I I I I I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII II I I I I I I I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII II I I I I I I I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII II I I I I I I I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII II I I I I I I I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII II I I I I I I I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII II I I I I I I I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII II I I I I I I I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII II I I I I I I I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII II I I I I I I I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII II I I I I I I I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII II I I I I I I IIIIIII I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII II I I I I I I I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII II I I I I I I I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII II I I I I I I I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII II I I I I I I I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII II I I I I I I I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII II I I I I I I I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII II I I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIII III IIIIIIIIIIIIIIIIIIIIII IIII II I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII II III III I I I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII II I I I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIIIIIIIIIII I II I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII II I I I II I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII II I II I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIIIIIIIIIIIIIIIII I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII I I I II I III I I I II I I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII III IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIIIIIIIIIIIIIIIIIIIIIIIIIIIIII I II IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII III IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII I II IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII * Used to determine the no-load dynamic power consumption: PD = CPD VCC 2 f + ICC VCC . For load considerations, see Chapter 2 of the Motorola High-Speed CMOS Data Book (DL129/D). NOTE: For propagation delays with loads other than 50 pF, and information on typical parametric values, see Chapter 2 of the Motorola High- Speed CMOS Data Book (DL129/D). IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIII I III I I I I I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII I I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIII I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIII I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIII I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIII I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIII I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIII I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIII I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIII I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIII I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIII I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIII I III I I I IIII I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIII I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIIIIIIIIIIIIIIIIIIIIIIIIIIIIII III I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIII I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIII I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIIIIIIIIIIIIIIIIIIIIIIIIIIIIII III I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIII I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIII I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIII I AC ELECTRICAL CHARACTERISTICS (VCC = 5.0 V 10%, CL = 50 pF, Input tr = tf = 6.0 ns) Symbol tPLH, tPHL tPLH, tPHL tTLH, tTHL fmax Cin Maximum Input Capacitance Maximum Output Transition Time, Any Output (Figures 1 and 4) Maximum Propagation Delay, Set or Reset to Q or Q (Figures 2 and 4) Maximum Propagation Delay, Clock to Q or Q (Figures 1 and 4) Maximum Clock Frequency (50% Duty Cycle) (Figures 1 and 4) Parameter - 55 to 25_C 10 15 24 24 30 Guaranteed Limit High-Speed CMOS Logic Data DL129 -- Rev 6 Symbol tr, tf trec tsu tw tw th CPD Maximum Input Rise and Fall Times Minimum Pulse Width, Set or Reset Minimum Pulse Width, Clock Minimum Recovery Time, Set or Reset Inactive to Clock Minimum Hold Time, Clock to Data Minimum Setup Time, Data to Clock Parameter TIMING REQUIREMENTS (VCC = 5.0 V 10%, CL = 50 pF, Input tr = tf = 6.0 ns) Power Dissipation Capacitance (Per Enabled Output)* 3 Fig. 1 2 1 2 3 3 Min 15 15 15 6 3 - 55 to 25_C Max 500 Typical @ 25C, VCC = 5.0 V Guaranteed Limit Min 19 19 19 8 3 v 85_C v 85_C 130 10 19 30 30 24 Max 500 Min 22 22 22 v 125_C 9 3 v 125_C MC74HCT74A 10 22 36 36 20 Max 500 MOTOROLA MHz Unit Units pF pF ns ns ns ns ns ns ns ns ns MC74HCT74A SWITCHING WAVEFORMS tw tr CLOCK 2.7 V 1.3 V 0.3 V tw 1/fmax tPLH Q OR Q 90% 1.3 V 10% CLOCK tTLH tTHL tPHL Q OR Q tf 3V GND Q OR Q 3V SET OR RESET 1.3 V GND tPHL 1.3 V tPLH 1.3 V trec 3V 1.3 V GND Figure 1. Figure 2. VALID 3V DATA 1.3 V GND tsu th 3V 1.3 V CLOCK * Includes all probe and jig capacitance GND DEVICE UNDER TEST TEST POINT OUTPUT CL* Figure 3. Figure 4. EXPANDED LOGIC DIAGRAM SET 4, 10 2, 12 DATA 5, 9 Q 3, 11 CLOCK 6, 8 Q 1, 13 RESET MOTOROLA 4 High-Speed CMOS Logic Data DL129 -- Rev 6 MC74HCT74A OUTLINE DIMENSIONS N SUFFIX PLASTIC DIP PACKAGE CASE 646-06 ISSUE L 14 8 B 1 7 NOTES: 1. LEADS WITHIN 0.13 (0.005) RADIUS OF TRUE POSITION AT SEATING PLANE AT MAXIMUM MATERIAL CONDITION. 2. DIMENSION L TO CENTER OF LEADS WHEN FORMED PARALLEL. 3. DIMENSION B DOES NOT INCLUDE MOLD FLASH. 4. ROUNDED CORNERS OPTIONAL. DIM A B C D F G H J K L M N INCHES MIN MAX 0.715 0.770 0.240 0.260 0.145 0.185 0.015 0.021 0.040 0.070 0.100 BSC 0.052 0.095 0.008 0.015 0.115 0.135 0.300 BSC 0_ 10_ 0.015 0.039 MILLIMETERS MIN MAX 18.16 19.56 6.10 6.60 3.69 4.69 0.38 0.53 1.02 1.78 2.54 BSC 1.32 2.41 0.20 0.38 2.92 3.43 7.62 BSC 0_ 10_ 0.39 1.01 A F C N H G D SEATING PLANE L J K M -A- 14 8 D SUFFIX PLASTIC SOIC PACKAGE CASE 751A-03 ISSUE F -B- 1 7 P 7 PL 0.25 (0.010) M B M NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETER. 3. DIMENSIONS A AND B DO NOT INCLUDE MOLD PROTRUSION. 4. MAXIMUM MOLD PROTRUSION 0.15 (0.006) PER SIDE. 5. DIMENSION D DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL BE 0.127 (0.005) TOTAL IN EXCESS OF THE D DIMENSION AT MAXIMUM MATERIAL CONDITION. G C R X 45 F SEATING PLANE D 14 PL K M M B S J 0.25 (0.010) T A S DIM A B C D F G J K M P R MILLIMETERS MIN MAX 8.75 8.55 4.00 3.80 1.75 1.35 0.49 0.35 1.25 0.40 1.27 BSC 0.25 0.19 0.25 0.10 7 0 5.80 6.20 0.25 0.50 INCHES MIN MAX 0.337 0.344 0.150 0.157 0.054 0.068 0.014 0.019 0.016 0.049 0.050 BSC 0.008 0.009 0.004 0.009 0 7 0.228 0.244 0.010 0.019 Motorola reserves the right to make changes without further notice to any products herein. Motorola makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does Motorola assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation consequential or incidental damages. "Typical" parameters can and do vary in different applications. All operating parameters, including "Typicals" must be validated for each customer application by customer's technical experts. Motorola does not convey any license under its patent rights nor the rights of others. Motorola products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the Motorola product could create a situation where personal injury or death may occur. Should Buyer purchase or use Motorola products for any such unintended or unauthorized application, Buyer shall indemnify and hold Motorola and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that Motorola was negligent regarding the design or manufacture of the part. Motorola and are registered trademarks of Motorola, Inc. Motorola, Inc. is an Equal Opportunity/Affirmative Action Employer. How to reach us: USA/EUROPE: Motorola Literature Distribution; P.O. Box 20912; Phoenix, Arizona 85036. 1-800-441-2447 MFAX: RMFAX0@email.sps.mot.com -TOUCHTONE (602) 244-6609 INTERNET: http://Design-NET.com JAPAN: Nippon Motorola Ltd.; Tatsumi-SPD-JLDC, Toshikatsu Otsuki, 6F Seibu-Butsuryu-Center, 3-14-2 Tatsumi Koto-Ku, Tokyo 135, Japan. 03-3521-8315 HONG KONG: Motorola Semiconductors H.K. Ltd.; 8B Tai Ping Industrial Park, 51 Ting Kok Road, Tai Po, N.T., Hong Kong. 852-26629298 High-Speed CMOS Logic Data DL129 -- Rev 6 CODELINE 5 *MC74HCT74A/D* MC74HCT74A/D MOTOROLA |
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