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FS16...H STANDARD SCR TO220-AB On-State Current 16 Amp Gate Trigger Current > 2 mA to < 40 mA Off-State Voltage 200 V / 600 V These series of Silicon Controlled R ectifier use a high performance PNPN technology. K A G These parts are intended for general purpose high current applications where moderate gate insensitivity is required. Absolute Maximum Ratings, according to IEC publication No. 134 SYMBOL PARAMETER On-state Current Average On-state Current Non-repetitive On-State Current Non-repetitive On-State Current Fusing Current Peak Reverse Gate Voltage Peak Gate Current Peak Gate Dissipation Gate Dissipation Operating Temperature Storage Temperature Soldering Temperature CONDITIONS 180 Conduction Angle, Tc = 110 C Half Cycle, = 180 , TC = 110 C Half Cycle, 60 Hz Half Cycle, 50 Hz tp = 10ms, Half Cycle IGR = 10 A 20 s max. 20 s max. 20ms max. -40 -40 10s max. Min. Max. 16 10 200 190 180 5 4 10 1 +125 +150 260 Unit A A A A A 2s V A W W C C C IT(RMS) IT(AV) ITSM ITSM I2t VGRM IGM PGM PG(AV) Tj Tstg Tsld SYMBOL PARAMETER Repetitive Peak Off State Voltage CONDITIONS RGK = 1 K B 200 VOLTAGE D 400 M 600 Unit V VDRM VRRM Dec - 02 FS16...H STANDARD SCR Electrical Characteristics SYMBOL PARAMETER Gate Trigger Current Off-State Leakage Current On-state Voltage Gate Trigger Voltage Gate Non Trigger Voltage Holding Current Latching Current Critical Rate of Voltage Rise CONDITIONS MIN MAX MAX MAX MAX MAX MIN SENSITIVITY 10 2 25 2 5 1.6 1.3 0.2 40 60 500 50 1.1 60 0.77 23 50 90 1000 14 4 40 Unit mA mA A V V V mA mA V/s A/s C/W C/W V m IGT IDRM / IRRM VTM VGT VGD IH IL dv / dt di / dt Rth(j-c) Rth(j-a) VD = 12 VDC , RL = 33. Tj = 25 C VD = VDRM , RGK = 220 Tj = 125 C VR = VRRM , Tj = 25 C at IT = 32 Amp, tp = 380 s, Tj = 25 C VD = 12 VDC , RL = 33, Tj = 25 C VD = VDRM , RL = 3.3K Tj = 125 C MAX IT = 500 mA , Gate open, Tj = 25 C IG = 1.2 IGT MAX VD = 0.67 x VDRM , Gate open Tj = 125 C MIN Tr 100 ns, F = 60 Hz, Tj = 125 C MIN Critical Rate of Current Rise IG = 2 x IGT Thermal Resistance Junction-Case for DC Thermal Resistance Junction-Amb Threshold Voltage Dynamic resistance Tj = 125 C Tj = 125 C Vt0 Rd MAX MAX PART NUMBER INFORMATION F FAGOR SCR CURRENT S 16 10 B H 00 TU PACKAGING FORMING CASE VOLTAGE SENSITIVITY Dec - 02 FS16...H STANDARD SCR Fig. 1: Maximum average power dissipation versus average on-state current. P (W) 16 18 14 12 10 8 6 4 2 0 IT(av)(A) 0 1 2 3 4 5 6 7 8 9 10 16 14 12 10 8 6 4 2 0 0 Tc (C) 25 50 75 100 125 Fig. 2: Average and D.C. on-state current versus case temperature. IT(av)(A) Fig. 3: Relative variation of thermal impedance junction to case versus pulse duration. K = [Zth(j-c) / Rth (j-c)] 1.0 Fig. 4: Relative variation of gate trigger current , holding current and latching current versus junction temperature. IGT, IH, IL (Tj) / IGR, IH, IL (Tj = 25 C) 2.5 2.0 0.5 1.5 IGT IH & IL 1.0 0.2 0.5 tp (s) 1E-2 1E-1 1E+0 Tj (C) -40 -20 0 20 40 60 80 100 120 140 0.1 1E-3 0.0 Fig. 5: Surge peak on-state current versus number of cycles. I TSM (A) 200 Fig. 7: Non repetitive surge peak on-state current for a sinusoidal pulse with width: tp < 10 ms, and corresponding value of I2t. ITSM(A). I2t (A2s) Tj initial = 25 C 150 1000 100 100 50 I2 t ITSM 0 1 10 100 1000 Number of cycles 10 1 10 tp(ms) Dec - 02 FS16...H STANDARD SCR Fig. 8: On-state characteristics (maximum values). ITM(A) 1000 100 Tj = Tj max. Tj max Vto = 0.77 V Rt = 23 m 10 Tj = 25 C 1 0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 VTM(V) PACKAGE MECHANICAL DATA TO-220AB DIMENSIONS Milimeters Nominal 3.75 13.00 10.00 0.61 1.23 4.40 0.49 2.40 2.40 6.20 3.75 15.80 2.65 1.14 1.14 14.00 10.40 0.88 1.32 4.60 0.70 2.72 2.70 6.60 3.85 16.80 2.95 1.70 1.70 B c b2 REF. A a1 a2 B b1 b2 C c1 c2 e F I I4 L I2 I3 M Min. 15.20 Max. 15.90 L F oI A 14 a1 13 c2 12 a2 16.40 b1 e M c1 2.60 Dec - 02 |
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