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UTRON Rev. 1.4 UT6264C 8K X 8 BIT LOW POWER CMOS SRAM REVISION HISTORY REVISION Preliminary Rev. 0.1 Rev. 1.0 Rev. 1.1 DESCRIPTION Original. Revised - The timeing waveforms add CE2 control pin Revised - Package outline dimension - Waveform. Revised - Improve IDR from 20A to 10A (LL-version , max.) - 28-pin PDIP package outline dimension 1. Add Extended temperature : -20J ~85J 2. Revised Operating : 45/30 mA (typ.) 40/30 mA (typ.) 3. Revised CMOS Standby : 2 0.3mA (typ.) normal 4. Revised DC characteristics : a. Icc(-35) : 45 40mA (typ.), 60 50 mA (max) b. Icc(-70) : 45 40mA (max.) c. Icc1(Tcycle=1us)= 10mA(max.) d. Icc2(Tcycle=500ns)=20mA(max.) 5. Revised "Order information" : add Extended parts Add order information for lead free product Date May 3 ,2001 Jun.4,2001 Jan 15,2002 Rev. 1.2 May 14,2002 Rev. 1.3 Jul 30,2002 Rev. 1.4 May 15,2003 UTRON TECHNOLOGY INC. 1F, No. 11, R&D Rd. II, Science-Based Industrial Park, Hsinchu, Taiwan, R. O. C. TEL: 886-3-5777882 FAX: 886-3-5777919 P80028 1 UTRON Rev. 1.4 UT6264C 8K X 8 BIT LOW POWER CMOS SRAM GENERAL DESCRIPTION The UT6264C is a 65,536-bit low power CMOS static random access memory organized as 8,192 words by 8 bits. It is fabricated using high performance, high reliability CMOS technology. Easy memory expansion is provided by using two chip enable input.( CE ,CE2) ,and supports low data retention voltage for battery back-up operation with low data retention current. The UT6264C operates from a single 4.5V~5.5V power supply and all inputs and outputs are fully TTL compatible. FEATURES Access time : 35/70ns (max.) Low power consumption : Operating : 40/30 mA (typ.) CMOS Standby : 0.3mA (typ.) normal 2 A (typ.) L-version 1 A (typ.) LL-version Single 4.5V~5.5V power supply Operating temperature : Commercial : 0J ~70J Extended : -20J ~85J All inputs and outputs TTL compatible Fully static operation Three state outputs Data retention voltage : 2V (min.) Package : 28-pin 600 mil PDIP 28-pin 330 mil SOP PIN CONFIGURATION NC A12 A7 1 2 3 4 28 27 26 25 Vcc WE FUNCTIONAL BLOCK DIAGRAM A0-A12 DECODER 8K X 8 MEMORY ARRAY CE2 A8 A9 A11 OE A6 A5 A4 A3 A2 A1 A0 UT6264C 5 6 7 8 9 10 11 12 13 14 24 23 22 21 20 19 18 17 16 15 Vcc Vss A10 CE I/O8 I/O7 I/O6 I/O5 I/O4 I/O1-I/O8 I/O DATA CIRCUIT COLUMN I/O I/O1 I/O2 I/O3 Vss PDIP/SOP CE CE2 OE PIN DESCRIPTION CONTROL CIRCUIT WE SYMBOL A0 - A12 I/O1 - I/O8 CE ,CE2 WE OE VCC VSS NC DESCRIPTION Address Inputs Data Inputs/Outputs Chip Enable Inputs Write Enable Input Output Enable Input Power Supply Ground No connection UTRON TECHNOLOGY INC. 1F, No. 11, R&D Rd. II, Science-Based Industrial Park, Hsinchu, Taiwan, R. O. C. TEL: 886-3-5777882 FAX: 886-3-5777919 P80028 2 UTRON Rev. 1.4 UT6264C 8K X 8 BIT LOW POWER CMOS SRAM SYMBOL VTERM TA TA TSTG PD IOUT Tsolder RATING -0.5 to 7.0 0 to 70 -20 to 85 -65 to 150 1 50 260 UNIT V J J J W mA J ABSOLUTE MAXIMUM RATINGS* PARAMETER Terminal Voltage with Respect to VSS Operating Temperature Commercial Extended Storage Temperature Power Dissipation DC Output Current Soldering Temperature (under 10 sec) *Stresses greater than those listed under "Absolute Maximum Ratings" may cause permanent damage to the device. This is a stress rating only and functional operation of the device or any other conditions above those indicated in the operational sections of this specification is not implied. Exposure to the absolute maximum rating conditions for extended period may affect device reliability. TRUTH TABLE MODE Standby Standby Output Disable Read Write CE H X L L L CE2 X L H H H OE X X H L X WE X X H H L I/O OPERATION High - Z High - Z High - Z DOUT DIN SUPPLY CURRENT ISB, ISB1 ISB, ISB1 Icc,Icc1,Icc2 Icc,Icc1,Icc2 Icc,Icc1,Icc2 note: H = VIH, L=VIL, X = Don't care. DC ELECTRICAL CHARACTERISTICS (VCC = 4.5V~5.5V, TA = 0J to 70J/ -20J to 85J (E)) SYMBOL TEST CONDITION MIN. TYP. MAX. 1 VIH 2.2 VCC+0.5 2 VIL - 0.5 0.8 O VIN O VCC -1 1 ILI VSS VSS O VI/OO VCC; CE =VIH;or CE2=VIL; Output Leakage Current ILO -1 1 or OE = VIH ;or WE = VIL Output High Voltage VOH IOH = -1mA 2.4 Output Low Voltage VOL IOL = 4mA 0.4 - 35 40 50 CE = VIL , ICC - 70 30 40 II/O = 0mA ,Cycle=Min. Operating Power Tcycle 10 CE = 0.2V; II/O = 0mA; Icc1 Supply Current =1s CE2=Vcc-0.2V; 20 other pins at 0.2V or VCC-0.2V Tcycle Icc2 =500ns normal ISB 1 10 CE =VIH or CE2= VIL 0.3 5 ISB1 CE U VCC-0.2V or CE2O 0.2V Standby Power ISB -L/-LL 3 CE =VIH or CE2= VIL Supply Current ISB1 -L 2 100 CE U VCC-0.2V or CE2O 0.2V -LL 1 50 Notes: 1. Overshoot : Vcc+2.0v for pulse width less than 10ns. 2. Undershoot : Vss-2.0v for pulse width less than 10ns. 3. Overshoot and Undershoot are sampled, not 100% tested. UTRON TECHNOLOGY INC. 1F, No. 11, R&D Rd. II, Science-Based Industrial Park, Hsinchu, Taiwan, R. O. C. TEL: 886-3-5777882 FAX: 886-3-5777919 PARAMETER Input High Voltage Input Low Voltage Input Leakage Current UNIT V V A A V V mA mA mA mA mA mA mA A A P80028 3 UTRON Rev. 1.4 UT6264C 8K X 8 BIT LOW POWER CMOS SRAM CAPACITANCE (TA=25J , f=1.0MHz) PARAMETER Input Capacitance Input/Output Capacitance SYMBOL CIN CI/O MIN. - MAX 8 10 UNIT pF pF Note : These parameters are guaranteed by device characterization, but not production tested. AC TEST CONDITIONS Input Pulse Levels Input Rise and Fall Times Input and Output Timing Reference Levels Output Load 0V to 3.0V 5ns 1.5V CL = 100pF, IOH/IOL = -1mA/4mA AC ELECTRICAL CHARACTERISTICS (VCC = 4.5V~5.5V, TA = 0J to 70J/ -20J to 85J (E)) (1) READ CYCLE PARAMETER Read Cycle Time Address Access Time Chip Enable Access Time Output Enable Access Time Chip Enable to Output in Low-Z Output Enable to Output in Low-Z Chip Disable to Output in High-Z Output Disable to Output in High-Z Output Hold from Address Change (2) WRITE CYCLE PARAMETER Write Cycle Time Address Valid to End of Write Chip Enable to End of Write Address Set-up Time Write Pulse Width Write Recovery Time Data to Write Time Overlap Data Hold from End of Write-Time Output Active from End of Write Write to Output in High-Z SYMBOL UT6264C-35 MIN. MAX. SYMBOL UT6264C-35 MIN. MAX. UT6264C-70 MIN. MAX. UNIT tRC tAA tACE tOE tCLZ* tOLZ* tCHZ* tOHZ* tOH 35 10 5 5 35 35 25 25 25 - 70 10 5 5 70 70 35 35 35 - ns ns ns ns ns ns ns ns ns UT6264C-70 MIN. MAX. UNIT tWC tAW tCW tAS tWP tWR tDW tDH tOW* tWHZ* 35 30 30 0 25 0 20 0 5 - 15 70 60 60 0 50 0 30 0 5 - 25 ns ns ns ns ns ns ns ns ns ns *These parameters are guaranteed by device characterization, but not production tested. UTRON TECHNOLOGY INC. 1F, No. 11, R&D Rd. II, Science-Based Industrial Park, Hsinchu, Taiwan, R. O. C. TEL: 886-3-5777882 FAX: 886-3-5777919 P80028 4 UTRON Rev. 1.4 UT6264C 8K X 8 BIT LOW POWER CMOS SRAM TIMING WAVEFORMS READ CYCLE 1 (Address Controlled) (1,2) tRC Address tAA tOH Dout Previous data valid Data Valid tOH READ CYCLE 2 ( CE and CE2 and OE Controlled) (1,3,4,5) tRC Address tAA CE tACE CE2 OE tOE tCLZ tOLZ Dout High-Z Data Valid tCHZ tOHZ tOH High-Z Notes : 1. WE is high for read cycle. 2.Device is continuously selected OE =low, CE =low, CE2=high. 3.Address must be valid prior to or coincident with CE =low, CE2=high; otherwise tAA is the limiting parameter. 4.tCLZ, tOLZ, tCHZ and tOHZ are specified with CL=5pF. Transition is measuredO 500mV from steady state. 5.At any given temperature and voltage condition, tCHZ is less than tCLZ , tOHZ is less than tOLZ. UTRON TECHNOLOGY INC. 1F, No. 11, R&D Rd. II, Science-Based Industrial Park, Hsinchu, Taiwan, R. O. C. TEL: 886-3-5777882 FAX: 886-3-5777919 P80028 5 UTRON Rev. 1.4 WRITE CYCLE 1 ( WE Controlled) (1,2,3,5,6) tW C A ddress UT6264C 8K X 8 BIT LOW POWER CMOS SRAM tAW CE tCW CE2 tAS WE tW P tW R tW H Z D out (4) H igh-Z tOW (4) tDW D in tDH D ata V alid WRITE CYCLE 2 ( CE and CE2 Controlled) (1,2,5,6) tW C A d d re s s tAW CE tAS tCW tW R CE2 tW P WE tW H Z Dout D in (4 ) H ig h -Z tDW D a ta V a lid tDH UTRON TECHNOLOGY INC. 1F, No. 11, R&D Rd. II, Science-Based Industrial Park, Hsinchu, Taiwan, R. O. C. TEL: 886-3-5777882 FAX: 886-3-5777919 P80028 6 UTRON Rev. 1.4 Notes : 1. WE , CE must be high or CE2 must be low during all address transitions. 2.A write occurs during the overlap of a low CE , high CE2, low WE . UT6264C 8K X 8 BIT LOW POWER CMOS SRAM 3. During a WE controlled write cycle with OE low, tWP must be greater than tWHZ+tDW to allow the drivers to turn off and data to be placed on the bus. 4.During this period, I/O pins are in the output state, and input signals must not be applied. 5. If the CE low transition and CE2 high transition occurs simultaneously with or after WE low transition, the outputs remain in a high impedance state. 6.tOW and tWHZ are specified with CL = 5pF. Transition is measured O 500mV from steady state. DATA RETENTION CHARACTERISTICS (TA = 0J to 70J/ -20J to 85J (E)) PARAMETER Vcc for Data Retention Data Retention Current Chip Disable to Data Retention Time Recovery Time tRC* = Read Cycle Time SYMBOL TEST CONDITION VDR CE U VCC-0.2V or CE2 0.2V Vcc=2V IDR CE U VCC-0.2V or CE2 0.2V tCDR tR See Data RetentionWaveforms (below) -L -LL MIN. 2.0 0 tRC* TYP. 1 0.5 - MAX. 5.5 50 10 - UNIT V A A ns ns DATA RETENTION WAVEFORM Low Vcc Data Retention Waveform (1) ( CE controlled) VDR U VCC Vcc(min.) 2V Vcc(min.) tCDR CE U VCC-0.2V tR CE VIH VIH Low Vcc Data Retention Waveform (2) (CE2 controlled) VDR U VCC VCC(min.) 2V VCC(min.) tCDR CE2 VIL CE2 O 0.2V tR VIL UTRON TECHNOLOGY INC. 1F, No. 11, R&D Rd. II, Science-Based Industrial Park, Hsinchu, Taiwan, R. O. C. TEL: 886-3-5777882 FAX: 886-3-5777919 P80028 7 UTRON Rev. 1.4 UT6264C 8K X 8 BIT LOW POWER CMOS SRAM PACKAGE OUTLINE DIMENSION 28 pin ( 600mil ) PDIP Package Outline Dimension UNIT SYMBOL A1 A2 B c D E e eB L K INCH(BASE) 0.010 (MIN) 0.150 O 0.01 0.018 O 0.005 0.010 O 0.004 1.460 O 0.005 0.600 O 0.010 0.100 (TYP) 0.640O 0.03 0.130 O 0.010 o o 0 a 15 MM(REF) 0.254 (MIN) 3.810 O 0.254 0.457 O 0.127 0.254 O 0.102 37.084 O 0.127 15.240 O 0.254 2.540 (TYP) 16.256 O 0.762 3.302 O 0.254 o o 0 a 15 UTRON TECHNOLOGY INC. 1F, No. 11, R&D Rd. II, Science-Based Industrial Park, Hsinchu, Taiwan, R. O. C. TEL: 886-3-5777882 FAX: 886-3-5777919 P80028 8 UTRON Rev. 1.4 28 pin 330 mil SOP Package Outline Dimension UT6264C 8K X 8 BIT LOW POWER CMOS SRAM SYMBOL UNIT INCH(BASE) 0.112(max) 0.004(MIN) 0.0980.005 0.016(TYP) 0.010(TYP) 0.7130.005 0.3310.005 0.4650.012 0.050(TYP) 0.04040.008 0.0670.008 0.047(MAX) 0.003(MAX) 0~10 MM(REF) 2.845(max) 0.102(MIN) 2.4890.127 0.406(TYP) 0.254(TYP) 18.1100.127 8.4070.127 11.8110.305 1.270(TYP) 1.02550.203 1.7020.203 1.194(MAX) 0.076(MAX) 0~10 A A1 A2 b c D E E1 e L L1 S y UTRON TECHNOLOGY INC. 1F, No. 11, R&D Rd. II, Science-Based Industrial Park, Hsinchu, Taiwan, R. O. C. TEL: 886-3-5777882 FAX: 886-3-5777919 P80028 9 UTRON Rev. 1.4 UT6264C 8K X 8 BIT LOW POWER CMOS SRAM ORDERING INFORMATION Commerical temperature PART NO. UT6264CPC-35 UT6264CPC-35L UT6264CPC-35LL UT6264CPC-70 UT6264CPC-70L UT6264CPC-70LL UT6264CSC-35 UT6264CSC-35L UT6264CSC-35LL UT6264CSC-70 UT6264CSC-70L UT6264CSC-70LL ACCESS TIME (ns) 35 35 35 70 70 70 35 35 35 70 70 70 STANDBY CURRENT (A) (TYP.) 0.3mA 2 A 1 A 0.3mA 2 A 1 A 0.3mA 2 A 1 A 0.3mA 2 A 1 A PACKAGE 28 PIN PDIP 28 PIN PDIP 28 PIN PDIP 28 PIN PDIP 28 PIN PDIP 28 PIN PDIP 28 PIN SOP 28 PIN SOP 28 PIN SOP 28 PIN SOP 28 PIN SOP 28 PIN SOP Extended temperature PART NO. UT6264CPC-35E UT6264CPC-35LE UT6264CPC-35LLE UT6264CPC-70E UT6264CPC-70LE UT6264CPC-70LLE UT6264CSC-35E UT6264CSC-35LE UT6264CSC-35LLE UT6264CSC-70E UT6264CSC-70LE UT6264CSC-70LLE ACCESS TIME (ns) 35 35 35 70 70 70 35 35 35 70 70 70 STANDBY CURRENT (A) (TYP.) 0.3mA 2 A 1 A 0.3mA 2 A 1 A 0.3mA 2 A 1 A 0.3mA 2 A 1 A PACKAGE 28 PIN PDIP 28 PIN PDIP 28 PIN PDIP 28 PIN PDIP 28 PIN PDIP 28 PIN PDIP 28 PIN SOP 28 PIN SOP 28 PIN SOP 28 PIN SOP 28 PIN SOP 28 PIN SOP UTRON TECHNOLOGY INC. 1F, No. 11, R&D Rd. II, Science-Based Industrial Park, Hsinchu, Taiwan, R. O. C. TEL: 886-3-5777882 FAX: 886-3-5777919 P80028 10 UTRON Rev. 1.4 UT6264C 8K X 8 BIT LOW POWER CMOS SRAM ORDERING INFORMATION (for lead free product) Commerical temperature PART NO. UT6264CPCL-35 UT6264CPCL-35L UT6264CPCL-35LL UT6264CPCL-70 UT6264CPCL-70L UT6264CPCL-70LL UT6264CSCL-35 UT6264CSCL-35L UT6264CSCL-35LL UT6264CSCL-70 UT6264CSCL-70L UT6264CSCL-70LL ACCESS TIME (ns) 35 35 35 70 70 70 35 35 35 70 70 70 STANDBY CURRENT (A) (TYP.) 0.3mA 2 A 1 A 0.3mA 2 A 1 A 0.3mA 2 A 1 A 0.3mA 2 A 1 A PACKAGE 28 PIN PDIP 28 PIN PDIP 28 PIN PDIP 28 PIN PDIP 28 PIN PDIP 28 PIN PDIP 28 PIN SOP 28 PIN SOP 28 PIN SOP 28 PIN SOP 28 PIN SOP 28 PIN SOP Extended temperature PART NO. UT6264CPCL-35E UT6264CPCL-35LE UT6264CPCL-35LLE UT6264CPCL-70E UT6264CPCL-70LE UT6264CPCL-70LLE UT6264CSCL-35E UT6264CSCL-35LE UT6264CSCL-35LLE UT6264CSCL-70E UT6264CSCL-70LE UT6264CSCL-70LLE ACCESS TIME (ns) 35 35 35 70 70 70 35 35 35 70 70 70 STANDBY CURRENT (A) (TYP.) 0.3mA 2 A 1 A 0.3mA 2A 1 A 0.3mA 2A 1 A 0.3mA 2A 1 A PACKAGE 28 PIN PDIP 28 PIN PDIP 28 PIN PDIP 28 PIN PDIP 28 PIN PDIP 28 PIN PDIP 28 PIN SOP 28 PIN SOP 28 PIN SOP 28 PIN SOP 28 PIN SOP 28 PIN SOP UTRON TECHNOLOGY INC. 1F, No. 11, R&D Rd. II, Science-Based Industrial Park, Hsinchu, Taiwan, R. O. C. TEL: 886-3-5777882 FAX: 886-3-5777919 P80028 11 UTRON Rev. 1.4 UT6264C 8K X 8 BIT LOW POWER CMOS SRAM THIS PAGE IS LEFT BLANK INTENTIONALLY. UTRON TECHNOLOGY INC. 1F, No. 11, R&D Rd. II, Science-Based Industrial Park, Hsinchu, Taiwan, R. O. C. TEL: 886-3-5777882 FAX: 886-3-5777919 P80028 12 |
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