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| TDA7499SA 6W+6W STEREO AMPLIFIER WITH MUTE & ST-BY PRODUCT PREVIEW s s s s s s s s WIDE SUPPLY VOLTAGE RANGE UP TO +18V 6+6W @THD = 10%, R L= 8, VS = 10V NO POP AT TURN-ON/OFF MUTE (POP FREE) STANDARD BY FEATURE (LOW Iq) SHORT CIRCUIT PROTECTION TO GND THERMAL OVERLOAD PROTECTION CLIPWATT 11 PACKAGE Clipwatt11 ORDERING NUMBER: TDA7499SA DESCRIPTION The TDA7499SA is class AB power amplifier assembled in the @ Clipwatt 11 package, specially designed for high quality sound application as Hi-Fi BLOCK DIAGRAM music centers and stereo TV sets. The TDA7499SA is pin to pin compatible with TDA7269, TDA7269A, TDA7269SA, TDA7269ASA, TDA7265, TDA7499. +VS 1000F MUTE/ ST-BY IN (L) 1F 3 15K 1F 5 7 + - 4 OUT (L) 18K 4.7 100nF 560 8 15K +5V P 18K GND 9 10 IN- (L) RL (L) IN- (R) 560 18K 1F IN (R) 11 + 1 6 -VS 1000F 2 OUT (R) 4.7 100nF RL (R) D94AU085 June 2003 This is preliminary information on a new product now in development. Details are subject to change without notice. 1/10 TDA7499SA ABSOLUTE MAXIMUM RATINGS Symbol VS IO Ptot Tamb Tstg, Tj DC Supply Voltage Output Power Current (internally limited) Total Power Dissipation (Tamb = 70C) Ambient Operating Temperature (1) Storage and Junction Temperature Parameter Value 20 2.5 20 0 to 70 -40 to 150 Unit V A W C C PIN CONNECTION (Top view) 11 10 9 8 7 6 5 4 3 2 1 IN+(1) IN-(1) GND IN-(2) IN+(2) -VS MUTE OUTPUT(2) +VS OUTPUT(1) -VS D03AU1506 THERMAL DATA Symbol Rth j-case Rth j-amb Parameter Thermal Resistance Junction-case Thermal Resistance Junction-ambient Value max = 3.9 max = 48 Unit C/W C/W Figure 1. Single Supply Application D1 5.1V R1 10K PLAY 5V 0 MUTE C1 1F R3 15K MUTE Q1 BSX33 R2 15K C2 100F C3 1F IN (L) 5 7 + 8 9 C4 1F IN (R) 11 IN- (L) 3 4 OUT (L) R4 30K R5 1K + 2 IN- (R) R6 30K R7 1K C9 470F +VS C5 1000F C6 0.1F R8 4.7 C7 0.1F C10 470F OUT (L) 10 1 6 GND OUT (R) R9 4.7 C8 0.1F OUT (R) D96AU444A 2/10 TDA7499SA ELECTRICAL CHARACTERISTCS (Refer to the test circuit VS = 10V; Rs = 50; GV = 30dB, f = 1KHz; Tamb = 25C, unless otherwise specified) Symbol VS Parameter Supply Voltage Range RL = 8 RL = 4; Iq VOS Ib PO Total Quiescent Current Input Offset Voltage Output Bias Current Output Power THD = 10%; RL = 8; VS = 8.5V; RL = 4; THD = 1%; RL = 8; VS = 8.5V; RL = 4; THD Total Harmonic Distortion RL = 8; PO = 1W; f = 1KHz; RL = 8; VS = 10V; PO = 0.1 to 5W; f = 100Hz to 15KHz; RL = 4; PO = 1W; f = 1KHz; RL = 4; VS = 10V; PO = 0.1 to 2W; f = 100Hz to 15KHz; CT SR GOL eN Ri SVR Tj Cross Talk Slew Rate Open Loop Voltage Gain Total Output Noise Input Resistance Supply Voltage Rejection (each channel) Thermal Shut-down Junction Temperature f = 100Hz; VR = 0.5V A Curve f = 20Hz to 22KHz 15 f = 1KHz; f = 10KHz; 50 6.5 -25 500 6 6 5 5 0.03 0.2 0.5 Test Condition Min. 5 5 50 Typ. Max. 18 12 90 25 Unit V V mA mV nA W W W W % % 0.02 0.2 1 % % 70 60 10 80 3 4 20 60 145 8 dB dB V/s dB V V K dB C MUTE & INPUT SELECTION FUNCTIONS VMUTE AMUTE Mute /Play threshold Mute Attenuation -7 60 -6 70 -5 V dB STAND-BY FUNCTIONS [ref: +VS] (only for Split Supply) VST-BY AST-BY IqST-BY Stand-by Mute threshold Stand-by Attenuation Quiescent Current @ Stand-by -3.5 -2.5 110 3 6 -0.5 V dB mA 3/10 TDA7499SA MUTE STAND-BY FUNCTION The pin 5 (MUTE/STAND-BY) controls the amplifier status by two different thresholds, referred to +VS. - When Vpin5 higher than = +VS -2.5V the amplifier is in Stand-by mode and the final stage generators are off. - When Vpin5 between = +VS -2.5V and VS -6V the final stage generators are switched on and the amplifier is in mute mode. - When Vpin5 lower than = +VS -6V the amplifier is play mode. Figure 2. +VS (V) 20 t -VS -20 VIN (mV) Vpin5 (V) VS VS-2.5 VS-6 VS-10 Iq (mA) 0 VOUT (V) OFF STDBY MUTE PLAY STDBY PLAY OFF STDBY D94AU086 MUTE MUTE MUTE 4/10 TDA7499SA Figure 3. Test and Application Circuit (Stereo Configuration) +VS C4 C5 R2 C3 MUTE/ ST-BY IN (L) C1 +VS 5 7 + 8 3 R1 SW1 ST-BY DZ Q1 4 OUT (L) R5 IN- (L) R6 R7 C8 RL (L) R4 SW2 MUTE R3 GND 9 10 IN- (R) R8 R9 C2 IN (R) 11 + 1 6 -VS C7 2 OUT (R) R10 C9 RL (R) C6 D94AU087B APPLICATION SUGGESTIONS (Demo Board Schematic) The recommended values of the external components are those shown the demoboard schematic different values can be used, the following table can help the designer. COMPONENT R1 R2 R3 R4 R5, R8 R6, R9 R7, R10 C1, C2 C3 C4, C6 C5, C7 C8, C9 Dz SUGGESTION VALUE 10K 15K 18K 15K 18K 560K 4.7K 1F 1F 1000F 0.1F 0.1F 5.1V Frequency Stability Input DC Decoupling St-By/Mute Time Constant Supply Voltage Bypass Supply Voltage Bypass Frequency Stability Mute Circuit Larger On/Off Time PURPOSE Mute Circuit Mute Circuit Mute Circuit Mute Circuit Closed Loop Gain Setting (*) LARGER THAN RECOMMENDED VALUE Increase of Dz Biasing Current Vpin #5 Shifted Downward Vpin #5 Shifted Upward Vpin #5 Shifted Upward Increase of Gain Decrease of Gain Danger of Oscillations Danger of Oscillations Higher low frequency cutoff Smaller On/Off Time Danger of Oscillations Danger of Oscillations Vpin #5 Shifted Upward Vpin #5 Shifted Downward Vpin #5 Shifted Downward SMALLER THAN RECOMMENDED VALUE (*) Closed loop gain has to be 25dB 5/10 TDA7499SA PC Board Figure 4. Evaluation Board Top Layer Layout Figure 5. Evaluation Board Bottom Layer Layout Figure 6. Component Layout 6/10 TDA7499SA HEAT SINK DIMENSIONING: In order to avoid the thermal protection intervention, that is placed approximatively at Tj = 150C, it is important the dimensioning of the Heat Sinker RTh (C/W). The parameters that influence the dimensioning are: - Maximum dissipated power for the device (Pdmax) - Max thermal resistance Junction to case (RTh j-c) - Max. ambient temperature Tamb max - Quiescent current Iq (mA) Example: VCC = 10V, Rload = 8ohm, RTh j-c = 3.9 C/W , Tamb max = 50C 2 Vcc Pdmax = (N channels) * -------------------------- + I q V cc 2 R lo ad Pdmax = 2 * ( 2.5 ) + 0.8 = 6W 150 - T am b max 150 - 50 (Heat Sinker) R Th c-a = ---------------------------------------- - R T h j-c = --------------------- - 3.9 = 12.7C/W 6 P d max In figure 7 is shown the Power derating curve for the device. Figure 7. Power derating curve 25 2 20 (a) Pd (W) 15 a) b) Infinite Heatsink 10 C/ W 15 C/ W 10 (b) 5 (c) 0 0 40 80 Tamb (C) 120 160 c) 7/10 TDA7499SA Clipwatt Assembling Suggestions The suggested mounting method of Clipwatt on external heat sink, requires the use of a clip placed as much as possible in the plastic body center, as indicated in the example of figure 8. A thermal grease can be used in order to reduce the additional thermal resistance of the contact between package and heatsink. A pressing force of 7 - 10 Kg gives a good contact and the clip must be designed in order to avoid a maximum contact pressure of 15 Kg/mm2 between it and the plastic body case. As example , if a 15Kg force is applied by the clip on the package , the clip must have a contact area of 1mm2 at least. Figure 8. Example of right placement of the clip 8/10 TDA7499SA DIM. MIN. A B C D E F F1 G G1 H1 H2 H3 L L1 L2 L3 M M1 10.7 19.85 1.57 16.87 0.49 0.77 mm TYP. MAX. 3.2 1.05 0.15 1.5 0.55 0.8 0.88 0.15 1.7 17 12 18.6 0.781 17.9 14.55 11 5.5 2.54 2.54 11.2 0.421 1.83 17.13 0.062 0.664 0.019 0.030 MIN. inch TYP. MAX. 0.126 0.041 0.006 0.059 0.002 0.031 0.035 0.006 0.067 0.669 0.480 0.732 0.072 0.674 Weight: 1.80gr OUTLINE AND MECHANICAL DATA 0.700 0.580 0.433 0.217 0.100 0.100 0.441 Clipwatt11 0044448 9/10 TDA7499SA Information furnished is believed to be accurate and reliable. However, STMicroelectronics assumes no responsibility for the consequences of use of such information nor for any infringement of patents or other rights of third parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of STMicroelectronics. Specifications mentioned in this publication are subject to change without notice. This publication supersedes and replaces all information previously supplied. STMicroelectronics products are not authorized for use as critical components in life support devices or systems without express written approval of STMicroelectronics. The ST logo is a registered trademark of STMicroelectronics (c) 2003 STMicroelectronics - All Rights Reserved STMicroelectronics GROUP OF COMPANIES Australia - Brazil - Canada - China - Finland - France - Germany - Hong Kong - India - Israel - Italy - Japan -Malaysia - Malta - Morocco Singapore - Spain - Sweden - Switzerland - United Kingdom - United States. http://www.st.com 10/10 |
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