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 DP8420A 21A 22A microCMOS Programmable 256k 1M 4M Dynamic RAM Controller Drivers
July 1992
DP8420A 21A 22A microCMOS Programmable 256k 1M 4M Dynamic RAM Controller Drivers
General Description
The DP8420A 21A 22A dynamic RAM controllers provide a low cost single chip interface between dynamic RAM and all 8- 16- and 32-bit systems The DP8420A 21A 22A generate all the required access control signal timing for DRAMs An on-chip refresh request clock is used to automatically refresh the DRAM array Refreshes and accesses are arbitrated on chip If necessary a WAIT or DTACK output inserts wait states into system access cycles including burst mode accesses RAS low time during refreshes and RAS precharge time after refreshes and back to back accesses are guaranteed through the insertion of wait states Separate on-chip precharge counters for each RAS output can be used for memory interleaving to avoid delayed back to back accesses because of precharge An additional feature of the DP8422A is two access ports to simplify dual accessing Arbitration among these ports and refresh is done on chip of Pins (PLCC) 68 68 84 of Address Outputs 9 10 11
Features
Y Y Y
Y
Y
Y Y
Y
Y
On chip high precision delay line to guarantee critical DRAM access timing parameters microCMOS process for low power High capacitance drivers for RAS CAS WE and DRAM address on chip On chip support for nibble page and static column DRAMs Byte enable signals on chip allow byte writing in a word size up to 32 bits with no external logic Selection of controller speeds 20 MHz and 25 MHz On board Port A Port B (DP8422A only) refresh arbitration logic Direct interface to all major microprocessors (application notes available) 4 RAS and 4 CAS drivers (the RAS and CAS configuration is programmable) Direct Drive Memory Capacity 4 Mbytes 16 Mbytes 64 Mbytes Access Ports Available Single Access Port Single Access Port Dual Access Ports (A and B)
Control DP8420A DP8421A DP8422A
Largest DRAM Possible 256 kbit 1 Mbit 4 Mbit
Block Diagram
DP8420A 21A 22A DRAM Controller
TL F 8588 - 5
FIGURE 1
TRI-STATE is a registered trademark of National Semiconductor Corporation Staggered RefreshTM is a trademark of National Semiconductor Corporation C1995 National Semiconductor Corporation TL F 8588 RRD-B30M105 Printed in U S A
Table of Contents
1 0 INTRODUCTION 2 0 SIGNAL DESCRIPTIONS 2 1 Address R W and Programming Signals 2 2 DRAM Control Signals 2 3 Refresh Signals 2 4 Port A Access Signals 2 5 Port B Access Signals (DP8422A) 2 6 Common Dual Port Signals (DP8422A) 2 7 Power Signals and Capacitor Input 2 8 Clock Inputs 3 0 PROGRAMMING AND RESETTING 3 1 External Reset 3 2 Programming Methods 3 2 1 Mode Load Only Programming 3 2 2 Chip Selected Access Programming 3 3 Internal Programming Modes 4 0 PORT A ACCESS MODES 4 1 Access Mode 0 4 2 Access Mode 1 4 3 Extending CAS with Either Access Mode 4 4 Read-Modify-Write Cycles with Either Access Mode 4 5 Additional Access Support Features 4 5 1 Address Latches and Column Increment 4 5 2 Address Pipelining 4 5 3 Delay CAS During Write Accesses 5 0 REFRESH OPTIONS 5 1 Refresh Control Modes 5 1 1 Automatic Internal Refresh 5 1 2 Externally Controlled Burst Refresh 5 1 3 Refresh Request Acknowledge 5 2 Refresh Cycle Types 5 2 1 Conventional Refresh 5 2 2 Staggered RefreshTM 5 2 3 Error Scrubbing Refresh 5 3 Extending Refresh 5 4 Clearing the Refresh Address Counter 5 5 Clearing the Refresh Request Clock 6 0 PORT A WAIT STATE SUPPORT 6 1 WAIT Type Output 6 2 DTACK Type Output 6 3 Dynamically Increasing the Number of Wait States 6 4 Guaranteeing RAS Low Time and RAS Precharge Time 7 0 RAS AND CAS CONFIGURATION MODES 7 1 Byte Writing 7 2 Memory Interleaving 7 3 Address Pipelining 7 4 Error Scrubbing 7 5 Page Burst Mode 8 0 TEST MODE 9 0 DRAM CRITICAL TIMING PARAMETERS 9 1 Programmable Values of tRAH and tASC 9 2 Calculation of tRAH and tASC 10 0 DUAL ACCESSING (DP8422A) 10 1 Port B Access Mode 10 2 Port B Wait State Support 10 3 Common Port A and Port B Dual Port Functions 10 3 1 GRANTB Output 10 3 2 LOCK Input 11 0 ABSOLUTE MAXIMUM RATINGS 12 0 DC ELECTRICAL CHARACTERISTICS 13 0 AC TIMING PARAMETERS 14 0 FUNCTIONAL DIFFERENCES BETWEEN THE DP8420A 21A 22A AND THE DP8420 21 22 15 0 DP8420A 21A 22A USER HINTS
2
1 0 Introduction
The DP8420A 21A 22A are CMOS Dynamic RAM controllers that incorporate many advanced features which include address latches refresh counter refresh clock row column and refresh address multiplexer delay line refresh access arbitration logic and high capacitive drivers The programmable system interface allows any manufacturer's microprocessor or bus to directly interface via the DP8420A 21A 22A to DRAM arrays up to 64 Mbytes in size After power up the user must first reset and program the DP8420A 21A 22A before accessing the DRAM The chip is programmed through the address bus Reset Due to the differences in power supplies the internal reset circuit may not always reset correctly therefore an External (hardware) Reset must be performed before programming the chip Programming After resetting the chip the user can program the controller by either one of two methods Mode Load Only Programming or Chip Select Access Programming Initialization Period Once the DP8420A 21A 22A has been programmed for the first time a 60 ms initialization period is entered During this time the DRC performs refreshes to the DRAM array so further warm up cycles are unnecessary The initialization period is entered only after the first programming after a reset Accessing Modes After resetting and programming the chip the DP8420A 21A 22A is ready to access the DRAM There are two modes of accessing with these controllers Mode 0 which indicates RAS synchronously and Mode 1 which indicates RAS asynchronously Refresh Modes The DP8420A 21A 22A have expanded refresh capabilities compared to previous DRAM controllers There are three modes of refreshing available Internal Automatic Refreshing Externally Controlled Burst Refreshing and Refresh Request Acknowledge Refreshing Any of these modes can be used together or separately to achieve the desired results Refresh Types These controllers have three types of refreshing available Conventional Staggered and Error Scrubbing Any refresh control mode can be used with any type of refresh Wait Support The DP8420A 21A 22A have wait support available as DTACK or WAIT Both are programmable DTACK Data Transfer ACKnowledge is useful for processors whose wait signal is active high WAIT is useful for those processors whose wait signal is active low The user can choose either at programming These signals are used by the on chip arbiter to insert wait states to guarantee the arbitration between accesses refreshes and precharge Both signals are independent of the access mode chosen and both signals can be dynamically delayed further through the WAITIN signal to the DP8420A 21A 22A Sequential Accesses (Static Column Page Mode) The DP8420A 21A 22A have address latches used to latch the bank row and column address inputs Once the address is latched a COLumn INCrement (COLINC) feature can be used to increment the column address The address latches can also be programmed to be fall through COLINC can be used for Sequential Accesses of Static Column DRAMs Also COLINC in conjunction with ECAS inputs can be used for Sequential Accesses to Page Mode DRAMs RAS and CAS Configuration (Byte Writing) The RAS and CAS drivers can be configured to drive a one two or four bank memory array up to 32 bits in width The ECAS signals can then be used to select one of four CAS drivers for Byte Writing with no extra logic Memory Interleaving When configuring the DP820A 21A 22A for more than one bank Memory Interleaving can be used By tying the low order address bits to the bank select lines B0 and B1 sequential back to back accesses will not be delayed since these controllers have separate precharge counters per bank Address Pipelining The DP8420A 21A 22A are capable of performing Address Pipelining In address pipelining the DRC will guarantee the column address hold time and switch the internal multiplexor to place the row address on the address bus At this time another memory access to another bank can be initiated Dual Accessing Finally the DP8422A has all the features previously mentioned and unlike the DP8420A 21A the DP8422A has a second port to allow a second CPU to access the same memory array The DP8422A has four signals to support Dual Accessing these signals are AREQB ATACKB LOCK and GRANTB All arbitration for the two ports and refresh is done on chip by the controller through the insertion of wait states Since the DP8422A has only one input address bus the address lines must be multiplexed externally The signal GRANTB can be used for this purpose Terminology The following explains the terminology used in this data sheet The terms negated and asserted are used Asserted refers to a ``true'' signal Thus ``ECAS0 asserted'' means the ECAS0 input is at a logic 0 The term ``COLINC asserted'' means the COLINC input is at a logic 1 The term negated refers to a ``false'' signal Thus ``ECAS0 negated'' means the ECAS0 input is at a logic 1 The term ``COLINC negated'' means the input COLINC is at a logic 0 The table shown below clarifies this terminology Signal Active High Active High Active Low Active Low Action Asserted Negated Asserted Negated Logic Level High Low Low High
3
Connection Diagrams
TL F 8588-4
TL F 8588 - 3
Top View FIGURE 2 Order Number DP8420AV-20 or DP8420AV-25 See NS Package Number V68A
Top View FIGURE 3 Order Number DP8421AV-20 or DP8421AV-25 See NS Package Number V68A
TL F 8588 - 2
Top View FIGURE 4 Order Number DP8422AV-20 or DP8422AV-25 See NS Package Number V84A
4
2 0 Signal Descriptions
Pin Name Device (If not Applicable to All) Input Output Description
2 1 ADDRESS R W AND PROGRAMMING SIGNALS R0 - 10 R0 - 9 C0 - 10 C0 - 9 B0 B1 DP8422A DP8420A 21A DP8422A DP8420A 21A I I I I I ROW ADDRESS These inputs are used to specify the row address during an access to the DRAM They are also used to program the chip when ML is asserted (except R10) COLUMN ADDRESS These inputs are used to specify the column address during an access to the DRAM They are also used to program the chip when ML is asserted (except C10) BANK SELECT Depending on programming these inputs are used to select a group of RAS and CAS outputs to assert during an access They are also used to program the chip when ML is asserted ENABLE CAS These inputs are used to enable a single or group of CAS outputs when asserted In combination with the B0 B1 and the programming bits these inputs select which CAS output or CAS outputs will assert during an access The ECAS signals can also be used to toggle a group of CAS outputs for page nibble mode accesses They also can be used for byte write operations If ECAS0 is negated during programming continuing to assert the ECAS0 while negating AREQ or AREQB during an access will cause the CAS outputs to be extended while the RAS outputs are negated (the ECASn inputs have no effect during scrubbing refreshes) WRITE ENABLE IN This input is used to signify a write operation to the DRAM If ECAS0 is asserted during programming the WE output will follow this input This input asserted will also cause CAS to delay to the next positive clock edge if address bit C9 is asserted during programming COLUMN INCREMENT When the address latches are used and RFIP is negated this input functions as COLINC Asserting this signal causes the column address to be incremented by one When RFIP is asserted this signal is used to extend the refresh cycle by any number of periods of CLK until it is negated MODE LOAD This input signal when low enables the internal programming register that stores the programming information
ECAS0 - 3
I
WIN
I
COLINC (EXTNDRF)
I I
ML 2 2 DRAM CONTROL SIGNALS Q0 - 10 Q0 - 9 Q0 - 8 RAS0 - 3 DP8422A DP8421A DP8421A
I
O O O O
DRAM ADDRESS These outputs are the multiplexed output of the R0 - 9 10 and C0-9 10 and form the DRAM address bus These outputs contain the refresh address whenever RFIP is asserted They contain high capacitive drivers with 20X series damping resistors ROW ADDRESS STROBES These outputs are asserted to latch the row address contained on the outputs Q0 - 8 9 10 into the DRAM When RFIP is asserted the RAS outputs are used to latch the refresh row address contained on the Q0 - 8 9 10 outputs in the DRAM These outputs contain high capacitive drivers with 20X series damping resistors COLUMN ADDRESS STROBES These outputs are asserted to latch the column address contained on the outputs Q0 - 8 9 10 into the DRAM These outputs have high capacitive drivers with 20X series damping resistors WRITE ENABLE or REFRESH REQUEST This output asserted specifies a write operation to the DRAM When negated this output specifies a read operation to the DRAM When the DP8420A 21A 22A is programmed in address pipelining mode or when ECAS0 is negated during programming this output will function as RFRQ When asserted this pin specifies that 13 ms or 15 ms have passed If DISRFSH is negated the DP8420A 21A 22A will perform an internal refresh as soon as possible If DISRFRSH is asserted RFRQ can be used to externally request a refresh through the input RFSH This output has a high capacitive driver and a 20X series damping resistor
CAS0 - 3
O
WE (RFRQ)
O O
5
2 0 Signal Descriptions (Continued)
Pin Name Device (If not Applicable to All) Input Output Description
2 3 REFRESH SIGNALS RFIP RFSH O I REFRESH IN PROGRESS This output is asserted prior to a refresh cycle and is negated when all the RAS outputs are negated for that refresh REFRESH This input asserted with DISRFRSH already asserted will request a refresh If this input is continually asserted the DP8420A 21A 22A will perform refresh cycles in a burst refresh fashion until the input is negated If RFSH is asserted with DISRFSH negated the internal refresh address counter is cleared (useful for burst refreshes) DISABLE REFRESH This input is used to disable internal refreshes and must be asserted when using RFSH for externally requested refreshes
DISRFSH 2 4 PORT A ACCESS SIGNALS ADS (ALE)
I
I I
ADDRESS STROBE or ADDRESS LATCH ENABLE Depending on programming this input can function as ADS or ALE In mode 0 the input functions as ALE and when asserted along with CS causes an internal latch to be set Once this latch is set an access will start from the positive clock edge of CLK as soon as possible In Mode 1 the input functions as ADS and when asserted along with CS causes the access RAS to assert if no other event is taking place If an event is taking place RAS will be asserted from the positive edge of CLK as soon as possible In both cases the low going edge of this signal latches the bank row and column address if programmed to do so CHIP SELECT This input signal must be asserted to enable a Port A access ACCESS REQUEST This input signal in Mode 0 must be asserted some time after the first positive clock edge after ALE has been asserted When this signal is negated RAS is negated for the access In Mode 1 this signal must be asserted before ADS can be negated When this signal is negated RAS is negated for the access WAIT or DTACK This output can be programmed to insert wait states into a CPU access cycle With R7 negated during programming the output will function as a WAIT type output In this case the output will be active low to signal a wait condition With R7 asserted during programming the output will function as DTACK In this case the output will be negated to signify a wait condition and will be asserted to signify the access has taken place Each of these signals can be delayed by a number of positive clock edges or negative clock levels of CLK to increase the microprocessor's access cycle through the insertion of wait states WAIT INCREASE This input can be used to dynamically increase the number of positive clock edges of CLK until DTACK will be asserted or WAIT will be negated during a DRAM access
CS AREQ
I I
WAIT (DTACK)
O O
WAITIN
I
6
2 0 Signal Descriptions (Continued)
Pin Name Device (If not Applicable to All) Input Output Description
2 5 PORT B ACCESS SIGNALS AREQB DP8422A only I PORT B ACCESS REQUEST This input asserted will latch the row column and bank address if programmed and requests an access to take place for Port B If the access can take place RAS will assert immediately If the access has to be delayed RAS will assert as soon as possible from a positive edge of CLK ADVANCED TRANSFER ACKNOWLEDGE PORT B This output is asserted when the access RAS is asserted for a Port B access This signal can be used to generate the appropriate DTACK or WAIT type signal for Port B's CPU or bus
ATACKB
DP8422A only
O
2 6 COMMON DUAL PORT SIGNALS GRANTB DP8422A only O GRANT B This output indicates which port is currently granted access to the DRAM array When GRANTB is asserted Port B has access to the array When GRANTB is negated Port A has access to the DRAM array This signal is used to multiplex the signals R0 - 8 9 10 C0 - 8 9 10 B0 - 1 WIN LOCK and ECAS0 - 3 to the DP8422A when using dual accessing LOCK This input can be used by the currently granted port to ``lock out'' the other port from the DRAM array by inserting wait states into the locked out port's access cycle until LOCK is negated
LOCK
DP8422A only
I
2 7 POWER SIGNALS AND CAPACITOR INPUT VCC GND CAP I I I POWER Supply Voltage GROUND Supply Voltage Reference CAPACITOR This input is used by the internal PLL for stabilization The value of the ceramic capacitor should be 0 1 mF and should be connected between this input and ground
2 8 CLOCK INPUTS There are two clock inputs to the DP8420A 21A 22A CLK and DELCLK These two clocks may both be tied to the same clock input or they may be two separate clocks running at different frequencies asynchronous to each other CLK I SYSTEM CLOCK This input may be in the range of 0 Hz up to 25 MHz This input is generally a constant frequency but it may be controlled externally to change frequencies or perhaps be stopped for some arbitrary period of time This input provides the clock to the internal state machine that arbitrates between accesses and refreshes This clock's positive edges and negative levels are used to extend the WAIT (DTACK) signals Ths clock is also used as the reference for the RAS precharge time and RAS low time during refresh All Port A and Port B accesses are assumed to be synchronous to the system clock CLK DELAY LINE CLOCK The clock input DELCLK may be in the range of 6 MHz to 20 MHz and should be a multiple of 2 (i e 6 8 10 12 14 16 18 20 MHz) to have the DP8420A 21A 22A switching characteristics hold If DELCLK is not one of the above frequencies the accuracy of the internal delay line will suffer This is because the phase locked loop that generates the delay line assumes an input clock frequency of a multiple of 2 MHz For example if the DELCLK input is at 7 MHz and we choose a divide by 3 (program bits C0- 2) this will produce 2 333 MHz which is 16 667% off of 2 MHz Therefore the DP8420A 21A 22A delay line would produce delays that are shorter (faster delays) than what is intended If divide by 4 was chosen the delay line would be longer (slower delays) than intended (1 75 MHz instead of 2 MHz) (See Section 10 for more information ) This clock is also divided to create the internal refresh clock
DELCLK
I
7
3 0 Programming and Resetting
Due to the variety in power supplies power-up times the internal power up reset circuit may not work in every design therefore an EXTERNAL RESET must be performed before the DRAM controller can be programmed and used After going through the reset procedure the DP8420A 21A 22A can be programmed by either of two methods Mode Load Only Programming or Chip Select Access Programming After programming the DRC for the first time after reset the chip enters a 60 ms initialization period during this period the controller performs refreshes every 13 ms or 15 ms this makes further DRAM warm up cycles unnecessary After this stage the chip can be reprogrammed as many times as the user wishes and the 60 ms period will not be entered into unless the chip is reset and programmed again During the 60 ms initialization period RFIP is asserted low and RAS toggles every 13 ms or 15 ms depending on the programming bit for refresh (C3) CAS will be inactive (logic 1) and the ``Q'' outputs will count from 0 to 2047 refreshing the entire DRAM array The actual initialization time period is given by the following formula T e 4096 (Clock Divisor Select) (Refresh Clock Fine Tune) (DELCLK Frq ) 3 1 EXTERNAL RESET At power up if the internal power up reset worked all internal latches and flip-flops are cleared and the part is ready to be programmed The power up state can also be achieved by performing an External Reset which is required to insure proper operation External Reset is achieved by asserting ML and DISRFSH for at least 16 positive clock edges In order to perform simply a Reset the ML signal must be negated before DISRFSH is negated as shown in Figure 5a This procedure will only reset the controller which now is ready for programming While performing an External Reset if the user negates DISRFSH at least one clock period before negating ML as shown in Figure 5b ML negated will program the DP8420A 21A 22A with the values in R0 - 9 C0 - 9 B0 - 1 and ECAS0 The 60 ms initialization period will be entered since it is the first programming after reset This is a good way of resetting and programming the part at the same time Make sure the right programming bits are on the address lines before ML is negated The DRC may be Reset and programmed any time on the fly but the user must make sure that No Access or Refresh is in progress
TL F 8588 - E1
FIGURE 5a Chip Reset but Not Programmed
TL F 8588 - E2
FIGURE 5b Chip Reset and Programmed
8
3 0 Programming and Resetting (Continued)
3 2 PROGRAMMING METHODS 3 2 1 Mode Load Only Programming To use this method the user asserts ML enabling the internal programming register After ML is asserted a valid programming selection is placed on the address bus B0 B1 and ECAS0 inputs then ML is negated When ML is negated the programming bits are latched into the internal programming register and the DP8420A 21A 22A is programmed see Figure 6 When programming the chip the controller must not be refreshing RFIP must be high (1) to have a successful programming 3 2 2 Chip Selected Access Programming The chip can also be programmed by performing a chip selected access To program the chip using this method ML is asserted then CS is asserted and a valid programming selection is placed on the address bus When AREQ is asserted the programming bits affecting the wait logic become effective immediately then DTACK is asserted allowing the access to terminate After the access ML is negated and the rest of the programming bits take effect
TL F 8588 - G3
FIGURE 6 ML Only Programming
TL F 8588 - G4
FIGURE 7 CS Access Programming
9
3 0 Programming and Resetting (Continued)
3 3 PROGRAMMING BIT DEFINITIONS Symbol ECAS0 0 1 Extend CAS Refresh Request Select The CASn outputs will be negated with the RASn outputs when AREQ (or AREQB DP8422A only) is negated The WE output pin will function as write enable The CASn outputs will be negated during an acccess (Port A (or Port B DP8422A only)) when their corresponding ECASn inputs are negated This feature allows the CAS outputs to be extended beyond the RAS outputs negating Scrubbing refreshes are NOT affected During scrubbing refreshes the CAS outputs will negate along with the RAS outputs regardless of the state of the ECAS inputs The WE output will function as ReFresh ReQuest (RFRQ) when this mode is programmed Access Mode Select ACCESS MODE 0 ALE pulsing high sets an internal latch On the next positive edge of CLK the access (RAS) will start AREQ will terminate the access ACCESS MODE 1 ADS asserted starts the access (RAS) immediately AREQ will terminate the access Address Latch Mode ADS or ALE asserted for Port A or AREQB asserted for Port B with the appropriate GRANT latch the input row column and bank address The row column and bank latches are fall through Delay CAS during WRITE Accesses CAS is treated the same for both READ and WRITE accesses During WRITE accesses CAS will be asserted by the event that occurs last CAS asserted by the internal delay line or CAS asserted on the positive edge of CLK after RAS is asserted Row Address Hold Time Row Address Hold Time e 25 ns minimum Row Address Hold Time e 15 ns minimum Column Address Setup Time Column Address Setup Time e 10 ns miniumum Column Address Setup Time e 0 ns minimum RAS and CAS Configuration Modes Error Scrubbing during Refresh RAS0-3 and CAS0-3 are all selected during an access ECASn must be asserted for CASn to be asserted B0 and B1 are not used during an access Error scrubbing during refresh RAS and CAS pairs are selected during an access by B1 ECASn must be asserted for CASn to be asserted B1 e 0 during an access selects RAS0-1 and CAS0 -1 B1 e 1 during an access selects RAS2-3 and CAS2 -3 B0 is not used during an Access Error scrubbing during refresh RAS and CAS singles are selected during an access by B0 - 1 ECASn must be asserted for CASn to be asserted B1 e 0 B0 e 0 during an access selects RAS0 and CAS0 B1 e 0 B0 e 1 during an access selects RAS1 and CAS1 B1 e 1 B0 e 0 during an access selects RAS2 and CAS2 B1 e 1 B0 e 1 during an access selects RAS3 and CAS3 Error scrubbing during refresh RAS0-3 and CAS0-3 are all selected during an access ECASn must be asserted for CASn to be asserted B1 B0 are not used during an access No error scrubbing (RAS only refreshing) RAS pairs are selected by B1 CAS0-3 are all selected ECASn must be asserted for CASn to be asserted B1 e 0 during an access selects RAS0-1 and CAS0 -3 B1 e 1 during an access selects RAS2-3 and CAS0 -3 B0 is not used during an access No error scrubbing Description
B1 0 1 B0 0 1 C9 0 1 C8 0 1 C7 0 1 C6 C5 C4 000 001
010
011
100
10
3 0 Programming and Resetting (Continued)
3 3 PROGRAMMING BIT DEFINITIONS (Continued) Symbol C6 C5 C4 101 Description RAS and CAS Configuration Modes (Continued) RAS and CAS pairs are selected by B1 ECASn must be asserted for CASn to be asserted B1 e 0 during an access selects RAS0 - 1 and CAS0 -1 B1 e 1 during an access selects RAS2 - 3 and CAS2 -3 B0 is not used during an access No error scrubbing RAS singles are selected by B0-1 CAS0 - 3 are all selected ECASn must be asserted for CASn to be asserted B1 e 0 B0 e 0 during an access selects RAS0 and CAS0 -3 B1 e 0 B0 e 1 during an access selects RAS1 and CAS0 -3 B1 e 1 B0 e 0 during an access selects RAS2 and CAS0 -3 B1 e 1 B0 e 1 during an access selects RAS3 and CAS0 -3 No error scrubbing RAS and CAS singles are selected by B0 1 ECASn must be asserted for CASn to be asserted B1 e 0 B0 e 0 during an access selects RAS0 and CAS0 B1 e 0 B0 e 1 during an access selects RAS1 and CAS1 B1 e 1 B0 e 0 during an access selects RAS2 and CAS2 B1 e 1 B0 e 1 during an access selects RAS3 and CAS3 No error scrubbing Refresh Clock Fine Tune Divisor Divide delay line refresh clock further by 30 (If DELCLK Refresh Clock Clock Divisor e 2 MHz e 15 ms refresh period) Divide delay line refresh clock further by 26 (If DELCLK Refresh Clock Clock Divisor e 2 MHz e 13 ms refresh period) Delay Line Refresh Clock Divisor Select Divide DELCLK by 10 to get as close to 2 MHz as possible Divide DELCLK by 9 to get as close to 2 MHz as possible Divide DELCLK by 8 to get as close to 2 MHz as possible Divide DELCLK by 7 to get as close to 2 MHz as possible Divide DELCLK by 6 to get as close to 2 MHz as possible Divide DELCLK by 5 to get as close to 2 MHz as possible Divide DELCLK by 4 to get as close to 2 MHz as possible Divide DELCLK by 3 to get as close to 2 MHz as possible Refresh Mode Select RAS0-3 will all assert and negate at the same time during a refresh Staggered Refresh RAS outputs during refresh are separated by one positive clock edge Depending on the configuration mode chosen either one or two RASs will be asserted Address Pipelining Select Address pipelining is selected The DRAM controller will switch the DRAM column address back to the row address after guaranteeing the column address hold time Non-address pipelining is selected The DRAM controller will hold the column address on the DRAM address bus until the access RASs are negated WAIT or DTACK Select WAIT type output is selected DTACK (Data Transfer ACKnowledge) type output is selected Add Wait States to the Current Access if WAITIN is Low WAIT or DTACK will be delayed by one additional positive edge of CLK WAIT or DTACK will be delayed by two additional positive edges of CLK
110
111
C3 0 1 C2 C1 C0 0 0 0 0 1 1 1 1 0 0 1 1 0 0 1 1 0 1 0 1 0 1 0 1
R9 0 1 R8 0 1 R7 0 1 R6 0 1
11
3 0 Programming and Resetting (Continued)
3 3 PROGRAMMING BIT DEFINITIONS (Continued) Symbol R5 R4 00 01 Description WAIT DTACK during Burst (See Section 5 1 2 or 5 2 2) NO WAIT STATES If R7 e 0 during programming WAIT will remain negated during burst portion of access If R7 e 1 programming DTACK will remain asserted during burst portion of access 1T If R7 e 0 during programming WAIT will assert when the ECAS inputs are negated with AREQ asserted WAIT will negate from the positive edge of CLK after the ECASs have been asserted If R7 e 1 during programming DTACK will negate when the ECAS inputs are negated with AREQ asserted DTACK will assert from the positive edge of CLK after the ECASs have been asserted T If R7 e 0 during programming WAIT will assert when the ECAS inputs are negated with AREQ asserted WAIT will negate on the negative level of CLK after the ECASs have been asserted If R7 e 1 during programming DTACK will negate when the ECAS inputs are negated with AREQ asserted DTACK will assert from the negative level of CLK after the ECASs have been asserted 0T If R7 e 0 during programming WAIT will assert when the ECAS inputs are negated WAIT will negate when the ECAS inputs are asserted If R7 e 1 during programming DTACK will negate when the ECAS inputs are negated DTACK will assert when the ECAS inputs are asserted WAIT DTACK Delay Times (See Section 5 1 1 or 5 2 1) NO WAIT STATES If R7 e 0 during programming WAIT will remain high during non-delayed accesses WAIT will negate when RAS is negated during delayed accesses NO WAIT STATES If R7 e 1 during programming DTACK will be asserted when RAS is asserted T If R7 e 0 during programming WAIT will negate on the negative level of CLK after the access RAS 1T If R7 e 1 during programming DTACK will be asserted on the positive edge of CLK after the access RAS NO WAIT STATES T If R7 e 0 during programming WAIT will remain high during non-delayed accesses WAIT will negate on the negative level of CLK after the access RAS during delayed accesses T If R7 e 1 during programming DTACK will be asserted on the negative level of CLK after the access RAS 1T If R7 e 0 during programming WAIT will negate on the positive edge of CLK after the access RAS 1 T If R7 e 1 during programming DTACK will be asserted on the negative level of CLK after the positive edge of CLK after the access RAS RAS Low and RAS Precharge Time RAS asserted during refresh e 2 positive edges of CLK RAS precharge time e 1 positive edge of CLK RAS will start from the first positive edge of CLK after GRANTB transitions (DP8422A) RAS asserted during refresh e 3 positive edges of CLK RAS precharge time e 2 positive edges of CLK RAS will start from the second positive edge of CLK after GRANTB transitions (DP8422A) RAS asserted during refresh e 2 positive edges of CLK RAS precharge time e 2 positive edges of CLK RAS will start from the first positive edge of CLK after GRANTB transitions (DP8422A) RAS asserted during refresh e 4 positive edges of CLK RAS precharge time e 3 positive edges of CLK RAS will start from the second positive edge of CLK after GRANTB transitions (DP8422A)
10
11
R3 R2 00
01 10
11
R1 R0 00
01
10
11
12
4 0 Port A Access Modes
The DP8420A 21A 22A have two general purpose access modes Mode 0 RAS synchronous and Mode 1 RAS asynchronous One of these modes is selected at programming through the B1 input A Port A access to DRAM is initiated by two input signals ADS (ALE) and CS The access is always terminated by one signal AREQ These input signals should be synchronous to the input clock 4 1 ACCESS MODE 0 Mode 0 synchronous access is selected by negating the input B1 during programming (B1 e 0) To initiate a Mode 0 access ALE is pulse high and CS is asserted If precharge time was met a refresh of DRAM or a Port B access was not in progress the RAS (RASs) would be asserted on the first rising edge of clock If a refresh or a Port B access is in progress or precharge time is required the controller will wait until these events have taken place and assert RAS (RASs) on the next positive edge of clock Sometime after the first positive edge of clock after ALE and CS have been asserted the input AREQ must be asserted In single port applications once AREQ is asserted CS can be negated On the other hand ALE can stay asserted several periods of clock however ALE must be negated before or during the period of CLK in which AREQ is negated The controller samples AREQ on the every rising edge of clock after DTACK is asserted The access will end when AREQ is sampled negated
TL F 8588 - 60
FIGURE 8a Access Mode 0
13
4 0 Port A Access Modes (Continued)
4 2 ACCESS MODE 1 Mode 1 asynchronous access is selected by asserting the input B1 during programming (B1 e 1) This mode allows accesses to start immediately from the access request input ADS To initiate a Mode 1 access CS is asserted followed by ADS asserted If precharge time was met a refresh of the DRAM or a Port B access was not in progress the RAS (RASs) would be asserted from ADS being asserted If a refresh or Port B access is in progress or precharge time is required the controller will wait until these events have taken place and assert RAS (RASs) from the next rising edge of clock When ADS is asserted or sometime after AREQ must be asserted At this time ADS can be negated and AREQ will continue the access Also ADS can continue to be asserted after AREQ has been asserted and negated however a new access will not start until ADS is negated and asserted again When address pipelining is not implemented ADS and AREQ can be tied together The access will end when AREQ is negated
TL F 8588 - 62
FIGURE 8b Access Mode 1
14
4 0 Port A Access Modes (Continued)
4 3 EXTENDING CAS WITH EITHER ACCESS MODE In both access modes once AREQ is negated RAS and DTACK if programmed will be negated If ECAS0 was asserted (0) during programming CAS (CASs) will be negated with AREQ If ECAS0 was negated (1) during programming CAS (CASs) will continue to be asserted after RAS has been negated given that the appropriate ECAS inputs are asserted This allows a DRAM to have data present on the data out bus while gaining RAS precharge time
TL F 8588 - 61
FIGURE 9a Access Mode 0 Extending CAS
TL F 8588 - 63
FIGURE 9b Access Mode 1 Extending CAS
15
4 0 Port A Access Modes (Continued)
4 4 READ-MODIFY-WRITE CYCLES WITH EITHER ACCESS MODE WIN from negated to asserted in a late write access beThere are 2 methods by which this chip can be used to do read-modify-write access cycles The first method involves cause here a problem may arise with DATA IN and DATA doing a late write access where the WIN input is asserted OUT being valid at the same time This may result in a data line trying to drive two different levels simultaneously The some delay after CAS is asserted The second method inpage mode method of a read-modify-write access allows volves doing a page mode read access followed by a page the user to have transceivers in the system because the mode write access with RAS held low (see Figure 9c ) data in (read data) is guaranteed to be high impedance durCASn must be toggled using the ECASn inputs and WIN has ing the time the data out (write data) is valid to be changed from negated to asserted (read to write) while CAS is negated This method is better than changing
TL F 8588 - G2
There may be idle states inserted here by the CPU
FIGURE 9c Read-Modify-Write Access Cycle
16
4 0 Port A Access Modes (Continued)
4 5 ADDITIONAL ACCESS SUPPORT FEATURES To support the different modes of accessing the DP8420A 21A 22A offer other access features These additional features include Address Latches and Column Increment (for page burst mode support) Address Pipelining and Delay CAS (to allow the user with a multiplexed bus to ensure valid data is present before CAS is asserted) 4 5 1 Address Latches and Column Increment The Address Latches can be programmed through programming bit B0 They can be programmed to either latch the address or remain in a fall-through mode If the address latches are used to latch the address the controller will function as follows In Mode 0 the rising edge of ALE places the latches in fallthrough once ALE is negated the address present in the row column and bank input is latched In Mode 1 the address latches are in fall through mode until ADS is asserted ADS asserted latches the address Once the address is latched the column address can be incremented with the input COLINC COLINC can be used for sequential accesses of static column DRAMs COLINC can also be used with the ECAS inputs to support sequential accesses to page mode DRAMs as shown in Figure 10 COLINC should only be asserted when the signal RFIP is negated during an access since this input functions as extended refresh when RFIP is asserted COLINC must be negated (0) when the address is being latched (ADS falling edge in Mode 1) If COLINC is asserted with all of the bits of the column address asserted (ones) the column address will return to zero
TL F 8588 - C4
FIGURE 10 Column Increment The address latches function differently with the DP8422A The DP8422A will latch the address of the currently granted port If Port A is currently granted the address will be latched as described in Section 4 5 1 If Port A is not granted and requests an access the address will be latched on the first or second positive edge of CLK after GRANTB has been negated depending on the programming bits R0 R1 For Port B if GRANTB is asserted the address will be latched with AREQB asserted If GRANTB is negated the address will latch on the first or second positive edge of CLK after GRANTB is asserted depending on the programming bits R0 R1
17
4 0 Port A Access Modes (Continued)
4 5 2 Address Pipelining Address pipelining is the overlapping of accesses to different banks of DRAM If the majority of successive accesses are to a different bank the accesses can be overlapped Because of this overlapping the cycle time of the DRAM accesses are greatly reduced The DP8420A 21A 22A can be programmed to allow a new row address to be placed on the DRAM address bus after the column address hold time has been met At this time a new access can be initiated with ADS or ALE depending on the access mode while AREQ is used to sustain the current access The DP8422A supports address pipelining for Port A only This mode cannot be used with page static column or nibble modes of operations because the DRAM column address is switched back to the row address after CAS is asserted This mode is programmed through address bit R8 (see Figures 11a and 11b ) In this mode the output WE always functions as RFRQ During address pipelining in Mode 0 shown in Figure 11c ALE cannot be pulsed high to start another access until AREQ has been asserted for the previous access for at least one period of CLK DTACK if programmed will be negated once AREQ is negated WAIT if programmed to insert wait states will be asserted once ALE and CS are asserted In Mode 1 shown in Figure 11d ADS can be negated once AREQ is asserted After meeting the minimum negated pulse width for ADS ADS can again be asserted to start a new access DTACK if programmed will be negated once AREQ is negated WAIT if programmed will be asserted once ADS is asserted In either mode with either type of wait programmed the DP8420A 21A 22A will still delay the access for precharge if sequential accesses are to the same bank or if a refresh takes place
TL F 8588 - G0
FIGURE 11a Non-Address Pipelined Mode
TL F 8588 - G1
FIGURE 11b Address Pipelined Mode
18
4 0 Port A Access Modes (Continued)
TL F 8588 - C5
FIGURE 11c Mode 0 Address Pipelining (WAIT of 0 T Has Been Programmed WAIT is Sampled at the ``T3'' Falling Clock Edge)
19
TL F 8588 - C6
FIGURE 11d Mode 1 Address Pipelining (DTACK 1
T Programmed DTACK is Sampled at the ``T3'' Falling Clock Edge)
4 0 Port A Access Modes (Continued)
4 5 3 Delay CAS during Write Accesses Address bit C9 asserted during programming will cause CAS to be delayed until the first positive edge of CLK after RAS is asserted when the input WIN is asserted Delaying CAS during write accesses ensures that the data to be written to DRAM will be setup to CAS asserting as shown in Figures
12a and 12b If the possibility exists that data still may not be present after the first positive edge of CLK CAS can be delayed further with the ECAS inputs If address bit C9 is negated during programming read and write accesses will be treated the same (with regard to CAS)
TL F 8588 - C7
FIGURE 12a Mode 0 Delay CAS
TL F 8588 - C8
FIGURE 12b Mode 1 Delay CAS
20
5 0 Refresh Options
The DP8420A 21A 22A support three refresh control mode options 1 Automatic Internally Controlled Refresh 2 Externally Controlled Burst Refresh 3 Refresh Request Acknowledge With each of the control modes above three types of refresh can be performed 1 All RAS Refresh 2 Staggered Refresh 3 Error Scrubbing During All RAS Refresh There are three inputs EXTNDRF RFSH and DISRFSH and two outputs RFIP and RFRQ associated with refresh There are also ten programming bits R0-1 R9 C0 - 6 and ECAS0 used to program the various types of refreshing Asserting the input EXTNDRF extends the refresh cycle for a single or multiple integral periods of CLK The output RFIP is asserted one period of CLK before the first refresh RAS is asserted If an access is currently in progress RFIP will be asserted up to one period of CLK before the first refresh RAS after AREQ or AREQB is negated for the access (see Figure 13 ) The DP8420A 21A 22A will increment the refresh address counter automatically independent of the refresh mode used The refresh address counter will be incremented once all the refresh RASs have been negated In every combination of refresh control mode and refresh type the DP8420A 21A 22A is programmed to keep RAS asserted a number of CLK periods The time values of RAS low during refresh are programmed through programming bits R0 and R1 5 1 REFRESH CONTROL MODES 5 1 1 Automatic Internal Refresh The DP8420A 21A 22A have an internal refresh clock The period of the refresh clock is generated from the programming bits C0 - 3 Every period of the refresh clock an internal refresh request is generated As long as a DRAM access is not currently in progress and precharge time has been met the internal refresh request will generate an automatic internal refresh If a DRAM access is in progress the DP8420A 21A 22A on-chip arbitration logic will wait until the access is finished before performing the refresh The refresh access arbitration logic can insert a refresh cycle between two address pipelined accesses However the refresh arbitration logic can not interrupt an access cycle to perform a refresh To enable automatic internally controlled refreshes the input DISRFSH must be negated
TL F 8588 - F8
Explanation of Terms
RFRQ e ReFresh ReQuest internal to the DP8420A 21A 22A RFRQ has the ability to hold off a pending access RFSH e Externally requested ReFreSH RFIP e ACIP e ReFresh in Progress Port A or Port B (DP8422A only) ACcess in Progress This means that either RAS is low for an access or is in the process of transitioning low for an access
FIGURE 13 DP8420A 21A 22A Access Refresh Arbitration State Program
21
5 0 Refresh Options (Continued)
5 1 2 Externally Controlled Burst Refresh To use externally controlled burst refresh the user must disable the automatic internally controlled refreshes by asserting the input DISRFSH The user is responsible for generating the refresh request by asserting the input RFSH Pulsing RFSH low sets an internal latch that is used to produce the internal refresh request The refresh cycle will take place on the next positive edge of CLK as shown in Figure 14a If an access to DRAM is in progress or precharge time for the last access has not been met the refresh will be delayed Since pulsing RFSH low sets a latch the user does not have to keep RFSH low until the refresh starts When the last refresh RAS negates the internal refresh request latch is cleared
TL F 8588 - 64
FIGURE 14a Single External Refreshes (2 Periods of RAS Low during Refresh Programmed) By keeping RFSH asserted past the positive edge of CLK which ends the refresh cycle as shown in Figure 14b the user will perform another refresh cycle Using this technique the user can perform a burst refresh consisting of any number of refresh cycles Each refresh cycle during a burst refresh will meet the refresh RAS low time and the RAS precharge time (programming bits R0-1) If the user desires to burst refresh the entire DRAM (all row addresses) he could generate an end of count signal (burst refresh finished) by looking at one of the DP8420A 21A 22A high address outputs (Q7 Q8 Q9 or Q10) and the RFIP output The Qn outputs function as a decode of how many row addresses have been refreshed (Q7 e 128 refreshes Q8 e 256 refreshes Q9 e 512 refreshes Q10 e 1024 refreshes)
TL F 8588 - 65
FIGURE 14b External Burst Refresh (2 Periods of RAS Precharge 2 Periods of Refresh RAS Low during Refresh Programmed)
22
5 0 Refresh Options (Continued)
5 1 3 Refresh Request Acknowledge The DP8420A 21A 22A can be programmed to output internal refresh requests When the user programs ECAS0 negated (1) and or address pipelining mode is selected the WE output functions as RFRQ RFRQ (WE) will be asserted by one of two events First when the external circuitry pulses low the input RFSH which will request an external refresh Second when the internal refresh clock has expired which signals that another refresh is needed An example of the first case where an external refresh is requested while RFRQ is negated (1) is shown in Figure 15a Notice that RFRQ will be asserted from a positive edge of clock On the second case when the RFRQ is asserted from the expiration of the internal refresh clock the user has two options First if DISRFSH is negated an automatic internal refresh will take place See Figure 15b Second with DISRFSH asserted RFRQ will stay asserted until RFSH is pulsed low This option will cause an externally requested burst refresh to take place See Figure 15c RFRQ will go high and then assert (toggle) if additional periods of the internal refresh clock have expired and neither an externally controlled refresh nor an automatically controlled internal refresh have taken place see Figure 15d If a time critical event or long accesses like page static column mode can not be interrupted RFRQ pulsing high can be used to increment a counter This counter can be used to perform a burst refresh of the number of refreshes missed (through the RFSH input)
TL F 8588 - 66
FIGURE 15a Externally Controlled Single and Burst Refresh with Refresh Request (RFRQ) Output (2 Periods of RAS Low during Refresh Programmed)
TL F 8588 - 67
FIGURE 15b Automatic Internal Refresh with Refresh Request (3T of RAS Low during Refresh Programmed)
23
5 0 Refresh Options (Continued)
TL F 8588 - 65
FIGURE 15c External Burst Refresh (2 Periods of RAS Precharge 2 Periods of Refresh RAS Low during Refresh Programmed)
24 FIGURE 15d Refresh Request Timing
TL F 8588 - 68
5 0 Refresh Options (Continued)
5 2 REFRESH CYCLE TYPES Three different types of refresh cycles are available for use The three different types are mutually exclusive and can be used with any of the three modes of refresh control The three different refresh cycle types are all RAS refresh staggered RAS refresh and error scrubbing during all RAS refresh In all refresh cycle types the RAS precharge time is guaranteed between the previous access RAS ending and the refresh RAS0 starting between refresh RAS3 ending and access RAS beginning between burst refresh RASs 5 2 1 Conventional RAS Refresh A conventional refresh cycle causes RAS0 - 3 to all assert from the first positive edge of CLK after RFIP is asserted as shown in Figure 16 RAS0 - 3 will stay asserted until the number of positive edges of CLK programmed have passed On the last positive edge RAS0 - 3 and RFIP will be negated This type of refresh cycle is programmed by negating address bit R9 during programming
TL F 8588 - 69
FIGURE 16 Conventional RAS Refresh 5 2 2 Staggered RAS Refresh A staggered refresh staggers each RAS or group of RASs by a positive edge of CLK as shown in Figure 17 The number of RASs which will be asserted on each positive edge of CLK is determined by the RAS CAS configuration mode programming bits C4-C6 If single RAS outputs are selected during programming then each RAS will assert on successive positive edges of CLK If two RAS outputs are selected during programming then RAS0 and RAS1 will assert
on the first positive edge of CLK after RFIP is asserted RAS2 and RAS3 will assert on the second positive edge of CLK after RFIP is asserted If all RAS outputs were selected during programming all RAS outputs would assert on the first positive edge of CLK after RFIP is asserted Each RAS or group of RASs will meet the programmed RAS low time and then negate
TL F 8588 - 70
FIGURE 17 Staggered RAS Refresh
25
5 0 Refresh Options (Continued)
5 2 3 Error Scrubbing during Refresh The DP8420A 21A 22A support error scrubbing during all RAS DRAM refreshes Error scrubbing during refresh is selected through bits C4-C6 with bit R9 negated during programming Error scrubbing can not be used with staggered refresh (see Section 8 0) Error scrubbing during refresh allows a CAS or group of CASs to assert during the all RAS refresh as shown in Figure 18 This allows data to be read from the DRAM array and passed through an Error Detection And Correction Chip EDAC If the EDAC determines that the data contains a single bit error and corrects that error the refresh cycle can be extended with the input extend refresh EXTNDRF and a read-modify-write operation can be performed by asserting WE It is the responsibility of the designer to ensure that WE is negated The DP8422A has a 24-bit internal refresh address counter that contains the 11 row 11 column and 2 bank addresses The DP8420A 21A have a 22-bit internal refresh address counter that contains the 10 row 10 column and 2 bank addresses These counters are configured as bank column row with the row address as the least significant bits The bank counter bits are then used with the programming selection to determine which CAS or group of CASs will assert during a refresh
TL F 8588 - 46
FIGURE 18 Error Scrubbing during Refresh
26
5 0 Refresh Options (Continued)
5 3 EXTENDING REFRESH The programmed number of periods of CLK that refresh RASs are asserted can be extended by one or multiple periods of CLK Only the all RAS (with or without error scrubbing) type of refresh can be extended To extend a refresh cycle the input extend refresh EXTNDRF must be asserted before the positive edge of CLK that would have negated all the RAS outputs during the refresh cycle and after the positive edge of CLK which starts all RAS outputs during the refresh as shown in Figure 19 This will extend the refresh to the next positive edge of CLK and EXTNDRF will be sampled again The refresh cycle will continue until EXTNDRF is sampled low on a positive edge of CLK 5 4 CLEARING THE REFRESH ADDRESS COUNTER The refresh address counter can be cleared by asserting RFSH while DISRFSH is negated as shown in Figure 20a This can be used prior to a burst refresh of the entire memory array By asserting RFSH one period of CLK before DISRFSH is asserted and then keeping both inputs asserted the DP8420A 21A 22A will clear the refresh address counter and then perform refresh cycles separated by the programmed value of precharge as shown in Figure 20b An end-of-count signal can be generated from the Q DRAM address outputs of the DP8420A 21A 22A and used to negate RFSH
TL F 8588 - 71
FIGURE 19 Extending Refresh with the Extend Refresh (EXTNDRF) Input
TL F 8588 - 72
FIGURE 20a Clearing the Refresh Address Counter
TL F 8588 - 73
FIGURE 20b Clearing the Refresh Counter during Burst
27
5 0 Refresh Options (Continued)
5 5 CLEARING THE REFRESH REQUEST CLOCK The refresh request clock can be cleared by negating DISRFSH and asserting RFSH for 500 ns one period of the internal 2 MHz clock as shown in Figure 21 By clearing the refresh request clock the user is guaranteed that an internal refresh request will not be generated for approximately 15 ms one refresh clock period from the time RFSH is negated This action will also clear the refresh address counter
TL F 8588 - 75
FIGURE 21 Clearing the Refresh Request Clock Counter
6 0 Port A Wait State Support
Wait states allow a CPU's access cycle to be increased by one or multiple CPU clock periods The wait or ready input is named differently by CPU manufacturers However any CPU's wait or ready input is compatible with either the WAIT or DTACK output of the DP8420A 21A 22A The user determines whether to program WAIT or DTACK (R7) and which value to select for WAIT or DTACK (R2 R3) depending upon the CPU used and where the CPU samples its wait input during an access cycle The decision to terminate the CPU access cycle is directly affected by the speed of the DRAMs used The system designer must ensure that the data from the DRAMs will be present for the CPU to sample or that the data has been written to the DRAM before allowing the CPU access cycle to terminate The insertion of wait states also allows a CPU's access cycle to be extended until the DRAM access has taken place The DP8420A 21A 22A insert wait states into CPU access cycles due to guaranteeing precharge time refresh currently in progress user programmed wait states the WAITIN signal being asserted and GRANTB not being valid (DP8422A only) If one of these events is taking place and the CPU starts an access the DP8420A 21A 22A will insert wait states into the access cycle thereby increasing the length of the CPU's access Once the event has been completed the DP8420A 21A 22A will allow the access to take place and stop inserting wait states There are six programming bits R2 - R7 an input WAITIN and an output that functions as WAIT or DTACK 6 1 WAIT TYPE OUTPUT With the R7 address bit negated during programming the user selects the WAIT output As long as WAIT is sampled asserted by the CPU wait states (extra clock periods) are inserted into the current access cycle as shown in Figure 22 Once WAIT is sampled negated the access cycle is completed by the CPU WAIT is asserted at the beginning of a chip selected access and is programmed to negate a number of positive edges and or negative levels of CLK from the event that starts the access WAIT can also be programmed to function in page burst mode applications Once WAIT is negated during an access and the ECAS inputs are negated with AREQ asserted WAIT can be programmed to toggle following the ECAS inputs Once AREQ is negated ending the access WAIT will stay negated until the next chip selected access For more details about WAIT Type Output see Application Note AN-773
TL F 8588 - 76
FIGURE 22 WAIT Type Output
28
6 0 Port A Wait State Support (Continued)
6 2 DTACK TYPE OUTPUT With the R7 address bit asserted during programming the user selects the DTACK type output As long as DTACK is sampled negated by the CPU wait states are inserted into the current access cycle as shown in Figure 23 Once DTACK is sampled asserted the access cycle is completed by the CPU DTACK which is normally negated is programmed to assert a number of positive edges and or negative levels from the event that starts RAS for the access DTACK can also be programmed to function during page burst mode accesses Once DTACK is asserted and the ECAS inputs are negated with AREQ asserted DTACK can be programmed to negate and assert from the ECAS inputs toggling to perform a page burst mode operation Once AREQ is negated ending the access DTACK will be negated and stays negated until the next chip selected access For more details about DTACK type output see Application Note AN-773 6 3 DYNAMICALLY INCREASING THE NUMBER OF WAIT STATES The user can increase the number of positive edges of CLK before DTACK is asserted or WAIT is negated With the input WAITIN asserted the user can delay DTACK asserting or WAIT negating either one or two more positive edges of CLK The number of edges is programmed through address bit R6 If the user is increasing the number of positive edges in a delay that contains a negative level the positive edges will be met before the negative level For example if the user programmed DTACK of T asserting WAITIN programmed as 2T would increase the number of positive edges resulting in DTACK of 2 T as shown in Figure 24a Similarly WAITIN can increase the number of positive edges in a page burst access WAITIN can be permanently asserted in systems requiring an increased number of wait states WAITIN can also be asserted and negated depending on the type of access As an example a user could invert the WRITE line from the CPU and connect the output to WAITIN This could be used to perform write accesses with 1 wait state and read accesses with 2 wait states as shown in Figure 24b
TL F 8588 - 97
FIGURE 23 DTACK Type Output
TL F 8588 - C1
FIGURE 24a WAITIN Example (DTACK is Sampled at the ``T3'' Falling Clock Edge)
29
6 0 Port A Wait State Support (Continued)
TL F 8588 - C2
FIGURE 24b WAITIN Example (WAIT is Sampled at the End of ``T2'')
6 4 GUARANTEEING RAS LOW TIME AND RAS PRECHARGE TIME The DP8420A 21A 22A will guarantee RAS precharge time between accesses between refreshes and between access and refreshes The programming bits R0 and R1 are used to program combinations of RAS precharge time and RAS low time referenced by positive edges of CLK RAS low time is programmed for refreshes only During an access the system designer guarantees the time RAS is asserted through the DP8420A 21A 22A wait logic Since inserting wait states into an access increases the length of the CPU signals which are used to create ADS or ALE and AREQ the time that RAS is asserted can be guaranteed The precharge time is also guaranteed by the DP8420A 21A 22A Each RAS output has a separate posi-
tive edge of CLK counter AREQ is negated setup to a positive edge of CLK to terminate the access That positive edge is 1T The next positive edge is 2T RAS will not be asserted until the programmed number of positive edges of CLK have passed as shown in Figure 25 Once the programmed precharge time has been met RAS will be asserted from the positive edge of CLK However since there is a precharge counter per RAS an access using another RAS will not be delayed Precharge time before a refresh is always referenced from the access RAS negating before RAS0 for the refresh asserting After a refresh precharge time is referenced from RAS3 negating for the refresh to the access RAS asserting
TL F 8588 - C3
FIGURE 25 Guaranteeing RAS Precharge (DTACK is Sampled at the ``T2'' Falling Clock Edge)
30
7 0 RAS and CAS Configuration Modes
The DP8420A 21A 22A allow the user to configure the DRAM array to contain one two or four banks of DRAM Depending on the functions used certain considerations must be used when determining how to set up the DRAM array Programming address bits C4 C5 and C6 along with bank selects B0-1 and CAS enables ECAS0-3 determine which RAS or group of RASs and which CAS or group of CASs will be asserted during an access Different memory schemes are described The DP8420A 21A 22A is specified driving a heavy load of 72 DRAMs representing four banks of DRAM with 16-bit words and 2 parity bits The DP8420A 21A 22A can drive more than 72 DRAMs but the AC timing must be increased Since the RAS and CAS outputs are configurable all RAS and CAS outputs should be used for the maximum amount of drive 7 1 BYTE WRITING By selecting a configuration in which all CAS outputs are selected during an access the ECAS inputs enable a single or group of CAS outputs to select a byte (or bytes) in a word size of up to 32 bits In this case the RAS outputs are used to select which of up to 4 banks is to be used as shown in Figures 26a and 26b In systems with a word size of 16 bits the byte enables can be gated with a high order address bit to produce four byte enables which gives an equivalent to 8 banks of 16-bit words as shown in Figure 26d If less memory is required each CAS should be used to drive each nibble in the 16-bit word as shown in Figure 26c
TL F 8588 - C9
FIGURE 26a DRAM Array Setup for 32-Bit System (C6 C5 C4 e 1 1 0 during Programming)
TL F 8588 - D0
FIGURE 26b DRAM Array Setup for 32-Bit 1 Bank System (C6 C5 C4 e 0 0 0 Allowing Error Scrubbing or C6 C5 C4 e 0 1 1 No Error Scrubbing during Programming)
31
7 0 RAS and CAS Configuration Modes (Continued)
TL F 8588 - D1
FIGURE 26c DRAM Array Setup for 16-Bit System (C6 C5 C4 e 1 1 0 during Programming)
TL F 8588 - D2
FIGURE 26d 8 Bank DRAM Array for 16-Bit System (C6 C5 C4 e 1 1 0 during Programming)
32
7 0 RAS and CAS Configuration Modes (Continued)
7 2 MEMORY INTERLEAVING Memory interleaving allows the cycle time of DRAMs to be reduced by having sequential accesses to different memory banks Since the DP8420A 21A 22A have separate precharge counters per bank sequential accesses will not be delayed if the accessed banks use different RAS outputs To ensure different RAS outputs will be used a mode is selected where either one or two RAS outputs will be asserted during an access The bank select or selects B0 and B1 are then tied to the least significant address bits causing a different group of RASs to assert during each sequential access as shown in Figure 27 In this figure there should be at least one clock period of all RAS's negated between different RAS's being asserted to avoid the condition of a CAS before RAS refresh cycle 7 3 ADDRESS PIPELINING Address pipelining allows several access RASs to be asserted at once Because RASs can overlap each bank requires either a mode where one RAS and one CAS are used per bank as shown in Figure 28a or where two RASs and two CASs are used per bank as shown in Figure 28b Byte writing can be accomplished in a 16-bit word system if two RASs and two CASs are used per bank In other systems WEs (or external gating on the CAS outputs) must be used to perform byte writing If WEs are used separate data in and data out buffers must be used If the array is not layed out this way a CAS to a bank can be low before RAS which will cause a refresh of the DRAM not an access To take full advantage of address pipelining memory interleaving is used To memory interleave the least significant address bits should be tied to the bank select inputs to ensure that all ``back to back'' sequential accesses are not delayed since different memory banks are accessed
TL F 8588 - D3
FIGURE 27 Memory Interleaving (C6 C5 C4 e 1 1 0 during Programming)
33
7 0 RAS and CAS Configuration Modes (Continued)
TL F 8588 - D4
FIGURE 28a DRAM Array Setup for 4 Banks Using Address Pipelining (C6 C5 C4 e 1 1 1 or C6 C5 C4 e 0 1 0 (Also Allowing Error Scrubbing) during Programming)
TL F 8588 - D5
FIGURE 28b DRAM Array Setup for Address Pipelining with 2 Banks (C6 C5 C4 e 1 0 1 or C6 C5 C4 e 0 0 1 (Also Allowing Error Scrubbing) during Programming) 7 4 ERROR SCRUBBING In error scrubbing during refresh the user selects one two or four RAS and CAS outputs per bank When performing error detection and correction memory is always accessed
as words Since the CAS signals are not used to select individual bytes the ECAS inputs can be tied low as shown in Figures 29a and 29b
TL F 8588 - D6
FIGURE 29a DRAM Array Setup for 4 Banks Using Error Scrubbing (C6 C5 C4 e 0 1 0 during Programming)
TL F 8588 - D7
FIGURE 29b DRAM Array Setup for Error Scrubbing with 2 Banks (C6 C5 C4 e 0 0 1 during Programming)
34
7 0 RAS and CAS Configuration Modes (Continued)
7 5 PAGE BURST MODE In a static column page or burst mode system the least significant bits must be tied to the column address in order to ensure that the page burst accesses are to sequential memory addresses as shown in Figure 30 In a nibble mode system the least significant bits must be tied to the highest column and row address bits in order to ensure that sequential address bits are the ``nibble'' bits for nibble mode accesses (Figure 30) The ECAS inputs may then be toggled with the DP8420A 21A 22A's address latches in fallthrough mode while AREQ is asserted The ECAS inputs can also be used to select individual bytes When using nibble mode DRAMS the third and fourth address bits can be tied to the bank select inputs to perform memory interleaving In page or static column modes the two address bits after the page size can be tied to the bank select inputs to select a new bank if the page size is exceeded
TL F 8588 - D8
See table below for row column
bank address bit map A0 A1 are used for byte addressing in this example
Addresses Column Address Row Address B0 B1
Nibble Mode C9 R9 e A2 A3 C0 - 8 e X X A4 A5
Page Mode Static Column Mode Page Size 256 Bits Page C0 - 7 e A2- 9 C8 - 10 e X X A10 A11 512 Bits Page C0- 8 e A2- 10 C9 10 e X X A11 A12 1024 Bits Page C0- 9 e A2- 11 C10 e X X A12 A13 2048 Bits Page C0- 10 e A2- 12 X A13 A14
Assume that the least significant address bits are used for byte addressing Given a 32-bit system A0 A1 would be used for byte addressing X e DON'T CARE the user can do as he pleases Nibble mode values for R and C assume a system using 1 Mbit DRAMs
FIGURE 30 Page Static Column Nibble Mode System
35
8 0 Test Mode
Staggered refresh in combination with the error scrubbing mode places the DP8420A 21A 22A in test mode In this mode the 24-bit refresh counter is divided into a 13-bit and 11-bit counter During refreshes both counters are incremented to reduce test time 9 2 CALCULATION OF tRAH AND tASC There are two clock inputs to the DP8420A 21A 22A These two clocks DELCLK and CLK can either be tied together to the same clock or be tied to different clocks running asynchronously at different frequencies The clock input DELCLK controls the internal delay line and refresh request clock DELCLK should be a multiple of 2 MHz If DELCLK is not a multiple of 2 MHz tRAH and tASC will change The new values of tRAH and tASC can be calculated by the following formulas If tRAH was programmed to equal 15 ns then tRAH e 30 (((DELCLK Divisor) 2 MHz (DELCLK Frequency))b1) a 15 ns If tRAH was programmed to equal 25 ns then tRAH e 30 (((DELCLK Divisor) 2 MHz (DELCLK Frequency))b1) a 25 ns If tASC was programmed to equal 0 ns then tASC e 15 ((DELCLK Divisor) 2 MHz (DELCLK Frequency)) b 15 ns If tASC was programmed to equal 10 ns then tASC e 25 ((DELCLK Divisor) 2 MHz (DELCLK Frequency)) b 15 ns Since the values of tRAH and tASC are increased or decreased the time to CAS asserted will also increase or decrease These parameters can be adjusted by the following formula Delay to CAS e Actual Spec a Actual tRAH b Programmed tRAH a Actual tASC b Programmed tASC
9 0 DRAM Critical Timing Parameters
The two critical timing parameters shown in Figure 31 that must be met when controlling the access timing to a DRAM are the row address hold time tRAH and the column address setup time tASC Since the DP8420A 21A 22A contain a precise internal delay line the values of these parameters can be selected at programming time These values will also increase and decrease if DELCLK varies from 2 MHz 9 1 PROGRAMMABLE VALUES OF tRAH AND tASC The DP8420A 21A 22A allow the values of tRAH and tASC to be selected at programming time For each parameter two choices can be selected tRAH the row address hold time is measured from RAS asserted to the row address starting to change to the column address The two choices for tRAH are 15 ns and 25 ns programmable through address bit C8 tASC the column address setup time is measured from the column address valid to CAS asserted The two choices for tASC are 0 ns and 10 ns programmable through address bit C7
TL F 8588 - E3
FIGURE 31 tRAH and tASC
36
10 0 Dual Accessing (DP8422A)
The DP8422A has all the functions previously described In addition to those features the DP8422A also has the capabilities to arbitrate among refresh Port A and a second port Port B This allows two CPUs to access a common DRAM array DRAM refresh has the highest priority followed by the currently granted port The ungranted port has the lowest priority The last granted port will continue to stay granted even after the access has terminated until an access request is received from the ungranted port (see Figure 32a ) The dual access configuration assumes that both Port A and Port B are synchronous to the system clock If they are not synchronous to the system clock they should be externally synchronized (Ex By running the access requests through several Flip-Flops see Figure 34a ) 10 1 PORT B ACCESS MODE Port B accesses are initiated from a single input AREQB When AREQB is asserted an access request is generated If GRANTB is asserted and a refresh is not taking place or precharge time is not required RAS will be asserted when AREQB is asserted Once AREQB is asserted it must stay asserted until the access is over AREQB negated negates RAS as shown in Figure 32b Note that if ECAS0 e 1 during programming the CAS outputs may be held asserted (beyond RASn negating) by continuing to assert the appropriate ECASn inputs (the same as Port A accesses) If Port B is not granted the access will begin on the first or second positive edge of CLK after GRANTB is asserted (See R0 R1 programming bit definitions) as shown in Figure 32c assuming that Port A is not accessing the DRAM (CS ADS ALE and AREQ) and RAS precharge for the particular bank has completed It is important to note that for GRANTB to transition to Port B Port A must not be requesting an access at a rising clock edge (or locked) and Port B must be requesting an access at that rising clock edge Port A can request an access through CS and ADS ALE or CS and AREQ Therefore during an interleaved access where CS and ADS ALE become asserted before AREQ from the previous access is negated Port A will retain GRANTB e 0 whether AREQB is asserted or not Since there is no chip select for Port B AREQB must incorporate this signal This mode of accessing is similar to Mode 1 accessing for Port A
TL F 8588 - F9
Explanation of Terms AREQA e AREQB e LOCK e Chip Selected access request from Port A Chip Selected access request from Port B Externally controlled LOCKing of the Port that is currently GRANTed
FIGURE 32a DP8422A Port A Port B Arbitration State Diagram This arbitration may take place during the ``ACCESS'' or ``REFRESH'' state (see Figure 13a )
TL F 8588 - E4
FIGURE 32b Access Request for Port B
TL F 8588 - E5
FIGURE 32c Delayed Port B Access
37
10 0 Dual Accessing (DP8422A) (Continued)
10 2 PORT B WAIT STATE SUPPORT Advanced transfer acknowledge for Port B ATACKB is used for wait state support for Port B This output will be asserted when RAS for the Port B access is asserted as shown in Figures 33a and 33b Once asserted this output will stay asserted until AREQB is negated With external logic ATACKB can be made to interface to any CPU's wait input as shown in Figure 33c 10 3 COMMON PORT A AND PORT B DUAL PORT FUNCTIONS An input LOCK and an output GRANTB add additional functionality to the dual port arbitration logic LOCK allows Port A or Port B to lock out the other port from the DRAM When a Port is locked out of the DRAM wait states will be inserted into its access cycle until it is allowed to access memory GRANTB is used to multiplex the input control signals and addresses to the DP8422A 10 3 1 GRANTB Output The output GRANTB determines which port has current access to the DRAM array GRANTB asserted signifies Port B has access GRANTB negated signifies Port A has access to the DRAM array
TL F 8588 - E6
FIGURE 33a Non-Delayed Port B Access
TL F 8588 - E7
FIGURE 33b Delayed Port B Access
TL F 8588 - 31
B Extend ATACK to 1T after RAS goes low
TL F 8588-30
A Extend ATACK to
T(
Clock) after RAS goes low
TL F 8588 - 32
C Synchronize ATACKB to CPU B Clock This is useful if CPU B runs asynchronous to the DP8422
FIGURE 33c Modifying Wait Logic for Port B
38
10 0 Dual Accessing (DP8422A) (Continued)
Since the DP8422A has only one set of address inputs the signal is used with the addition of buffers to allow the currently granted port's addresses to reach the DP8422A The signals which need to be bufferred are R0-10 C0 - 10 B0 - 1 ECAS0 - 3 WE and LOCK All other inputs are not common and do not have to be buffered as shown in Figure 34a If a Port which is not currently granted tries to access the DRAM array the GRANTB output will transition from a rising clock edge from AREQ or AREQB negating and will precede the RAS for the access by one or two clock periods GRANTB will then stay in this state until the other port requests an access and the currently granted port is not accessing the DRAM as shown in Figure 34b
TL F 8588 - 55
If Port B is synchronous the Request Synchronizing logic will not be required
FIGURE 34a Dual Accessing with the DP8422A (System Block Diagram)
39
10 0 Dual Accessing (DP8422A) (Continued)
TL F 8588 - 29
FIGURE 34b Wait States during a Port B Access 10 3 2 LOCK Input When the LOCK input is asserted the currently granted port can ``lock out'' the other port through the insertion of wait states to that port's access cycle LOCK does not disable refreshes it only keeps GRANTB in the same state even if the other port requests an access as shown in Figure 35a LOCK can be used by either port
TL F 8588 - E8
FIGURE 35 LOCK Function
40
11 0 Absolute Maximum Ratings (Note 1)
If Military Aerospace specified devices are required please contact the National Semiconductor Sales Office Distributors for availability and specifications Temperature under Bias Storage Temperature 0 C to a 70 C b 65 C to a 150 C All Input or Output Voltage with Respect to GND Power Dissipation 20 MHz ESD Rating to be determined
b 0 5V to a 7V
0 5W
12 0 DC Electrical Characteristics TA e 0 C to a 70 C
Symbol VIH VIL VOH1 VOL1 VOH2 VOL2 IIN IIL ML ICC1 ICC1 ICC1 ICC2 ICC2 ICC2 CIN Parameter Logical 1 Input Voltage Logical 0 Input Voltage Q and WE Outputs Q and WE Outputs All Outputs except Qs WE All Outputs except Qs WE Input Leakage Current ML Input Current (Low) Standby Current Standby Current Standby Current Supply Current Supply Current Supply Current Input Capacitance Conditions Tested with a Limited Functional Pattern Tested with a Limited Functional Pattern IOH e b10 mA IOL e 10 mA IOH e b3 mA IOL e 3 mA VIN e VCC or GND VIN e GND CLK at 8 MHz (VIN e VCC or GND)
VCC e 5V g10% GND e 0V Min 20
b0 5
Typ
Max VCC a 0 5 08
Units V V V
VCC b 1 0 05 VCC b 1 0 05
b 10
V V V mA mA mA mA mA mA mA mA pF
10 200 6 8 10 20 40 50 15 17 20 40 75 95 10
CLK at 20 MHz (VIN e VCC or GND) CLK at 25 MHz (VIN e VCC or GND) CLK at 8 MHz (Inputs Active) (ILOAD e 0) (VIN e VCC or GND) CLK at 20 MHz (Inputs Active) (ILOAD e 0) (VIN e VCC or GND) CLK at 25 MHz (Inputs Active) (ILOAD e 0) (VIN e VCC or GND) fIN at 1 MHz
CIN is not 100% tested
41
13 0 AC Timing Parameters
Two speed selections are given the DP8420A 21A 22A-20 and the DP8420A 21A 22A-25 The differences between the two parts are the maximum operating frequencies of the input CLKs and the maximum delay specifications Low frequency applications may use the ``b25'' part to gain improved timing The AC timing parameters are grouped into sectional numbers as shown below These numbers also refer to the timing diagrams 1 - 36 Common parameters to all modes of operation 50 - 56 Difference parameters used to calculate RAS low time RAS precharge time CAS high time and CAS low time 100 - 121 Common dual access parameters used for Port B accesses and inputs and outputs used only in dual accessing 200 - 212 Refresh parameters 300 - 315 Mode 0 access parameters used in both single and dual access applications 400 - 416 Mode 1 access parameters used in both single and dual access applications 450 - 455 Special Mode 1 access parameters which supersede the 400 - 416 parameters when dual accessing 500 - 506 Programming parameters Unless otherwise stated VCC e 5 0V g10% 0 k TA k 70 C the output load capacitance is typical for 4 banks of 18 DRAMs per bank including trace capacitance (see Note 2) Two different loads are specified CL e 50 pF loads on all outputs except CL e CH e CH e CH e 150 pF loads on Q0 - 8 9 10 and WE or 50 pF loads on all outputs except 125 pF loads on RAS0 - 3 and CAS0 -3 and 380 pF loads on Q0 - 8 9 10 and WE
Note 1 ``Absolute Maximum Ratings'' are the values beyond which the safety of the device cannot be guaranteed They are not meant to imply that the device should be operated at these limits The table of ``Electrical Characteristics'' provides conditions for actual device operation Note 2 Input pulse 0V to 3V tR e tF e 2 5 ns Input reference point on AC measurements is 1 5V Output reference points are 2 4V for High and 0 8V for Low Note 3 AC Production testing is done at 50 pF
TL F 8588 - E9
FIGURE 36 Clock DELCLK Timing
42
13 0 AC Timing Parameters (Continued) Unless otherwise stated VCC e 5 0V g10% 0 C k TA k 70 C the output load capacitance is typical for 4 banks of 18 DRAMs per bank including trace capacitance (Note 2)
Two different loads are specified CL e 50 pF loads on all outputs except CL e 150 pF loads on Q0-8 9 10 and WE or CH e 50 pF loads on all outputs except CH e 125 pF loads on RAS0 - 3 and CAS0 -3 and CH e 380 pF loads on Q0 - 8 9 10 and WE 8420A 21A 22A-20 Number Symbol Common Parameter Description Min 1 2 34 5 6 78 9a 9b 9c 9d 10a 10b 11a 11b 12 13 14 15 16 17 18 fCLK tCLKP tCLKPW fDCLK tDCLKP tDCLKPW tPRASCAS0 tPRASCAS1 tPRASCAS2 tPRASCAS3 tRAH tRAH tASC tASC tPCKRAS tPARQRAS tPENCL tPENCH tPARQCAS tPCLKWH tPCLKDL0 CLK Frequency CLK Period CLK Pulse Width DELCLK Frequency DELCLK Period DELCLK Pulse Width RAS Asserted to CAS Asserted (tRAH e 15 ns tASC e 0 ns) RAS Asserted to CAS Asserted (tRAH e 15 ns tASC e 10 ns) (RAS Asserted to CAS Asserted (tRAH e 25 ns tASC e 0 ns) (RAS Asserted to CAS Asserted (tRAH e 25 ns tASC e 10 ns) Row Address Hold Time (tRAH e 15) Row Address Hold Time (tRAH e 25) Column Address Setup Time (tASC e 0) Column Address Setup Time (tASC e 10) CLK High to RAS Asserted following Precharge AREQ Negated to RAS Negated ECAS0-3 Asserted to CAS Asserted ECAS0-3 Negated to CAS Negated AREQ Negated to CAS Negated CLK to WAIT Negated CLK to DTACK Asserted (Programmed as DTACK of 1 2 1 1 or if WAITIN is Asserted) ECAS Negated to WAIT Asserted during a Burst Access ECAS Asserted Setup to CLK High to Recognize the Rising Edge of CLK during a Burst Access 24 0 50 15 5 50 15 30 40 40 50 15 25 0 10 27 38 23 25 60 39 33 20 200 CL Max 20 Min 0 50 15 5 50 15 30 40 40 50 15 25 0 10 32 43 31 33 68 39 33 20 200 CH Max 20 Min 0 40 12 5 50 12 30 40 40 50 15 25 0 10 22 31 20 20 47 31 28 20 200 8420A 21A 22A-25 CL Max 25 Min 0 40 12 5 50 12 30 40 40 50 15 25 0 10 26 35 27 27 54 31 28 20 200 CH Max 25
19 20
tPEWL tSECK
44
44
36
36
24
19
19
43
13 0 AC Timing Parameters (Continued) Unless otherwise stated VCC e 5 0V g10% 0 C k TA k 70 C the output load capacitance is typical for 4 banks of 18 DRAMs per bank including trace capacitance (Note 2)
Two different loads are specified CL e 50 pF loads on all outputs except CL e 150 pF loads on Q0-8 9 10 and WE or CH e 50 pF loads on all outputs except CH e 125 pF loads on RAS0 - 3 and CAS0 -3 and CH e 380 pF loads on Q0 - 8 9 10 and WE 8420A 21A 22A-20 Number Symbol Common Parameter Description Min 21 tPEDL ECAS Asserted to DTACK Asserted during a Burst Access (Programmed as DTACK0) ECAS Negated to DTACK Negated during a Burst Access WAITIN Asserted Setup to CLK WIN Asserted to WE Asserted WIN Negated to WE Negated Row Column Address Valid to Q0-8 9 10 Valid COLINC Asserted to Q0-8 9 10 Incremented COLINC Asserted Setup to ECAS Asserted to Ensure tASC e 0 ns AREQ AREQB Negated Setup to CLK High with 1 Period of Precharge AREQ AREQB Negated Setup to CLK High with l1 Period of Precharge Programmed 18 46 19 34 31 14 20 81 91 91 101 32 90 32 90 15 20 89 99 99 109 32 90 5 34 34 29 34 19 46 19 34 39 14 20 72 82 82 92 32 90 CL Max 48 Min CH Max 48 Min 8420A 21A 22A-25 CL Max 38 Min CH Max 38
22 23 24 25 26 27 28 29a 29b 30 31 32 33 34a 34b 34c 34d 35 36
tPEDH tSWCK tPWINWEH tPWINWEL tPAQ tPCINCQ tSCINEN tSARQCK1 tSARQCK2
49 5
49 5 44 44 38 43 17 37 15
38 5 27 27 26 30 19 37 15 27 25 16 20
38
37 37 35 39
tPAREQDH AREQ Negated to DTACK Negated tPCKCAS tSCADEN tWCINC tPCKCL0 tPCKCL1 tPCKCL2 tPCKCL3 tCAH tPCQR CLK High to CAS Asserted when Delayed by WIN Column Address Setup to ECAS Asserted to Guarantee tASC e 0 COLINC Pulse Width CLK High to CAS Asserted following Precharge (tRAH e 15 ns tASC e 0 ns) CLK High to CAS Asserted following Precharge (tRAH e 15 ns tASC e 10 ns) CLK High to CAS Asserted following Precharge (tRAH e 25 ns tASC e 0 ns) CLK High to CAS Asserted following Precharge (tRAH e 25 ns tASC e 10 ns) Column Address Hold Time (Interleave Mode Only) CAS Asserted to Row Address Valid (Interleave Mode Only)
27 32
79 89 89 99
44
13 0 AC Timing Parameters (Continued) Unless otherwise stated VCC e 5 0V g10% 0 C k TA k 70 C the output load capacitance is typical for 4 banks of 18 DRAMs per bank including trace capacitance (Note 2)
Two different loads are specified CL e 50 pF loads on all outputs except CL e 150 pF loads on Q0-8 9 10 and WE or CH e 50 pF loads on all outputs except CH e 125 pF loads on RAS0 - 3 and CAS0 -3 and CH e 380 pF loads on Q0 - 8 9 10 and WE 8420A 21A 22A-20 Number Symbol Difference Parameter Description Min 50 tD1 (AREQ or AREQB Negated to RAS Negated) Minus (CLK High to RAS Asserted) (CLK High to Refresh RAS Negated) Minus (CLK High to RAS Asserted) (ADS Asserted to RAS Asserted (Mode 1)) Minus (AREQ Negated to RAS Negated) (CLK High to RAS Asserted (Mode 0)) Minus (AREQ Negated to RAS Negated) (ECAS Asserted to CAS Asserted) Minus (ECAS Negated to CAS Negated) (CLK to Refresh RAS Asserted) Minus (CLK to Refresh RAS Negated) (AREQ Negated to RAS Negated) Minus (ADS Asserted to RAS Asserted (Mode 1))
b7
8420A 21A 22A-25 CL Max 16 Min Max 14 Min CH Max 14
CL Max 16 Min
CH
51 52
tD2 tD3a
13
13
11
11
4
4
4
4
53 54 55 56
tD3b tD4 tD5 tD6
4 7 6
b7
4 7 6
b7
4 7 6
b7
4 7 6
12
12
10
10
45
13 0 AC Timing Parameters (Continued) Unless otherwise stated VCC e 5 0V g10% 0 C k TA k 70 C the output load capacitance is typical for 4 banks of 18 DRAMs per bank including trace capacitance (Note 2)
Two different loads are specified CL e 50 pF loads on all outputs except CL e 150 pF loads on Q0-8 9 10 and WE or Common Dual Access Parameter Description Min 100 101 102 103 105 106 107 108 109 110 tHCKARQB tSARQBCK tPAQBRASL tPAQBRASH tPCKRASG AREQB Negated Held from CLK High AREQB Asserted Setup to CLK High AREQB Asserted to RAS Asserted AREQB Negated to RAS Negated CLK High to RAS Asserted for Pending Port B Access CLK High to ATACKB Asserted for Pending Access CLK High to GRANTB Asserted CLK High to GRANTB Negated Row Address Setup to CLK High That Asserts RAS following a GRANTB Change to Ensure tASR e 0 ns for Port B LOCK Asserted Setup to CLK Low to Lock Current Port AREQ Negated to ATACKB Negated AREQB Negated to CAS Negated Address Valid Setup to AREQB Asserted AREQ Negated Held from CLK High AREQB High Pulse Width to Guarantee tASR e 0 ns AREQB Asserted to CAS Asserted (tRAH e 15 ns tASC e 0 ns) AREQB Asserted to CAS Asserted (tRAH e 15 ns tASC e 10 ns) AREQB Asserted to CAS Asserted (tRAH e 25 ns tASC e 0 ns) AREQB Asserted to CAS Asserted (tRAH e 25 ns tASC e 10 ns) CLK High to CAS Asserted for Pending Port B Access (tRAH e 15 ns tASC e 0 ns) CLK High to CAS Asserted for Pending Port B Access (tRAH e 15 ns tASC e 10 ns) CLK High to CAS Asserted for Pending Port B Access (tRAH e 25 ns tASC e 0 ns) CLK High to CAS Asserted for Pending Port B Access (tRAH e 25 ns tASC e 10 ns) Bank Address Valid Setup to CLK High That Starts RAS for Pending Port B Access 46 10 7 5 31 103 113 113 123 11 3 8 43 41 55 57 67 40 35 15 CH e 50 pF loads on all outputs except CH e 125 pF loads on RAS0 - 3 and CAS0 -3 and CH e 380 pF loads on Q0 - 8 9 10 and WE 8420A 21A 22A-20 Number Symbol CL Max Min 3 8 48 46 60 57 67 40 35 11 CH Max Min 3 7 37 32 44 45 51 32 29 16 8420A 21A 22A-25 CL Max Min 3 7 41 36 48 45 51 32 29 CH Max
tPAQBATKBL AREQB Asserted to ATACKB Asserted tPCKATKB tPCKGH tPCKGL tSADDCKG
111 112 113 114 116 117 118a 118b 118c 118d 120a
tSLOCKCK tPAQATKBH tPAQBCASH tSADAQB tHCKARQG tWAQB tPAQBCAS0 tPAQBCAS1 tPAQBCAS2 tPAQBCAS3 tPCKCASG0
5 26 59
5 26 67 11 5 35 111 121 121 131
5 21 47 7 5 26 87 97 97 107
5 21 54 12 5 31 94 104 104 114
113
121
96
103
120b
tPCKCASG1
123
131
106
113
120c
tPCKCASG2
123
131
106
113
120d
tPCKCASG3
133
141
116
123
121
tSBADDCKG
10
10
10
13 0 AC Timing Parameters (Continued)
TL F 8588 - F0
FIGURE 37 100 Dual Access Port B
TL F 8588 - F1
FIGURE 38 100 Port A and Port B Dual Access
47
13 0 AC Timing Parameters (Continued) Unless otherwise stated VCC e 5 0V g10% 0 C k TA k 70 C the output load capacitance is typical for 4 banks of 18 DRAMs per bank including trace capacitance (Note 2)
Two different loads are specified CL e 50 pF loads on all outputs except CL e 150 pF loads on Q0-8 9 10 and WE or Refresh Parameter Description Min 200 201 202 204 205 206 207 208 209a tSRFCK tSDRFCK tSXRFCK tPCKRFL tPARQRF tPCKRFH tPCKRFRASH tPCKRFRASL tPCKCL0 RFSH Asserted Setup to CLK High DISRFSH Asserted Setup to CLK High EXTENDRF Setup to CLK High CLK High to RFIP Asserted AREQ Negated to RFIP Asserted CLK High to RFIP Negated CLK High to Refresh RAS Negated CLK High to Refresh RAS Asserted CLK High to CAS Asserted during Error Scrubbing (tRAH e 15 ns tASC e 0 ns) CLK High to CAS Asserted during Error Scrubbing (tRAH e 15 ns tASC e 10 ns) CLK High to CAS Asserted during Error Scrubbing (tRAH e 25 ns tASC e 0 ns) CLK High to CAS Asserted during Error Scrubbing (tRAH e 25 ns tASC e 10 ns) RFSH Pulse Width CLK High to RFRQ Asserted CLK High to RFRQ Negated 15 46 50 27 28 15 39 62 65 35 28 82 CH e 50 pF loads on all outputs except CH e 125 pF loads on RAS0 - 3 and CAS0 -3 and CH e 380 pF loads on Q0 - 8 9 10 and WE 8420A 21A 22A-20 Number Symbol CL Max Min 27 28 15 39 62 65 40 33 90 CH Max Min 22 22 12 31 50 51 29 23 73 8420A 21A 22A-25 CL Max Min 22 22 12 31 50 51 33 27 80 CH Max
209b
tPCKCL1
92
100
83
90
209c
tPCKCL2
92
100
83
90
209d
tPCKCL3
102 15
110 15 46 50
93 15 40 40
100
210 211 212
tWRFSH tPCKRQL tPCKRQH
40 40
TL F 8588 - F2
FIGURE 39 200 Refresh Timing 48
13 0 AC Timing Parameters (Continued) Unless otherwise stated VCC e 5 0V g10% 0 C k TA k 70 C the output load capacitance is typical for 4 banks of 18 DRAMs per bank including trace capacitance (Note 2)
Two different loads are specified CL e 50 pF loads on all outputs except CL e 150 pF loads on Q0-8 9 10 and WE or Mode 0 Access Parameter Description Min 300 301a tSCSCK tSALECKNL CS Asserted to CLK High ALE Asserted Setup to CLK High Not Using On-Chip Latches or if Using On-Chip Latches and B0 B1 Are Constant Only 1 Bank ALE Asserted Setup to CLK High if Using On-Chip Latches if B0 B1 Can Change More Than One Bank ALE Pulse Width Bank Address Valid Setup to CLK High Row Column Valid Setup to CLK High to Guarantee tASR e 0 ns Row Column Bank Address Held from ALE Negated (Using On-Chip Latches) Row Column Bank Address Setup to ALE Negated (Using On-Chip Latches) CLK High to RAS Asserted CLK High to CAS Asserted (tRAH e 15 ns tASC e 0 ns) CLK High to CAS Asserted (tRAH e 15 ns tASC e 10 ns) CLK High to CAS Asserted (tRAH e 25 ns tASC e 0 ns) CLK High to CAS Asserted (tRAH e 25 ns tASC e 10 ns) ALE Negated Hold from CLK High WIN Asserted Setup to CLK High to Guarantee CAS is Delayed CS Asserted to WAIT Asserted CS Negated to WAIT Negated CLK High to DTACK Asserted (Programmed as DTACK0) ALE Asserted to WAIT Asserted (CS is Already Asserted) AREQ Negated to CLK High That Starts Access RAS to Guarantee tASR e 0 ns (Non-Interleaved Mode Only) tPCKCV0 CLK High to Column Address Valid (tRAH e 15 ns tASC e 0 ns) 41 0
b 21
CH e 50 pF loads on all outputs except CH e 125 pF loads on RAS0 - 3 and CAS0 -3 and CH e 380 pF loads on Q0 - 8 9 10 and WE 8420A 21A 22A-20 8420A 21A 22A-25 CL Max Min 13 Max Min 13 CH Max
Number
Symbol
CL Max Min 14 14
CH
16
16
15
15
301b
tSALECKL
29 18 20 11
29 18 20 15
29 13 18 11
29 13 18 16
302 303 304
tWALE tSBADDCK tSADDCK
305
tHASRCB
10
10
8
8
306
tSRCBAS
3 27 81 91 91 101
3 32 89 99 99 109 0
b 21
2 22 72 82 82 92 0
b 16
2 26 79 89 89 99 0
b 16
307 308a 308b 308c 308d 309 310 311 312 313 314 315
tPCKRL tPCKCL0 tPCKCL1 tPCKCL2 tPCKCL3 tHCKALE tSWINCK tPCSWL tPCSWH tPCLKDL1 tPALEWL
26 30 40 35
26 30 40 35
22 25 32 29
22 25 32 29
45
34
39
316
78
87
66
75
49
13 0 AC Timing Parameters (Continued)
TL F 8588 - F3
FIGURE 40 300 Mode 0 Timing
50
13 0 AC Timing Parameters (Continued)
TL F 8588 - F4
(Programmed as C4 e 1 C5 e 1 C6 e 1)
FIGURE 41 300 Mode 0 Interleaving
51
13 0 AC Timing Parameters (Continued) Unless otherwise stated VCC e 5 0V g10% 0 C k TA k 70 C the output load capacitance is typical for 4 banks of 18 DRAMs per bank including trace capacitance (Note 2)
Two different loads are specified CL e 50 pF loads on all outputs except CL e 150 pF loads on Q0-8 9 10 and WE or Mode 1 Access Parameter Description Min 400a 400b tSADSCK1 tSADSCKW ADS Asserted Setup to CLK High ADS Asserted Setup to CLK (to Guarantee Correct WAIT or DTACK Output Doesn't Apply for DTACK0) CS Setup to ADS Asserted ADS Asserted to RAS Asserted ADS Asserted to CAS Asserted (tRAH e 15 ns tASC e 0 ns) ADS Asserted to CAS Asserted (tRAH e 15 ns tASC e 10 ns) ADS Asserted to CAS Asserted (tRAH e 25 ns tASC e 0 ns) ADS Asserted to CAS Asserted (tRAH e 25 ns tASC e 10 ns) Row Address Valid Setup to ADS Asserted to Guarantee tASR e 0 ns ADS Negated Held from CLK High WAITIN Asserted Setup to ADS Asserted to Guarantee DTACK0 Is Delayed Bank Address Setup to ADS Asserted Row Column Bank Address Held from ADS Asserted (Using On-Chip Latches) Row Column Bank Address Setup to ADS Asserted (Using On-Chip Latches) ADS Negated Pulse Width ADS Asserted to DTACK Asserted (Programmed as DTACK0) WIN Asserted Setup to ADS Asserted (to Guarantee CAS Delayed during Writes Accesses) ADS Asserted to WAIT Asserted (Programmed as WAIT0 Delayed Access) ADS Asserted to WAIT Asserted (Programmed WAIT 1 2 or 1) CLK High to DTACK Asserted (Programmed as DTACK0 Delayed Access) AREQ Negated to ADS Asserted to Guarantee tASR e 0 ns (Non Interleaved Mode Only) tPADSCV0 ADS Asserted to Column Address Valid (tRAH e 15 ns tASC e 0 ns) 52 38
b 10
CH e 50 pF loads on all outputs except CH e 125 pF loads on RAS0 - 3 and CAS0 -3 and CH e 380 pF loads on Q0 - 8 9 10 and WE 8420A 21A 22A-20 8420A 21A 22A-25 CL Max Min 13 25 5 35 94 104 104 114 13 0 0 11 10 3 16 43 43 9 0 0 11 10 2 12 35 25 75 85 85 95 14 0 0 11 10 2 17 35 Max Min 13 25 5 29 82 92 92 102 CH Max
Number
Symbol
CL Max Min 15 31 6 30 86 96 96 106 9 0 0 11 10 3 12 15 31 6
CH
401 402 403a 403b 403c 403d 404 405 406
tSCSADS tPADSRL tPADSCL0 tPADSCL1 tPADSCL2 tPADSCL3 tSADDADS tHCKADS tSWADS
407 408 409 410 411 412
tSBADAS tHASRCB tSRCBAS tWADSH tPADSD tSWINADS
b 10
b 10
b 10
413 414 415
tPADSWL0 tPADSWL1 tPCLKDL1
35 35
35 35
29 29
29 29
40
40
32
32
416
42
31
36
417
83
92
69
78
13 0 AC Timing Parameters (Continued)
TL F 8588 - F5
FIGURE 42 400 Mode 1 Timing
53
13 0 AC Timing Parameters (Continued)
TL F 8588 - F6
FIGURE 43 400 COLINC Page Static Column Access Timing
54
13 0 AC Timing Parameters (Continued) Unless otherwise stated VCC e 5 0V g10% 0 C k TA k 70 C the output load capacitance is typical for 4 banks of 18 DRAMs per bank including trace capacitance (Note 2)
Two different loads are specified CL e 50 pF loads on all outputs except CL e 150 pF loads on Q0-8 9 10 and WE or Mode 1 Dual Access Parameter Description Min 450 tSADDCKG Row Address Setup to CLK High That Asserts RAS following a GRANTB Port Change to Ensure tASR e 0 ns CLK High to RAS Asserted for Pending Access CLK to DTACK Asserted for Delayed Accesses (Programmed as DTACK0) CLK High to CAS Asserted for Pending Access (tRAH e 15 ns tASC e 0 ns) CLK High to CAS Asserted for Pending Access (tRAH e 15 ns tASC e 10 ns) CLK High to CAS Asserted for Pending Access (tRAH e 25 ns tASC e 0 ns) CLK High to CAS Asserted for Pending Access (tRAH e 25 ns tASC e 10 ns) Bank Address Valid Setup to CLK High that Asserts RAS for Pending Access ADS Asserted Setup to CLK High 5 12 11 CH e 50 pF loads on all outputs except CH e 125 pF loads on RAS0 - 3 and CAS0 -3 and CH e 380 pF loads on Q0 - 8 9 10 and WE 8420A 21A 22A-20 Number Symbol CL Max Min 15 CH Max Min 11 8420A 21A 22A-25 CL Max Min 16 CH Max
451 452 453a
tPCKRASG tPCLKDL2 tPCKCASG0
48 53
53 53
38 43
42 43
101
109
86
93
453b
tPCKCASG1
111
119
96
103
453c
tPCKCASG2
111
119
96
103
453d
tPCKCASG3
121
129
106
113
454 455
tSBADDCKG tSADSCK0
5 12
4 11
4 11
55
13 0 AC Timing Parameters (Continued) Unless otherwise stated VCC e 5 0V g10% 0 C k TA k 70 C the output load capacitance is typical for 4 banks of 18 DRAMs per bank including trace capacitance (Note 2)
Two different loads are specified CL e 50 pF loads on all outputs except CL e 150 pF loads on Q0-8 9 10 and WE or CH e 50 pF loads on all outputs except CH e 125 pF loads on RAS0 - 3 and CAS0 -3 and CH e 380 pF loads on Q0 - 8 9 10 and WE 8420A 21A 22A-20 Number Symbol Programming Parameter Description Min 500 501 502 503 504 505 506 tHMLADD tSADDML tWML tSADAQML Mode Address Held from ML Negated Mode Address Setup to ML Negated ML Pulse Width Mode Address Setup to AREQ Asserted 8 6 15 0 51 6 10 CL Max Min 8 6 15 0 51 6 10 CH Max Min 7 6 15 0 38 6 10 8420A 21A 22A-25 CL Max Min 7 6 15 0 38 6 10 CH Max
tHADAQML Mode Address Held from AREQ Asserted tSCSARQ tSMLARQ CS Asserted Setup to AREQ Asserted ML Asserted Setup to AREQ Asserted
TL F 8588 - F7
FIGURE 44 500 Programming
56
14 0 Functional Differences between the DP8420A 21A 22A and the DP8420 21 22
1 Extending the Column Address Strobe (CAS) after AREQ Transitions High The DP8420A 21A 22A allows CAS to be asserted for an indefinite period of time beyond AREQ (or AREQB DP8422A only Scrubbing refreshes are not affected ) being negated by continuing to assert the appropriate ECAS inputs This feature is allowed as long as the ECAS0 input was negated during programming The DP8420 21 22 does not allow this feature 2 Dual Accessing The DP8420A 21A 22A asserts RAS either one or two clock periods after GRANTB has been asserted or negated depending upon how the R0 bit was programmed during the mode load operation The DP8420 21 22 will always start RAS one clock period after GRANTB is asserted or negated The above statements assume that RAS precharge has been completed by the time GRANTB is asserted or negated 3 Refresh Request Output (RFRQ) The DP8420A 21A 22A allows RFRQ (refresh request) to be output on the WE output pin given that ECAS0 was negated during programming or the controller was programmed to function in the address pipelining (memory interleaving) mode The DP8420 21 22 only allows RFRQ to be output during the address pipelining mode 4 Clearing the Refresh Request Clock Counter The DP8420A 21A 22A allows the internal refresh request clock counter to be cleared by negating DISRFSH and asserting RFSH for at least 500 ns The DP8420 21 22 clears the internal refresh request clock counter if DISRFSH remains low for at least 500 ns Once the internal refresh request clock counter is cleared the user is guaranteed that an internally generated RFRQ will not be generated for at least 13 ms - 15 ms (depending upon how programming bits C0 1 2 3 were programmed)
5
6 7
8
15 0 DP8420A 21A 22A User Hints
1 All inputs to the DP8420A 21A 22A should be tied high low or the output of some other device
Note One signal is active high COLINC (EXTNDRF) should be tied low to disable
wrap board) because they may be needed The value of these damping resistors (if needed) will vary depending upon the output the capacitance of the load and the characteristics of the trace as well as the routing of the trace The value of the damping resistor also may vary between the wire-wrap board and the printed circuit board To determine the value of the series damping resistor it is recommended to use an oscilloscope and look at the furthest DRAM from the DP8420A 21A 22A The undershoot of RAS CAS WE and the addresses should be kept to less than 0 5V below ground by varying the value of the damping resistor The damping resistors should be placed as close as possible with short leads to the driver outputs of the DP8420A 21A 22A The circuit board must have a good VCC and ground plane connection If the board is wire-wrapped the VCC and ground pins of the DP8420A 21A 22A the DRAM associated logic and buffer circuitry must be soldered to the VCC and ground planes The traces from the DP8420A 21A 22A to the DRAM should be as short as possible ECAS0 should be held low during programming if the user wishes that the DP8420A 21A 22A be compatible with a DP8420 21 22 design Parameter Changes due to Loading All A C parameters are specified with the equivalent load capacitances including traces of 64 DRAMs organized as 4 banks of 18 DRAMs each Maximums are based on worst-case conditions If an output load changes then the A C timing parameters associated with that particular output must be changed For example if we changed our output load to C e 250 pF loads on RAS0 - 3 and CAS0 -3 C e 760 pF loads on Q0 - 9 and WE we would have to modify some parameters (not all calculated here) $308a clock to CAS asserted (tRAH e 15 ns tASC e 0 ns) A ratio can be used to figure out the timing change per change in capacitance for a particular parameter by using the specifications and capacitances from heavy and light load timing Ratio e $308a w Heavy Load b $308a w Light Load CH(CAS) b CL(CAS)
2 Each ground on the DP8420A 21A 22A must be decoupled to the closest on-chip supply (VCC) with 0 1 mF ceramic capacitor This is necessary because these grounds are kept separate inside the DP8420A 21A 22A The decoupling capacitors should be placed as close as possible with short leads to the ground and supply pins of the DP8420A 21A 22A 3 The output called ``CAP'' should have a 0 1 mF capacitor to ground 4 The DP8420A 21A 22A has 20X series damping resistors built into the output drivers of RAS CAS address and WE RFRQ Space should be provided for external damping resistors on the printed circuit board (or wire-
79 ns b 72 ns 7 ns e 125 pF b 50 pF 75 pF $308a (actual) e (capacitance difference c ratio) a $308a (specified) 7 ns e (250 pF b 125 pF) a 79 ns 75 pF e 11 7 ns a 79 ns e 90 7 ns 250 pF load 9 It is required that the user perform a hardware reset of the DP8420A 21A 22A before programming and using the chip A hardware reset consists of asserting both ML and DISRFSH for a minimum of 16 positive edges of CLK see Section 3 1
e
57
DP8420A 21A 22A microCMOS Programmable 256k 1M 4M Dynamic RAM Controller Drivers
Physical Dimensions inches (millimeters)
Lit
103064
Plastic Chip Carrier (V) Order Number DP8420AV-20 DP8420AV-25 DP8421AV-20 or DP8421AV-25 NS Package Number V68A
Plastic Chip Carrier (V) Order Number DP8422AV-20 or DP8422AV-25 NS Package Number V84A
LIFE SUPPORT POLICY NATIONAL'S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF THE PRESIDENT OF NATIONAL SEMICONDUCTOR CORPORATION As used herein 1 Life support devices or systems are devices or systems which (a) are intended for surgical implant into the body or (b) support or sustain life and whose failure to perform when properly used in accordance with instructions for use provided in the labeling can be reasonably expected to result in a significant injury to the user
National Semiconductor Corporation 1111 West Bardin Road Arlington TX 76017 Tel 1(800) 272-9959 Fax 1(800) 737-7018
2 A critical component is any component of a life support device or system whose failure to perform can be reasonably expected to cause the failure of the life support device or system or to affect its safety or effectiveness
National Semiconductor Europe Fax (a49) 0-180-530 85 86 Email cnjwge tevm2 nsc com Deutsch Tel (a49) 0-180-530 85 85 English Tel (a49) 0-180-532 78 32 Fran ais Tel (a49) 0-180-532 93 58 Italiano Tel (a49) 0-180-534 16 80
National Semiconductor Hong Kong Ltd 13th Floor Straight Block Ocean Centre 5 Canton Rd Tsimshatsui Kowloon Hong Kong Tel (852) 2737-1600 Fax (852) 2736-9960
National Semiconductor Japan Ltd Tel 81-043-299-2309 Fax 81-043-299-2408
National does not assume any responsibility for use of any circuitry described no circuit patent licenses are implied and National reserves the right at any time without notice to change said circuitry and specifications
This datasheet has been download from: www..com Datasheets for electronics components.


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