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FSUSB30 Low Power 2-Port Hi-Speed USB 2.0 (480Mbps) Switch
February 2006
FSUSB30 Low Power 2-Port Hi-Speed USB 2.0 (480Mbps) Switch
General Description
The FSUSB30 is a Low Power, 2-Port Hi-Speed USB 2.0 switch. This part is configured as a DPDT switch and is optimized for switching between two Hi-Speed (480Mbps) sources or a Hi-Speed and Full Speed (12Mbps) source. The FSUSB30 is compatible with the requirements of USB2.0 and features an extremely low On Capacitance (CON) of 6.5pF. The wide bandwidth of this device (720MHz), exceeds the bandwidth needed to pass the 3rd harmonic, resulting in signals with minimum edge and phase distortion. Superior channel-to-channel crosstalk also minimizes interference. The FSUSB30 contains special circuitry on the D+/Dpins which allows the device to withstand an overvoltage condition. This device is also designed to minimize current consumption even when the control voltage applied to the S pin, is lower than the supply voltage (VCC). This feature is especially valuable to Ultra-Portable applications such as cell phones, allowing for direct interface with the General Purpose I/Os of the baseband processor. Other applications include switching and connector sharing in portable cell phones, PDAs, digital cameras, printers, and notebook computers.
Features
Low On Capacitance, 6.5pF (typical) Low On Resistance, 6.5 (typical) Low power consumption (1A maximum)

- 10A maximum ICCT over and expanded control voltage range (VIN = 2.6V, VCC = 4.3V) Wide -3dB bandwidth, >720MHz 8KV ESD protection Power OFF protection when VCC = 0V, D+/D- pins can tolerate up to 4.3V Packaged in: - Pb-Free 10-lead MicroPakTM (1.6mm x 2.1mm) - Pb-Free 14-lead DQFN - Pb-Free 10-lead MSOP (preliminary)
Applications
Cell phone, PDA, Digital Camera, and Notebook LCD Monitor, TV, and Set-top Box
Ordering Information
Order Number
FSUSB30L10X FSUSB30BQX FSUSB30MUX (Preliminary)
Package Number
MAC010A MLP014A MUA10A
Package Description
Pb-Free 10-Lead MicroPak, 1.6 mm x 2.1mm Pb-Free 14-Terminal Depopulated Quad Very-Thin Flat Pack No Leads (DQFN), JEDEC MO-241, 2.5 x 3.0mm 10-Lead Molded Small Outline Package (MSOP), JEDEC MO-187, 3.0mm Wide
Pb-Free package per JEDEC J-STD-020B.
Application Diagram
1D+ USB2.0 Controller Set Top Box (STB) CPU or DSP Processor VCC FSUSB30 D+ 1D- USB Connector D- 2D+ DVR or Mass Storage Controller 2D- Control S OE
MicroPak is a trademark of Fairchild Semiconductor Corporation.
(c)2006 Fairchild Semiconductor Corporation
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FSUSB30 Rev. 1.0.1
FSUSB30 Low Power 2-Port Hi-Speed USB 2.0 (480Mbps) Switch
Connection Diagrams
Pad Assignments for MicroPak
HSD1- HSD2- OE
Analog Symbol
HSD1+ D+ HSD2+
D-
HSD1- D- HSD2-
9
8
7
6
VCC
10
5
GND
S OE Control
1
2
3
4
HSD1+
HSD2+
S
D+
(Top View)
Pin Descriptions
Pin Name
OE S D+, D-, HSDn+, HSDn- NC
13 12 11 10 9
Description
Bus Switch Enable Select Input Data Ports No Connect
Pad Assignments for DQFN
NC
1
VCC
14
S HSD1+ NC HSD2+ D+
2 3 4 5 6 7 8
OE HSD1- NC HSD2- D-
Truth Table
S
X L H
OE
H L L
Function
Disconnect D+, D- = HSD1n D+, D- = HSD2n
GND NC
(Top Through View)
Pin Assignment for MSOP
S HSD1+ HSD2+ D+ GND VCC OE HSD1- HSD2- D-
1
10
2 3 4
9 8 7
5
6
(Top Through View)
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FSUSB30 Rev. 1.0.1
FSUSB30 Low Power 2-Port Hi-Speed USB 2.0 (480Mbps) Switch
Absolute Maximum Ratings
(The "Absolute Maximum Ratings" are those values beyond which the safety of the device cannot be guaranteed. The device should not be operated at these limits. The parametric values defined in the Electrical Characteristics tables are not guaranteed at the absolute maximum ratings. The "Recommended Operating Conditions" table will define the conditions for actual device operation.)
Symbol
VCC VCNTRL VSW Supply Voltage DC Input Voltage1 DC Switch Voltage1 HSDnX D+, D- DC Input Diode Current DC Output Current Storage Temperature ESD (Human Body Model) All Pins I/O to GND
Parameter
Rating
-0.5V to +4.6V -0.5V to +4.6V -0.5V to VCC + 0.3V -0.5V to +4.6V -50mA 50mA -65C to +150C 8 KV 8 KV
Recommended Operating Conditions2
Symbol
VCC VIN Supply Voltage Control Input Voltage Switch Input Voltage Operating Temperature Thermal Resistance, 10 MicroPak
Parameter
Rating
3.0V to 4.3V 0V to VCC 0V to VCC -40C to +85C 250C/W
Notes: 1. The input and output negative voltage ratings may be exceeded if the input and output diode current ratings are observed. DC switch voltage may never exceed 4.6V. 2. Control input must be held HIGH or LOW and it must not float.
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FSUSB30 Rev. 1.0.1
FSUSB30 Low Power 2-Port Hi-Speed USB 2.0 (480Mbps) Switch
DC Electrical Characteristics
(All typical values are @ 25C unless otherwise specified.)
TA = -40C to +85C Symbol
VIK VIH VIL IIN IOZ IOFF RON RON RON Flatness ICC ICCT
Parameter
Clamp Diode Voltage Input Voltage HIGH Input Voltage LOW Control Input Leakage OFF State Leakage Power OFF Leakage Current (D+, D-) Switch On Resistance3 Delta RON4 RON Flatness
3
Conditions
IIN = -18mA
VCC (V)
3.0 3.0 to 3.6 4.3 3.0 to 3.6 4.3
Min
1.3 1.7
Typ
Max
-1.2
Units
V V V
0.5 0.7 -1.0 -2.0 -2.0 6.5 0.35 2.0 1.0 10.0 1.0 2.0 2.0 9.0
V V A A A A A
VSW = 0.0V to VCC 0 Dn, HSD1n, HSD2n VCC VSW = 0V to 4.3V, VCC = 0V VSW = 0.8V, ION = -8mA VSW = 0.8V, ION = -8mA VSW = 0.0V - 1.0V, ION = -8mA VCNTRL = 0.0V or VCC, IOUT = 0 VCNTRL (control input) = 2.6V
4.3 4.3 0 3.0 3.0 3.0 4.3 4.3
Quiescent Supply Current Increase in ICC Current per Control Voltage
AC Electrical Characteristics
(All typical values are for VCC = 3.3V @ 25C unless otherwise specified.)
TA = -40C to +85C Symbol
tON tOFF tPD TBBM OIRR Xtalk BW
Parameter
Turn On Time S, OE to Output Turn OFF Time S, OE to Output Propagation Delay4 Break-Before-Make OFF Isolation (Non-Adjacent) Non-Adjacent Channel Crosstalk -3dB Bandwidth
Conditions
HD1n, HD2n = 0.8V, RL = 50, CL = 5pF HD1n, HD2n = 0.8V, RL = 50, CL = 5pF RL = 50, CL = 5pF RL = 50, CL = 5pF, VIN = 0.8V f = 240MHz, RT = 50 RT = 50, f = 240MHz RT = 50, CL = 0pF RT = 50, CL = 5pF
VCC (V)
3.0 to 3.6 3.0 to 3.6 3.3 3.0 to 3.6 3.0 to 3.6 3.0 to 3.6 3.0 to 3.6
Min
Typ
13.0 12.0 0.25
Max
30.0 25.0
Figure Units Number
ns ns ns Figure 8 Figure 8 Figure 6 Figure 7 Figure 9 Figure 12 Figure 13 Figure 11
2.0 -30.0 -45.0 720 550
6.5
ns dB dB MHz
Notes: 3. Measured by the voltage drop between Dn, HSD1n, HSD2n pins at the indicated current through the switch. On Resistance is determined by the lower of the voltage on the two ports. 4. Guaranteed by characterization.
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FSUSB30 Rev. 1.0.1
FSUSB30 Low Power 2-Port Hi-Speed USB 2.0 (480Mbps) Switch
USB Hi-Speed Related AC Electrical Characteristics
Symbol
tSK(O) tSK(P)
Parameter
Channel-to-Channel Skew5 Skew of Opposite Transitions of the Same Output5 Total Jitter5
Conditions
RL = 50, CL = 5pF RL = 50, CL = 5pF
VCC (V)
3.0 to 3.6 3.0 to 3.6
TA = -40C to +85C Min Typ
50.0 20.0
Max
Units
ps ps
Figure Number
Figure 6 Figure 10 Figure 6 Figure 10
tJ
RL = 50, CL = 5pF, tR = tF = 500ps at 480 Mbps (PRBS = 215 - 1)
3.0 to 3.6
200
ps
Notes: 5. Guaranteed by characterization.
Capacitance
Symbol
CIN CON COFF
Parameter
Control Pin Input Capacitance D1n, D2n, Dn ON Capacitance D1n, D2n OFF Capacitance
Conditions
VCC = 0V VCC = 3.3, OE = 0V VCC and OE = 3.3
TA = -40C to +85C Min Typ
1.5 6.5 2.5
Max
Units
pF pF pF
Figure Number
Figure 15 Figure 14 Figure 15
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FSUSB30 Rev. 1.0.1
FSUSB30 Low Power 2-Port Hi-Speed USB 2.0 (480Mbps) Switch
Typical Characteristics
Freqency Response
0 -1 -2 Gain (dB) -3 -4 -5 -6 -7 -8 1 10 100 Frequency (MHz) 1000 10000
Figure 1. Gain vs. Frequency, CL = 0pF, VCC = 3.3V
Freqency Response
0 -10 -20 -30 -40 -50 -60 -70 -80 -90 -100 -110 -120 1
Off Isolation (dB)
10 Frequency (MHz)
100
1000
Figure 2. OFF Isolation, VCC = 3.3V
Freqency Response
0 -10 -20 -30 -40 -50 -60 -70 -80 -90 -100 -110 -120 1
Crosstalk (dB)
10 Frequency (MHz)
100
1000
Figure 3. Crosstalk, VCC = 3.3V
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FSUSB30 Rev. 1.0.1
FSUSB30 Low Power 2-Port Hi-Speed USB 2.0 (480Mbps) Switch
Test Diagrams
VON FSUSB30 NC Dn VIN GND Select VS = 0 to VCC RON = VON / ION GND ION Select GND VS = 0 or VCC Each switch port is tested separately. IDn(OFF)
FSUSB30 HSDn
A
VIN
Figure 4. On Resistance
Figure 5. OFF Leakage
FSUSB30 HSDn D+, D- VIN GND RS CL GND VSel GND RL, RS, and CL are functions of the application environment (see AC Electrical tables for specific values). CL includes test fixture and stray capacitance. VOH Output: D+, D- VOL tPLH tPHL
50% 50%
tRISE = 500ps RL VOUT 800mV Input: HSDn+, HSDn- 400mV
90% 50% 10% 90% 50%
tFALL = 500ps
10%
Figure 6. AC Test Circuit Load
Figure 7. Switch Propagation Delay Waveforms
tRISE = 2.5ns VCC Input - S, OE GND
10% 90% VCC/2 90% VCC/2
tFALL = 2.5ns
10%
VOH Output - VOUT VOL tON
90%
90%
tOFF
Figure 8. Turn ON / Turn OFF Waveform
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FSUSB30 Rev. 1.0.1
FSUSB30 Low Power 2-Port Hi-Speed USB 2.0 (480Mbps) Switch
VCC VCC VO HSDn D+, D- HSDn RL S Control Input GND VOUT CL* VOUT Control Input VCC
50%
0V
tR = tF = 2.5ns (10-90%)
0.9 x VOUT tD
*CL includes test fixture and stray capacitance.
Figure 9. Break-before-Make (TBBM)
tRISE = 500ps 800mV Input: D+, D- 400mV tRISE = 500ps 800mV Input: HSDn+ HSDn- 400mV
10% 90% 50% 10% 90% 50% 90% 50%
tFALL = 500ps
10%
tFALL = 500ps VOH Output1: HSD1+ HSD1- VOL
10%
90% 50%
50%
50%
tPLH1
tPHL1
VOH Output: D+, D- VOL tPLH TSK(P) = | tPHL - tPLH | Pulse Skew, TSK(P) tPHL
50% 50%
VOH Output1: D2+, D2- VOL tPLH2 tPHL2
50% 50%
TSK(O) = | tPLH1 - tPLH2 | or | tPHL1 - tPHL2 | Output Skew, TSK(OUT)
Figure 10. Switch Skew Tests
Network Analyzer FSUSB30 VIN GND VSel GND VOUT GND RS and RT are functions of the application environment (See AC Electrical Tables for specific values). RT GND RS VS GND
Figure 11. Bandwidth
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FSUSB30 Rev. 1.0.1
FSUSB30 Low Power 2-Port Hi-Speed USB 2.0 (480Mbps) Switch
Network Analyzer FSUSB30 VIN RT VSel GND GND GND OFF-Isolation = 20 Log (VOUT / VIN) VOUT RT GND GND RS VS GND
Figure 12. Channel OFF Isolation
NC FSUSB30
Network Analyzer RS VIN GND VS GND RT GND
VSel GND
GND RS and RT are functions of the application environment (50, 75 or 100) Crosstalk = 20 Log (VOUT / VIN)
RT GND
VOUT
Figure 13. Non-Adjacent Channel-to-Channel Crosstalk
Capacitance Meter F = 1MHz
Dn
FSUSB30 S VSel = 0 or VCC Capacitance Meter F = 1MHz
Dn
FSUSB30 S VSel = 0 or VCC D1n, D2n
D1n, D2n
Figure 14. Channel ON Capacitance
Figure 15. Channel OFF Capacitance
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FSUSB30 Rev. 1.0.1
FSUSB30 Low Power 2-Port Hi-Speed USB 2.0 (480Mbps) Switch
Tape and Reel Specifications
Tape Format for MircoPak Package Designator
L10X
Tape Section
Leader (Start End) Carrier Trailer (Hub End)
Number Cavities
125 (typ) 5000 75 (typ)
Cavity Status
Empty Filled Empty
Cover Tape Status
Sealed Sealed Sealed
Tape Dimension inches (millimeters)
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FSUSB30 Rev. 1.0.1
FSUSB30 Low Power 2-Port Hi-Speed USB 2.0 (480Mbps) Switch
Reel Dimension for MircoPak inches (millimeters)
Tape Size
8 mm
A
7.0 (177.8)
B
0.059 (1.50)
C
0.512 (13.00)
D
0.795 (20.20)
N
2.165 (55.00)
W1
0.331 + 0.059/-0.000 (8.40 + 1.50/-0.00)
W2
0.567 (14.40)
W3
W1 + 0.078/-0.039 (W1 + 2.00/-1.00)
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FSUSB30 Rev. 1.0.1
FSUSB30 Low Power 2-Port Hi-Speed USB 2.0 (480Mbps) Switch
Tape Format for DQFN Package Designator
BQX
Tape Section
Leader (Start End) Carrier Trailer (Hub End)
Number Cavities
125 (typ) 2500/3000 75 (typ)
Cavity Status
Empty Filled Empty
Cover Tape Status
Sealed Sealed Sealed
Tap Dimensions inches (millimeters)
12
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FSUSB30 Rev. 1.0.1
FSUSB30 Low Power 2-Port Hi-Speed USB 2.0 (480Mbps) Switch
Reel Dimensions for DQFN inches (millimeters)
Tape Size
12 mm
A
13.0 (330)
B
0.059 (1.50)
C
0.512 (13.00)
D
0.795 (20.20)
N
7.008 (178)
W1
0.488 (12.4)
W2
0.724 (18.4)
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FSUSB30 Rev. 1.0.1
FSUSB30 Low Power 2-Port Hi-Speed USB 2.0 (480Mbps) Switch
Physical Dimensions inches (millimeters) unless otherwise noted
Pb-Free 10-Lead MicroPak, 1.6 mm x 2.1mm Package Number MAC010A
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FSUSB30 Rev. 1.0.1
FSUSB30 Low Power 2-Port Hi-Speed USB 2.0 (480Mbps) Switch
Pb-Free 14-Terminal Depopulated Quad Very-Thin Flat Pack No Leads (DQFN), JEDEC MO-241, 2.5 x 3.0mm Package Number MLP014A
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FSUSB30 Rev. 1.0.1
FSUSB30 Low Power 2-Port Hi-Speed USB 2.0 (480Mbps) Switch
SEE DETAIL A
DETAIL A
10-Lead Molded Small Outline Package (MSOP), JEDEC MO-187, 3.0mm Wide Package Number MUA10A
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FSUSB30 Rev. 1.0.1
FSUSB30 Low Power 2-Port Hi-Speed USB 2.0 (480Mbps) Switch
TRADEMARKS
The following are registered and unregistered trademarks Fairchild Semiconductor owns or is authorized to use and is not intended to be an exhaustive list of all such trademarks.
ACExTM FAST(R) ActiveArrayTM FASTrTM BottomlessTM FPSTM Build it NowTM FRFETTM CoolFETTM GlobalOptoisolatorTM CROSSVOLTTM GTOTM DOMETM HiSeCTM EcoSPARKTM I2CTM E2CMOSTM i-LoTM EnSignaTM ImpliedDisconnectTM FACTTM IntelliMAXTM FACT Quiet SeriesTM Across the board. Around the world.TM The Power Franchise(R) Programmable Active DroopTM
DISCLAIMER
ISOPLANARTM LittleFETTM MICROCOUPLERTM MicroFETTM MicroPakTM MICROWIRETM MSXTM MSXProTM OCXTM OCXProTM OPTOLOGIC(R) OPTOPLANARTM PACMANTM POPTM Power247TM PowerEdgeTM
PowerSaverTM PowerTrench(R) QFET(R) QSTM QT OptoelectronicsTM Quiet SeriesTM RapidConfigureTM RapidConnectTM SerDesTM ScalarPumpTM SILENT SWITCHER(R) SMART STARTTM SPMTM StealthTM SuperFETTM SuperSOTTM-3
SuperSOTTM-6 SuperSOTTM-8 SyncFETTM TCMTM TinyLogic(R) TINYOPTOTM TruTranslationTM UHCTM UltraFET(R) UniFETTM VCXTM WireTM
FAIRCHILD SEMICONDUCTOR RESERVES THE RIGHT TO MAKE CHANGES WITHOUT FURTHER NOTICE TO ANY PRODUCTS HEREIN TO IMPROVE RELIABILITY, FUNCTION OR DESIGN. FAIRCHILD DOES NOT ASSUME ANY LIABILITY ARISING OUT OF THE APPLICATION OR USE OF ANY PRODUCT OR CIRCUIT DESCRIBED HEREIN; NEITHER DOES IT CONVEY ANY LICENSE UNDER ITS PATENT RIGHTS, NOR THE RIGHTS OF OTHERS. LIFE SUPPORT POLICY FAIRCHILDiS PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF FAIRCHILD SEMICONDUCTOR CORPORATION. As used herein: 2. A critical component is any component of a life 1. Life support devices or systems are devices or support device or system whose failure to perform can systems which, (a) are intended for surgical implant into be reasonably expected to cause the failure of the life the body, or (b) support or sustain life, or (c) whose support device or system, or to affect its safety or failure to perform when properly used in accordance with instructions for use provided in the labeling, can be effectiveness. reasonably expected to result in significant injury to the user. PRODUCT STATUS DEFINITIONS Definition of Terms Datasheet Identification Advance Information Product Status Formative or In Design Definition This datasheet contains the design specifications for product development. Specifications may change in any manner without notice. This datasheet contains preliminary data, and supplementary data will be published at a later date. Fairchild Semiconductor reserves the right to make changes at any time without notice in order to improve design. This datasheet contains final specifications. Fairchild Semiconductor reserves the right to make changes at any time without notice in order to improve design.
Preliminary
First Production
No Identification Needed
Full Production
Obsolete
Not In Production
This datasheet contains specifications on a product that has been discontinued by Fairchild semiconductor. The datasheet is printed for reference information only.
Rev. I18
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FSUSB30 Rev. 1.0.1

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