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 HT0610 33120 LCD Driver
Features
* Operating voltage: 2.4V~3.5V * 33 common/120 segment LCD driver output * 33120=3960 bits capacity of built-in graphic display * External contrast control * Low power icon mode driven by com32 * Four static icon driver circuit * High accuracy voltage regulator with temperature co-
data RAM (BGDRAM)
* Master and slave mode available for multi-chip
efficient (0.00%, -0.18%, -0.22%, -0.35%)
* Low power consumption - Read/write mode 170mA (Typical) - Display mode 160mA (Typical) - Standby mode 15mA (Typical; Display off; internal
operation
* 8-bit Parallel interface with general MCU * On-chip oscillator circuit for display clock, external
clock can also be used
* Selectable multiplex ratio: 1/16, 1/32, 1/33 * Selectable bias ratio: 1/5 or 1/7 * External driving circuit for external bias supply * On-chip selectable voltage doublers and tripler * Wide range of operating temperature: -30C to 85C * S/W controlled electronic contrast control function
oscillator enable)
- Standby mode < 1mA (Typical; Display off; external
oscillator enable)
* CMOS process * TCP available
(16 levels)
General Description
The HT0610 is a driver and controller LSI for graphic dot-matrix liquid crystal display systems. It has 33 common and 120 segment driver circuits. This chip is connected directly to an MCU, accepts 8-bit parallel display data and stores an on-chip graphic display data RAM (BGDRAM) of 33120 bits. It provides a high-flexible display section due to the one-to-one correspondence between BGDRAM bits and LCD panel pixels. It performs BGDRAM read/write operation with no externally operating clock to minimize power consumption. In addition, because it contains power supply circuits necessary to drive an LCD, it is possible to make a display system with minimal components.
Rev. 1.00
1
February 24, 2004
HT0610
Block Diagram
IB P IC O N 0 ~ IC O N 3 SEG 0~SEG 119 CO M 0~CO M 32
S ta tic Ic o n C o n tr o l C ir c u it
H ig h V o lta g e C e ll L e v e l S h ifte r
Level S e le c to r VLL2
1 5 5 B its L a tc h ( 3 3 B its & 1 2 0 B its )
VLL6 VCCA1 L C D D r iv in g V o lta g e G e n e r a to r D o u b le r & T r ip le r V o lta g e R e g u la to r , V o lta g e D iv id e r , C o n tr a s t C o n tr o l, T e m p e ra tu re C o m p e n s a tio n C ir c u it VR C2 C2 C1 C1 DU DU C+ CVD N P N M2 M1 DA VF P
OSC1 OSC2
T im in g G e n e r a to r fo r D is p la y
VDD VSS
BGDRAM 1 2 0 3 3 B its
C o m m a n d D e c o d e r C ir c u it
C o m m a n d In te rfa c e
P a r a lle l In te r fa c e
C S (C L K ) D C O M
RES
CE
RW
D0~D7
Operation of LCD Driver
Description of block diagram module Block Description
This module determines whether the input data is interpreted as data or command. Data is directed to this module based upon the input of the DCOM pin. If DCOM High, then data is written to BGDRAM ( Built-in Graphic Display data RAM) . DCOM pin Low indicates that the input at D0~D7 is interpreted as a Command. Command Decoder and CE is the master chip selection signal . A High input enable the input lines ready to samCommand Interface ple signals. RES pin of same function as Power On Reset (POR). Once RES received the reset signal, all internal circuitry will back to its initial status. Refer to Command Description section for more information. The parallel interface consists of 8 bi-directional data lines (D0~D7),RW, and CS. The RW input High indicates a read operation from the BGDRAM . RW input Low indicates a write to BGDRAM or Internal Command Registers depending on the status of DCOM pin input. The CS input serves as data latch signal (clock).
Parallel Interface
The BGDRAM is a bit mapped static RAM holding the bit pattern to be displayed. The Built-in Graphic Display size of the BGDRAM is determined by number of row times the number of column data RAM (BGDRAM) (12033 =3960 bits). Figure as follow is a description of the BGDRAM address map. For mechanical flexibility, re-mapping on both Segment and Common outputs are provided This module is an on chip low power RC oscillator circuitry. The oscillator frequency can be selected in the range of 15kHz to 50kHz by external resistor. One can enable the circuitry by software command. For external clock provided, feed the clock to OSC2 and leave OSC1 open.
Display Timing Generator
Rev. 1.00
2
February 24, 2004
HT0610
Block Static Icon Control Circuit Description This module generates the LCD waveform of the 4 annunciators and IBP signal. The four independent static icons are enabled by software command. Icon signals are also controlled by oscillator circuit, too. This module generates the LCD voltage needed for display output. It takes a single supply input and generates necessary bias voltages. It consists of:
* Voltage doubler and voltage tripler
To generate the VCCA1 voltage. Either doubler or tripler can be enabled.
* Voltage regulator
Feedback gain control for initial LCD voltage. It can also be used with external contrast control.
* Voltage divider
LCD Driving Voltage Generator
Divide the LCD display voltage (VLL2~VLL6) from the regulator output. This is low power consumption circuit, which can save the most display current compare with traditional resistor ladder method.
* Bias Ratio Selection circuitry
Software control of 1/5 and 1/7 bias ratios to match the characteristic of LCD panel.
* Self adjust temperature compensation circuitry
Provide 4 different compensation grade selections to satisfy the various liquid crystal temperature grades. The grading can be selected by software control.
* Contrast Control Block
Software control of 16 voltage levels of LCD voltage.
* External Contrast Control
By adjusting the gain control resistors connected externally, the contrast can be varied. All blocks can be individually turned off if external voltage generator is employed. 120 Bit Latch/33 Bit Latch 153 bit long registers, which carry the display signal information. First 33 bits are Common driving signals and other 120 bits are Segment driving signals. Data will be input to the HV-buffer Cell for bumping up to the required level. Level selector is a control of the display synchronization. Display voltage can be separated into two sets and used with different cycles. Synchronization is important since it selects the required LCD voltage level to the HV Buffer Cell for output signal voltage pump. HV Buffer Cell works as a level shifter that translates the low voltage output signal to the required driving voltage. The output is shifted out with an internal FRM clock, which comes from the Display Timing Generator. The voltage levels are given by the level selector which is synchronized with the internal M signal.
Level Selector
HV Buffer Cell (Level Shifter)
Rev. 1.00
3
February 24, 2004
HT0610
Pin Assignment
DUMMY 197 196 195 194 193 192 1 1 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 36 37 38 47 46 45 44 43 42 41 40 39 COM COM COM COM IC O N IC O N IC O N IC O N IB P 19 18 17 16 0 1 2 3 184 183 182 181 180 179 178 177 176 COM COM COM COM SEG SEG SEG SEG SEG 0 1 2 3 4 12 13 14 15 2 COM COM COM COM COM COM 0 1 2 3 4 32
DUMMY VS OSC VS V S R S
VF VCCA1 CC+ DUM2 OSC2 DUM1 VLL6 VLL5 VLL4 VLL3 VLL2 C2N C2P C1N C1P VDDA VSS CE D7 D6 D5 D4 D3 D2 D1 D0 VSS C S (C L K ) RW DCOM VSS RES VDD DUMMY
63 62 61 60 59 58 57 56
SEG SEG SEG COM COM COM COM COM
117 118 119 32 31 30 29 28
DUMMY
Rev. 1.00
4
February 24, 2004
HT0610
Pin Description
Pin Name VDD RES VSS DCOM I/O I I I I Description VDD is the positive supply to the digital control circuit and other circuitry in LCD bias voltage generator (Must have same voltage level with VDDA) Active low reset pin; reset all internal status of circuit (Same as power on reset) VSS is ground If pull this pin High then D0~D7 bi-direction bus is used for data transferring; If DCOM pin is Low then D0~D7 bi-direction bus is used for command transferring. If pull this pin high: Indicate we want to read the display data RAM or the internal state. If we force this to Low: Indicate we want to write data to display data RAM or write some internal state to registers. This pin is normal low clock input. Data on D0~D7 bi-direction data bus are latched at the falling edge of CS Those bi-direction pins are used for DATA or command transferring. High input to this pin to enable the control pins on the driver. Oscillator input pin. For internal oscillator mode, this is an input for the internal low power RC oscillator circuit. In this mode, an external resistor of certain value is placed between the OSC1 and OSC2 pins. For external oscillator mode, OSC1 pin should be left open
RW
I
CS D0~D7 CE
I B I
OSC1
I
OSC2
Oscillator output pin For internal oscillator mode, this is an output for the internal low power RC oscillator circuit. O External Oscillator input For external oscillator mode, OSC2 will be an input pin for external clock and no external resistor is needed. 3/4 If internal DC/DC converter is enabled, a capacitor is required to connect these two pins. 3/4 If internal tripler is enabled, a capacitor is required to connect these two pins. Otherwise, leave these pin open.
C1P, C1N C2P, C2N
VLL2~VLL6
Group of voltage level pins for driving the LCD panel. They can either be connected to external O driving circuit for external bias supply or connected internally to built-in divider circuit. For internal voltage divider enable, a 0.1mF capacitor to VSS is required on each pin. O If internal voltage divider is enable with 1/7 bias selected, a capacitor to VSS is required on each pin. Otherwise, pull these two pin to VSS
DUM1, DUM2 C+, CVCCA1
3/4 If internal divider circuit is enable, a capacitor is required to connect between these two pin O If internal DC/DC Converter is enabled, a 0.1mF capacitor from this pin to VSS is required. It can also be an external bias input pin if internal DC/DC converter is not used
VF, VR
This is a feedback path for the gain control (external contrast control) of VLL1 to VLL6. For adjusting the LCD driving voltage, it requires a feedback resistor placed between VR and VF, a 3/4 gain control resistor placed between VF and VSS, a 10uF capacitor placed between VR and VSS. O These pins provide the row driving signal to LCD panel I VDDA is the positive supply to the noise sensitive circuitry and must have same voltage level with VDD
COM0~COM32 VDDA ICON1~ICON4 IBP SEG0~SEG119
O There are four independent annunciator driving outputs O This pin combines with ICON1~ICON4 pins to form annunciator driving part. O These 120 pins provide LCD column driving signal to LCD panel.
Rev. 1.00
5
February 24, 2004
HT0610
Absolute Maximum Ratings
Supply Voltage ........................................-0.3V to 4.0V Input Voltage .............................VSS-0.3V to VDD+0.3V LCD Input Voltage ..................................-0.3V to 10.5V Note: These are stress ratings only. Stresses exceeding the range specified under Absolute Maximum Ratings may cause substantial damage to the device. Functional operation of this device at other conditions beyond those listed in the specification is not implied and prolonged exposure to extreme conditions may affect device reliability. HT0610 contains circuitry to protect the inputs against damage due to high static voltages or electric fields; however, it is advised that normal precaution to be taken to avoid application of any voltage higher than maximum rated voltages to this high impedance circuit . For proper operation it is recommended that VIN and Vout be constrained to the range VSS < or = (VIN or VOUT) < or = VDD. Reliability of operation is enhanced if unused inputs are connected to an appropriate logic voltage level (e.g., either VSS or VDD). Unused outputs must be left open. This device may be light sensitive? caution should be taken to avoid exposure of this device to any light source during normal operation. This device is not radiation protected. Storage Temperature ...........................-65C to 150C Operating Temperature ..........................-30C to 85C
Electrical Characteristics
Symbol Supply voltage VDD Operating Voltage 2.4V~ VDDA=VDD 3.5V 2.4 3.15 3.5 Parameter Test Conditions VDD Conditions Min. Typ.
Ta=25C Max. Unit
V
Supply Current Measure with VDD fixed at 3.15V Internal DC/DC converter on, Read/write Mode 2.4V~ display on, tripler enable, Supply Current Drain from Pin VDDA 120 3.5V read/write accessing, and VDD tCYC=1MHz, Osc freq.=50kHz, 1/33 duty, 1/7 bias Internal DC/DC converter on, display on, tripler enable, Display on Mode 2.4V~ read/write HALT, Supply Current Drain from Pin VDDA 3.5V Osc freq.=50kHz, 1/33 duty, and VDD 1/7 bias
IRW
170
200
mA
ION1
130
110
140
mA
ION2
Internal DC/DC converter on, display on, tripler enable, Display on Mode 2.4V~ 140 read/write HALT, Supply Current Drain from Pin VDDA 3.5V Osc freq.=38.4kHz, 1/33 duty, and VDD 1/7 bias Standby Mode Supply Current Drain 2.4V~ Display off, oscillator disabled, from Pin VDDA and VDD 3.5V read/write HALT Display off, oscillator enabled, Standby Mode Supply Current Drain 2.4V~ read/write HALT, external osfrom Pin VDDA and VDD 3.5V cillator and frequency=50kHz Display off, oscillator enabled, Standby Mode Supply Current Drain 2.4V~ read/write HALT, internal oscilfrom Pin VDDA and VDD 3.5V lator and frequency=50kHz Low power ICON mode, oscillaStandby Mode Supply Current Drain 2.4V~ tor enable, read/write HALT, from Pin VDDA and VDD 3.5V internal oscillator and frequency=50kHz 3/4 3/4
100
120
mA
ISTB1
300
500
nA
ISTB2
0.6
1
mA
ISTB3
3/4
23
30
mA
IICON
3/4
25
30
mA
Rev. 1.00
6
February 24, 2004
HT0610
Symbol Parameter Test Conditions VDD Conditions Min. Typ. Max. Unit
VLCD voltage (Absolute value referenced to VSS) Display on, internal DC/DC converter enable, tripler enLCD Driving Voltage 2.4V~ a b l e , o sci l l a t o r a n d f r eGenerator Output Voltage at Pin 3.5V quency=50kHz, regulator VCCA1 e n a b l e , d i vi d e r e n a b l e IOUT100mA Display on, internal DC/DC converter enable, doubler enLCD Driving Voltage 2.4V~ a b l e , o sci l l a t o r a n d f r eGenerator Output Voltage at Pin 3.5V quency=50kHz, regulator VCCA1 e n a b l e , d i vi d e r e n a b l e IOUT100mA LCD Driving Voltage Input at Pin 2.4V~ Internal DC/DC converter disVCCA1 3.5V able
VLCC1
3/4
3VDD
10.5
V
VLCC2
3/4
2VDD
7
V
VLCD
5
3/4
10.5
V
Output voltage VOH1 VOL1 VR1 VR2 Output High Voltage at Pin D0~D7, 2.4V~ IOUT=100mA ICON1~ICON4, IBP and OSC2 3.5V Output Low Voltage at Pin D0~D7, ICON1~ICON4, IBP and OSC2 2.4V~ IOUT=100mA 3.5V 0.8 VDD 0 0 3/4 3/4 3/4 3/4 Floating VDD 0.2 VDD VCCA1 3/4 V V V V
LCD Driving Voltage Source at Pin 2.4V~ Regulator enable, IOUT=50mA VR 3.5V LCD Driving Voltage Source at Pin 2.4V~ Regulator disable VR 3.5V
Input voltage VIH1 Input High Voltage at Pin RES, CE, 2.4V~ CS, D0~D7, RW, DCOM, OSC1 and 3.5V OSC2 Input Low Voltage at Pin RES, CE, 2.4V~ CS, D0~D7, RW, DCOM, OSC1 and 3.5V OSC2 3/4 0.8 VDD 3/4 VDD V
VIL1
3/4
0
3/4
0.2 VDD
V
LCD display voltage VLL6 VLL5 VLL4 VLL3 VLL2 2.4V~ 3.5V 2.4V~ 3.5V LCD Driving Voltage Output from Pin 2.4V~ 1/5 bias ratio, voltage divider VLL6~VLL2 3.5V enable, regulator enable 2.4V~ 3.5V 2.4V~ 3.5V 3/4 3/4 3/4 3/4 3/4 VR 0.8VR 0.6VR 0.4VR 0.2VR 3/4 3/4 3/4 3/4 3/4 V V V V V
Rev. 1.00
7
February 24, 2004
HT0610
Symbol VLL6 VLL5 VLL4 DUM2 DUM1 VLL3 VLL2 VLL6 VLL5 VLL4 VLL3 VLL2 Output Current IOH Output High Current Source from 2.4V~ VOUT=VDD-0.1V Pins D0~D7, ICON1~ICON4, IBP 3.5V and OSC2 Output Low Current Drain by Pins 2.4V~ VOUT=0.1V D0~D7, ICON1~ICON4, IBP and 3.5V OSC2 Output Tri-state Current Drain 2.4V~ Source at Pins D0~D7 and OSC2 3.5V Input Current at Pins RES, CE, CS, 2.4V~ D0~D7, RW, DCOM, OSC1 and 3.5V OSC2 3/4 3/4 3/4 1.5 3/4 mA Parameter Test Conditions VDD 2.4V~ 3.5V 2.4V~ 3.5V 2.4V~ 3.5V 2.4V~ 1/7 bias ratio, voltage divider 3.5V enable, regulator enable 2.4V~ 3.5V 2.4V~ 3.5V 2.4V~ 3.5V 2.4V~ 3.5V 2.4V~ 3.5V Conditions Min. 3/4 3/4 3/4 3/4 3/4 3/4 3/4
0.5 VCCA1 0.5 VCCA1
Typ. VR 6/7VR 5/7VR 4/7VR 3/7VR 2/7VR 1/7VR 3/4 3/4 3/4 3/4 3/4
Max. 3/4 3/4 3/4 3/4 3/4 3/4 3/4 VCCA1 VCCA1 VCCA1
0.5 VCCA1 0.5 VCCA1
Unit V V V V V V V
2.4V~ External voltage generator, 0.5 3.5V internal voltage divider disable VCCA1 2.4V~ 3.5V 2.4V~ 3.5V vss vss
IOL
3/4 -1 -1
5
3/4
mA
IOZ
3/4 3/4
1
mA mA
IIL/IIH
1
On resistance During display on, 0.1V apply Channel Resistance between LCD Driving Signal Pins (Segment and 2.4V~ b e t w e e n t w o t e r m i n a l s, Common) and Driving Voltage Input 3.5V VCCA1 within operating voltage range Pins (VLL2 to VLL6) Memory Retention Voltage (VDD) 2.4V~ Standby Mode, Retained All Internal 3.5V Configuration and BGDRAM Data Input Capacitance All Control Pins 2.4V~ 3.5V 3/4 3/4
RON
3/4
3/4
5
kW
VMR
1.8
3/4
3/4
V
CIN
3/4
5
7.5
pF
Rev. 1.00
8
February 24, 2004
HT0610
Symbol Parameter Test Conditions VDD Conditions Min. Typ. Max. Unit
Temperature coefficient compensation PTC0 PTC1 PTC2 PTC3 Flat Temperature Coefficient Temperature Coefficient 1* Temperature Coefficient 2* Temperature Coefficient 3* 2.4V~ TC1=0, TC2=0, 3.5V regulator disable 2.4V~ TC1=0, TC2=1, 3.5V regulator enable 2.4V~ TC1=1, TC2=0, 3.5V regulator enable 2.4V~ TC1=1, TC2=1, 3.5V regulator enable 3/4 3/4 3/4 3/4 0 -0.18 -0.22 -0.35 3/4 3/4 3/4 3/4 % % % %
VCON
Internal Contrast Control VR Output Voltage with Internal Contrast ConInternal regulator enabled, trol Selected 2.4V~ internal contrast control en16 Voltage Levels Controlled by Soft3.5V abled ware Each Level is Typical of 2.25% of the Regulator Output Voltage
3/4
18
3/4
%
Oscillator frequency FOSC1 Oscillator Frequency of Display Tim2.4V~ ing Generator with 60Hz Frame FreSet clock frequency to slow 3.5V quency Oscillator Frequency of Display Tim2.4V~ Set clock frequency to normal ing Generator with 60Hz Frame Fre3.5V quency Four Static ICON Display (50% Duty 2.4V~ Cycle) from Pins ICON1~ICON4 and 3.5V IBP Four Static ICON Display (50% Duty 2.4V~ Cycle) from Pins ICON1~ICON4 and 3.5V IBP LCD Driving Signal Frame Frequency 3/4 3/4 38.4 3/4 kHz
FOSC2
3/4
50
3/4
kHz
FICON1
3/4
18.75
3/4
Hz
FICON2
3/4
3/4
24.4
3/4
Hz
FFRAME1
Either external clock input or 2.4V~ internal oscillator enable, ei3.5V ther 1/32 or 1/16 duty cycle, graphic display mode Either external clock input or 2.4V~ internal oscillator enable, ei3.5V ther 1/32 or 1/16 duty cycle Either external clock input or 2.4V~ internal oscillator enable, 1/33 3.5V duty cycle, graphic display mode Either external clock input or 2.4V~ internal oscillator enable, 1/33 3.5V duty cycle
3/4
66
3/4
Hz
FFRAME2
LCD Driving Signal Frame Frequency
3/4
65
3/4
Hz
FCON1
LCD Driving Signal Frame Frequency
3/4
64
3/4
Hz
FCON2
LCD Driving Signal Frame Frequency
3/4
63
3/4
Hz
Internal oscillation frequency OSC Internal OSC Oscillation Frequency 2.4V~ Internal oscillator enable with Different Value of Feedback Re3.5V within operation range sistor See the figure as follow
Note: * The formula for the temperature coefficient is: TC (%)= VR at 50o C - VR at 0o C 1 100% 50o C - 0o C VR at 25o C
Rev. 1.00
9
February 24, 2004
HT0610
Total variation of VR D VRT is affected by the following factors: Process variation of regulator D VR External VDD variation contributed to regulator D VVDD External resistor pair Ra/Rf contributed to regulator D VRES Where D VRT = DVR
2
DVVDD
2
DVRES
2
Assume external VDD variation is 6% at 3.15V and 1% variation resistor used at application TC Level TC0 TC1 Reference Generator TC2 TC3 Parallel timing characteristics (Write cycle) Symbol tCYCLE tEH tAS tDS tDH tAH Parameter Enable Cycle Time Enable Pulse Width Address Setup Time Data Setup Time Data Hold Time Address Hold Time Min. 620 300 10 300 30 30 D VVDD (%) 6.0 4.0 2.5 1.4 2.5 1.414 D VR (%) D VRES (%) D VRT (%) 6.652 4.924 3.805 3.195 Ta=30C~85C, DVDD=2.4V~3.5V, VSS=0V Typ. 3/4 3/4 3/4 3/4 3/4 3/4 Max. 3/4 3/4 3/4 3/4 3/4 3/4 Unit ns ns ns ns ns ns
CE
tC
YCLE
C S (C L K )
tE
H
RW tA
S
tA
H
DCOM
tD
S
tD
H
D0~D7
V a lid D a ta
Timing characteristics (Write cycle)
Rev. 1.00
10
February 24, 2004
HT0610
Parallel timing characteristics (Read cycle) Symbol tCYCLE tEH tAS tDS tDH tAH Parameter Enable Cycle Time Enable Pulse Width Address Setup Time Data Setup Time Data Hold Time Address Hold Time Min. 620 300 10 3/4 10 30 Ta=30C~85C, DVDD=2.4V~3.5V, VSS=0V Typ. 3/4 3/4 3/4 3/4 3/4 3/4 Max. 3/4 3/4 3/4 300 3/4 3/4 Unit ns ns ns ns ns ns
CE
tC
YCLE
C S (C L K )
tE
H
RW tA
S
tA
H
DCOM
tD
S
tD
H
D0~D7
V a lid D a ta
Timing characteristics (Read cycle)
Rev. 1.00
11
February 24, 2004
HT0610
Functional Description
300
250
O s c illa to r F r e q u e n c y (k H z )
200
150
100
50
0 100K 150K 200K 240K 300K 360K 430K 510K 560K 620K 680K 750K 820K 910K 1M 1 .5 M 2 .0 M R e s is to r v a lu e o n O S C 1 & O S C 2 (W )
Internal oscillator frequency relationship with different external resistor value
* Set clock frequency to slow: FFRAME1=FOSC1/576 * Set clock frequency to normal: FFRAME2=FOSC2/768
C o lu m n a d d r e s s 0 0 H ( o r c lo u m n a d d r e s s 7 7 H ) LSB C o lu m n a d d r e s s 7 7 H ( o r c lo u m n a d d r e s s 0 0 H ) COM0 (C O M 3 1 )
Page 1
MSB Page 2
Page 3
Page 4 COM0 (C O M 3 1 ) CO M 32
SEG0
Page 5
SEG 119
Built-in graphic display data RAM (BGDRAM) address map
Rev. 1.00
12
February 24, 2004
HT0610
Command Description The display on command turns the LCD common and segment outputs on and has no effect to the static icons output. This command causes the conversion of data in BGDRAM to necessary waveforms on the common and segment driving outputs. The on-chip bias generator is also turned on by this command. (Note: oscillator on command should be sent before display on is selected.) The display off command turns the display off and the states of the LCD driver are as follow during display off:
Set Display On/Off (Display Mode/Standby Mode) * The common and segment outputs are fixed at VLL1(VSS)
* The bias voltage generator is turned off. * The RAM and content of all register are retained. * IC will accept new commands and data.
* The status of the static Icons and oscillator are not affected by display off com-
mand. Set BGDRAM Page Address Master Clear BGDRAM This command positions the row address to 1 of 5 possible positions in BGDRAM. This command is to clear the 480 byte BGDRAM by setting the RAM data to zero. Issue this command followed by a dummy writes command. The RAM for icon line will not be affected by this command. This command is used to clear the data in page 5 of BGDRAM, which stores the icon line data. Before using this command, set the page address to page 5 by the command set BGDRAM page address. A dummy write data is also needed after this master clear Icons command to make the clear icon action effective. If 1/32 Mux selected, use this command change to 1/33 Mux for using the Icon line. This command can also change Icon display mode to normal display mode (1/32 or 1/33 MUX). This command forces the output to the icon display mode. Display on row 0 to row 31 will be disabled. The contrast of the icon line and static icon in icon mode can be set by this command. There are four levels to select from. This command is used to scroll the screen vertically with scroll value 0 to 31. With scroll value equals to 0, row 0 of BGDRAM is mapped to com 0 and row 1 through row 31 are mapped to com 1 through com 31 respectively. With scroll value equal to 1, row 1 of BGDRAM is mapped to com 0, then row 2 through row 31 will be mapped to com 1 through com 30 respectively and row 0 will be mapped to com 31. Com 32 is not affected by this command. With bit option=1 in this command, the save/restore column address command saves a copy of the column address of BGDRAM. With a bit option=0, this command restores the copy obtained from the previous execution of saving column address. This instruction is very useful for writing full graphics characters that are larger than 8 pixels vertically. This instruction selects the mapping of BGDRAM to segment drivers for mechanical flexibility. There are 2 mappings to select: Set Column Mapping
* Column 0~column 119 of BGDRAM mapped to SEG0~SEG119 respectively * Column 0~column 119 of BGDRAM mapped to SEG119~SEG0 respectively
Master Clear Icons
Set Display with Icon Line
Set Icon Display Mode Set Icon Line/Static Icon Contrast Level
Set Vertical Scroll Value
Save/Restore BGDRAM Column Address
COM 32 will not be affected by this command. Detailed information please refer to section display output description. This instruction selects the mapping of BGDRAM to common drivers for mechanical flexibility. There are 2 mappings to select: Set Row Mapping
* Row 0~Row 31 of BGDRAM mapped to COM 0~COM 31 respectively. * Row 0~Row 31 of BGDRAM mapped to COM 31~COM 0 respectively.
COM 32 will not be affected by this command. Detail information please refer to section display output description.
Rev. 1.00
13
February 24, 2004
HT0610
Command Set Static Icon Control Signal Description This command is used to control the active states of the 4 stand-alone icons drivers. This command is used to either disable or enable the oscillator. For using internal or external oscillator, this command should be executed. The setting for this command is not affected by command set display on/off and set static Icon control signal. Refer to command set internal/external oscillator for more information.
Set Oscillator Disable/Enable
This command is used to select either internal or external oscillator. When internal Set Internal/External Oscillator oscillator is selected, feedback resistor between OSC1 and OSC2 is needed. For external oscillation circuit, feed clock input signal to OSC2 and leaves OSC1 open. Use this command to choose from two different oscillation frequency (50kHz or 38.4kHz) to get the 60Hz frame frequency. With frequency high, 50kHz clock frequency is preferred. 38.4kHz clock frequency (low frequency) enable for power saving purpose. Use this command selects the internal DC/DC converter to generate the VDDA1 from VDD. Disable the internal DC/DC converter if external VCCA1 is provided. Use this command to choose doubler or tripler when the internal DC/DC converter is enabled. Choose bit option 0 to disable the internal regulator. Choose bit option 1 to enable internal regulator, which consists of the internal contrast control and temperature compensation circuits.
Set Clock Frequency
Set DC/DC Converter On/Off Set Voltage Doubler/Tripler
Set Internal Regulator On/Off
If the internal voltage divider is disabled, external bias can be used for VLL6 to Set Internal Voltage Divider VLL2. If the internal voltage divider is enabled, the internal circuit will automatically select the correct bias level according to the number of multiplex. Refer to comOn/Off mand bias ratio select. Set Duty Cycle This command is to select 16 mux or 32 mux display. When 16 mux is enabled, the unused 16 common outputs will be swinging between VLL2 and VLL5 for dummy scan purpose and doubler will be used. This command sets the 1/5 bias or 1/7 bias for the divider output. The selection should match the characteristic of LCD panel.
Set Bias Ratio
This command is used to turn on or off the internal control of delta voltage of the Set Internal Contrast Control bias voltages. With bit option=1, the software selection for delta bias voltage conOn/Off trol is enabled. With bit option=0, internal contrast control is disabled. If the internal contrast control is enabled, this command is used to increase or deIncrease/Decrease Contrast crease the contrast level within the 16 contrast levels. The contrast level starts from Level lowest value after power on reset. Set Contrast Level This command is to select one of the 16 contrast levels when internal contrast control circuitry is in use. This command allows the user to read the current contrast level value. With RW input HIGH (READ), DCOM input LOW (Command) and D7, D6, D5 and D4 are equal to 0001, the value if the internal contrast value can be read on D0~D3 at the falling edge of CS. This command can select 4 different LCD driving voltage temperature coefficients to match various liquid crystal temperature grades. Those temperature coefficients are specified in electrical characteristics table.
Read Contrast Value
Set Temperature Coefficient
S e t I D D R educ t i on M o d e By using this command to reduce the display clock frequency by HALT. Use in Icon On/Off mode to reduce standby current
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Command table Bit Pattern (D7~D0) Command Comment
00000X2X1X0
Set BGDRAM page address using X2X1X0 as address bits. X2X1X0=000: page 1 (POR; initial state) X2X1X0=001: page 2 Set BGDRAM Page Address X2X1X0=010: page 3 X2X1X0=011: page 4 X2X1X0=100: page 5 Set one of the 4 available values to the icon and annunciator contrast, using X1X0 as data bits. X1X0=00 (Von=0.87VDD) X1X0=01 (Von=0.71VDD) X1X0=10 (Von=0.61VDD) (POR initial state) X1X0=11 (Von=0.55VDD) Set one of the 16 available values to the internal contrast register, using X3X2X1X0 as data bits. The contrast register is reset to 0000 during POR With DCOM pin input low, RW pin input high, and D7~d4 pins equal to 0001 at the rising edge of CS, the value of the internal contrast register will be latched out at D3, D2, D1 and D0 pins, i.e. X3X2X1X0 at the rising edge of CS. X0=0: Select voltage tripler (POR initial state) X0=1: Select voltage doubler X0=0: COL0 to SEG0 (POR initial state) X0=1: COL0 to SEG119 X0=0: ROW0 to COM0 (POR initial state) X0=1: ROW0 to COM31
000011X1X0
Set Icon Line/Annunciator Contrast Level
0001X3X2X1X0
Set Contrast Level
0001X3X2X1X0
Read Contrast Value
0010000X0 0010001X0 0010010X0 0010011X0 0010100X0 0010101X0
Set Voltage Doubler/Tripler Set Column Mapping Set Row Mapping Reserved Set Display On/Off Set DC/DC Converter On/Off
X0=0: Display off (POR initial state) X0=1: Display on X0=0: DC/DC converter off (POR initial state) X0=1: DC/DC converter on
0010110X0
X0=0: Internal regulator off (POR initial state) X0=1: Internal regulator on Set Internal Regulator On/Off When the application employs external contrast control, the internal contrast control, temperature compensation and the regulator must be enabled. X0=0: Internal voltage divider off (POR initial state) Set Internal Voltage Divider X0=1: Internal voltage divider on On/Off When an external bias network is preferred, the voltage divider should be disabled. X0=0: Internal contrast control off (POR initial state) Set Internal Contrast Control X0=1: Internal contrast control on On/Off Internal contrast circuits can be disabled if external contrast circuit is preferred. Set Clock Frequency X0=0: Low frequency (38.4kHz) (POR initial state) X0=1: High frequency (50kHz)
0010111X0
0011000X0
0011001X0 0011010X0 00110110 00110111
Save/Restore RAM Column X0=0: Restore address Address X0=1: Save address Master Clear RAM Master Clear Icons Master clear BGDRAM page 1 to 4 Master clear of BGDRAM page 5
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Bit Pattern (D7~D0) 0011100X0 Command Set Bias Ratio Comment X0=0: Set 1/7 bias (POR initial state) X0=1: Set 1/5 bias X0=0: Normal operation (POR initial state) X0=1: Test mode (Note: make sure to set X0=0: during application) X0=0: Set display mode without Icon line (POR initial state) X0=1: Set display mode with Icon line Power saving icon display mode, COM 0 to COM 31 will be disabled. Use X4X3X2X1 as number for lines to scroll. Scroll value=0 upon POR
0011101X0
Reserved
0011110X0 00111110 010X4X3X2X1X0
Set Display with Icon Line Set Icon Display Mode Set Vertical Scroll Value
01100A1A0X0
A1A0=00: Select Icon 1 (POR initial state) A1A0=01: Select Icon 2 Set Static Icon Control Sig- A1A0=10: Select Icon 3 nals A1A0=11: Select Icon 4 X0=0: Turned selected Icon off (POR state) X0=1: Turned selected Icon on Set Duty Cycle Set IDD Reduction Mode X0=0: 1/32 duty and triple enabled (POR initial state) X0=1: 1/16 duty and doubler enabled X0=0: Normal mode X0=1: IDD reduction mode
0110100X0 0110101X0
011011X1X0
X0=00: 0.00% (POR initial state) X0=01: -0.18% Set Temperature Coefficient X0=10: -0.22% X0=11: -0.35% X0=0: Decrease by one level (POR initial state) Increase/Decrease Contrast X0=1: Increase by one level Value (Note: increment/decrement wraps round among the 16 contrast levels. Start at the lowest level when POR. Reserved Reserved Reserved Reserved Set Internal/External Oscillator Reserved X0=0: Oscillator disable (POR initial state) X0=1: Oscillator enable Set Oscillator Disable/Enable This is the master control for oscillator circuitry. This command should be issued after the external/internal oscillator command. Set BGDRAM column address. Use X6X5X4X3X2X1X0 as address bits X0=0: Internal oscillator (POR initial state) X0=1: External oscillator If resistors are placed at OSC1 and OSC2. For external oscillator, simply feed clock in OSC2. X0=0: Normal operation (POR initial state) X0=1: Test mode select (Note: make sure to set X0=0 during application)
0111000X0
0111001X0 0111010X0 0111011X0 0111100X0
0111101X0
0111110X0
0111111X0
1X6X5X4X3X2X1X0 Set BGDRAM Address
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Data read write
* To read data from the BGDRAM, input high to RW pin and DCOM pin. Data is valid at the falling edge of CS. And the
BGDRAM column address pointer will be increased by one automatically.
* To write data to the BGDRAM, input low to RW pin and high to DCOM pin. Data is latched at the falling edge of CS.
And the BGDRAM column address pointer will be increased by one automatically.
* No auto address pointer increment will be performed for the dummy write data after master clear BGDRAM
Address increment table (Automatic) DCOM 0 0 1 1 RW 0 1 0 1 Comment Write command Read command Write data Read data O O *1 *2 Address Increment Note
Address increment is done automatically data read write. The column address pointer of BGDRAM*3 is affected. Note: *1 Refer to the command read contrast value *2 If write data is issued after command clear RAM, address increase is not applied *3 Column address will be wrapped around when overflow Power up sequence (Command required) Command Required Set Clock Frequency Set Oscillator Enable Set Static Icon Control Signals Set Duty Cycle Set Bias Ratio Set Internal DC/DC Converter On Set Internal Regulator On Set Temperature Coefficient Set Internal Contrast Control On Increase Contrast Level Set Internal Voltage Divider On Set Segment Mapping Set Common Mapping Set Vertical Scroll Value Set Display On Note: Low Disable Static Icon off 1/32 duty 1/7 bias Off Off TC=0% Off Contrast level=0 Off SEG0=COLUMN0 COM0=ROW0 Scroll value=0 Off POR Status *1 *1 *1 *1 *1 *1 *1 *1, *3 *1, *3 *1, *2, *3 *1 Note
*1 Required only if desired status differ from power on reset *2 Effective only if internal contrast control is enabled. *3 Effective only if the regulator is enabled.
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Command Required for Display Mode Setup Display Mode Display Mode Set external/internal oscillator* Set oscillator enable* Set display on* Set external/internal oscillator* Set oscillator enable* Set static Icon control signal* Set display off* Set oscillator disable* Set external oscillator* Set static Icon control signal* Set display off* Set oscillator enable* Set internal oscillator* Set static Icon control signal* Set display off* Set oscillator enable* Command Required
Static Icon Display
Standby Mode 1
Standby Mode 2
Standby Mode 3
Other related command with display mode: set duty cycle, set column mapping, set row mapping, set vertical scroll value. Command Related to Internal DC/DC Converter Set oscillator disable/enable, set internal regulator on/off, set duty cycle, set temperature coefficient, set internal contrast control on/off, increase contrast level, set internal voltage divider on/off, set bias ratio, set display on/off, set internal/external oscillator, set contrast level, set voltage doubler/tripler, set 33 mux display mode, set Icon display mode. * You do not need to resend the command again if it is set previously. Command Required for R/W Actions on RAM R/W Actions on RAM Read data from BGDRAM Write data to BGDRAM Save or restore BGDRAM column address Increase BGDRAM address by one Master clear BGDRAM Command Required Set BGDRAM page address* Set BGDRAM column address* Read/write data Save or restore BGDRAM column address Dummy read data Master clear BGDRAM Dummy write data
* You do not need to resend the command again if it is set previously.
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Note:
Film: UPILEX-S 755mm thickness Copper: FQ-VLP 255mm thickness Adhesive: Toray #7100, 122mm thickness Solder resist: AE-70-M11, 2614mm thickness Flex coating: FS-100L Min. 10mm Plating: Sn 0.210.05mm thickness All corner radii of base film are less than 0.2mm unless otherwise noted Other specs than display in this drawing are based on the standard spec lists All dimensional tolerances of SR & Flex are 0.2mm & 0.3mm unless otherwise noted All dimensional tolerances of base film are 0.05mm unless otherwise noted Inner lead accumulative pitch: Output side: 9.3590.008mm Input side: 9.0770.008mm Reel size: F405mm
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Application Circuits
32/33 MUX display with analog circuitry enabled, tripler enabled and 1/7 bias
To LCD Panel
M P U /M C U w ith P a r a lle l In te rfa c e
RES CS CE RW DCOM D0~D7
CO M 0~CO M 32 SEG 0~SEG 119 AN N 1~AN N 4,BP
VDD VSS VDDA VLL2 VLL3
0 .1 m F 0 .1 m F 0 .1 m F 0 .1 m F 0 .1 m F 0 .1 m F 0 .1 m F 0 .1 m F 0 .1 m F 0 .1 m F
V
DD
H T0610
DUM2 DUM1 VLL4 VLL5 VLL6
RAM
EPROM OSC2 OSC1 C1N C1P C2N C2P
VCCA1 VF 150kW VR 560pF 4 .7 m F
C1
C2
910kW
0 .1 m F
0 .1 m F
0 .1 m F 300kW
N o te : V R a n d V F c a n b e le ft o p e n w h e n R e g u la to r is d is a b le d .
16 MUX display with analog circuitry enabled, tripler enabled and 1/5 bias
To LC D Panel
M P U /M C U w ith P a r a lle l In te rfa c e
RES CS CE RW DCOM D0~D7
CO M 0~CO M 32 SEG 0~SEG 119 AN N 1~AN N 4,BP
VDD VSS VDDA VLL2 VLL3
0 .1 m F 0 .1 m F 0 .1 m F 0 .1 m F
V
DD
H T0610
DUM2 DUM1 VLL4 VLL5 VLL6 0 .1 m F 0 .1 m F 0 .1 m F 0 .1 m F
RAM
EPROM OSC2 OSC1 C1N C1P C2N C2P
VCCA1 VF 150kW VR 560pF 4 .7 m F
C1
E x te rn a l C lo c k
0 .1 m F
C2
0 .1 m F 300kW
N o te : V R a n d V F c a n b e le ft o p e n w h e n R e g u la to r is d is a b le d .
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16/32/33 MUX display with analog circuitry disabled
To LCD Panel
MPU w Pa In te
/M C U ith r a lle l rfa c e
RES CS CE RW DCOM D0~D7
CO M 0~CO M 32 SEG 0~SEG 119 AN N 1~AN N 4,BP
VDD VSS VDDA VLL2 VLL DUM DUM VLL VLL5 3 2 1 4
0 .1 m F 0 .1 m F
V
DD
H T0610
RAM
EPROM OSC2 OSC1 C1N C1P C2N C2P
C1
C2
VF
VR
VLL6 VCCA1
E x te rn a l C lo c k
VCC
N o te : V R a n d V F c a n b e le ft o p e n w h e n R e g u la to r is d is a b le d .
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Holtek Semiconductor Inc. (Headquarters) No.3, Creation Rd. II, Science Park, Hsinchu, Taiwan Tel: 886-3-563-1999 Fax: 886-3-563-1189 http://www.holtek.com.tw Holtek Semiconductor Inc. (Sales Office) 4F-2, No. 3-2, YuanQu St., Nankang Software Park, Taipei 115, Taiwan Tel: 886-2-2655-7070 Fax: 886-2-2655-7373 Fax: 886-2-2655-7383 (International sales hotline) Holtek Semiconductor (Shanghai) Inc. 7th Floor, Building 2, No.889, Yi Shan Rd., Shanghai, China Tel: 021-6485-5560 Fax: 021-6485-0313 http://www.holtek.com.cn Holtek Semiconductor (Hong Kong) Ltd. Block A, 3/F, Tin On Industrial Building, 777-779 Cheung Sha Wan Rd., Kowloon, Hong Kong Tel: 852-2-745-8288 Fax: 852-2-742-8657 Holmate Semiconductor, Inc. 46712 Fremont Blvd., Fremont, CA 94538 Tel: 510-252-9880 Fax: 510-252-9885 http://www.holmate.com Copyright O 2004 by HOLTEK SEMICONDUCTOR INC. The information appearing in this Data Sheet is believed to be accurate at the time of publication. However, Holtek assumes no responsibility arising from the use of the specifications described. The applications mentioned herein are used solely for the purpose of illustration and Holtek makes no warranty or representation that such applications will be suitable without further modification, nor recommends the use of its products for application that may present a risk to human life due to malfunction or otherwise. Holteks products are not authorized for use as critical components in life support devices or systems. Holtek reserves the right to alter its products without prior notification. For the most up-to-date information, please visit our web site at http://www.holtek.com.tw.
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