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Philips Semiconductors
Product specification
Rectifier diodes Schottky barrier
FEATURES
* Low forward volt drop * Fast switching * Reverse surge capability * High thermal cycling performance * Low thermal resistance
PBYL3025CT, PBYL3025CTB series
SYMBOL
QUICK REFERENCE DATA VR = 20 V/ 25 V IO(AV) = 30 A VF 0.43 V
a1 1 k2
a2 3
GENERAL DESCRIPTION
Dual schottky rectifier diodes intended for use as output rectifiers in low voltage, high frequency switched mode power supplies. The PBYL3025CT series is supplied in the SOT78 (TO220AB) conventional leaded package. The PBYL3025CTB series is supplied in the SOT404 surface mounting package.
PINNING
PIN 1 2 3 tab gate drain 1 source DESCRIPTION
SOT78 (TO220AB)
tab
SOT404
tab
2
drain
1 23
1
3
LIMITING VALUES
Limiting values in accordance with the Absolute Maximum System (IEC 134) SYMBOL PARAMETER CONDITIONS PBYL30 PBYL30 VRRM VRWM VR IO(AV) IFRM IFSM Peak repetitive reverse voltage Working peak reverse voltage Continuous reverse voltage Average rectified output current (both diodes conducting) Repetitive peak forward current per diode Non-repetitive peak forward current per diode Peak repetitive reverse surge current per diode Operating junction temperature Storage temperature Tmb 120 C square wave; = 0.5; Tmb 123 C square wave; = 0.5; Tmb 123 C t = 10 ms t = 8.3 ms sinusoidal; Tj = 125 C prior to surge; with reapplied VRRM(max) pulse width and repetition rate limited by Tj max - 65 MIN. MAX. 20CT 20CTB 20 20 20 30 30 135 150 1 150 175 25CT 25CTB 25 25 25 UNIT
V V V A A A A A C C
IRRM Tj Tstg
1. It is not possible to make connection to pin 2 of the SOT404 package.
March 1998
1
Rev 1.000
Philips Semiconductors
Product specification
Rectifier diodes Schottky barrier
THERMAL RESISTANCES
SYMBOL PARAMETER Rth j-mb Rth j-a Thermal resistance junction to mounting base Thermal resistance junction to ambient CONDITIONS
PBYL3025CT, PBYL3025CTB series
MIN. -
TYP. MAX. UNIT 60 50 2 1.5 K/W K/W K/W K/W
per diode both diodes SOT78 package, in free air SOT404 package, pcb mounted, minimum footprint, FR4 board
ELECTRICAL CHARACTERISTICS
All characteristics are per diode at Tj = 25 C unless otherwise specified SYMBOL PARAMETER VF Forward voltage CONDITIONS IF = 15 A; Tj = 150C IF = 15 A; Tj = 125C IF = 30 A; Tj = 125C IF = 30 A VR = VRWM VR = VRWM; Tj = 100C VR = 5 V; f = 1 MHz, Tj = 25C to 125C MIN. TYP. MAX. UNIT 0.35 0.38 0.52 0.6 1 22 700 0.43 0.46 0.6 0.67 5 40 V V V V mA mA pF
IR Cd
Reverse current Junction capacitance
March 1998
2
Rev 1.000
Philips Semiconductors
Product specification
Rectifier diodes Schottky barrier
PBYL3025CT, PBYL3025CTB series
12 10 8
Forward dissipation, PF (W)
Vo = 0.32 V Rs = 0.009 Ohms
PBYL3025CT
Tmb(max) / C D = 1.0
126 130 134
1A
IR / A Tj = 150 C
PBYR2025CT
0.5 0.2 0.1
100mA 125 10mA 100 75 50 100uA 25
6 4 2
T t I tp
138
1mA
D= tp 142 T
146 150 25
0
0
5
10 15 20 Average forward current, IF(AV) (A)
10uA
0
5
10 VR / V
15
20
25
Fig.1. Maximum forward dissipation PF = f(IF(AV)) per diode; square current waveform where IF(AV) =IF(RMS) x D.
Forward dissipation, PF (W)
Vo = 0.32 V Rs = 0.009 Ohms
Fig.4. Typical reverse leakage current per diode; IR = f(VR); parameter Tj
10 8
PBYL3025CT
Tmb(max) / C a = 1.57
130 134
10000
Cd / pF
PBYR2025CT
2.2 2.8 4
1.9
6 4 2 0
138
1000
142 146 150 15
0
5 10 Average forward current, IF(AV) (A)
100
1
10 VR / V
100
Fig.2. Maximum forward dissipation PF = f(IF(AV)) per diode; sinusoidal current waveform where a = form factor = IF(RMS) / IF(AV).
PBYR2025CT typ Tj = 25 C Tj = 125 C max
Fig.5. Typical junction capacitance per diode; Cd = f(VR); f = 1 MHz; Tj = 25C to 125 C.
30 25 20 15 10
IF / A
10
Transient thermal impedance, Zth j-mb (K/W)
1
0.1
0.01
P D
tp
D=
tp T t
5 0
0.001 1us
T
0
0.2
0.4 VF / V
0.6
0.8
1
10us
100us 1ms 10ms 100ms 1s 10s pulse width, tp (s) PBYL3025CT
Fig.3. Typical and maximum forward characteristic IF = f(VF); parameter Tj
Fig.6. Transient thermal impedance per diode; Zth j-mb = f(tp).
March 1998
3
Rev 1.000
Philips Semiconductors
Product specification
Rectifier diodes Schottky barrier
MECHANICAL DATA
Dimensions in mm Net Mass: 2 g
PBYL3025CT, PBYL3025CTB series
4,5 max 10,3 max
1,3
3,7 2,8
5,9 min
15,8 max
3,0 max not tinned
3,0
13,5 min
1,3 max 1 2 3 (2x)
2,54 2,54
0,9 max (3x)
0,6 2,4
Fig.7. SOT78 (TO220AB); pin 2 connected to mounting base.
Notes 1. Refer to mounting instructions for SOT78 (TO220) envelopes. 2. Epoxy meets UL94 V0 at 1/8".
March 1998
4
Rev 1.000
Philips Semiconductors
Product specification
Rectifier diodes Schottky barrier
MECHANICAL DATA
Dimensions in mm Net Mass: 1.4 g
10.3 max
PBYL3025CT, PBYL3025CTB series
4.5 max 1.4 max
11 max 15.4
2.5 0.85 max (x2) 2.54 (x2)
0.5
Fig.8. SOT404 : centre pin connected to mounting base.
MOUNTING INSTRUCTIONS
Dimensions in mm
11.5
9.0
17.5 2.0
3.8
5.08
Fig.9. SOT404 : soldering pattern for surface mounting.
Notes 1. Epoxy meets UL94 V0 at 1/8".
March 1998
5
Rev 1.000
Philips Semiconductors
Product specification
Rectifier diodes Schottky barrier
DEFINITIONS
Data sheet status Objective specification Product specification Limiting values
PBYL3025CT, PBYL3025CTB series
This data sheet contains target or goal specifications for product development. This data sheet contains final product specifications.
Preliminary specification This data sheet contains preliminary data; supplementary data may be published later.
Limiting values are given in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of this specification is not implied. Exposure to limiting values for extended periods may affect device reliability. Application information Where application information is given, it is advisory and does not form part of the specification. (c) Philips Electronics N.V. 1998 All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner. The information presented in this document does not form part of any quotation or contract, it is believed to be accurate and reliable and may be changed without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license under patent or other industrial or intellectual property rights.
LIFE SUPPORT APPLICATIONS
These products are not designed for use in life support appliances, devices or systems where malfunction of these products can be reasonably expected to result in personal injury. Philips customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such improper use or sale.
March 1998
6
Rev 1.000

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