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 ZXT849K
30V NPN LOW SATURATION TRANSISTOR IN D-PAK
SUMMARY BVCEO = 30V : RSAT = 33m DESCRIPTION
Packaged in the D-Pak outline this high current high performance 30V NPN transistor offers low on state losses making it ideal for use in DC-DC circuits and various driving and power management functions.
typical; IC = 7A
FEATURES
* 7 amps continuous current * Up to 20 amps peak current * Low equivalent on resistance * Low saturation voltages * Excellent hFE performance up to 20 amps
DPAK
APPLICATIONS
* DC - DC converters * DC - DC modules * Power switches * Motor control * Automotive circuits
PINOUT ORDERING INFORMATION
DEVICE ZXT849KTC REEL SIZE 13" TAPE WIDTH 16mm QUANTITY PER REEL 2500 units/reel
DEVICE MARKING
* ZXT849
TOP VIEW
ISSUE 2 - DECEMBER 2003 1
SEMICONDUCTORS
ZXT849K
ABSOLUTE MAXIMUM RATINGS
PARAMETER Collector-base voltage Collector-emitter voltage Collector-emitter voltage Emitter-base voltage Peak pulse current Continuous collector current (b) Base current Power dissipation at T A =25C (a) Linear derating factor Power dissipation at T A =25C (b) Linear derating factor Power dissipation at T A =25C (c) Linear derating factor Operating and storage temperature range T j , T stg SYMBOL BV CBO BV CER BV CEO BV EBO I CM IC IB PD PD PD LIMIT 80 80 30 7 20 7 0.5 2.1 16.8 3.2 25.6 4.2 33.6 -55 to +150 UNIT V V V V A A A W mW/C W mW/C W mW/C C
THERMAL RESISTANCE
PARAMETER Junction to ambient
(a)
SYMBOL R JA R JA R JA
VALUE 59 39 30
UNIT C/W C/W C/W
Junction to ambient (b) Junction to ambient (c)
NOTES (a) (For a device surface mounted on 25mm x 25mm x 1.6mm FR4 PCB with high coverage of single sided 1oz copper in still air conditions. (b) For a device surface mounted on 50mm x 50mm x 1.6mm FR4 PCB with high coverage of single sided 1oz copper in still air conditions. (c) For a device surface mounted on 25mm x 25mm x 1.6mm FR4 PCB with high coverage of single sided 2oz copper in still air conditions.
ISSUE 2 - DECEMBER 2003
SEMICONDUCTORS
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ZXT849K
TYPICAL CHARACTERISTICS
ISSUE 2 - DECEMBER 2003 3
SEMICONDUCTORS
ZXT849K
ELECTRICAL CHARACTERISTICS (at Tamb = 25C unless otherwise stated)
PARAMETER Collector-base breakdown voltage Collector-emitter breakdown voltage Collector-emitter breakdown voltage Emitter-base breakdown voltage Collector cut-off current Collector cut-off current Emitter cut-off current Collector-emitter saturation voltage SYMBOL BV CBO BV CER BV CEO BV EBO I CBO I CER I EBO V CE(SAT) 27 55 115 230 Base-emitter saturation voltage Base-emitter turn-on voltage Static forward current transfer ratio V BE(SAT) V BE(ON) H FE 100 100 100 40 Transition frequency Output capacitance Switching times fT C OBO t ON t OFF * Measured under pulsed conditions. Pulse width 1.04 0.93 190 200 165 90 100 75 45 630 300 s; duty cycle 2%. 300 MIN. 80 80 30 7 TYP. 125 125 40 8 20 20 10 40 80 180 280 1.15 1.1 MAX. UNIT CONDITIONS V V V V nA nA nA mV mV mV mV mV mV I C =100 A I C =1 A, R BE = 1k I C =10mA* I E =100 A V CB =70V V CB =70V, R BE = 1k V EB =6V I C =0.5A, I B =20mA* IC=1A, IB=20mA* IC=2A, IB=20mA* IC=7A, IB=350mA* I C =7A, I B =350mA* I C =7A, V CE =1V* I C =10mA, V CE =1V* IC=1A, VCE=1V* IC=7A, VCE=1V* IC=20A, VCE=2V* MHz I C =100mA, V CE =10V f=50MHz pF nS nS V CB =10V, f=1MHz* I C =1A, V CC =10V, I B1 =I B2 =100mA
ISSUE 2 - DECEMBER 2003
SEMICONDUCTORS
4
ZXT849K
TYPICAL CHARACTERISTICS
ISSUE 2 - DECEMBER 2003 5
SEMICONDUCTORS
ZXT849K
PACKAGE OUTLINE
Controlling dimensions are in millimeters. Approximate conversions are given in inches
PACKAGE DIMENSIONS
DIM A A1 b b2 b3 c c2 D D1 E E1 0.635 0.762 5.20 0.457 0.457 5.97 5.20 6.35 4.32 6.73 Millimeters Min 2.18 Max 2.38 0.127 0.89 1.114 5.46 0.609 0.584 6.22 0.025 0.030 0.205 0.018 0.018 0.235 0.205 0.250 0.170 0.265 Inches Min 0.086 Max 0.094 0.005 0.035 0.045 0.215 0.024 0.023 0.245 DIM e H L L1 L2 L3 L4 L5 1 Millimeters Min Max Inches Min Max
2.30 BSC 9.40 1.40 10.41 1.78
0.090 BSC 0.370 0.055 0.410 0.070
2.74 REF 0.051 BSC 0.89 0.635 1.14 0 0 1.27 1.01 1.52 10 15
0.108 REF 0.020 BSC 0.035 0.025 0.045 0 0 0.050 0.040 0.060 10 15
(c) Zetex plc 2003
Europe Zetex plc Fields New Road Chadderton Oldham, OL9 8NP United Kingdom Telephone (44) 161 622 4444 Fax: (44) 161 622 4446 hq@zetex.com Zetex GmbH Streitfeldstrae 19 D-81673 Munchen Germany Telefon: (49) 89 45 49 49 0 Fax: (49) 89 45 49 49 49 europe.sales@zetex.com Americas Zetex Inc 700 Veterans Memorial Hwy Hauppauge, NY 11788 USA Telephone: (1) 631 360 2222 Fax: (1) 631 360 8222 usa.sales@zetex.com Asia Pacific Zetex (Asia) Ltd 3701-04 Metroplaza Tower 1 Hing Fong Road Kwai Fong Hong Kong Telephone: (852) 26100 611 Fax: (852) 24250 494 asia.sales@zetex.com
These offices are supported by agents and distributors in major countries world-wide. This publication is issued to provide outline information only which (unless agreed by the Company in writing) may not be used, applied or reproduced for any purpose or form part of any order or contract or be regarded as a representation relating to the products or services concerned. The Company reserves the right to alter without notice the specification, design, price or conditions of supply of any product or service. For the latest product information, log on to
www.zetex.com ISSUE 2 - DECEMBER 2003
SEMICONDUCTORS
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