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DATA SHEET
TJA1050 High speed CAN transceiver
Product specification Supersedes data of 2000 May 26 2002 May 16
Philips Semiconductors
Product specification
High speed CAN transceiver
FEATURES * Fully compatible with the "ISO 11898" standard * High speed (up to 1 Mbaud) * Very low ElectroMagnetic Emission (EME) * Differential receiver with wide common-mode range for high ElectroMagnetic Immunity (EMI) * An unpowered node does not disturb the bus lines * Transmit Data (TXD) dominant time-out function * Silent mode in which the transmitter is disabled * Bus pins protected against transients in an automotive environment * Input levels compatible with 3.3 V and 5 V devices * Thermally protected * Short-circuit proof to battery and to ground * At least 110 nodes can be connected. QUICK REFERENCE DATA SYMBOL VCC VCANH VCANL Vi(dif)(bus) tPD(TXD-RXD) Tvj PARAMETER supply voltage DC voltage at pin CANH DC voltage at pin CANL differential bus input voltage propagation delay TXD to RXD virtual junction temperature 0 < VCC < 5.25 V; no time limit 0 < VCC < 5.25 V; no time limit dominant VS = 0 V; see Fig.7 CONDITIONS MIN. 4.75 -27 -27 1.5 - -40 GENERAL DESCRIPTION
TJA1050
The TJA1050 is the interface between the Controller Area Network (CAN) protocol controller and the physical bus. The device provides differential transmit capability to the bus and differential receive capability to the CAN controller. The TJA1050 is the third Philips high-speed CAN transceiver after the PCA82C250 and the PCA82C251. The most important differences are: * Much lower electromagnetic emission due to optimal matching of the output signals CANH and CANL * Improved behaviour in case of an unpowered node * No standby mode. This makes the TJA1050 eminently suitable for use in nodes that are in a power-down situation in partially powered networks.
MAX. 5.25 +40 +40 3 250 +150
UNIT V V V V ns C
ORDERING INFORMATION TYPE NUMBER TJA1050T TJA1050U PACKAGE NAME SO8 - DESCRIPTION plastic small outline package; 8 leads; body width 3.9 mm bare die; die dimensions 1700 x 1280 x 380 m VERSION SOT96-1 -
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Philips Semiconductors
Product specification
High speed CAN transceiver
BLOCK DIAGRAM
TJA1050
handbook, full pagewidth
VCC 3 30 A VCC 200 A GND TEMPERATURE PROTECTION
S
8
TXD
1
TXD DOMINANT TIME-OUT TIMER VCC
DRIVER 7 25 k 0.5VCC GND 6
CANH
RXD
4
RECEIVER GND 5 REFERENCE VOLTAGE
25 k CANL
Vref
TJA1050
2
MGS374
GND
Fig.1 Block diagram.
PINNING SYMBOL TXD PIN 1 DESCRIPTION transmit data input; reads in data from the CAN controller to the bus line drivers ground supply voltage receive data output; reads out data from the bus lines to the CAN controller reference voltage output LOW-level CAN bus line HIGH-level CAN bus line select input for high-speed mode or silent mode Fig.2 Pin configuration.
handbook, halfpage
GND VCC RXD
2 3 4
TXD 1 GND 2
8S 7 CANH CANL Vref
TJA1050T
VCC RXD 3 4
MGS375
6 5
Vref CANL CANH S
5 6 7 8
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Philips Semiconductors
Product specification
High speed CAN transceiver
FUNCTIONAL DESCRIPTION The TJA1050 is the interface between the CAN protocol controller and the physical bus. It is primarily intended for high-speed automotive applications using baud rates from 60 kbaud up to 1 Mbaud. It provides differential transmit capability to the bus and differential receiver capability to the CAN protocol controller. It is fully compatible to the "ISO 11898" standard. A current-limiting circuit protects the transmitter output stage from damage caused by accidental short-circuit to either positive or negative supply voltage, although power dissipation increases during this fault condition. A thermal protection circuit protects the IC from damage by switching off the transmitter if the junction temperature exceeds a value of approximately 165 C. Because the transmitter dissipates most of the power, the power dissipation and temperature of the IC is reduced. All other IC functions continue to operate. The transmitter off-state resets when pin TXD goes HIGH. The thermal protection circuit is particularly needed when a bus line short-circuits. The pins CANH and CANL are protected from automotive electrical transients (according to "ISO 7637"; see Fig.4). Table 1 Function table of the CAN transceiver; X = don't care VCC 4.75 to 5.25 V 4.75 to 5.25 V 4.75 to 5.25 V <2 V (not powered) 2 V < VCC < 4.75 V TXD 0 X 1 (or floating) X >2 V S 0 (or floating) 1 X X X CANH HIGH 0.5VCC 0.5VCC CANL LOW 0.5VCC 0.5VCC
TJA1050
Control pin S allows two operating modes to be selected: high-speed mode or silent mode. The high-speed mode is the normal operating mode and is selected by connecting pin S to ground. It is the default mode if pin S is not connected. In the silent mode, the transmitter is disabled. All other IC functions continue to operate. The silent mode is selected by connecting pin S to VCC and can be used to prevent network communication from being blocked, due to a CAN controller which is out of control. A `TXD dominant time-out' timer circuit prevents the bus lines being driven to a permanent dominant state (blocking all network communication) if pin TXD is forced permanently LOW by a hardware and/or software application failure. The timer is triggered by a negative edge on pin TXD. If the duration of the LOW-level on pin TXD exceeds the internal timer value, the transmitter is disabled, driving the bus into a recessive state. The timer is reset by a positive edge on pin TXD.
BUS STATE RXD dominant recessive recessive recessive recessive 0 1 1 X X
0 V < VCANH < VCC 0 V < VCANL < VCC 0 V < VCANH < VCC 0 V < VCANL < VCC
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Philips Semiconductors
Product specification
High speed CAN transceiver
TJA1050
LIMITING VALUES In accordance with the Absolute Maximum Rating System (IEC 60134). All voltages are referenced to GND (pin 2). Positive currents flow into the IC. SYMBOL VCC VCANH VCANL VTXD VRXD Vref VS Vtrt(CANH) Vtrt(CANL) Ves Tstg Tvj Notes 1. The waveforms of the applied transients shall be in accordance with "ISO 7637 part 1", test pulses 1, 2, 3a and 3b (see Fig.4). 2. Human body model: C = 100 pF and R = 1.5 k. 3. Machine model: C = 200 pF, R = 10 and L = 0.75 H. 4. In accordance with "IEC 60747-1". An alternative definition of Tvj is: Tvj = Tamb + P x Rth(vj-a), where Rth(vj-a) is a fixed value to be used for the calculation of Tvj. The rating for Tvj limits the allowable combinations of power dissipation (P) and ambient temperature (Tamb). THERMAL CHARACTERISTICS According to IEC 60747-1. SYMBOL Rth(vj-a) Rth(vj-s) PARAMETER thermal resistance from junction to ambient in SO8 package thermal resistance from junction to substrate of bare die CONDITIONS in free air in free air VALUE 145 50 UNIT K/W K/W PARAMETER supply voltage DC voltage at pin CANH DC voltage at pin CANL DC voltage at pin TXD DC voltage at pin RXD DC voltage at pin Vref DC voltage at pin S transient voltage at pin CANH transient voltage at pin CANL note 1 note 1 note 3 storage temperature virtual junction temperature note 4 0 < VCC < 5.25 V; no time limit 0 < VCC < 5.25 V; no time limit CONDITIONS MIN. -0.3 -27 -27 -0.3 -0.3 -0.3 -0.3 -200 -200 -4000 -200 -55 -40 MAX. +6 +40 +40 V V V UNIT
VCC + 0.3 V VCC + 0.3 V VCC + 0.3 V VCC + 0.3 V +200 +200 +4000 +200 +150 +150 V V V V C C
electrostatic discharge voltage at all pins note 2
QUALITY SPECIFICATION Quality specification "SNW-FQ-611 part D" is applicable.
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Philips Semiconductors
Product specification
High speed CAN transceiver
TJA1050
CHARACTERISTICS VCC = 4.75 to 5.25 V; Tvj = -40 to +150 C; RL = 60 unless specified otherwise; all voltages are referenced to GND (pin 2); positive currents flow into the IC; see notes 1 and 2. SYMBOL Supply (pin VCC) ICC supply current dominant; VTXD = 0 V recessive; VTXD = VCC Transmitter data input (pin TXD) VIH VIL IIH IIL Ci VIH VIL IIH IIL IOH IOL HIGH-level input voltage LOW-level input voltage HIGH-level input current LOW-level input current input capacitance output recessive output dominant VTXD = VCC VTXD = 0 V not tested 2.0 -0.3 -5 -100 - 2.0 -0.3 20 15 -2 2 - - 0 -200 5 - - 30 30 -6 8.5 VCC + 0.3 V +0.8 +5 -300 10 V A A pF 25 2.5 50 5 75 10 mA mA PARAMETER CONDITIONS MIN. TYP. MAX. UNIT
Mode select input (pin S) HIGH-level input voltage LOW-level input voltage HIGH-level input current LOW-level input current silent mode high-speed mode VS = 2 V VS = 0.8 V VRXD = 0.7VCC VRXD = 0.45 V -50 A < IVref < +50 A VTXD = VCC; no load VTXD = VCC; no load VCC + 0.3 V +0.8 50 45 -15 20 V A A mA mA
Receiver data output (pin RXD) HIGH-level output current LOW-level output current
Reference voltage output (pin Vref) Vref Vo(reces)(CANH) Vo(reces)(CANL) Io(reces)(CANH) Io(reces)(CANL) Vo(dom)(CANH) Vo(dom)(CANL) Vi(dif)(bus) reference output voltage 0.45VCC 2.0 2.0 0.5VCC 2.5 2.5 - - 3.6 1.4 2.25 0 0.55VCC 3.0 3.0 +2.5 +2.5 4.25 1.75 3.0 +50 V
Bus lines (pins CANH and CANL) recessive bus voltage at pin CANH recessive bus voltage at pin CANL recessive output current at pin CANH recessive output current at pin CANL dominant output voltage at pin CANH dominant output voltage at pin CANL differential bus input voltage (VCANH - VCANL) V V mA mA V V V mV
-27 V < VCANH < +32 V; -2.0 0 V < VCC < 5.25 V -27 V < VCANL < +32 V; 0 V < VCC < 5.25 V VTXD = 0 V VTXD = 0 V VTXD = 0 V; dominant; 42.5 < RL < 60 VTXD = VCC; recessive; no load -2.0 3.0 0.5 1.5 -50
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Philips Semiconductors
Product specification
High speed CAN transceiver
TJA1050
SYMBOL Io(sc)(CANH) Io(sc)(CANL) Vi(dif)(th)
PARAMETER
CONDITIONS
MIN.
TYP. -70 70 0.7
MAX. -95 100 0.9
UNIT mA mA V
short-circuit output current at VCANH = 0 V; VTXD = 0 V -45 pin CANH short-circuit output current at VCANL = 36 V; pin CANL VTXD = 0 V 45
differential receiver threshold -12 V < VCANL < +12 V; 0.5 voltage -12 V < VCANH < +12 V; see Fig.5 differential receiver input voltage hysteresis common mode input resistance at pin CANH common mode input resistance at pin CANL matching between pin CANH and pin CANL common mode input resistance differential input resistance input capacitance at pin CANH input capacitance at pin CANL input leakage current at pin CANH input leakage current at pin CANL VTXD = VCC; not tested VTXD = VCC; not tested VCANH = VCANL -12 V < VCANL < +12 V; 50 -12 V < VCANH < +12 V; see Fig.5 15 15 -3
Vi(dif)(hys)
70
100
mV
Ri(cm)(CANH) Ri(cm)(CANL) Ri(cm)(m)
25 25 0
35 35 +3
k k %
Ri(dif) Ci(CANH) Ci(CANL) Ci(dif) ILI(CANH) ILI(CANL)
25 - - - 100 100
50 7.5 7.5 3.75 170 170
75 20 20 10 250 250
k pF pF pF A A
differential input capacitance VTXD = VCC; not tested VCC = 0 V; VCANH = 5 V VCC = 0 V; VCANL = 5 V
Thermal shutdown Tj(sd) shutdown junction temperature 155 165 180 C
Timing characteristics (see Figs.6 and 7) td(TXD-BUSon) td(TXD-BUSoff) td(BUSon-RXD) td(BUSoff-RXD) tdom(TXD) Notes 1. All parameters are guaranteed over the virtual junction temperature range by design, but only 100% tested at 125 C ambient temperature for dies on wafer level and in addition to this 100% tested at 25 C ambient temperature for cased products, unless specified otherwise. 2. For bare die, all parameters are only guaranteed if the backside of the bare die is connected to ground. delay TXD to bus active delay TXD to bus inactive delay bus active to RXD delay bus inactive to RXD TXD dominant time for time-out VS = 0 V VS = 0 V VS = 0 V VS = 0 V VTXD = 0 V 25 25 20 45 250 55 60 50 95 450 110 95 110 155 750 ns ns ns ns s
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Philips Semiconductors
Product specification
High speed CAN transceiver
APPLICATION AND TEST INFORMATION
TJA1050
handbook, full pagewidth
+5 V 100 nF VCC TX0 TXD Vref 3 1 7 CANH 60
47 nF 60
SJA1000
CAN CONTROLLER RX0
5
TJA1050
6 CANL
CAN BUS LINE
RXD
4 2 GND 8 S 60 60 47 nF
MGS380
MICROCONTROLLER
Fig.3 Application information.
handbook, full pagewidth
+5 V 100 nF VCC TXD Vref 3 1 7 CANH 1 nF
5
TJA1050
6 2 8 GND S CANL 1 nF
TRANSIENT GENERATOR
RXD
4
MGS379
15 pF
The waveforms of the applied transients shall be in accordance with "ISO 7637 part 1", test pulses 1, 2, 3a and 3b.
Fig.4 Test circuit for automotive transients.
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Philips Semiconductors
Product specification
High speed CAN transceiver
TJA1050
handbook, full pagewidth
MGS378
VRXD HIGH
LOW hysteresis 0.5 0.9 Vi(dif)(bus) (V)
Fig.5 Hysteresis of the receiver.
+ 5 halfpage handbook, V 100 nF VCC TXD Vref 3 1 7 CANH RL 60 6 2 15 pF GND 8 S CANL CL 100 pF
5
TJA1050
RXD
4
MGS376
Fig.6 Test circuit for timing characteristics.
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Philips Semiconductors
Product specification
High speed CAN transceiver
TJA1050
handbook, full pagewidth
HIGH TXD LOW
CANH CANL dominant (BUS on) 0.9 V Vi(dif)(bus)(1) 0.5 V recessive (BUS off) HIGH RXD t d(TXD-BUSon) t d(BUSon-RXD) t PD(TXD-RXD) t PD(TXD-RXD) 0.3VCC 0.7VCC LOW t d(TXD-BUSoff) t d(BUSoff-RXD)
MGS377
(1) Vi(dif)(bus) = VCANH - VCANL.
Fig.7 Timing diagram for AC characteristics.
handbook, full pagewidth
CANL TX
6.2 k 6.2 k 30 30
10 nF ACTIVE PROBE
TJA1050 CANH
SPECTRUMANALYZER 47 nF test PCB
MGT229
GND
Fig.8 Basic test set-up (with split termination) for electromagnetic emission measurement (see Figs 9 and 10).
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Philips Semiconductors
Product specification
High speed CAN transceiver
TJA1050
handbook, full pagewidth
80
MGT231
A (dBV) 60
40
20
0 0 10 20 30 40 f (MHz) 50
Data rate of 500 kbits/s.
Fig.9 Typical electromagnetic emission up to 50 MHz (peak amplitude measurement).
handbook, full pagewidth
80
MGT233
A (dBV) 60
40
20
0 0 Data rate of 500 kbits/s. 2 4 6 8 f (MHz) 10
Fig.10 Typical electromagnetic emission up to 10 MHz (peak amplitude measurement and envelope on peak amplitudes).
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Philips Semiconductors
Product specification
High speed CAN transceiver
TJA1050
handbook, full pagewidth
CANL TX
30 30
4.7 nF
TJA1050
CANH
RF VOLTMETER AND POWER AMPLIFIER 50
RF SIGNAL GENERATOR
RX
TJA1050
GND test PCB
MGT230
Fig.11 Basic test set-up for electromagnetic immunity measurement (see Fig.12).
handbook, full pagewidth
30
MGT232
VRF(rms) (V)
max RF voltage reached with no errors
20
10
0 10-1 Data rate of 500 kbits/s.
1
10
102
f (MHz)
103
Fig.12 Typical electromagnetic immunity.
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Philips Semiconductors
Product specification
High speed CAN transceiver
BONDING PAD LOCATIONS COORDINATES(1) SYMBOL TXD GND VCC RXD Vref CANL CANH S Note 1. All x/y coordinates represent the position of the centre of each pad (in m) with respect to the lefthand bottom corner of the top aluminium layer (see Fig.13). PAD x 1 2 3 4 5 6 7 8 103 740 886.5 1371.5 1394 998 538.5 103 y 103 85 111 111 1094 1115 1115 1097
x 0 0 y
handbook, halfpage
TJA1050
8
7
6
5
TJA1050U
test pad
1
23
4
MGS381
The backside of the bare die must be connected to ground.
Fig.13 Bonding pad locations.
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Philips Semiconductors
Product specification
High speed CAN transceiver
PACKAGE OUTLINE SO8: plastic small outline package; 8 leads; body width 3.9 mm
TJA1050
SOT96-1
D
E
A X
c y HE vMA
Z 8 5
Q A2 A1 pin 1 index Lp 1 e bp 4 wM L detail X (A 3) A
0
2.5 scale
5 mm
DIMENSIONS (inch dimensions are derived from the original mm dimensions) UNIT mm inches A max. 1.75 A1 0.25 0.10 A2 1.45 1.25 A3 0.25 0.01 bp 0.49 0.36 c 0.25 0.19 D (1) 5.0 4.8 0.20 0.19 E (2) 4.0 3.8 0.16 0.15 e 1.27 HE 6.2 5.8 L 1.05 Lp 1.0 0.4 Q 0.7 0.6 v 0.25 0.01 w 0.25 0.01 y 0.1 Z (1) 0.7 0.3
0.010 0.057 0.069 0.004 0.049
0.019 0.0100 0.014 0.0075
0.244 0.039 0.028 0.050 0.041 0.228 0.016 0.024
0.028 0.004 0.012
8 0o
o
Notes 1. Plastic or metal protrusions of 0.15 mm maximum per side are not included. 2. Plastic or metal protrusions of 0.25 mm maximum per side are not included. OUTLINE VERSION SOT96-1 REFERENCES IEC 076E03 JEDEC MS-012 EIAJ EUROPEAN PROJECTION
ISSUE DATE 97-05-22 99-12-27
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Philips Semiconductors
Product specification
High speed CAN transceiver
SOLDERING Introduction to soldering surface mount packages This text gives a very brief insight to a complex technology. A more in-depth account of soldering ICs can be found in our "Data Handbook IC26; Integrated Circuit Packages" (document order number 9398 652 90011). There is no soldering method that is ideal for all surface mount IC packages. Wave soldering can still be used for certain surface mount ICs, but it is not suitable for fine pitch SMDs. In these situations reflow soldering is recommended. Reflow soldering Reflow soldering requires solder paste (a suspension of fine solder particles, flux and binding agent) to be applied to the printed-circuit board by screen printing, stencilling or pressure-syringe dispensing before package placement. Several methods exist for reflowing; for example, convection or convection/infrared heating in a conveyor type oven. Throughput times (preheating, soldering and cooling) vary between 100 and 200 seconds depending on heating method. Typical reflow peak temperatures range from 215 to 250 C. The top-surface temperature of the packages should preferable be kept below 220 C for thick/large packages, and below 235 C for small/thin packages. Wave soldering Conventional single wave soldering is not recommended for surface mount devices (SMDs) or printed-circuit boards with a high component density, as solder bridging and non-wetting can present major problems. To overcome these problems the double-wave soldering method was specifically developed.
TJA1050
If wave soldering is used the following conditions must be observed for optimal results: * Use a double-wave soldering method comprising a turbulent wave with high upward pressure followed by a smooth laminar wave. * For packages with leads on two sides and a pitch (e): - larger than or equal to 1.27 mm, the footprint longitudinal axis is preferred to be parallel to the transport direction of the printed-circuit board; - smaller than 1.27 mm, the footprint longitudinal axis must be parallel to the transport direction of the printed-circuit board. The footprint must incorporate solder thieves at the downstream end. * For packages with leads on four sides, the footprint must be placed at a 45 angle to the transport direction of the printed-circuit board. The footprint must incorporate solder thieves downstream and at the side corners. During placement and before soldering, the package must be fixed with a droplet of adhesive. The adhesive can be applied by screen printing, pin transfer or syringe dispensing. The package can be soldered after the adhesive is cured. Typical dwell time is 4 seconds at 250 C. A mildly-activated flux will eliminate the need for removal of corrosive residues in most applications. Manual soldering Fix the component by first soldering two diagonally-opposite end leads. Use a low voltage (24 V or less) soldering iron applied to the flat part of the lead. Contact time must be limited to 10 seconds at up to 300 C. When using a dedicated tool, all other leads can be soldered in one operation within 2 to 5 seconds between 270 and 320 C.
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Philips Semiconductors
Product specification
High speed CAN transceiver
Suitability of surface mount IC packages for wave and reflow soldering methods PACKAGE(1) BGA, LBGA, LFBGA, SQFP, TFBGA, VFBGA HBCC, HBGA, HLQFP, HSQFP, HSOP, HTQFP, HTSSOP, HVQFN, HVSON, SMS PLCC(4), SO, SOJ LQFP, QFP, TQFP SSOP, TSSOP, VSO Notes not suitable not suitable(3)
TJA1050
SOLDERING METHOD WAVE REFLOW(2) suitable suitable suitable suitable suitable
suitable not not recommended(4)(5) recommended(6)
1. For more detailed information on the BGA packages refer to the "(LF)BGA Application Note" (AN01026); order a copy from your Philips Semiconductors sales office. 2. All surface mount (SMD) packages are moisture sensitive. Depending upon the moisture content, the maximum temperature (with respect to time) and body size of the package, there is a risk that internal or external package cracks may occur due to vaporization of the moisture in them (the so called popcorn effect). For details, refer to the Drypack information in the "Data Handbook IC26; Integrated Circuit Packages; Section: Packing Methods". 3. These packages are not suitable for wave soldering. On versions with the heatsink on the bottom side, the solder cannot penetrate between the printed-circuit board and the heatsink. On versions with the heatsink on the top side, the solder might be deposited on the heatsink surface. 4. If wave soldering is considered, then the package must be placed at a 45 angle to the solder wave direction. The package footprint must incorporate solder thieves downstream and at the side corners. 5. Wave soldering is suitable for LQFP, TQFP and QFP packages with a pitch (e) larger than 0.8 mm; it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.65 mm. 6. Wave soldering is suitable for SSOP and TSSOP packages with a pitch (e) equal to or larger than 0.65 mm; it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm.
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Philips Semiconductors
Product specification
High speed CAN transceiver
DATA SHEET STATUS DATA SHEET STATUS(1) Objective data PRODUCT STATUS(2) Development DEFINITIONS
TJA1050
This data sheet contains data from the objective specification for product development. Philips Semiconductors reserves the right to change the specification in any manner without notice. This data sheet contains data from the preliminary specification. Supplementary data will be published at a later date. Philips Semiconductors reserves the right to change the specification without notice, in order to improve the design and supply the best possible product. This data sheet contains data from the product specification. Philips Semiconductors reserves the right to make changes at any time in order to improve the design, manufacturing and supply. Changes will be communicated according to the Customer Product/Process Change Notification (CPCN) procedure SNW-SQ-650A.
Preliminary data
Qualification
Product data
Production
Notes 1. Please consult the most recently issued data sheet before initiating or completing a design. 2. The product status of the device(s) described in this data sheet may have changed since this data sheet was published. The latest information is available on the Internet at URL http://www.semiconductors.philips.com.
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Philips Semiconductors
Product specification
High speed CAN transceiver
DEFINITIONS Short-form specification The data in a short-form specification is extracted from a full data sheet with the same type number and title. For detailed information see the relevant data sheet or data handbook. Limiting values definition Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 60134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended periods may affect device reliability. Application information Applications that are described herein for any of these products are for illustrative purposes only. Philips Semiconductors make no representation or warranty that such applications will be suitable for the specified use without further testing or modification. DISCLAIMERS Life support applications These products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. Philips Semiconductors customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips Semiconductors for any damages resulting from such application.
TJA1050
Right to make changes Philips Semiconductors reserves the right to make changes, without notice, in the products, including circuits, standard cells, and/or software, described or contained herein in order to improve design and/or performance. Philips Semiconductors assumes no responsibility or liability for the use of any of these products, conveys no licence or title under any patent, copyright, or mask work right to these products, and makes no representations or warranties that these products are free from patent, copyright, or mask work right infringement, unless otherwise specified. Bare die All die are tested and are guaranteed to comply with all data sheet limits up to the point of wafer sawing for a period of ninety (90) days from the date of Philips' delivery. If there are data sheet limits not guaranteed, these will be separately indicated in the data sheet. There are no post packing tests performed on individual die or wafer. Philips Semiconductors has no control of third party procedures in the sawing, handling, packing or assembly of the die. Accordingly, Philips Semiconductors assumes no liability for device functionality or performance of the die or systems after third party sawing, handling, packing or assembly of the die. It is the responsibility of the customer to test and qualify their application in which the die is used.
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Philips Semiconductors
Product specification
High speed CAN transceiver
NOTES
TJA1050
2002 May 16
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Philips Semiconductors - a worldwide company
Contact information For additional information please visit http://www.semiconductors.philips.com. Fax: +31 40 27 24825 For sales offices addresses send e-mail to: sales.addresses@www.semiconductors.philips.com.
(c) Koninklijke Philips Electronics N.V. 2002
SCA74
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner. The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license under patent- or other industrial or intellectual property rights.
Printed in The Netherlands
03/pp20
Date of release: 2002
May 16
Document order number:
9397 750 09778

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