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product brief
Intel(R) TXN17401
10Gbps Optical Serializer/Deserializer XENPAK Transceiver
Product Overview The Intel(R) TXN17401 10Gbps Serializer/ Deserializer (SerDes) XENPAK transceiver is designed to provide an IEEE802.3ae, draft 4.0-compliant 10.3Gbps interface between the photonic physical layer and the electrical section layer. The module is comprised of an optical transmitter and receiver pair integrated with Attachment Unit Interface (XAUI)-to-serial conversion. The TXN17401 includes Physical Coding Sublayer (PCS), Physical Medium Attachment (PMA), and Physical Medium Dependent (PMD) functions. The transmitter section decodes four 8B10B encoded channels at 3125Mbps from a XAUI parallel data bus, performs 64B/66B scrambling, and multiplexes the result into a 10.312Gbps optical signal launched into a single-mode optical fiber pigtail. The receiver section demultiplexes a single 10.3125Gbps optical signal and converts it to four channels of 3125Mbps XAUI. The receiver includes a photodiode, transimpedance amplifier, clock recovery, decision circuit and demultiplexer, and operates over both the 1.3m and 1.5m bands. The transponder is assembled in a Multi-Source Agreement (MSA)-compatible package (4.8 inches long, 1.4 inches wide, and 0.7 inches high). The heat sinking was designed for 50C ambient temperature with 200 linear feet per minute airflow. The electrical interface is through a XENPAK MSA-compliant 70-pin board edge connector, with optical connections made using standard SC-UPC optical connectors. The 10GBASE-LR transceiver is intended for link spans up to 10km, and uses a 1.3m Distributed Feedback (DFB) laser source. An IEEE802.3ae and XENPAK MSA compliant Management Data Interface (MDIO) is also included. Intel's automated manufacturing process produces transmitter and receiver modules that are smaller and have excellent optical performance over temperature. This process is easily scalable to support high volume requirements with repeatability and high quality. Intel brings these modules together with it's SerDes and PHY components to produce an optimized, high performance XENPAK solution. Key Applications
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Enterprise switches and routers Core-routers
Control Processor
Network Processor
Interconnect to centralized switch fabric
TXN17401
SF1-4 P2
Customer Proprietary or SF1-4 P2
10GbE Media Access Controller
XAUI
XENPAK
10.3Gbps
TXN17401
XAUI
XENPAK
10.3Gbps
10GbE Enterprise Line Card Modular Switch/Router Application
EEPROM
TXN17401 Block Diagram
LASI PRTAD<04> MDC MDIO XAIP(N), XBIP(N), XCIP(N), XDIP(N) XAUI Receive/ DeMUX/ Deskew
MDC/MDIO Management Laser Diode Control
8B/10B Decoder
FIFO
64/66 Encoder/ Scrambler
MUX
Output Driver
Laser Driver
Transmit Laser Diode
REFCLK
XAOP(N), XBOP(N), XCOP(N), XDOP(N)
MUX/ XAUI Transmit
8B/10B Encoder
FIFO
Descrambler/ 66/64 Decoder
DeMUX
CDR
Loop Select
TIA
Receive PIN Diode
Features
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Benefits
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Hot pluggable front faceplate
Gives the system designer ability to install and change transceivers both in manufacturing and in the field resulting in flexible designs and lowered inventory cost Enables up to eight 10Gbps ports on a single line card Improves time-to-market as a standardized, turnkey solution Excellent performance at temperature
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Small cross section Complies with XENPAK MSA Intel miniature un-cooled transmitter and receiver
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Support Collateral/Tools Item Evaluation Board Intel Access Developer's Site Networking Components Home Page Other Intel Support: Intel Literature Center General Information Hotline http://developer.intel.com http://developer.intel.com/design/network http://developer.intel.com/design/litcentr (800) 548-4725 7 a.m. to 7 p.m. CST (U.S. and Canada)
International locations please contact your local sales office.
Description
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Order Number TXNEB17401
TXN17401 Evaluation Board
(800) 628-8686 or (916) 356-3104 5 a.m. to 5 p.m. PST
Intel is a trademark or registered trademark of Intel Corporation or its subsidiaries in the United States and other countries. Information in this document is provided in connection with Intel(R) products. No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted by this document. Except as provided in Intel's Terms and Conditions of Sale for such products, Intel assumes no liability whatsoever, and Intel disclaims any express or implied warranty, relating to sale and/or use of Intel products including liability or warranties relating to fitness for a particular purpose, merchantability, or infringement of any patent, copyright, or other intellectual property right. Intel products are not intended for use in medical, life saving or life sustaining applications. Intel may make changes to specifications and product descriptions at any time, without notice. Designers must not rely on the absence or characteristics of any features or instructions marked "reserved" or "undefined." Intel reserves these for future definition and shall have no responsibility whatsoever for conflicts or incompatibilities arising from future changes to them. * Other names and brands may be claimed as the property of others. UNITED STATES AND CANADA Intel Corporation Robert Noyce Bldg. 2200 Mission College Blvd. P.O. Box 58119 Santa Clara, CA 95052-8119 USA (c) 2002 Intel Corporation EUROPE Intel Corporation (UK) Ltd. Pipers Way Swindon Wiltshire SN3 1RJ UK ASIA-PACIFIC Intel Semiconductor Ltd. 32/F Two Pacific Place 88 Queensway, Central Hong Kong JAPAN Intel Japan (Tsukuba HQ) 5-6 Tokodai Tsukuba-shi 300-2635 Ibaraki-ken Japan SOUTH AMERICA Intel Semicondutores do Brasil Ltda Av. Dr. Chucri Zaidan, 940-10 andar 04583-904 Sao Paulo, SP Brazil
Order Number: 249800-001 Printed in USA/0102/5K/MGS/DC

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