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INTEGRATED CIRCUITS
DATA SHEET
74HC3G14; 74HCT3G14 Inverting Schmitt-triggers
Product specification 2002 Jul 23
Philips Semiconductors
Product specification
Inverting Schmitt-triggers
FEATURES * Wide supply voltage range from 2.0 to 6.0 V * High noise immunity * Low power dissipation * Balanced propagation delays * Unlimited input rise and fall times * Very small 8 pins package. APPLICATIONS * Wave and pulse shapers for highly noisy environments * Astable multivibrators QUICK REFERENCE DATA GND = 0 V; Tamb = 25 C; tr = tf 6.0 ns. DESCRIPTION
74HC3G14; 74HCT3G14
* Monostable multivibrators * Output capability: standard.
The 74HC3G/HCT3G14 is a high-speed Si-gate CMOS device. The 74HC3G/HCT3G14 provides three inverting buffers with Schmitt-trigger action. This device is capable of transforming slowly changing input signals into sharply defined, jitter-free output signals.
TYPICAL SYMBOL tPHL/tPLH CI CPD Notes 1. CPD is used to determine the dynamic power dissipation (PD in W). PD = CPD x VCC2 x fi x N + (CL x VCC2 x fo) where: fo = output frequency in MHz; CL = output load capacitance in pF; VCC = supply voltage in Volts; N = total switching outputs; (CL x VCC2 x fo) = sum of outputs. 2. For HC3G the condition is VI = GND to VCC. For HCT3G the condition is VI = GND to VCC - 1.5 V. FUNCTION TABLE See note 1. INPUT nA L H Note 1. H = HIGH voltage level; L = LOW voltage level. OUTPUT nY H L PARAMETER propagation delay nA to nY input capacitance power dissipation capacitance per buffer notes 1 and 2 CONDITIONS HC3G14 CL = 50 pF; VCC = 4.5 V 16 2 10 HCT3G14 21 2 10 ns pF pF UNIT
2002 Jul 23
2
Philips Semiconductors
Product specification
Inverting Schmitt-triggers
ORDERING INFORMATION
74HC3G14; 74HCT3G14
PACKAGE TYPE NUMBER TEMPERATURE RANGE 74HC3G14DP 74HCT3G14DP PINNING PIN 1 2 3 4 5 6 7 8 1A 3Y 2A GND 2Y 3A 1Y VCC SYMBOL data input 1A data output 3Y data input 2A ground (0 V) data output 2Y data input 3A data output 1Y supply voltage DESCRIPTION -40 to +125 C -40 to +125 C PINS 8 8 PACKAGE MATERIAL TSSOP-8 TSSOP-8 plastic plastic CODE SOT505-2 SOT505-2 MARKING H14 T14
handbook, halfpage
handbook, halfpage
1A 1 3Y 2
8 VCC 7 1Y 3A 2Y
1
1A
1Y
7
3G14
2A GND 3 4
MNA739
2
3Y
3A
6
6 5
3
2A
2Y
5
MNA740
Fig.1 Pin configuration.
Fig.2 Logic symbol.
handbook, halfpage
1
7
6
2
handbook, halfpage
A
Y
MNA025
3
5
MNA741
Fig.3 IEC logic symbol.
Fig.4 Logic diagram (one driver).
2002 Jul 23
3
Philips Semiconductors
Product specification
Inverting Schmitt-triggers
RECOMMENDED OPERATING CONDITIONS 74HC3G14 SYMBOL VCC VI VO Tamb PARAMETER supply voltage input voltage output voltage operating ambient temperature CONDITIONS MIN. 2.0 0 0 see DC and AC -40 characteristics per device TYP. 5.0 - - +25
74HC3G14; 74HCT3G14
74HCT3G14 UNIT MIN. 4.5 0 0 -40 TYP. 5.0 - - +25 MAX. 5.5 VCC VCC +125 V V V C
MAX. 6.0 VCC VCC +125
LIMITING VALUES In accordance with the Absolute Maximum Rating System (IEC 60134); voltages are referenced to GND (ground = 0 V). SYMBOL VCC IIK IOK IO ICC Tstg PD Notes 1. The input and output voltage ratings may be exceeded if the input and output current ratings are observed. 2. Above 110 C the value of PD derates linearly with 8 mW/K. PARAMETER supply voltage input diode current output diode current output source or sink current VCC or GND current storage temperature power dissipation per package for temperature range from -40 to +125 C; note 2 VI < -0.5 V or VI > VCC + 0.5 V; note 1 VO < -0.5 V or VO > VCC + 0.5 V; note 1 -0.5 V < VO < VCC + 0.5 V; note 1 note 1 CONDITIONS MIN. -0.5 - - - - -65 - MAX. +7.0 20 20 25 50 +150 300 UNIT V mA mA mA mA C mW
2002 Jul 23
4
Philips Semiconductors
Product specification
Inverting Schmitt-triggers
DC CHARACTERISTICS
74HC3G14; 74HCT3G14
Type 74HC3G14 Over recommended operating conditions; voltages are referenced to GND (ground = 0 V). TEST CONDITIONS SYMBOL PARAMETER OTHER VOH HIGH-level output voltage VI = VIH or VIL; IO = -20 A VI = VIH or VIL; IO = -20 A VI = VIH or VIL; IO = -20 A VI = VIH or VIL; IO = -4.0 mA VI = VIH or VIL; IO = -5.2 mA VOL LOW-level output VI = VIH or VIL; voltage IO = 20 A VI = VIH or VIL; IO = 20 A VI = VIH or VIL; IO = 20 A VI = VIH or VIL; IO = 4.0 mA VI = VIH or VIL; IO = 5.2 mA ILI ICC input leakage current quiescent supply current VI = VCC or GND VCC (V) 2.0 4.5 6.0 4.5 6.0 2.0 4.5 6.0 4.5 6.0 6.0 MIN. 1.9 4.4 5.9 4.18 5.68 - - - - - - - 25 TYP. 2.0 4.5 6.0 4.32 5.81 0 0 0 0.15 0.16 - - - - - - - 0.1 0.1 0.1 0.26 0.26 0.1 1.0 Tamb (C) -40 to +85 - - - - - 0.1 0.1 0.1 0.33 0.33 1.0 10 -40 to +125 UNIT - - - - - 0.1 0.1 0.1 0.4 0.4 1.0 20
MAX. MIN. MAX. MIN. MAX. 1.9 4.4 5.9 4.13 5.63 - - - - - - - 1.9 4.4 5.9 3.7 5.2 - - - - - - - V V V V V V V V V V A A
VI = VCC or GND; 6.0 IO = 0
2002 Jul 23
5
Philips Semiconductors
Product specification
Inverting Schmitt-triggers
74HC3G14; 74HCT3G14
Type 74HCT3G14 Over recommended operating conditions; voltages are referenced to GND (ground = 0 V). TEST CONDITIONS SYMBOL PARAMETER OTHER VOH HIGH-level output voltage VI = VIH or VIL; IO = -20 A VI = VIH or VIL; IO = -4.0 mA VOL LOW-level output VI = VIH or VIL; voltage IO = 20 A VI = VIH or VIL; IO = 4.0 mA ILI ICC ICC input leakage current VI = VCC or GND VCC (V) 4.5 4.5 4.5 4.5 5.5 MIN. 4.4 4.18 - - - - 25 TYP. 4.5 4.32 0 0.15 - - - - - 0.1 0.26 0.1 1.0 300 Tamb (C) -40 to +85 - - 0.1 0.33 1.0 10 375 -40 to +125 UNIT - - 0.1 0.4 1.0 20 410
MAX. MIN. MAX. MIN. MAX. 4.4 4.13 - - - - - 4.4 3.7 - - - - - V V V V A A A
quiescent supply VI = VCC or GND; 5.5 current IO = 0 additional supply VI = VCC - 2.1 V; current per input IO = 0
4.5 to 5.5 -
2002 Jul 23
6
Philips Semiconductors
Product specification
Inverting Schmitt-triggers
TRANSFER CHARACTERISTICS
74HC3G14; 74HCT3G14
Type 74HC3G14 Over recommended operating conditions; voltages are referenced to GND (ground = 0 V). TEST CONDITIONS SYMBOL PARAMETER WAVEFORMS VT+ positive going threshold voltage negative going threshold voltage hysteresis voltage (VT+ - VT-) VCC (V) 25 MIN. 1.0 2.3 3.0 0.3 1.13 1.5 0.3 0.6 0.8 TYP. 1.18 2.6 3.46 0.6 1.47 2.06 0.6 1.13 1.40 MAX. 1.5 3.15 4.2 0.9 2.0 2.6 1.0 1.4 1.7 Tamb (C) -40 to +85 MIN. 1.0 2.3 3.0 0.3 1.13 1.5 0.3 0.6 0.8 MAX. 1.5 3.15 4.2 0.9 2.0 2.6 1.0 1.4 1.7 -40 to +125 MIN. 1.0 2.3 3.0 0.3 1.13 1.5 0.3 0.6 0.8 MAX. 1.5 3.15 4.2 0.9 2.0 2.6 1.0 1.4 1.7 V V V V V V V V V UNIT
see Figs. 5 and 6 2.0 4.5 6.0 see Figs. 5 and 6 2.0 4.5 6.0 see Figs. 5 and 6 2.0 4.5 6.0
VT-
VH
Type 74HCT3G14 Over recommended operating conditions; voltages are referenced to GND (ground = 0 V). TEST CONDITIONS SYMBOL PARAMETER OTHER VT+ positive going threshold voltage negative going threshold voltage hysteresis voltage (VT+ - VT-) VCC (V) 25 MIN. 1.2 1.4 0.5 0.6 0.4 0.4 TYP. 1.58 1.78 0.87 1.11 0.71 0.67 MAX. 1.9 2.1 1.2 1.4 - - Tamb (C) -40 to +85 MIN. 1.2 1.4 0.5 0.6 0.4 0.4 MAX. 1.9 2.1 1.2 1.4 - - -40 to +125 MIN. 1.2 1.4 0.5 0.6 0.4 0.4 MAX. 1.9 2.1 1.2 1.4 - - V V V V V V UNIT
see Figs. 5 and 6 4.5 5.5 see Figs. 5 and 6 4.5 5.5 see Figs. 5 and 6 4.5 5.5
VT-
VH
2002 Jul 23
7
Philips Semiconductors
Product specification
Inverting Schmitt-triggers
TRANSFER CHARACTERISTIC WAVEFORMS
74HC3G14; 74HCT3G14
handbook, halfpage
VO
handbook, halfpage
VI
VT+ VT-
VH
VO
MNA027
VH VT- VT+
VI
MNA026
VT+ and VT- are between limits of 20% and 70%. Fig.5 Transfer characteristic. Fig.6 The definitions of VT+, VT- and VH
handbook, halfpage
100
MNA028
handbook, halfpage
1.0
MNA029
ICC (A)
ICC (mA) 0.8
0.6 50 0.4
0.2
0 0 1.0 VI (V) 2.0
0 0 2.5 VI (V) 5.0
VCC = 2.0 V. Fig.7 Typical HC3G transfer characteristics.
VCC = 4.5 V. Fig.8 Typical HC3G transfer characteristics.
2002 Jul 23
8
Philips Semiconductors
Product specification
Inverting Schmitt-triggers
74HC3G14; 74HCT3G14
handbook, halfpage
1.6
MNA030
handbook, halfpage
2.0
MNA031
ICC (mA)
ICC (mA)
0.8
1.0
0 0 3.0 VI (V) 6.0
0 0 2.5 VI (V) 5.0
VCC = 6.0 V. Fig.9 Typical HC3G transfer characteristics.
VCC = 4.5 V. Fig.10 Typical HCT3G transfer characteristics.
handbook, halfpage
3.0
MNA032
ICC (mA)
2.0
1.0
0 0 3.0 VI (V) 6.0
VCC = 5.5 V. Fig.11 Typical HCT3G transfer characteristics;
2002 Jul 23
9
Philips Semiconductors
Product specification
Inverting Schmitt-triggers
AC CHARACTERISTICS Type 74HC3G14 GND = 0 V; tr = tf 6.0 ns; CL = 50 pF. TEST CONDITIONS SYMBOL PARAMETER WAVEFORMS tPHL/tPLH VCC (V) 25 MIN. - - - - - -
74HC3G14; 74HCT3G14
Tamb (C) -40 to +85 - - - - - - -40 to +125 - - - - - - UNIT
TYP. MAX. MIN. MAX. MIN. MAX. 53 16 13 20 7 5 125 25 21 75 15 13 155 31 26 95 19 16 190 38 32 110 22 19 ns ns ns ns ns ns
propagation delay see Figs 12 and 13 2.0 nA to nY 4.5 6.0 output transition time see Figs 12 and 13 2.0 4.5 6.0
tTHL/tTLH
Type 74HCT3G14 GND = 0 V; tr = tf 6.0 ns; CL = 50 pF. TEST CONDITIONS SYMBOL PARAMETER WAVEFORMS tPHL/tPLH tTHL/tTLH VCC (V) 25 MIN. - - Tamb (C) -40 to +85 - - -40 to +125 - - UNIT
TYP. MAX. MIN. MAX. MIN. MAX. 21 6 32 15 40 19 48 22 ns ns
propagation delay see Figs 12 and 13 4.5 nA to nY output transition time see Figs 12 and 13 4.5
2002 Jul 23
10
Philips Semiconductors
Product specification
Inverting Schmitt-triggers
AC WAVEFORMS
74HC3G14; 74HCT3G14
V handbook, halfpage I nA input GND t PHL VOH nY output VOL t THL VM VM
10%
VM
VM
t PLH
90%
t TLH
MNA722
For HC3G: VM = 50%; VI = GND to VCC. For HCT3G: VM = 1.3 V; VI = GND to 3.0 V.
Fig.12 The input (nA) to output (nY) propagation delays and output transition times.
handbook, full pagewidth
S1 VCC PULSE GENERATOR VI D.U.T. RT CL 50 pF
MNA742
VCC open GND
RL VO 1 k
TEST tPLH/tPHL tPLZ/tPZL tPHZ/tPZH open VCC GND
S1
Definitions for test circuit: CL = load capacitance including jig and probe capacitance. RT = termination resistance should be equal to the output impedance Zo of the pulse generator.
Fig.13 Load circuitry for switching times.
2002 Jul 23
11
Philips Semiconductors
Product specification
Inverting Schmitt-triggers
APPLICATION INFORMATION The slow input rise and fall times cause additional power dissipation, this can be calculated using the following formula: Pad = fi x (tr x ICCa + tf x ICCa) x VCC Where: Pad = additional power dissipation (W) fi = input frequency (MHz) tr = input rise time between 10% and 90% (ns); tf = input fall time between 90% and 10% (ns); ICC(AV) = average additional supply current (A).
50 100
74HC3G14; 74HCT3G14
handbook, halfpage
200
MNA036
ICC(AV) (A) 150 positive-going edge
Average ICCa differs with positive or negative input transitions, as shown in Fig.14 and Fig.15. HC3G14/HCT3G14 used in relaxation oscillator circuit, see Fig.16. Remark to the application information 1. All values given are typical unless otherwise specified.
0 0 2.0
negative-going edge 4.0 VCC (V) 6.0
Linear change of VI between 0.1VCC to 0.9VCC. Fig.14 Average ICC for HC Schmitt-trigger devices.
handbook, halfpage
200
MNA058
ICC(AV) (A)
handbook, halfpage
R
150
positive-going edge C
MNA035
100
50
negative-going edge
0 0 2 4 VCC (V) 6 1 1 For HC3G: f = -- ---------------------T 0.8 x RC 1 1 For HCT3G: f = -- -------------------------T 0.67 x RC
Linear change of VI between 0.1VCC to 0.9VCC. Fig.15 Average ICC for HCT Schmitt-trigger devices.
Fig.16 Relaxation oscillator using the HC3G/HCT3G14.
2002 Jul 23
12
Philips Semiconductors
Product specification
Inverting Schmitt-triggers
PACKAGE OUTLINE
74HC3G14; 74HCT3G14
TSSOP8: plastic thin shrink small outline package; 8 leads; body width 3 mm; lead length 0.5 mm
SOT505-2
D
E
A
X
c y HE vMA
Z
8
5
A pin 1 index
A2 A1
(A3)
Lp L
1
e bp
4
wM
detail X
0
2.5 scale
5 mm
DIMENSIONS (mm are the original dimensions) UNIT mm A max. 1.1 A1 0.15 0.00 A2 0.95 0.75 A3 0.25 bp 0.38 0.22 c 0.18 0.08 D(1) 3.1 2.9 E(1) 3.1 2.9 e 0.65 HE 4.1 3.9 L 0.5 Lp 0.47 0.33 v 0.2 w 0.13 y 0.1 Z(1) 0.70 0.35 8 0
Note 1. Plastic or metal protrusions of 0.15 mm maximum per side are not included. OUTLINE VERSION SOT505-2 REFERENCES IEC JEDEC --JEITA EUROPEAN PROJECTION ISSUE DATE 02-01-16
2002 Jul 23
13
Philips Semiconductors
Product specification
Inverting Schmitt-triggers
SOLDERING Introduction to soldering surface mount packages This text gives a very brief insight to a complex technology. A more in-depth account of soldering ICs can be found in our "Data Handbook IC26; Integrated Circuit Packages" (document order number 9398 652 90011). There is no soldering method that is ideal for all surface mount IC packages. Wave soldering can still be used for certain surface mount ICs, but it is not suitable for fine pitch SMDs. In these situations reflow soldering is recommended. Reflow soldering Reflow soldering requires solder paste (a suspension of fine solder particles, flux and binding agent) to be applied to the printed-circuit board by screen printing, stencilling or pressure-syringe dispensing before package placement. Several methods exist for reflowing; for example, convection or convection/infrared heating in a conveyor type oven. Throughput times (preheating, soldering and cooling) vary between 100 and 200 seconds depending on heating method. Typical reflow peak temperatures range from 215 to 250 C. The top-surface temperature of the packages should preferable be kept below 220 C for thick/large packages, and below 235 C for small/thin packages. Wave soldering Conventional single wave soldering is not recommended for surface mount devices (SMDs) or printed-circuit boards with a high component density, as solder bridging and non-wetting can present major problems. To overcome these problems the double-wave soldering method was specifically developed.
74HC3G14; 74HCT3G14
If wave soldering is used the following conditions must be observed for optimal results: * Use a double-wave soldering method comprising a turbulent wave with high upward pressure followed by a smooth laminar wave. * For packages with leads on two sides and a pitch (e): - larger than or equal to 1.27 mm, the footprint longitudinal axis is preferred to be parallel to the transport direction of the printed-circuit board; - smaller than 1.27 mm, the footprint longitudinal axis must be parallel to the transport direction of the printed-circuit board. The footprint must incorporate solder thieves at the downstream end. * For packages with leads on four sides, the footprint must be placed at a 45 angle to the transport direction of the printed-circuit board. The footprint must incorporate solder thieves downstream and at the side corners. During placement and before soldering, the package must be fixed with a droplet of adhesive. The adhesive can be applied by screen printing, pin transfer or syringe dispensing. The package can be soldered after the adhesive is cured. Typical dwell time is 4 seconds at 250 C. A mildly-activated flux will eliminate the need for removal of corrosive residues in most applications. Manual soldering Fix the component by first soldering two diagonally-opposite end leads. Use a low voltage (24 V or less) soldering iron applied to the flat part of the lead. Contact time must be limited to 10 seconds at up to 300 C. When using a dedicated tool, all other leads can be soldered in one operation within 2 to 5 seconds between 270 and 320 C.
2002 Jul 23
14
Philips Semiconductors
Product specification
Inverting Schmitt-triggers
74HC3G14; 74HCT3G14
Suitability of surface mount IC packages for wave and reflow soldering methods PACKAGE(1) BGA, LBGA, LFBGA, SQFP, TFBGA, VFBGA HBCC, HBGA, HLQFP, HSQFP, HSOP, HTQFP, HTSSOP, HVQFN, HVSON, SMS PLCC(4), SO, SOJ LQFP, QFP, TQFP SSOP, TSSOP, VSO Notes 1. For more detailed information on the BGA packages refer to the "(LF)BGA Application Note" (AN01026); order a copy from your Philips Semiconductors sales office. 2. All surface mount (SMD) packages are moisture sensitive. Depending upon the moisture content, the maximum temperature (with respect to time) and body size of the package, there is a risk that internal or external package cracks may occur due to vaporization of the moisture in them (the so called popcorn effect). For details, refer to the Drypack information in the "Data Handbook IC26; Integrated Circuit Packages; Section: Packing Methods". 3. These packages are not suitable for wave soldering. On versions with the heatsink on the bottom side, the solder cannot penetrate between the printed-circuit board and the heatsink. On versions with the heatsink on the top side, the solder might be deposited on the heatsink surface. 4. If wave soldering is considered, then the package must be placed at a 45 angle to the solder wave direction. The package footprint must incorporate solder thieves downstream and at the side corners. 5. Wave soldering is suitable for LQFP, TQFP and QFP packages with a pitch (e) larger than 0.8 mm; it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.65 mm. 6. Wave soldering is suitable for SSOP and TSSOP packages with a pitch (e) equal to or larger than 0.65 mm; it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm. not suitable not suitable(3) SOLDERING METHOD WAVE REFLOW(2) suitable suitable suitable suitable suitable
suitable not not recommended(4)(5) recommended(6)
2002 Jul 23
15
Philips Semiconductors
Product specification
Inverting Schmitt-triggers
DATA SHEET STATUS DATA SHEET STATUS(1) Objective data PRODUCT STATUS(2) Development
74HC3G14; 74HCT3G14
DEFINITIONS This data sheet contains data from the objective specification for product development. Philips Semiconductors reserves the right to change the specification in any manner without notice. This data sheet contains data from the preliminary specification. Supplementary data will be published at a later date. Philips Semiconductors reserves the right to change the specification without notice, in order to improve the design and supply the best possible product. This data sheet contains data from the product specification. Philips Semiconductors reserves the right to make changes at any time in order to improve the design, manufacturing and supply. Changes will be communicated according to the Customer Product/Process Change Notification (CPCN) procedure SNW-SQ-650A.
Preliminary data
Qualification
Product data
Production
Notes 1. Please consult the most recently issued data sheet before initiating or completing a design. 2. The product status of the device(s) described in this data sheet may have changed since this data sheet was published. The latest information is available on the Internet at URL http://www.semiconductors.philips.com. DEFINITIONS Short-form specification The data in a short-form specification is extracted from a full data sheet with the same type number and title. For detailed information see the relevant data sheet or data handbook. Limiting values definition Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 60134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended periods may affect device reliability. Application information Applications that are described herein for any of these products are for illustrative purposes only. Philips Semiconductors make no representation or warranty that such applications will be suitable for the specified use without further testing or modification. DISCLAIMERS Life support applications These products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. Philips Semiconductors customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips Semiconductors for any damages resulting from such application. Right to make changes Philips Semiconductors reserves the right to make changes, without notice, in the products, including circuits, standard cells, and/or software, described or contained herein in order to improve design and/or performance. Philips Semiconductors assumes no responsibility or liability for the use of any of these products, conveys no licence or title under any patent, copyright, or mask work right to these products, and makes no representations or warranties that these products are free from patent, copyright, or mask work right infringement, unless otherwise specified.
2002 Jul 23
16
Philips Semiconductors
Product specification
Inverting Schmitt-triggers
NOTES
74HC3G14; 74HCT3G14
2002 Jul 23
17
Philips Semiconductors
Product specification
Inverting Schmitt-triggers
NOTES
74HC3G14; 74HCT3G14
2002 Jul 23
18
Philips Semiconductors
Product specification
Inverting Schmitt-triggers
NOTES
74HC3G14; 74HCT3G14
2002 Jul 23
19
Philips Semiconductors - a worldwide company
Contact information For additional information please visit http://www.semiconductors.philips.com. Fax: +31 40 27 24825 For sales offices addresses send e-mail to: sales.addresses@www.semiconductors.philips.com.
(c) Koninklijke Philips Electronics N.V. 2002
SCA74
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner. The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license under patent- or other industrial or intellectual property rights.
Printed in The Netherlands
613508/01/pp20
Date of release: 2002
Jul 23
Document order number:
9397 750 09981

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