Part Number Hot Search : 
20T32 C2500 EC4A22M GW5329 2412D 2412D 34671 2N3646
Product Description
Full Text Search
 

To Download HSD667A Datasheet File

  If you can't view the Datasheet, Please click here to try to view without PDF Reader .  
 
 


  Datasheet File OCR Text:
 HI-SINCERITY
MICROELECTRONICS CORP.
Spec. No. : HE6510-B Issued Date : 1996.07.15 Revised Date : 2000.10.01 Page No. : 1/4
HSD667A
SILICON NPN EPITAXIAL
Description
Low Frequency Power Amplifier Complementary Pair With HSB647A.
Absolute Maximum Ratings
* Maximum Temperatures Storage Temperature ............................................................................................ -55 ~ +150 C Junction Temperature ..................................................................................... 150 C Maximum * Maximum Power Dissipation Total Power Dissipation (Ta=25C) ............................................................................... 900 mW * Maximum Voltages and Currents (Ta=25C) VCBO Collector to Base Voltage ...................................................................................... 120 V VCEO Collector to Emitter Voltage ................................................................................... 100 V VEBO Emitter to Base Voltage ............................................................................................. 5 V IC Collector Current (DC)...................................................................................................... 1 A IC Collector Current (Pulse).................................................................................................. 2 A
Characteristics (Ta=25C)
Symbol BVCBO BVCEO BVEBO ICBO *VCE(sat) VBE(on) *hFE1 *hFE2 fT Cob Min. 120 100 5 60 30 Typ. 140 12 Max. 10 1 1.5 200 Unit V V V uA V V Test Conditions IC=10uA, IE=0 IC=1mA, IB=0 IE=10uA, IC=0 VCB=100V, IE=0 IC=500mA, IB=50mA VCE=5V, IC=150mA VCE=5V, IC=150mA VCE=5V, IC=500mA VCE=5V, IC=150mA VCB=10V, f=1MHz, IE=0
*Pulse Test : Pulse Width 380us, Duty Cycle2%
MHz pF
Classification of hFE
Rank Range B 60-120 C 100-200
HSMC Product Specification
HI-SINCERITY
MICROELECTRONICS CORP.
Characteristics Curve
Current Gain & Collector Current
1000 1
Spec. No. : HE6510-B Issued Date : 1996.07.15 Revised Date : 2000.10.01 Page No. : 2/4
Saturation Voltage & Collector Current
VBE(sat) @ IC=10IB
hFE
VCE=5V 100
Saturation Voltage (V)
0.1
VCE(sat) @ IC=10IB
10 1 10 100 1000
0.01 0.1 1 10 100 1000
Collector Current (mA)
Collector Current (mA)
On Voltage & Collector Current
10 1000
Cutoff Frequency & Collector Current
Cutoff Frequency (MHz)
On Voltage (mV)
100 VCE=5V
1 VBE(on) @ VCE=5V
10
0.1 0.1 1 10 100 1000
1 1 10 100 1000
Collector Current (mA)
Collector Current (mA)
Capacitance & Reverse-Biased Voltage
100 10000 PT=1ms PT=100ms
Safe Operating Area
Collector Current-IC (mA)
1000 PT=1s
Capacitance (pF)
10
Cob
100
10
1 0.1 1 10 100
1 1 10 100
Reverse-Biased Voltage (V)
Forward Voltage-VCE (V)
HSMC Product Specification
HI-SINCERITY
MICROELECTRONICS CORP.
Spec. No. : HE6510-B Issued Date : 1996.07.15 Revised Date : 2000.10.01 Page No. : 3/4
Power Derating
1000 900
Power Dissipation-PD(mW)
800 700 600 500 400 300 200 100 0 0 20 40 60 80 100
o
120
140
160
Ambient Temperature-Ta( C)
HSMC Product Specification
HI-SINCERITY
MICROELECTRONICS CORP.
TO-92 Dimension
A B
12 3
Spec. No. : HE6510-B Issued Date : 1996.07.15 Revised Date : 2000.10.01 Page No. : 4/4
2
Marking :
HSMC Logo Part Number Date Code Rank Product Series
3
Laser Mark
HSMC Logo Product Series
C
D
Part Number
H I E F
G
Ink Mark Style : Pin 1.Emitter 2.Collector 3.Base
1
3-Lead TO-92 Plastic Package HSMC Package Code : A
*:Typical
DIM A B C D E F
Inches Min. Max. 0.1704 0.1902 0.1704 0.1902 0.5000 0.0142 0.0220 *0.0500 0.1323 0.1480
Millimeters Min. Max. 4.33 4.83 4.33 4.83 12.70 0.36 0.56 *1.27 3.36 3.76
DIM G H I 1 2 3
Inches Min. Max. 0.0142 0.0220 *0.1000 *0.0500 *5 *2 *2
Millimeters Min. Max. 0.36 0.56 *2.54 *1.27 *5 *2 *2
Notes : 1.Dimension and tolerance based on our Spec. dated Apr. 25,1996.
2.Controlling dimension : millimeters. 3.Maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material. 4.If there is any question with packing specification or packing method, please contact your local HSMC sales office.
Material :
* Lead : 42 Alloy ; solder plating * Mold Compound : Epoxy resin family, flammability solid burning class:UL94V-0
Important Notice:
* All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of HSMC. * HSMC reserves the right to make changes to its products without notice. * HSMC semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems. * HSMC assumes no liability for any consequence of customer product design, infringement of patents, or application assistance.
Head Office And Factory :
* Head Office (Hi-Sincerity Microelectronics Corp.) : 10F.,No. 61, Sec. 2, Chung-Shan N. Rd. Taipei Taiwan R.O.C. Tel : 886-2-25212056 Fax : 886-2-25632712, 25368454 * Factory 1 : No. 38, Kuang Fu S. Rd., Fu-Kou Hsin-Chu Industrial Park Hsin-Chu Taiwan. R.O.C Tel : 886-3-5983621~5 Fax : 886-3-5982931 * Factory 2 : No. 17-1, Ta-Tung Rd., Fu-Kou Hsin-Chu Industrial Park Hsin-Chu Taiwan. R.O.C Tel : 886-3-5977061 Fax : 886-3-5979220
HSMC Product Specification


▲Up To Search▲   

 
Price & Availability of HSD667A

All Rights Reserved © IC-ON-LINE 2003 - 2022  

[Add Bookmark] [Contact Us] [Link exchange] [Privacy policy]
Mirror Sites :  [www.datasheet.hk]   [www.maxim4u.com]  [www.ic-on-line.cn] [www.ic-on-line.com] [www.ic-on-line.net] [www.alldatasheet.com.cn] [www.gdcy.com]  [www.gdcy.net]


 . . . . .
  We use cookies to deliver the best possible web experience and assist with our advertising efforts. By continuing to use this site, you consent to the use of cookies. For more information on cookies, please take a look at our Privacy Policy. X