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FDC6332L June 2003 FDC6332L Common Source Load Switch P-Channel 1.8V Specified PowerTrench MOSFET General Description This Load Switch integrates an N-Channel Power MOSFET that drives Common-Source P-Channels and TM in a small SuperSot -6 package. It uses Fairchild's advanced low voltage PowerTrench process. The RDS(ON) is 750 m per the switch @ VGS 1.8Vand is optimized for battery power management applications. Features * -1 A, 8 V. RDS(ON) = 350 m @ VGS = -4.5 V RDS(ON) = 500 m @ VGS = -2.5 V RDS(ON) = 750 m @ VGS = -1.8 V * N-Channel MOSFET includes Zener protection for ESD ruggedness (>6KV Human body model) * High performance trench technology for extremely low RDS(ON) Applications * Battery management/Charger Application * Accessory load switching S1 D1 D2 Vin 1 2 3 6 5 4 S1/S2 On/Off Vout GND IN V DROP OUT G2 SuperSOT Pin 1 TM -6 G1 S2 G1/G2 ON/OFF SuperSOTTM-6 Equivalent Circuit TA=25oC unless otherwise noted Absolute Maximum Ratings Symbol VIN VON ILoad PD TJ, TSTG Input Voltage Turn-On Voltage Load Current - Continuous - Pulsed Maximum Power Dissipation Parameter Ratings 8 8 (Note 1) Units V V A W C -1.0 -2.0 0.7 -55 to +150 (Note 1) Operating and Storage Junction Temperature Range Thermal Characteristics RJA RJC Thermal Resistance, Junction-to-Ambient Thermal Resistance, Junction-to-Case (Note 1) (Note 1) 160 90 C/W Package Marking and Ordering Information Device .332 FDC6332L Reel Size 7'' Tape width 8mm Quantity 3000 units 2003Fairchild Semiconductor Corporation FDC6332L Rev D(W) FDC6332L Electrical Characteristics Symbol Off Characteristics BVIN IRIN BVGOFF IGOFF Input - Output Breakdown Voltage Reverse Input Current TA = 25C unless otherwise noted Parameter Test Conditions VON/OFF = 0 V, VIN = -8V, IG = 250uA VG = 8 V ID = -250 A VON/OFF = 0 V Min -20 Typ Max Units V -1 A V 100 nA Driver FET Gate Breakdown Voltage Driver FET Gate Leakage Current (Note 2) 8 On Characteristics VIN VON VOFF ILOAD RDS(on) Input Voltage Range Turn-On Voltage Range Turn-off Voltage Range Output Load Current Static Drain-Source On-Resistance Loadswitch On-Resistance VIN = -5 V VGS = 4.5 V, VGS = 2.5 V, VGS = 1.8 V, VIN = 8 V, VIN = 8 V, VIN = 8 V, VON = -4.5V ID = -1.0A ID = -0.9 A ID = -0.7 A ID = -1.0 A ID = -0.9 A ID = -0.7 A 1.8 1.5 -0.2 -1 2.5 8 8 0.2 V V V A m RON 230 338 643 409 411 420 350 500 750 m Drain-Source Diode Characteristics and Maximum Ratings IS VSD Maximum Continuous Drain-Source Diode Forward Current Drain-Source Diode Forward Voltage VON/OFF = 0 V, IS = -0.6 A (Note 2 -0.9 -0.6 -1.2 A V Notes: 1. RJA is the sum of the junction-to-case and case-to-ambient thermal resistance where the case thermal reference is defined as the solder mounting surface of the drain pins. RJC is guaranteed by design while RCA is determined by the user's board design. a) 90C/W when mounted on a 1in2 pad of 2 oz copper b) 160C/W when mounted on a minimum pad of 2 oz copper Scale 1 : 1 on letter size paper 2. Pulse Test: Pulse Width < 300s, Duty Cycle < 2.0% FDC6332L Load Switch Application Circuit S1/S2 Q2 Q3 IN G1/G2 ON/OFF Q1 OUT LOAD FDC6332L Rev D(W) FDC6332L Typical Characteristics 1.2 1 0.8 -VDROP, (V) -VDROP, (V) TJ = 125OC VIN = 2.5V VON/OFF = 2.5V to 8V PW = 300us, D < 2% 1 VIN = 3.3V VON/OFF = 2.5V to 8V PW = 300us, D < 2% 0.8 0.6 TJ = 125OC 0.6 TJ = 25 C O 0.4 TJ = 25OC 0.4 0.2 0 0 0.2 0.4 -IL, (A) 0.6 0.8 1 0.2 0 0 0.2 0.4 -IL, (A) 0.6 0.8 1 Figure 1. Conduction Voltage Drop Variation with Load Current. 0.6 0.5 0.4 -VDROP, (V) 0.3 0.2 0.1 0 0 0.2 0.4 -IL, (A) 0.6 0.8 1 VIN = 8V VON/OFF = 2.5V to 8V PW = 300us, D < 2% 2 Figure 2. Conduction Voltage Drop Variation with Load Current. IL = 1A VON/OFF = 2.5V to 8V PW = 300us, D < 2% TJ = 125OC RDS(ON), ON-RESISTANCE (W) 1.6 1.2 TJ = 25 C O TJ = 125OC 0.8 TJ = 25OC 0.4 0 1 2 3 4 5 6 7 8 -VIN, INPUT VOLTAGE (V) Figure 3. Conduction Voltage Drop Variation with Load Current. 1 D = 0.5 0.2 Figure 4. On-Resistance Variation With Input Voltage r(t), NORMALIZED EFFECTIVE TRANSIENT THERMAL RESISTANCE R JA(t) = r(t) * R JA R JA = 160 C/W 0.1 0.1 0.05 0.02 0.01 P(pk) t1 t2 SINGLE PULSE T J - T A = P * R JA(t) Duty Cycle, D = t1 / t2 0.01 0.0001 0.001 0.01 0.1 t1, TIME (sec) 1 10 100 1000 Figure 5. Transient Thermal Response Curve. Thermal characterization performed using the conditions described in Note 1 Transient thermal response will change depending on the circuit board design. FDC6332L Rev D(W) TRADEMARKS The following are registered and unregistered trademarks Fairchild Semiconductor owns or is authorized to use and is not intended to be an exhaustive list of all such trademarks. ACEx FACT ActiveArray FACT Quiet Series Bottomless FASTa CoolFET FASTr CROSSVOLT FRFET DOME GlobalOptoisolator EcoSPARK GTO E2CMOSTM HiSeC EnSignaTM I2C Across the board. Around the world. The Power Franchise Programmable Active Droop DISCLAIMER ImpliedDisconnect PACMAN POP ISOPLANAR Power247 LittleFET PowerTrencha MicroFET QFET MicroPak QS MICROWIRE QT Optoelectronics MSX Quiet Series MSXPro RapidConfigure OCX RapidConnect OCXPro SILENT SWITCHERa OPTOLOGICa SMART START OPTOPLANAR SPM Stealth SuperSOT-3 SuperSOT-6 SuperSOT-8 SyncFET TinyLogica TruTranslation UHC UltraFETa VCX FAIRCHILD SEMICONDUCTOR RESERVES THE RIGHT TO MAKE CHANGES WITHOUT FURTHER NOTICE TO ANY PRODUCTS HEREIN TO IMPROVE RELIABILITY, FUNCTION OR DESIGN. FAIRCHILD DOES NOT ASSUME ANY LIABILITY ARISING OUT OF THE APPLICATION OR USE OF ANY PRODUCT OR CIRCUIT DESCRIBED HEREIN; NEITHER DOES IT CONVEY ANY LICENSE UNDER ITS PATENT RIGHTS, NOR THE RIGHTS OF OTHERS. LIFE SUPPORT POLICY FAIRCHILDS PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF FAIRCHILD SEMICONDUCTOR CORPORATION. As used herein: 2. A critical component is any component of a life 1. Life support devices or systems are devices or support device or system whose failure to perform can systems which, (a) are intended for surgical implant into be reasonably expected to cause the failure of the life the body, or (b) support or sustain life, or (c) whose support device or system, or to affect its safety or failure to perform when properly used in accordance with instructions for use provided in the labeling, can be effectiveness. reasonably expected to result in significant injury to the user. PRODUCT STATUS DEFINITIONS Definition of Terms Datasheet Identification Advance Information Product Status Formative or In Design First Production Definition This datasheet contains the design specifications for product development. Specifications may change in any manner without notice. This datasheet contains preliminary data, and supplementary data will be published at a later date. Fairchild Semiconductor reserves the right to make changes at any time without notice in order to improve design. This datasheet contains final specifications. Fairchild Semiconductor reserves the right to make changes at any time without notice in order to improve design. This datasheet contains specifications on a product that has been discontinued by Fairchild semiconductor. The datasheet is printed for reference information only. Preliminary No Identification Needed Full Production Obsolete Not In Production Rev. I2 |
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