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CMOS Static RAM 64K (16K x 4-Bit) IDT7188S IDT7188L x Features High-speed (equal access and cycle times) - Military: 25/35/45/55/70/85ns (max.) Low power consumption Battery backup operation -- 2V data retention (L version only) Available in high-density industry standard 22-pin, 300 mil ceramic DIP Produced with advanced CMOS technology Inputs/outputs TTL-compatible Military product compliant to MIL-STD-883, Class B innovative circuit design techniques, provides a cost effective approach for memory intensive applications. Access times as fast as 25ns are available. The IDT7188 offers a reduced power standby mode, ISB1, which is activated when CS goes HIGH. This capability significantly decreases power while enhancing system reliability. The low-power version (L) version also offers a battery backup data retention capability where the circuit typically consumes only 30W operating from a 2V battery. All inputs and outputs are TTL-compatible and operate from a single 5V supply. The IDT7188 is packaged in a 22-pin, 300 mil ceramic DIP providing excellent board-level packing densities. Military grade product is manufactured in compliance with the latest revision of MIL-STD-883, Class B, making it ideally suited to military temperature applications demanding the highest level of performance and reliability. x x x x x x Description The IDT7188 is a 65,536-bit high-speed static RAM organized as 16K x 4. It is fabricated using IDT's high-performance, high-reliability technology -- CMOS. This state-of-the-art technology, combined with Functional Block Diagram A0 VCC GND 65,536-BIT MEMORY ARRAY DECODER A13 I/O0 I/O1 I/O2 I/O3 COLUMN I/O INPUT DATA CONTROL , CS WE 2989 drw 01 FEBRUARY 2001 1 (c)2000 Integrated Device Technology, Inc. DSC-2989/09 IDT7188S/L CMOS Static RAM 64K (16K x 4-Bit) Military Temperature Range Pin Configuration A0 A1 A2 A3 A4 A5 A6 A7 A8 CS GND 1 2 3 4 5 6 7 8 9 10 11 22 21 20 19 18 17 16 15 14 13 12 Absolute Maximum Ratings(1) Symbol Rating Terminal Voltage with Respect to GND Operating Temperature Temperature Under Bias Storage Temperature Power Dissipation DC Output Current Value -0.5 to +7.0 -55 to +125 -65 to +135 -65 to +150 1.0 50 Unit V o o D22-1 VCC A 13 A12 A11 A10 A9 I/O 3 I/O 2 I/O 1 I/O 0 WE 2989 drw 02 VTERM TA TBIAS TSTG PT IOUT C C C o W mA 2989 tbl 03 , DIP Top View NOTE: 1. Stresses greater than those listed under ABSOLUTE MAXIMUM RATINGS may cause permanent damage to the device. This is a stress rating only and functional operation of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect reliability. (TA = +25C, f = 1.0MHz, VCC = 0V) Symbol Parameter(1) Input Capacitance I/O Capacitance Conditions VIN = 0V VOUT = 0V Max. 6 6 Unit pF pF 2989 tbl 04 Capacitance Pin Descriptions Name A0 - A13 CS WE I/O0 - I/O3 VCC GND Description Address Inputs Chip Select Write Enable Data Input/Output Power Ground 2989 tbl 01 CIN CI/O NOTE: 1. This parameter is determined by device characterization, but is not production tested. Recommended DC Operating Conditions Symbol VCC GND Parameter Supply Voltage Ground Input High Voltage Input Low Voltage Min. 4.5 0 2.2 -0.5(1) Typ. 5.0 0 ____ Max. 5.5 0 6.0 0.8 Unit V V V V 2989 tbl 05 Truth Table Mode Standby Read Write (1) VIH WE X H L I/O High-Z DOUT DIN Power Standby Active Active 2989 tbl 02 CS H L L VIL ____ NOTE: 1. VIL (min.) = -3.0V for pulse width less than 20ns,once per cycle. NOTE: 1. H = VIH, L = VIL, X = don't care. Recommended Operating Temperature and Supply Voltage Grade Military Temperature -55 C to +125 C O O GND 0V Vcc 5V 10% 2989 tbl 06 2 IDT7188S/L CMOS Static RAM 64K (16K x 4-Bit) Military Temperature Range DC Electrical Characteristics (VCC = 5.0V 10%) IDT7188S Symbol |ILI| |ILO| VOL Parameter Input Leakage Current Output Leakage Current Output Low Voltage Test Conditions VCC = Max., VIN = GND to VCC VCC = Max., CS = VIH, VOUT = GND to VCC IOL = 10mA, VCC = Min. IOL = 8mA, VCC = Min. VOH Output High Voltage IOH = -4mA, VCC = Min. Min. ____ IDT7188L Min. ____ Max. 10 10 0.5 0.4 ____ Max. 5 5 0.5 0.4 ____ Unit A A V ____ ____ ____ ____ ____ ____ 2.4 2.4 V 2989 tbl 07 DC Electrical Characteristics(1) Symbol ICC1 Parameter Operating Power Supply Current CS = VIL, Outputs Open VCC = Max., f = 0(2) Dynamic Operating Current CS = VIL, Outputs Open VCC = Max., f = fMAX(2) Standby Power Supply Current (TTL Level) CS > VIH, Outputs Open VCC = Max., f = fMAX(2) Full Standby Power Supply Current (CMOS Level) CS > VHC, VCC = Max., VIN > VHC or VIN < VLC, f = 0(2) Power S L S L S L S L (VCC = 5V 10%, VLC = 0.2V, VHC = VCC - 0.2V) 7188S25 7188L25 105 80 155 120 60 40 20 1.5 7188S35 7188L35 105 80 140 115 50 40 20 1.5 7188S45 7188L45 105 80 140 110 50 35 20 1.5 7188S55 7188L55 105 80 140 110 50 35 20 1.5 7188S70 7188L70 105 80 140 110 50 35 20 1.5 7188S85 7188L85 105 80 140 105 50 35 20 1.5 2989 tbl 08 Unit mA ICC2 mA ISB mA ISB1 mA NOTES: 1. All values are maximum guaranteed values. 2. At f = fMAX address and data inputs are cycling at the maximum frequency of read cycles of 1/tRC. f = 0 means no input lines change. 6.42 3 IDT7188S/L CMOS Static RAM 64K (16K x 4-Bit) Military Temperature Range Data Retention Characteristics (L Version Only) (VHC = VCC - 0.2V) Typ. (1) VCC @ Symbol VDR ICCDR tCDR(3) tR(3) Parameter VCC for Data Retention Data Retention Current Chip Deselect to Data Retention Time Operation Recovery Time Input Leakage Current CS > VHC VIN > VHC or < VLC Test Condition ____ Max. VCC @ 3.0V ____ Min. 2.0 ____ 2.0V ____ 2.0V ____ 3.0V ____ Unit V A ns ns A 2989 tbl 09 10 ____ 15 ____ 600 ____ 900 ____ 0 tRC(2) ____ ____ ____ ____ ____ IILII(3) ____ ____ 2 2 NOTES: 1. TA = +25C. 2. tRC = Read Cycle Time. 3. This parameter is guaranteed by device characterization but is not production tested. Low VCC Data Retention Waveform VCC t CDR CS VIH DATA RETENTION MODE 4.5V VDR 2V VDR V IH 2989 drw 03 4.5V tR , AC Test Conditions Input Pulse Levels Input Rise/Fall Times Input Timing Reference Levels Output Reference Levels AC Test Load GND to 3.0V 5ns 1.5V 1.5V See Figures 1 and 2 2989 tbl 10 5V 480 DATAOUT 255 30pF* 5V 480 DATA OUT , 2989 drw 04 255 5pF* 2989 drw 05 , Figure 1. AC Test Load *Includes scope and jig capacitances Figure 2. AC Test Load (for tHZ, tLZ, tWZ, tOHZ and tOW) 4 IDT7188S/L CMOS Static RAM 64K (16K x 4-Bit) Military Temperature Range AC Electrical Characteristics 7188S25 7188L25 Symbol Parameter Min. Max. (VCC = 5.0V 10%) 7188S35 7188L35 Min. Max. 7188S45 7188L45 Min. Max. 7188S55 7188L55 Min. Max. 7188S70 7188L70 Min. Max. 7188S85 7188L85 Min. Max. Unit Read Cycle tRC tAA tACS tOH tLZ(1) tHZ(1) tPU(1) tPD(1) Read Cycle Time Address Access Time Chip Select Access Time Output Hold from Address Change Output Select to Output in Low-Z Chip Deselect to Output in High-Z Chip Select to Power Up Time Chip Deselect to Power Down Time 25 ____ ____ 35 ____ -- 35 35 ____ 45 ____ -- 45 45 ____ 55 ____ ____ 70 ____ ____ 85 ____ ____ ns ns ns ns ns ns ns ns 2989 tbl 11 25 25 ____ 55 55 ____ 70 70 ____ 85 85 ____ ____ ____ ____ ____ ____ ____ 5 5 ____ 5 5 ____ 5 5 ____ 5 5 ____ 5 5 ____ 5 5 ____ ____ ____ ____ ____ ____ ____ 10 ____ 14 ____ 14 ____ 20 ____ 25 ____ 30 ____ 0 ____ 0 ____ 0 ____ 0 ____ 0 ____ 0 ____ 25 35 45 55 70 85 NOTE: 1. This parameter is guaranteed by device characterization but is not production tested. Timing Waveform of Read Cycle No. 1(1,2) tRC (5) ADDRESS tAA tOH DATAOUT PREVIOUS DATA VALID DATA VALID 2989 drw 06 , Timing Waveform of Read Cycle No. 2(1,3) tRC (5) CS tACS tLZ (4) DATAOUT tPU VCC SUPPLY CURRENT ICC ISB 2989 drw 07 tHZ (4) DATA VALID tPD HIGH IMPEDANCE , NOTES: 1. WE is HIGH for Read cycle. 2. CS is LOW for Read cycle. 3. Address valid prior to or coincident with CS transition LOW. 4. Transition is measured 200mV from steady state voltage. 5. All Read cycle timings are referenced from the last valid address to the first transitioning address. 6.42 5 IDT7188S/L CMOS Static RAM 64K (16K x 4-Bit) Military Temperature Range AC Electrical Characteristics 7188S25 7188L25 Symbol Parameter Min. Max. (VCC = 5.0V 10%) 7188S35 7188L35 Min. Max. 7188S45 7188L45 Min. Max. 7188S55 7188L55 Min. Max. 7188S70 7188L70 Min. Max. 7188S85 7188L85 Min. Max. Unit Write Cycle tWC tCW tAW tAS tWP tWR tDW tDH tWZ(1) tOW(1) Write Cycle Time Chip Select to End-of-Write Address Valid to End-of-Write Address Set-up Time Write Pulse Width Write Recovery Time Data Valid to End-of-Write Data Hold Time Write Enable to Output in High-Z Output Active from End-of-Write 20 20 20 0 20 0 13 0 ____ ____ 30 25 25 0 25 0 15 0 ____ ____ 40 35 35 0 35 0 20 0 ____ ____ 50 50 50 0 50 0 25 0 ____ ____ 60 60 60 0 60 0 30 0 ____ ____ 75 75 75 0 75 0 35 0 ____ ____ ns ns ns ns ns ns ns ns ns ns 2989 tbl 12 ____ ____ ____ ____ ____ ____ ____ ____ ____ ____ ____ ____ ____ ____ ____ ____ ____ ____ ____ ____ ____ ____ ____ ____ ____ ____ ____ ____ ____ ____ ____ ____ ____ ____ ____ ____ ____ ____ ____ ____ ____ ____ 7 ____ 10 ____ 15 ____ 25 ____ 30 ____ 40 ____ 5 5 5 5 5 5 NOTE: 1. This parameter is guaranteed by device characterization. Timing Waveform of Write Cycle No. 1 (WE Controlled Timing)(1,2,3) tWC ADDRESS tAW CS1, CS2 tAS WE tWZ (6) DATAOUT (4) tWP tWR tOW (6) (4) tDW DATAIN tDH , 2989 drw 08 DATA VALID NOTES: 1. WE or CS must be HIGH during all address transitions. 2. A write occurs during the overlap (tWP) of a LOW CS and a LOW WE. 3. tWR is measured from the earlier of CS or WE going HIGH to the end of the write cycle. 4. During this period, I/O pins are in the output state so that the input signals should not be applied. 5. If the CS LOW transition occurs simultaneously with or after the WE LOW transition, the outputs remain in the high-impedance state. 6. Transition is measured 200mV from steady state. 6 IDT7188S/L CMOS Static RAM 64K (16K x 4-Bit) Military Temperature Range Timing Waveform of Write Cycle No. 2 (CS Controlled Timing)(1,2,3,5) tWC ADDRESS tAW CS tAS WE tDW DATAIN DATA VALID 2989 drw 09 tCW t WR , tDH NOTES: 1. WE or CS must be HIGH during all address transitions. 2. A write occurs during the overlap (tWP) of a LOW CS and a LOW WE. 3. tWR is measured from the earlier of CS or WE going HIGH to the end of the write cycle. 4. During this period, I/O pins are in the output state so that the input signals should not be applied. 5. If the CS LOW transition occurs simultaneously with or after the WE LOW transition, the outputs remain in the high-impedance state. 6. Transition is measured 200mV from steady state. Ordering Information IDT 7188 Device Type X Power XX Speed X Package X Process/ Temperature Range B Military (-55C to +125C) Compliant to MIL-STD-883, Class B , D 300 mil Ceramic DIP (D22-1) 25 35 45 55 70 85 S L Speed in nanoseconds Standard Power Low Power 2989 drw 10 6.42 7 IDT7188S/L CMOS Static RAM 64K (16K x 4-Bit) Military Temperature Range Datasheet Document History 11/xx/99 Pg. 2, 3, 4 Pg. 8 08/09/00 02/01/01 Updated to new format Removed commercial temperature data Added Datasheet Document History Not recommended for new designs Removed "Not recommended for new designs" CORPORATE HEADQUARTERS 2975 Stender Way Santa Clara, CA 95054 for SALES: 800-345-7015 or 408-727-6116 fax:408-492-8674 www.idt.com for Tech Support: sramhelp@idt.com 800 544-7726, x4033 The IDT logo is a registered trademark of Integrated Device Technology, Inc. 8 |
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