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E2N0023-28-72 Semiconductor
Semiconductor MSM60851
USB Device Controller
This version:MSM60851 Jul. 1998 Previous version: Mar. 1998
GENERAL DESCRIPTION
The MSM60851 is a general purpose Universal Serial Bus (USB) device controller. The MSM60851 provides a USB interface, control/status block, application interface, and FIFOs. The FIFO interface and two types of transfer have been optimized for BulkOut devices such as printers and BulkIn devices such as digital still cameras and image scanners.
FEATURES
* USB 1.0 compliant * Built-in USB transceiver circuit * Full-speed (12 Mb/sec) support * Supports printer device class and image device class * Supports two types of transfer; control transfer and bulk transfer * Built-in FIFOs for control transfer Two 64 bytes (one for receive FIFO and the other for transmit FIFO) * Built-in FIFOs for bulk transfer (available for either receive FIFO or transmit FIFO) One 64 byte One 128 byte (2-level) * Supports one control endpoint and two bulk endpoint addresses * 128 byte 2-level FIFO enables fast BulkOut transfer and BulkIn transfer * Supports 8 bit/16 bit DMA transfer * VCC is 3.0 V to 3.6 V * Supporting dual power supply enables 5 V application interface * Built-in 48 MHz oscillator circuit * Package options: 44-pin plastic QFP (QFP44-P-910-0.80-2K) (Product name: MSM60851GA) 44-pin plastic TQFP (TQFP44-P-1010-0.80-K) (Product name: MSM60851TB)
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Semiconductor
BLOCK DIAGRAM
MSM60851
XIN 48 MHz XOUT Oscillator DPLL
Status/Control
A7:A0
D15:D0 Application Interface CS, WR, RD RESET Application Module (Local MCU)
D+ USB USB Bus D- Transceiver
Protocol Engine
8 byte Setup Register Endpoint FIFO/
INTR DREQ DACK
MSM60851
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Semiconductor
MSM60851
PIN CONFIGURATION (TOP VIEW)
AD0 AD1
VCC5 AD2 AD3 AD4 AD5 44 43 42 41 40 39 VSS 38 37
D+ D- 1 2 VCC3 3 TEST1 TEST2 4 5 XIN 6 XOUT CS 7 8 RD 9 WR 10 RESET 11
36
35
34
33 32 31 30 29 28 27 26 25 24 23
DREQ
AD6
AD7
DACK A0 A1 A2 A3 A4 A5 A6 A7 ADSEL ALE
12
13
14
15
16
17
18
19
20
21 D9 35 AD7
INTR
D15
D14
D13
D12
D11
VCC5
D10
44-Pin Plastic QFP
VSS
44
43
42
41
40
39
38
37
36
D+ D- VCC3 TEST1 TEST2 XIN XOUT CS RD WR RESET

1 2 3 4 5 6 7 8 9 10 11
12 13 14 15 INTR D15 D14 D13
34
DREQ
VCC5
AD0
AD1
AD2
AD3
AD4
AD5
AD6
VSS
D8
22
33 32 31 30 29 28 27 26 25 24 23
DACK A0 A1 A2 A3 A4 A5 A6 A7 ADSEL ALE
16
17
18
19
20
21 D9
VSS
VCC5
D12
D11
D10
44-Pin Plastic TQFP 3/42
D8
22
Semiconductor
MSM60851
PIN DESCRIPTION
Pin 1, 2 6, 7 4, 5 13 to 16, 19 to 22 35 to 38, 41 to 44 25 to 32 8 9 10 12 34 33 23 24 11 Symbol D+,D- XIN,XOUT TEST1, 2 D15:D8 AD7:AD0 A7:A0 CS RD WR INTR DREQ DACK ALE ADSEL RESET Type I/O -- I I/O I/O I I I I O O I I I I USB data Pin for external crystal oscillator Test Pins (normally "L") Internal data bus (MSB) Internal data bus (LSB)/address input Address input Chip select signal input pin. LOW active Read signal input pin. LOW active Write signal input pin. LOW active Interrupt request signal output pin DMA request output pin DMA acknowledge signal input pin Address latch enable signal input pin Address input mode select input pin. "H": address/data multiplex System Reset signal input pin. LOW active Description
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Semiconductor
MSM60851
INTERNAL REGISTERS
Addresses and Names of Registers
Address A5:A0 00h 01h 02h 03h 04h 08h 09h 0Ah 0Bh 0Eh 0Fh 10h 11h 12h 13h 14h 15h 16h 17h 1Ah 1Bh 1Ch 1Dh 1Eh 1Fh 20h 21h 22h 23h 24h 25h 26h 27h Read A7,A6 11b 11b 11b 11b 11b 11b 11b 11b 11b -- -- 11b 11b 11b 11b 11b 11b 11b 11b 11b 11b 11b 11b 11b -- 11b 11b 11b -- 11b 11b 11b -- Write A7,A6 01b 01b -- -- -- 01b -- -- -- 01b 01b -- -- -- -- -- -- -- -- 01b 01b -- 01b 01b -- -- -- 01b -- 01b 01b 01b -- Device Address Register Device State Register Packet Error Register Receive FIFO Register Transmit FIFO Register Endpoint Packet-Ready Register Endpoint 0 Receive-Byte Count Register Endpoint 1 Receive-Byte Count Register Endpoint 2 Receive-Byte Count Register Flash Transmit FIFO Software Reset bmRequestType Setup Register bRequest Setup Register wValue LSB Setup Register wValue MSB Setup Register wIndex LSB Setup Register wIndex MSB Setup Register wLength LSB Setup Register wLength MSB Setup Register Assertion Select Register Interrupt Enable Register Interrupt Status Register DMA Control Register DMA Interval Register Reserved Endpoint 0 Receive Control Register Endpoint 0 Receive General Register Endpoint 0 Receive Payload Register Reserved Endpoint 1 Control Register Endpoint 1 General Register Endpoint 1 Payload Register Reserved Register name
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Semiconductor Addresses and Names of Registers (Continued)
Address A5:A0 30h 31h 32h 33h 34h 35h 36h 37h 00h 01h 02h 00h 01h 02h Read A7,A6 11b 11b 11b 11b 11b 11b 11b -- 01b 01b 01b -- -- -- Write A7,A6 -- -- 01b 01b 01b 01b 01b -- -- -- -- 11b 11b 11b Endpoint 0 Transmit Control Register Endpoint 0 Transmit General Register Endpoint 0 Transmit Payload Register Endpoint 0 General Register Endpoint 2 Control Register Endpoint 2 General Register Endpoint 2 Payload Register Reserved Endpoint 0 Receive FIFO data Endpoint 1 Receive FIFO data Endpoint 2 Receive FIFO data Endpoint 0 Transmit FIFO data Endpoint 1 Transmit FIFO data Endpoint 2 Transmit FIFO data Register name
MSM60851
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Semiconductor Register Description Device Address Register (C0h, 40h)
D7 RFU D6 D5 D4 D3 Device Address (R/W) D2 D1 D0
MSM60851
The local MCU writes a device address, which is given by the SET_ADDRESS command form the host computer, into this register. Thereafter, this device processes an only token packet transmitted to the given device address. Device State Register (C1h, 41h)
D7 RFU D6 D5 D4 D3 D2 D1 D0
Default State (R/W) Address State (R/W) Configuration State (R/W) Suspended State (R) Remote Wakeup (R/W)
Default, Address, and Configuration States: D2, D1, and D0 are set to 0, 0, and 1 (default states) by reset respectively. Changing the values of this register gives no influence on operation of this device. Suspended State: This register is asserted when the device enters the suspended state. This register is deaserted by reset or when the device exits the suspended state by a resume signaling from the USB bus. Remote Wakeup: When this device signals a remote wakeup during the suspended state, this register is asserted by a local MCU. This register is automatically deasserted when the device exits the suspended state by a resume signaling from the USB bus. Packet Error Register (C2h, -)
D7 D6 RFU D5 D4 D3 D2 D1 D0
Bit Stuff Error (R) RFU = 0000b Data CRC Error (R) Address CRC Error (R) PID Error (R)
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Semiconductor FIFO Status Register 1 (C3h, -)
D7 D6 RFU D5 D4 D3 D2 D1 D0
MSM60851
Receive FIFO0 Full (R) RFU = 0000b Receive FIFO0 Empty (R) FIFO1 Full (R) FIFO1 Empty (R)
FIFO Status Register 2 (C4h, -)
D7 D6 RFU D5 D4 D3 D2 D1 D0
Transmit FIFO0 Full (R) Transmit FIFO0 Empty (R) FIFO2 Full (R) FIFO2 Empty (R)
RFU = 0000b
Endpoint Packet-Ready Register (C8h, 48h)
D7 RFU D6 D5 D4 D3 RFU D2 D1 D0
EP0 Receive Packet Ready (R/Reset) EP1 Receive Packet Ready (R/Reset) EP2 Receive Packet Ready (R/Reset) EP0 Transmit Packet Ready (R/Set) EP1 Transmit Packet Ready (R/Set) EP2 Transmit Packet Ready (R/Set)
Receive Packet Ready: When a valid packet arrives at an endpoint, this bit is automatically set and the endpoint is locked. When "1" is written in this register, Receiver Packet Ready is reset and the endpoint is unlocked. (This bit also is set to "0".) When DMA is enabled, EP1 Receive Packet Ready is automatically reset after all the data in EP1 is read during DMA transfer. Transmit Packet Ready: When "1" is written in this register, the Transmit Packet Ready is set and the packet in the corresponding endpoint is transmitted. Transmit Packet Ready is automatically reset when the ACK handshake is returned from the host. When DMA is enabled, EP1 Transmit Packet Ready is automatically set after the data written in EP1 reaches the maximum packet size during DMA transfer. The value of this register remains unchanged when "0" is written in this register.
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Semiconductor Endpoint 0 Receive Byte Count Register (C9h, -)
D7 RFU D6 D5 D4 D3 EP0 Byte Count (R) D2 D1 D0
MSM60851
Endpoint 1 Receive Byte Count Register (CAh, -)
D7 RFU D6 D5 D4 D3 EP1 Byte Count (R) D2 D1 D0
Endpoint 2 Receive Byte Count Register (CBh, -)
D7 RFU D6 D5 D4 D3 EP2 Byte Count (R) D2 D1 D0
Flash Transmit FIFO (-, 4Eh)
D7 0 D6 0 D5 0 D4 0 D3 0 D2 D1 D0 0
In case EP1 is set as a transmission endpoint, when "1" is written in this bit, the FIFO at EP1 is cleared and Packet Ready at EP1 is reset by the WRITE pulse. In case EP2 is set as a transmission endpoint, when "1" is written in this bit, the FIFO at EP2 is cleared and Packet Ready at EP2 is reset by the WRITE pulse.
Software Reset (-, 4Fh)
D7 0 D6 0 D5 0 D4 0 D3 0 D2 0 D1 0 D0
When "1" is written in this bit, the MSM60851 is reset by the WRITE pulse.
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Semiconductor bmRequestType Setup Register (D0h, -)
D7 D6 Type (R) D5 D4 D3 Recipient (R) 0 = Device 1 = Interface 2 = Endpoint 3 = Others 4 to 31 = Reserved 0 = Standard 1 = Class 2 = Vendor 3 = Reserved Data Transfer Direction (R) 0 = Host to device 1 = Device to host D2 D1 D0
MSM60851
bRequest Setup Register (D1h, -)
D7 D6 D5 D4 D3 D2 D1 D0
Specific Request (R)
* wValueLSB Setup Register (D2h, -) D7:D0 = LSB of Word Size Field (R) * wValueMSB Setup Register (D3h, -) D7:D0 = MSB of Word Size Field (R) * wIndexLSB Setup Register (D4h, -) D7:D0 = LSB of Word Size Field (R) * wIndexMSB Setup Register (D5h, -) D7:D0 = MSB of Word Size Field (R) * wLengthLSB Setup Register (D6h, -) This field defines the length of data that is transferred in the second stage (data stage) of control transfer. (R) * wLengthMSB Setup Register (D7h, -) This field defines the length of data that is transferred in the data stage of control transfer. (R)
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Semiconductor Assertion Select Register (DAh, 5Ah) (R/W)
D7 D6 D5 RFU D4 D3 D2 Assertion of DACK D1 Assertion of DREQ D0 Assertion of INTR
MSM60851
0 = Active LOW (Initial value) 1 = Active HIGH 0 = Active LOW (Initial value) 1 = Active HIGH 0 = Active HIGH (Initial value) 1 = Active LOW
Interrupt Enable Register (DBh, 5Bh) (R/W)
D7 RFU D6 D5 RFU D4 D3 D2 D1 D0
Setup Ready Interrupt Enable EP1 Packet Ready Interrupt Enable EP2 Packet Ready Interrupt Enable EP0 Receive Packet Ready Interrupt Enable EP0 Transmit Packet Ready Interrupt Enable Suspended State Interrupt Enable Initial value of D0 is 1. Initial values of D1 to D6 are 0.
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Semiconductor Interrupt Status Register (DCh, 5Ch) (R/W)
D7 RFU D6 D5 RFU D4 D3 D2 D1 D0
MSM60851
Setup Ready Interrupt Status (R) EP1 Packet Ready Interrupt Status (R) EP2 Packet Ready Interrupt Status (R) EP0 Receive Packet Ready Interrupt Status (R) EP0 Transmit Packet Ready Interrupt Status (R) Suspended State Interrupt Status (R)
Setup Ready Interrupt Status: Equivalent to Setup Ready at (F3h)described later when the corresponding Interrupt Enable bit is asserted. EP1 Packet Ready Interrupt Status: Equivalent to EP1 Receive Packet Ready (the complement of EP1 Transmit Packet Ready when EP1 is set for transmitter) at (C8h) described before when the corresponding Interrupt Enable bit is asserted. EP2 Packet Ready Interrupt Status: Equivalent to EP2 Receive Packet Ready (the complement of EP2 Transmit Packet Ready when EP2 is set for transmitter) at (C8h) described before when the corresponding Interrupt Enable bit is asserted. EP0 Receive Packet Ready Interrupt Status: Equivalent to EP0 Receive Packet Ready at (C8h) described before when the corresponding Interrupt Enable bit is asserted. EP0 Transmit Packet Ready Interrupt Status: Equivalent to the complement of EP0 Transmit Packet Ready at (C8h) described before when the corresponding Interrupt Enable bit is asserted. Suspended State Interrupt Status: Equivalent to Suspended State Register at (C1h) described before when the corresponding Interrupt Enable bit is asserted.
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Semiconductor DMA Control Register (DDh, 5Dh) (R/W)
D7 D6 RFU D5 D4 Transfer Mode D3 Transfer Size D2 Byte Count D1 Address Mode D0 DMA Enable
MSM60851
0 = Disables DMA Transfer (Initial value) 1 = Enables DMA Transfer for EP1 0 = Single Address Mode (Initial value) 1 = Dual Address Mode 0 = (Initial value) 1 = Inserts EP1 receive byte count into the top byte or top word of the transfer data. (Note 1) 0 = Byte (8 bits) (Initial value) 1 = Word (16 bits) (Note 2) 0 = Single Transfer Mode (Initial value) 1 = Demand Transfer Mode
(Note 1) (Note 2)
When 16-bit mode is set, the upper byte of the top word is 00h. When 16-bit mode is set and the packet size is an odd-number byte, the upper byte of the last word is 00h.
DMA Interval Register (DEh, 5Eh) (R/W)
D7 D6 D5 D4 D3 D2 D1 D0
This register specifies a DMA transfer interval between de-assertion and re-assertion of DREQ in Single Transfer mode. The interval is specified between 0 and 255 (bit times). The initial value is 0. 1 bit time = 1/12 MHz (= 84 ns)
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Semiconductor Endpoint 0 Receive Control Register (E0h, -)
D7 RFU D6 0 D5 0 D4 0 D3 0 D2 0 D1 RFU D0
MSM60851
Configuration Bit (R) Transfer Type (R) Endpoint Address (R)
Configuration Bit: Only when this bit is asserted ("1"), a packet transmitted from a host computer to this EP is received. The packet is ignored when this bit is deasserted ("0"). This bit is deasserted by system reset and is asserted by USB reset (both D+ and D- are 0s for more than 2.5 ms). Endpoint 0 Receive General Register (E1h, -)
D7 D6 D5 RFU D4 D3 D2 D1 D0
Data Sequence Toggle Bit (R)
Endpoint 0 Receive Payload Register (E2h, 62h)
D7 RFU D6 D5 D4 D3 D2 D1 D0
Maximum Packet Size (R/W)
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Semiconductor Endpoint 1 Control Register (E4h, 64h)
MSM60851
Register to set the attribute of EP1. To use EP1, the local MCU writes EP1's attribute in this register by the request from the host computer.
D7 D6 0 D5 0 D4 1 D3 1 D2 0 D1 D0
Configuration Bit (R/W) Stall Bit (R/W)
Transfer Type (R)
10 = Bulk Transfer
Endpoint Address (R) Transfer Direction (R/W) 0 = Reception (OUT endpoint) (Supports printer) 1 = Transmission (IN endpoint) (Supports scanner, DSC)
Configuration Bit: Only when this bit is asserted ("1"), a packet transmitted from the host computer to this EP is received. The packet is ignored when this bit is deasserted ("0"). Whether or not this EP is configured can be known by referencing this bit. Stall Bit: When this bit is asserted ("1"), a stall handshake for a packet transmitted from the host computer to this EP is automatically returned to the host computer. Endpoint 1 General Register (E5h, 65h)
D7 D6 D5 RFU D4 D3 D2 D1 D0
Data Sequence Toggle Bit (R/Reset)
Data Sequence Toggle Bit: When initializing EP, PID of DATA0 is specified after resetting the Data Packet Toggle bit by writing "1" to this bit (this bit goes to "0"). Endpoint 1 Payload Register (E6h, 66h)
D7 RFU D6 D5 D4 D3 D2 D1 D0
Maximum packet size (R/W)
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Semiconductor Endpoint 0 Transmit Control Register (F0h, -)
D7 D6 RFU D5 D4 D3 0 D2 0 D1 RFU D0
MSM60851
Transfer Type (R)
Endpoint 0 Transmit General Register (F1h, -)
D7 D6 D5 RFU D4 D3 D2 D1 D0
Data Sequence Toggle Bit (R)
Endpoint 0 Transmit Payload Register (F2h, 72h)
D7 RFU D6 D5 D4 D3 D2 D1 D0
Maximum Packet Size (R/W)
Endpoint 0 Transmit General Register (F3h, 73h)
D7 D6 RFU D5 D4 D3 D2 D1 RFU D0
Setup Ready (R/Reset) Stall Bit (R/W) EP0 Stage (R) 00 = Setup Stage 01 = Data Stage 10 = Status Stage
Setup Ready: When a valid setup packet has arrived at an 8-byte setup register, this register is automatically set and the receive FIFO at endpoint 0 is locked. Writing "1" in this register resets Setup Ready. When the data stage of Control Write transaction follows, Packet Ready at endpoint 0 is also reset. Therefore, the endpoint 0 receive FIFO is unlocked and ready to receive the packets in the data stage. The value of this register remains unchanged when "0" is written in this register.
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Semiconductor Endpoint 2 Control Register (F4h, 74h)
D7 D6 0 D5 1 D4 0 D3 1 D2 0 D1 D0
MSM60851
Configuration Bit (R/W) Stall Bit (R/W)
Transfer Type (R)
10 = Bulk Transfer
Endpoint Address (R) Transfer Direction (R/W) 0 = Reception (OUT endpoint) 1 = Transmission (IN endpoint)
Configuration Bit: Only when this bit is asserted ("1"), a packet transmitted from the host computer to this EP is received. The packet is ignored when this bit is deasserted ("0"). Whether or not this EP is configured can be known by referencing this bit. Stall Bit: When this bit is asserted ("1"), a stall handshake for a packet transmitted from the host computer to this EP is automatically returned to the host computer. Endpoint 2 General Register (F5h, 75h)
D7 D6 D5 RFU D4 D3 D2 D1 D0
Data Sequence Toggle Bit (R/Reset)
Data Sequence Toggle Bit: When initializing EP, PID of DATA0 is specified after resetting the Data Packet Toggle bit by writing "1" to this bit (this bit goes to "0"). Endpoint 2 Payload Register (F6h, 76h)
D7 RFU D6 D5 D4 D3 D2 D1 D0
Maximum Packet Size (R/W)
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Semiconductor Endpoint 0 Receive FIFO Data (40h, -)
D7 D6 D5 D4 D3 D2 D1 D0
MSM60851
Endpoint 0 Receive FIFO Data (R)
Area to store data to be transmitted from the host computer to this device in the data stage of Control Write transfer. Endpoint 1 Receive FIFO Data (41h, -)
D7 D6 D5 D4 D3 D2 D1 D0
Endpoint 1 Receive FIFO Data (R)
Area to store data to be transmitted from the host computer to EP1 of this device in Bulk Out transfer. This register is valid only when EP1 is set for the OUT endpoint. Endpoint 2 Receive FIFO Data (42h, -)
D7 D6 D5 D4 D3 D2 D1 D0
Endpoint 2 Receive FIFO Data (R)
Area to store data to be transmitted from the host computer to EP2 of this device in Bulk Out transfer. This register is valid only when EP2 is set for the OUT endpoint.
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Semiconductor Endpoint 0 Transmit FIFO Data (-, C0h)
D7 D6 D5 D4 D3 D2 D1 D0
MSM60851
Endpoint 0 Transmit FIFO Data (W)
Area to store data to be transmitted from this device to the host computer in the data stage of Control Read transter. Endpoint 1 Transmit FIFO Data (-, C1h)
D7 D6 D5 D4 D3 D2 D1 D0
Endpoint 1 Transmit FIFO Data (W)
Area to store data to be transmitted from EP1 of this device to the host computer in Bulk In transfer. This register is valid only when EP1 is set for the IN endpoint. Endpoint 2 Transmit FIFO Data (-, C2h)
D7 D6 D5 D4 D3 D2 D1 D0
Endpoint 2 Transmit FIFO Data (W)
Area to store data to be transmitted from EP2 of this device to the host computer in Bulk In transfer. This register is valid only when EP2 is set for the IN endpoint.
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Semiconductor
MSM60851
ABSOLUTE MAXIMUM RATINGS
Parameter Power Supply 3 Power Supply 5 Input Voltage Storage Temperature Symbol VCC3 VCC5 VI TSTG Condition -- -- -- -- Rating -0.3 to +4.6 -0.5 to +6.5 -0.3 to VCC5 + 0.3 -55 to +150 Unit V V V C
RECOMMENDED OPERATING CONDITIONS
Parameter Power Supply 3 Power Supply 5 Operating Temperature Oscillation Frequency Symbol VCC3 VCC5 Ta FOSC Condition -- -- -- -- Range 3.0 to 3.6 3.0 to 5.5 0 to 70 48 Unit V V C MHz
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Semiconductor
MSM60851
ELECTRICAL CHARACTERISTICS
DC Characteristics (1)
(VCC5 = VCC3 = 3.0 to 3.6 V, VSS = 0 V, Ta = 0 to 70C) Parameter High-level Input Voltage Low-level Input Voltage High-level Input Voltage Low-level Input Voltage Schmitt Trigger Input Voltage High-level Output Voltage Low-level Output Voltage High-level Input Current Low-level Input Current 3-state Output Leakage Current Power Supply Current (Operating) Power Supply Current (Standby) Symbol VIH VIL VIH VIL Vt+ Vt- DVt VOH VOL IIH IIL IOZH IOZL ICC3 ICCS3 Condition -- -- -- -- -- -- (Vt+) - (Vt-) IOH = -100 mA IOH = -4 mA IOL = 100 mA IOL = 4 mA VIH = VCC5 VIL = VSS VOH = VCC5 VOL = VSS -- Note 3 Min. 2.0 -0.3 VCC3 0.8 -0.3 -- 0.8 0.1 VCC5 - 0.2 2.4 -- -- -- -1 -- -1 -- -- Typ. -- -- -- -- 1.6 1.2 0.4 -- -- -- -- 0.01 -0.01 0.01 -0.01 -- -- Max. VCC5 + 0.3 +0.8 VCC3 + 0.3 VCC3 0.2 2.0 -- -- -- -- 0.2 0.4 1 -- 1 -- 50 50 Unit V Note 1 V V XIN V V V V V V V V mA Note 2 mA mA mA mA mA D15:D8 AD7:AD0 VCC3 VCC3 D15:D8 AD7:AD0 INTR, DREQ RESET Applicable pin
Notes: 1. Applied to D15:D8, AD7:AD0, A7:A0, CS, RD, WR, DACK, ALE, and ADSEL. 2. Applied to XIN, A7:A0, CS, RD, WR, DACK, ALE, and ADSEL. VIH = VCC3 for only XIN. 3. The XIN pin is fixed to High level or Low level in the suspend state. All the output pins are open.
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Semiconductor DC Characteristics (2)
MSM60851
(VCC5 = 4.5 to 5.5 V, VCC3 = 3.0 to 3.6 V, VSS = 0 V, Ta = 0 to 70C) Parameter High-level Input Voltage Low-level Input Voltage Schmitt Trigger Input Voltage High-level Output Voltage Low-level Output Voltage High-level Input Current Low-level Input Current 3-state Output Leakage Current Power Supply Current (Operating) Power Supply Current (Standby) Symbol VIH VIL Vt+ Vt- DVt VOH VOL IIH IIL IOZH IOZL ICC3 ICCS3 Condition -- -- -- -- (Vt+) - (Vt-) IOH = -100 mA IOH = -8 mA IOL = 100 mA IOL = 8 mA VIH = VCC5 VIL = VSS VOH = VCC5 VOL = VSS -- Note 3 Min. 2.2 -0.5 -- 0.8 0.2 VCC5 - 0.2 3.7 -- -- -- -10 -- -10 -- -- Typ. -- -- 1.7 1.4 0.3 -- -- -- -- 0.01 -0.01 0.01 -0.01 -- -- Max. VCC5 + 0.5 +0.8 2.2 -- -- -- -- 0.2 0.4 10 -- 10 -- 50 50 Unit V Note 1 V V V V V V V V mA Note 2 mA mA mA mA mA D15:D8 AD7:AD0 VCC3 VCC3 D15:D8 AD7:AD0 INTR, DREQ RESET Applicable pin
Notes: 1. Applied to D15:D8, AD7:AD0, A7:A0, CS, RD, WR, DACK, ALE, and ADSEL. The DC characteristics (1) applies to XIN. 2. Applied to A7:A0, CS, RD, WR, DACK, ALE, and ADSEL. The DC characteristics (1) applies to XIN. 3. The XIN pin is fixed to High level or Low level in the suspend state. All the output pins are open.
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Semiconductor DC Characteristics (3) USB Port
MSM60851
(VCC3 = 3.0 to 3.6 V, VSS = 0 V, Ta = 0 to 70C) Parameter Differential Input Sensitivity Differential Common Mode Range Single Ended Receiver Threshold High-level Output Voltage Low-level Output Voltage Output Leakage Current Symbol VDI VCM VSE VOH VOL ILO RL of 15 kW to VSS RL of 1.5 kW to 3.6 V 0 V < VIN < 3.3 V -10 Condition (D+) - (D-) Includes VDI range Min. 0.2 0.8 0.8 2.8 2.5 2.0 3.6 0.3 +10 Typ. Max. Unit V V V D+, D- V V mA Applicable pin
AC Characteristics USB Port
(VCC3 = 3.0 to 3.6 V, VSS = 0 V, Ta = 0 to 70C) Parameter Rise Transition Time Fall Transition Time Rise/Fall Time Matching Output Signal Crossover Voltage Driver Output Resistance Data Rate Symbol tR tF tRFM VCRS ZDRV tDRATE Steady State Driver Ava. Bit Rate (12 Mb/s 0.25%) Condition (Notes 1. and 2.) CL = 50 pF CL = 50 pF (tR/tF) Min. 4 4 90 1.2 28 11.97 Typ. Max. 25 25 140 2 43 12.03 Unit ns ns % V W Mbs D+, D- Applicable pin
Notes: 1. 1.5 kW pull-up to 2.8 V on the D+ data line. 2. Measured from 10% to 90% of the data signal.
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Semiconductor
MSM60851
TIMING DIAGRAM
READ Timing (1) (Address Separate ADSEL = 0)
Parameter Address Setup Time Address (CS) Hold Time Read Data Delay Time Read Data Hold Time Recovery Time FIFO Access Time Symbol t1 t2 t3 t4 t5 t6 FIFO READ FIFO READ Load 20 pF Condition Min. 21 0 -- 0 63 42 Max. -- -- 25 -- -- -- Unit ns ns ns ns ns ns 3 4 Note 1 2 1
Notes: 1. 2. 3. 4.
t1 and t3 are defined depending upon CS or RD which becomes active last. t2 is defined depending upon CS or RD which becomes active first. 3-clock time of oscillation clock (clock period: 21 ns). It is required for increment of FIFO. 2-clock time of oscillation clock (clock period: 21 ns). It is required for increment of FIFO.
A7:A0
t1 t6 CS
t2
t5 RD t3
t4
AD7:AD0
DATA OUT
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Semiconductor READ Timing (2) (Address/Data Multiplex ADSEL = 1)
Parameter Address (CS) Setup Time Address (CS) Hold Time Read Data Delay Time Read Data Hold Time Recovery Time FIFO Access Time Symbol t1 t2 t3 t4 t5 t6 FIFO READ FIFO READ Load 20 pF Condition Min. 10 0 -- 0 63 42 Max. -- -- 25 -- -- --
MSM60851
Unit ns ns ns ns ns ns
Note
1 2
Notes: 1. 3-clock time of oscillation clock (clock period: 21 ns). It is required for increment of FIFO. 2. 2-clock time of oscillation clock (clock period: 21 ns). It is required for increment of FIFO.
AD7:AD0
ADDRESS
DATA OUT
t1 CS
t2 t4
ALE
t3 RD
t5
t6
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Semiconductor WRITE Timing (1) (Address Separate ADSEL = 0)
Parameter Address Setup Time Address (CS) Hold Time CS Setup Time Write Data Setup Time Write Data Hold Time Recovery Time FIFO Access Time Symbol t1 t2 t3 t4 t5 t6 t7 FIFO WRITE FIFO WRITE Condition Min. 21 0 10 30 5 63 42 Max. -- -- -- -- -- -- --
MSM60851
Unit ns ns ns ns ns ns ns
Note 1
2 3
Notes: 1. t1 is defined depending upon CS or WR which becomes active last. 2. 3-clock time of oscillation clock (clock period: 21 ns). It is required for increment of FIFO. 3. 2-clock time of oscillation clock (clock period: 21 ns). It is required for increment of FIFO.
A7:A0
t1 t7 CS t3 WR t4 AD7:AD0 DATA IN
t2
t6
t5
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Semiconductor WRITE Timing (2) (Address/Data Multiplex ADSEL = 1)
Parameter Address (CS) Setup Time Address (CS) Hold Time Write Data Setup Time Write Data Hold Time Recovery Time FIFO Access Time Symbol t1 t2 t3 t4 t5 t6 FIFO WRITE FIFO WRITE Condition Min. 10 0 30 5 63 42 Max. -- -- -- -- -- --
MSM60851
Unit ns ns ns ns ns ns
Note
1 2
Notes: 1. 3-clock time of oscillation clock (clock period: 21 ns). It is required for increment of FIFO. 2. 2-clock time of oscillation clock (clock period: 21 ns). It is required for increment of FIFO.
AD7:AD0
ADDRESS
DATA IN
t1 CS
t2
t4
ALE t3 t5 WR
t6
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Semiconductor DMA Transfer Timing (1) MSM60851 to Memory (Single Transfer, Single Address Mode)
Parameter DREQ Disable Time DREQ Enable Time DACK Hold Time Read Data Delay Time Data Hold Time Recovery Time Symbol t1 t2 t3 t4 t5 t6 8 bit DMA 16 bit DMA Load 20 pF Condition Load 20 pF Min. -- -- 0 -- 0 63 105 Max. 20 63 -- 25 -- -- --
MSM60851
Unit ns ns ns ns ns ns ns
Note
1 2 3
Notes: 1. When in Single Address mode, CS and A7:A0 are ignored. t4 is defined depending on DACK or RD which becomes active last. 2. 3-clock time of oscillation clock (clock period: 21 ns). 3. 5-clock time of oscillation clock (clock period: 21 ns).
DREQ t1 DACK t4 t6 t3 t2
RD t5
DOUT
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Semiconductor
MSM60851
DMA Transfer Timing (2) MSM60851 to Memory (Single Transfer, Dual Address Mode)
Parameter DREQ Disable Time DREQ Enable Time Read Data Delay Time Data Hold Time Recovery Time Symbol t1 t2 t3 t4 t5 8 bit DMA 16 bit DMA Load 20 pF Condition Load 20 pF Min. -- -- -- 0 63 105 Max. 20 63 25 -- -- -- Unit ns ns ns ns ns ns 2 3 1 Note
Notes: 1. When in Dual Address mode, the DACK is ignored. t3 is defined depending on CS or RD which becomes active last. A7:A0 specifies the FIFO address. Refer to READ Timing (1) for Address Setup Time and Address Hold Time. 2. 3-clock time of oscillation clock (clock period: 21 ns). 3. 5-clock time of oscillation clock (clock period: 21 ns).
A7:A0
DREQ
t2 t1 t5
CS
t3 RD t4
DOUT
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Semiconductor
MSM60851
DMA Transfer Timing (3) MSM60851 to Memory (Demand Transfer, Single Address Mode)
Parameter DREQ Disable Time DACK Hold Time Read Data Delay Time Data Hold Time Recovery Time Symbol t1 t2 t3 t4 t5 8 bit DMA 16 bit DMA Load 20 pF Condition Load 20 pF Min. -- 0 -- 0 63 105 Max. 20 -- 25 -- -- -- Unit ns ns ns ns ns ns 2 3 1 Note
Notes: 1. When in Single Address mode, t3 is defined depending on DACK or RD which becomes active last. A7:A0 and CS are ignored. 2. 3-clock time of oscillation clock (clock period: 21 ns). 3. 5-clock time of oscillation clock (clock period: 21 ns).
DREQ t1 DACK t5 RD t3 DOUT t4 Last Packet Read t2
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Semiconductor DMA Transfer Timing (4) MSM60851 to Memory (Demand Transfer, Dual Address Mode)
Parameter DREQ Disable Time CS Hold Time Read Data Delay Time Data Hold Time Recovery Time Symbol t1 t2 t3 t4 t5 8 bit DMA 16 bit DMA Load 20 pF Condition Load 20 pF Min. -- 0 -- 0 63 105 Max. 20 -- 25 -- -- --
MSM60851
Unit ns ns ns ns ns ns
Note
1 2 3
Notes: 1. When in Dual Address mode, the DACK is ignored. t3 is defined depending on CS or RD which becomes active last. A7:A0 specifies the FIFO address. Refer to READ Timing (1) for Address Setup Time and Address Hold Time. 2. 3-clock time of oscillation clock (clock period: 21 ns). 3. 5-clock time of oscillation clock (clock period: 21 ns).
A7:A0
DREQ t1 CS t5 RD t3 DOUT t4 Last Packet Read t2
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Semiconductor DMA Transfer Timing (5) Memory to MSM60851 (Single Transfer, Single Address Mode)
Parameter DREQ Disable Time DREQ Enable Time FIFO Access Time DACK Hold Time Write Data Setup Time Write Data Hold Time Recovery Time Symbol t1 t2 t3 t4 t5 t6 t7 8 bit DMA 16 bit DMA FIFO WRITE Condition Load 20 pF Min. -- -- 42 0 30 5 63 105 Max. 20 63 -- -- -- -- -- --
MSM60851
Unit ns ns ns ns ns ns ns ns
Note
1
2 3
Notes: 1. When in Single Address mode, CS and A7:A0 are ignored. 2. 3-clock time of oscillation clock (clock period: 21 ns). 3. 5-clock time of oscillation clock (clock period: 21 ns).
DREQ t1 DACK t3 t7 WR t5 DIN t6 t4 t2
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Semiconductor DMA Transfer Timing (6) Memory to MSM60851 (Single Transfer, Dual Address Mode)
Parameter DREQ Disable Time DREQ Enable Time FIFO Access Time Write Data Setup Time Write Data Hold Time Recovery Time Symbol t1 t2 t3 t4 t5 t6 8 bit DMA 16 bit DMA FIFO WRITE Condition Load 20 pF Min. -- -- 42 30 5 63 105 Max. 20 63 -- -- -- -- --
MSM60851
Unit ns ns ns ns ns ns ns
Note
1
2 3
Notes: 1. When in Dual Address mode, the DACK is ignored. Refer to WRITE Timing (1) for Address Setup Time and Address Hold Time. 2. 3-clock time of oscillation clock (clock period: 21 ns). 3. 5-clock time of oscillation clock (clock period: 21 ns).
A7:A0
DREQ t1 CS t3 WR t5 t4 DIN t6 t2
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Semiconductor DMA Transfer Timing (7) Memory to MSM60851 (Demand Transfer, Single Address Mode)
Parameter DREQ Disable Time FIFO Access Time DACK Hold Time Write Data Setup Time Write Data Hold Time Recovery Time Symbol t1 t2 t3 t4 t5 t6 8 bit DMA 16 bit DMA Condition Load 20 pF FIFO WRITE Min. -- 42 0 30 5 63 105 Max. 20 -- -- -- -- -- --
MSM60851
Unit ns ns ns ns ns ns ns
Note 1
2 3
Notes: 1. When in Single Address mode, A7:A0 and CS and ignored. 2. 3-clock time of oscillation clock (clock period: 21 ns). 3. 5-clock time of oscillation clock (clock period: 21 ns).
DREQ t1 DACK t2 t6 WR (Note) t4 DIN t5 Last Packet Write t3
(Note) The last Write to reach the byte size (maximum packet size) specified by the EP1 Payload Register. To terminate DMA transfer before reaching the maximum packet size, set EP1 Packet Ready by writing "1" to the EP1 Transmit Packet Ready bit.
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Semiconductor DMA Transfer Timing (8) Memory to MSM60851 (Demand Transfer, Dual Address Mode)
Parameter DREQ Disable Time FIFO Access Time CS Hold Time Write Data Setup Time Write Data Hold Time Recovery Time Symbol t1 t2 t3 t4 t5 t6 8 bit DMA 16 bit DMA Condition Load 20 pF FIFO WRITE Min. -- 42 0 30 5 63 105 Max. 20 -- -- -- -- -- --
MSM60851
Unit ns ns ns ns ns ns ns
Note 1
2 3
Notes: 1. When in Dual Address mode, the DACK is ignored. A7:A0 specifies the FIFO address. Refer to WRITE Timing (1) for Address Setup Time and Address Hold Time. 2. 3-clock time of oscillation clock (clock period: 21 ns). 3. 5-clock time of oscillation clock (clock period: 21 ns).
A7:A0
DREQ t1 CS t2 WR (Note) t4 DIN t5 Last Packet Write t6 t3
(Note) Refer to the previous page.
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Semiconductor
MSM60851
FUNCTIONAL DESCRIPTIONS
Pin Functional Description USB Interface
Signal Type Assertion Description USB data (Plus). This signal and the D- signal are the transmitted or received data from USB Bus. The table below shows values and results forthese signal. D+ I/O -- D+ 0 0 1 1 D- 0 1 0 1 Result Single end 0 Differential "0" Differential "1" Undefined
USB Data (Minus). This signal and the D+ signal are the transmitted or D- I/O -- received data from USB Bus. The table above shows values and results for these signals.
Crystal Oscillator Interface
Signal XIN XOUT Type Assertion I O -- -- Description For internal oscillation, connect a crystal to XIN and XOUT. For external oscillation, supply an external 48 MHz clock signal to XIN. Set XOUT to be open.
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Semiconductor Application Interface
Signal D15:D8 AD7:AD0 Type Assertion I/O I/O -- -- register files and FIFO data. Lower byte (LSB) of data bus when ADSEL is LOW. Description
MSM60851
Upper byte (MSB) of data bus. This data bus is used by applications to access
Address and lower byte of data bus are multiplexed when ADSEL is HIGH. Address when ADSEL is LOW. This address signal is used by application to access register files and FIFO data. This signal is ignored (all lows or all highs) when ADSEL is HIGH. Chip Select. When this signal is asserted LOW, the MSM60851 is selected and ready to read or write data. Read Strobe. When this signal is asserted LOW, the Read instruction is executed. Write Strobe. When this signal is asserted LOW, the Write instruction is executed. Interrupt Request. When this signal is asserted, the MSM60851 makes an interrupt request to the application. DMA Request. This signal requests the BulkOut FIFO to make a DMA transfer. DMA Acknowledge Signal. This signal, when asserted, enables accessing FIFOs, without address bus setting. When ADSEL is HIGH, the address and CS on AD7:AD0 is latched at the trailing edge of this signal. This signal is ignored when ADSEL is LOW. When ADSEL is LOW, the address is input on A7:A0 and data i input on D15:D8 and AD7:AD0. When ADSEL is HIGH, the lower bytes (LSB) of address and data are multiplexed on AD7:AD0. System Reset. When this signal is asserted LOW, the MSM60851 is reset. When the MSM60851 is powered on, this signal must be asserted for 100 ms.
A7:A0
I
--
CS RD WR INTR DREQ DACK ALE
I I I O O I I
LOW LOW LOW LOW (Note 1) LOW (Note 1) HIGH (Note 1) --
ADSEL
I
--
RESET
I
LOW
Note: 1. Initial value immediately after resetting. Its assertion can be changed by programming.
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Semiconductor Functional Description
MSM60851
The MSM60851 USB device controller contains the Protocol Engine, DPLL, Timer, Status/Control, FIFO Control, Application Interface, and Remote Wakeup blocks. * Protocol Engine The Protocol Engine handles the USB communication protocol. It performs control of packet transmission/reception, generation/detection of synchronous patterns, CRC generation/checking, NRZI data modulation, bit stuffing, and packet ID (PID) generation/checking. * DPLL (Digital Phase Locked Loop) The DPLL extracts clock and data from the USB differential received data (D+ and D-). * Timer The Timer block monitors idle time on the USB bus. * Status/Control The Status Control block moniors the transaction status and transmits control events to the application through an interrupt request.
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Semiconductor
MSM60851
* FIFO Control The FIFO Control block controls all FIFO operations for transmitting and receiving USB packets. The FIFO configuration is described below. Endpoint FIFO/8 Byte Setup Register Configuration
8 Byte Endpoint Address 0 Setup Register
For Control Transfer
Setup Ready
64 Byte Endpoint Address 0 FIFO Rx Packet Ready 64 Byte Endpoint Address 0 FIFO Tx Packet Ready EP0 Transmit FIFO EP0 Receive FIFO
For Bulk Transfer 64 Byte FIFO Packet Ready DMA Request EP1 FIFO (128 bytes) (Selectable for transmitter or receiver)
64 Byte Endpoint Address 1 FIFO
Endpoint Address 2
64 Byte FIFO Packet Ready
EP2 FIFO (64 bytes) (Selectable for transmitter or receiver)
FIFO type Reception Transmission Reception/Transmission Reception/Transmission
Endpoint address 0 0 1 2
Program size 64 Byte 64 Byte 64 Byte (2 levels) 64 Byte
Function Transfer control Transfer control Bulk-In and bulk-Out Bulk-Out and bulk-In
Every FIFO has a flag that indicates a full or empty FIFO and the capability of re-transmitting and re-receiving data. Endpoint addresses 1 and 2 can be used for either of reception and transmission by writing the register. The FIFO at endpoint address 1 can be used for DMA transfer. 39/42
Semiconductor
MSM60851
* Interrupt Interrupt factors include Packet Ready for a transmit/receive FIFO, Setup Ready for 8-byte setup data, and Suspend. Generation of each interrupt request can be enabled or disabled by the Interrupt Enable register. * DMA 8-bit and 16-bit demand transfer DMA and single transfer DMA are enabled for bulk-transfer FIFO at endpoint address 1. In Demand Transfer mode, DREQ is asserted when a valid packet arrives at the FIFO. When the external DMA contoller has completed transferring all byte data of a received packet, DREQ is deasserted. Accordingly, other devices cannot access the local bus during DMA transfer. In Single Tranfer mode, each time transfer of one byte data is completed, DREQ is deasserted. While DREQ is deasserted, other devices can access the local bus. * Remote Wakeup This functional block supports the remote wakeup function. * USB Transfers The MSM60851 supports the two transfer types (Control Transfer and Bulk Transfer) of four transfer types (Control, Isochronous, Interrupt, and Bulk) defined by the USB Specifications. - The Control Transfer is required for transfer of configuration, commands, and status information between the host and devices. - The Bulk Transfer enables transfer of a large amount of data when the bus bandwidth is enough. * USB Transceiver The MSM60851 contains an Oki's USB transceiver which converts internal unidirectional signals into USB-compatible signals. This enables the designer's application module to interface to the physical layer of the USB.
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Semiconductor
MSM60851
PACKAGE DIMENSIONS
(Unit : mm)
QFP44-P-910-0.80-2K
Mirror finish
Package material Lead frame material Pin treatment Solder plate thickness Package weight (g)
Epoxy resin 42 alloy Solder plating 5 mm or more 0.41 TYP.
Notes for Mounting the Surface Mount Type Package The SOP, QFP, TSOP, SOJ, QFJ (PLCC), SHP and BGA are surface mount type packages, which are very susceptible to heat in reflow mounting and humidity absorbed in storage. Therefore, before you perform reflow mounting, contact Oki's responsible sales person for the product name, package name, pin number, package code and desired mounting conditions (reflow method, temperature and times).
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Semiconductor
MSM60851
(Unit : mm)
TQFP44-P-1010-0.80-K
Mirror finish
Package material Lead frame material Pin treatment Solder plate thickness Package weight (g)
Epoxy resin 42 alloy Solder plating 5 mm or more 0.28 TYP.
Notes for Mounting the Surface Mount Type Package The SOP, QFP, TSOP, SOJ, QFJ (PLCC), SHP and BGA are surface mount type packages, which are very susceptible to heat in reflow mounting and humidity absorbed in storage. Therefore, before you perform reflow mounting, contact Oki's responsible sales person for the product name, package name, pin number, package code and desired mounting conditions (reflow method, temperature and times).
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