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LG Semicon Co.,Ltd. GM71V65163A GM71VS65163AL 4,196,304 WORDS x 16 BIT CMOS DYNAMIC RAM Description The GM71V(S)65163A/AL is the new generation dynamic RAM organized 4,196,304 words by 16 bits. The GM71V(S)65163A/AL utilizes advanced CMOS Silicon Gate Process Technology as well as advanced circuit techniques for wide operating margins, both internally and to the system user. System oriented features include single power supply of 3.3V+/-10% tolerance, direct interfacing capability with high performance logic families such as Schottky TTL. The GM71V(S)65163A/AL offers Extended Data Out(EDO) Mode as a high speed access mode. Pin Configuration 50 SOJ / TSOP VCC IO0 IO1 IO2 IO3 VCC IO4 IO5 IO6 IO7 NC VCC 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 50 49 48 47 46 45 44 43 42 41 40 39 38 VSS IO15 IO14 IO13 IO12 VSS IO11 IO10 IO9 IO8 NC VSS /LCAS Features * 4,196,304 Words x 16 Bit * Extended Data Out (EDO) Mode Capability * Fast Access Time & Cycle Time (Unit: ns) /WE /RAS NC NC NC NC A0 A1 37 /UCAS 36 35 34 33 32 31 30 29 28 27 26 /OE NC NC NC A11 A10 A9 A8 A7 A6 VSS tRAC GM71V(S)65163A/AL-5 GM71V(S)65163A/AL-6 50 60 tAA 25 30 tCAC 13 15 tRC 90 110 tHPC 20 25 A2 A3 A4 A5 VCC w w w . at d sh a *Power dissipation - Active : 720mW/648mW(MAX) - Standby : 1.8 mW ( CMOS level : MAX ) 0.54mW ( L-Version : MAX) *EDO page mode capability *Access time : 50ns/60ns (max) *Refresh cycles - RAS only Refresh 4096 cycles/64 A (GM71V65163A) 4096 cycles/128A (GM71VS65163AL)(L_Version) *CBR & Hidden Refresh 4096 cycles/64 A (GM71V65163A) 4096 cycles/128 A (GM71VS65163AL)( L-Version ) *4 variations of refresh -RAS-only refresh -CAS-before-RAS refresh -Hidden refresh -Self refresh (L-Version) *Single Power Supply of 3.3V+/-10 % with a built-in VBB generator *Battery Back Up Operation ( L-Version ) (Top View) et e u. 4 om c 1 www..com LG Semicon Pin Description Pin A0-A11 A0-A11 RAS UCAS,LCAS OE Function Address Inputs Refresh Address Inputs Row Address Strobe Column Address Strobe Output Enable Pin WE I/O0 - I/O15 VCC VSS NC GM71V65163A GM71VS65163AL Function Write Enable Data Input / Output Power (+3.3V) Ground No Connection Ordering Information Type No. GM71V(S)65163A/ALJ-5 GM71V(S)65163A/ALJ-6 GM71V(S)65163A/ALT-5 GM71V(S)65163A/ALT-6 Access Time 50A 60A 50A 60A Package 400 Mil 50 Pin Plastic SOJ 400 Mil 50 Pin Plastic TSOP II Absolute Maximum Ratings* Symbol TSTG VT VCC IOUT PT Parameter Storage Temperature (Plastic) Voltage on any Pin Relative to VSS Voltage on VCC Relative to VSS Short Circuit Output Current Power Dissipation Rating -55 to 125 -0.5 to VCC + 0.5 (MAX ; 4.6V) -0.5 to 4.6 50 1.0 Unit C V V mA W *Note : Operation at or above Absolute Maximum Ratings can adversely affect device reliability. Recommended DC Operating Conditions (TA = 0 ~ 70C) Symbol VCC VSS VIH VIL TA Parameter Supply Voltage Supply Voltage Input High Voltage Input Low Voltage Ambient Temperature under Bias Min 3.0 0 2.0 -0.3 0 Typ 3.3 0 Max 3.6 0 Vcc+0.3 0.8 70 Unit V V V V C Notes 1,2 2 1 1 2 LG Semicon Symbol VOH VOL ICC1 Parameter Output Level Output Level Voltage (IOUT = -2mA) Output Level Output Level Voltage (IOUT = 2mA) Operating Current (tRC = tRC min) 50ns 60ns ICC2 Standby Current (TTL interface) Power Supply Standby Current (RAS, UCAS,LCAS= VIH, DOUT = High-Z) RAS-Only Refresh Current ( tRC = tRC min) Extended Data Out page Mode Current (RAS = VIL, CAS, Address Cycling: tHPC = tHPC min) CMOS interface (RAS, UCAS,LCAS>=VCC-0.2V, DOUT = HighZ) Standby Current(L_Version) CAS-before-RAS Refresh Current (tRC = tRC min) 50ns 60ns 50ns 60ns 50ns 60ns GM71V65163A GM71VS65163AL Min 2.4 0 Max VCC 0.4 200 180 2 mA Unit V V mA 1,2 Note DC Electrical Characteristics: (VCC = 3.3V+/-10%, TA = 0 ~ 70C) ICC3 - 200 180 120 mA 110 0.5 mA 1,3 mA 2 ICC4 ICC5 - 300 160 140 500 uA mA uA 4 ICC6 ICC7 ICC8 Battery Back Up Operating Current(Standby with CBR) (tRC=31.25us,,tRAS=300ns,Dout=High-Z) Standby Current (CMOS) Power Supply Standby Current RAS = VIH,UCAS, LCAS = VIL , DOUT = Enable Self Refresh Current (RAS,UCAS,LCAS <=0.2V,Dout=High-Z) Input Leakage Current, Any Input (0V<=VIN<=Vcc) Output Leakage Current (DOUT is Disabled, 0V<=VOUT<=Vcc) 4, 5 - 5 mA 1 5 ICC9 II(L) IO(L) -5 -5 400 5 5 uA uA uA Note: 1. ICC depends on output load condition when the device is selected. ICC(max) is specified at the output open condition. 2. Address can be changed once or less while RAS = VIL. 3. Measured with one sequential address change per EDO cycle, tHPC. 4. VIH>=VCC-0.2V, 0V<=VIL<=0.2V 5. L-version 3 LG Semicon Capacitance (VCC = 3.3V+/-10%, TA = 25C) Symbol CI1 CI2 CI/O Parameter Input Capacitance (Address) Input Capacitance (Clocks) Output Capacitance (Data-in,Data-Out) Typ - GM71V65163A GM71VS65163AL Max 5 7 7 Unit U U U Note 1 1 1, 2 Note: 1. Capacitance measured with Boonton Meter or effective capacitance measuring method. 2. RAS, UCAS and LCAS = VIH to disable DOUT. AC Characteristics (VCC = 3.3V+/-10%, TA = 0 ~ 70C, Notes 1,2,19,20) Test Conditions Input rise and fall times : 2ns Output timing reference levels : VOL/VOH = 0.8/2.0V Input level : VIL/VIH = 0.0/3.0V Output load : 1 TTL gate+CL (100pF) Input timing reference levels : VIL/VIH = 0.8/2.0V (Including scope and jig) Read, Write, Read-Modify-Write and Refresh Cycles (Common Parameters) Symbol Parameter Random Read or Write Cycle Time RAS Precharge Time CAS Precharge Time RAS Pulse Width CAS Pulse Width Row Address Set-up Time Row Address Hold Time Column Address Set-up Time Column Address Hold Time RAS to CAS Delay Time RAS to Column Address Delay Time RAS Hold Time CAS Hold Time CAS to RAS Precharge Time OE to DIN Delay Time OE Delay Time from DIN CAS Delay Time from DIN TransitionTime (Rise and Fall) Refresh Period Refresh Period ( L-Version ) GM71V(S)65163A/AL-5 GM71V(S)65163A/AL-6 Min Max 10000 10000 37 25 50 64 128 Min 104 40 10 60 10 0 10 0 10 14 12 17 40 5 15 0 0 2 - Unit Notes Max 10000 10000 45 30 50 64 128 A A A A A A A A A A A A A A A A A A A A 22 5 6 6 7 4096 cycles 4096 cycles tRC tRP tCP tRAS tCAS tASR tRAH tASC tCAH tRCD tRAD tRSH tCSH tCRP tODD tDZO tDZC tT tREF 84 30 8 50 8 0 8 0 8 12 10 13 35 5 13 0 0 2 - 24 21 21 3 4 4 LG Semicon Read Cycles GM71V65163A GM71VS65163AL GM71V(S)65163A/AL-5 GM71V(S)65163A/AL-6 Symbol Parameter Min Max 50 13 25 13 13 13 13 13 - Unit Notes Min 0 0 0 30 18 15 15 15 3 3 60 3 0 Max 60 15 30 15 15 15 15 15 A A A A A A A A A A A A A A A A A A A A A tRAC tCAC tAA tOAC tRCS tRCH tRRH tRAL tCAL tOFF tOEZ tCDD tRDD tWDD tOFR tWEZ tOH tOHR tRCHR tOHO tCLZ Access Time from RAS Access Time from CAS Access Time from Column Address Access Time from OE Read Command Set-up Time Read Command Hold Time to CAS Read Command Hold Time to RAS Column Address to RAS Lead Time Column Address to CAS Lead Time Output Buffer Turn-off Delay Time from CAS Output Buffer Turn-off Delay Time from OE CAS to DIN Delay Time RAS to DIN Delay Time WE to DIN Delay Time Output Buffer Turn-off Delay Time from RAS Output Buffer Turn-off Delay Time from WE Output Data Hold Time Output Data Hold Time from RAS Read Command Hold Time from RAS Output data hold time from OE CAS to Output in Low - Z 0 0 0 25 15 13 13 13 3 3 50 3 0 8,9 9,10,17 9,11,17 9 21 12,22 12 13,26 13 5 13,26 13 26 26 5 LG Semicon Write Cycles GM71V(S)65163A/AL-5 GM71V65163A GM71VS65163AL GM71V(S)65163A/AL-6 Unit Notes Symbol Parameter Min Max - Min 0 10 10 17 10 0 10 Max A A A A A A A 23 15,23 15,23 14,21 21 tWCS tWCH Write Command Set-up Time Write Command Hold Time Write Command Pulse Width Write Command to RAS Lead Time Write Command to CAS Lead Time Data-in Set-up Time Data-in Hold Time 0 8 8 13 8 0 8 tWP tRWL tCWL tDS tDH Read-Modify-Write Cycles Symbol Parameter Read-Modify-Write Cycle Time RAS to WE Delay Time CAS to WE Delay Time Column Address to WE Delay Time OE Hold Time from WE GM71V(S)65163A/AL-5 GM71V(S)65163A/AL-6 Unit Notes Min Max - Min 140 79 34 49 15 Max A A A A A 14 14 14 tRWC tRWD tCWD tAWD tOEH 116 67 30 42 13 Refresh Cycle Cycles GM71V(S)65163A/AL-5 GM71V(S)65163A/AL-6 Unit Notes Symbol Parameter CAS Set-up Time (CAS-before-RAS Refresh Cycle) CAS Hold Time (CAS-before-RAS Refresh Cycle) WE setup time (CAS-before-RAS Refresh Cycle) WE hold time (CAS-before-RAS Refresh Cycle) RAS Precharge to CAS Hold Time Min 5 8 0 Max - Min 5 Max A 21 tCSR tCHR tWRP tWRH tRPC - 10 0 - A A 22 8 5 - 10 5 - A A 21 6 LG Semicon Extended Data Out Mode Cycles Symbol GM71V65163A GM71VS65163AL GM71V(S)65163A/AL-5 GM71V(S)65163A/AL-6 Parameter Min Max 100000 28 - Unit Notes Min 25 10 35 10 5 35 Max 100000 35 A A A A A A A A A A 25 tHPC tWPE tRASP tACP tRHCP tCOL tCOP tRCHP tDOH tOEP EDO Page Mode Cycle Time Write pulse width during CAS Precharge EDO Mode RAS Pulse Width Access Time from CAS Precharge RAS Hold Time from CAS Precharge CAS Hold Time Referred OE CAS to OE set-up Time Read Command Hold Time from CAS Precharge Output Data Hold Time from CAS Low OE Precharge Time 20 8 28 8 5 28 16 9,17,22 3 8 - 3 10 - 9,27 EDO Page Mode Read-Modify-Write cycle GM71V(S)65163A/AL-5 GM71V(S)65163A/AL-6 Symbol Parameter Min Max - Unit Notes Min 68 54 Max A A 14,22 tHPRWC EDO Read-Modify-Write Cycle Time tCPW EDO Page Mode Read-Modify-Write Cycle CAS Precharge to WE Delay Time 57 45 Self Refresh Cycles (L_Version) GM71V(S)65163A/AL-5 GM71V(S)65163A/AL-6 Symbol Parameter RAS Pulse Width(Self-Refresh) RAS Prechartge Time(Self-Refresh) CAS Hold Time(Self-Refresh) Min 100 90 -50 Max - Min 100 110 -50 Max - Unit us us us Notes 31 31 23 tRASS tRPS tCHS 7 LG Semicon Notes: 1. 2. AC measurements assume tT = 2A. GM71V65163A GM71VS65163AL AC initial pause of 200us is required after power up followed by a minimum of eight initialization cycles ( any combination of cycles containing RAS-only refresh or CAS-beforeRAS refresh) Operation with the tRCD(max) limit insures that tRAC(max) can be met, tRCD(max) is specified as a reference point only: if tRCD is greater than the specified tRCD(max) limit, then access time is controlled exclusively by tCAC. Operation with the tRAD(max) limit insures that tRAC(max) can be met, tRAD(max) is specified as a reference point only: if tRAD is greater than the specified tRAD(max) limit, then access time is controlled exclusively by tAA. Either tODD or tCDD must be satisfied. Either tDZO or tDZC must be satisfied. VIH(min) and VIL(max) are reference levels for measuring timing of input signals. Also, transition times are measured between VIH(min) and VIL (max). Assumes that tRCD<=tRCD(max) and tRAD<=tRAD(max). If tRCD or tRAD is greater than the maximum recommended value shown in this table, tRAC exceeds the value shown. Measured with a load circuit equivalent to 1 TTL loads and 100 pF. Assumes that tRCD>=tRCD(max) and tRCD + tCAC(max) >=tRAD + tAA(max). Assumes that tRAD >=tRAD (max) and tRCD + tCAC(max)<=tRAD + tAA(max). Either tRCH or tRRH must be satisfied for a read cycles. tOFF(max), tOEZ(max), tOFR(max) and tWEZ(max) define the time at which the outputs achieve the open circuit condition and is not referenced to output voltage levels. tWCS, tRWD, tCWD, tAWD, and tCPW are not restrictive operating parameters. They are included in the data sheet as electrical characteristics only: if tWCS >=tWCS(min), the cycle is an early write cycle and the data out pin will remain open circuit (high impedance) throughout the entire cycle: if tRWD>=tRWD(min), tCWD>=tCWD(min), tAWD>=tAWD(min) and tCPW>=tCPW(min), the cycle is a readmodify-write and the data output will contain data read from the selected cell: if neither of the above sets of conditions is satisfied, the condition of the data out (at access time) is indeterminate. tDS and tDH are referred to UCAS and LCAS leading edge in early write cycles and to WE leading edge in delayed write or read-modify-write cycles. tRASP defines RAS pulse width in extended data out mode cycles. Access time is determined by the longest among tAA, tCAC and tACP. In delayed write or read-modify-write cycles, OE must disable output buffer prior to applying data to the device. When output buffers are enabled once, sustain the low impedance state until valid data is obtained. When output buffer is turned on and off within a very short time, generally it causes large VCC/VSS line noise, which causes to degrade VIH min/VIL max level. When both UCAS and LCAS go low at the same time, all 16-bit data are written into the device. UCAS and LCAS cannot be staggered within the same write/read cycles. tASC, tCAH, tRCS, tWCS, tWCH, tCSR and tRPC are determined by the earlier falling edge of UCAS or LCAS. tCRP, tCHR, tRCH, tACP and tCPW are determined by the later rising edge of UCAS or LCAS. 3. 4. 5. 6. 7. 8. 9. 10. 11. 12. 13. 14. 15. 16. 17. 18. 19. 20. 21. 22. 8 LG Semicon GM71V65163A GM71VS65163AL 23. tCWL, tDH, tDS and tCHS should be satisfied by the both UCAS and LCAS. 24. tCP is determined by the time that both UCAS and LCAS are high. 25. tHPC(min) can be achieved during a series of EDO mode early write cycles or EDO mode read cycles. If both write and read operation are mixed in a EDO mode, RAS cycle { EDO mode mix cycle (1),(2) } minimum value of CAS cycle tHPC(tCAS + tCP + 2tT) becomes greater than the specified tHPC(min) value. The value of CAS cycle time of mixed EDO page mode is shown in EDO page mode mix cycle (1) and (2). 26. Data output turns off and becomes high impedance from later rising edge of RAS and CAS. Hold time and turn off time are specified by the timing specifications of later rising edge of RAS and CAS between tOHR and tOH, and between tOFR and tOFF. 27. tDOH defines the time at which the output level go cross. VOL=0.8V, VOH=2.0V of output timing reference level. 28. Before and after self refresh mode, execute CBR refresh to all refresh addresses in or within 64A period on the condition a and b below. a. Enter self refresh mode within 15.6us after either burst refresh or distributed refresh at equal interval to all refresh addresses are completed. b. Start burst refresh or distributed refresh at equal interval to all refresh addressed within 15.6us after exiting from self refresh mode. 29. In case of entering from RAS-only-refresh, it is necessary to execute CBR refresh before and after self refresh mode according as note 28. 30. For L_Version, it is available to apply each 128A and 31.2us instead of 64A and 15.6us at note 28. 31. At tRASS3/4100 us , self refresh mode is activated, and not active at tRASS 1/410us. It is undefined within the range of 10 us 1/4tRASS 1/4100 us . for tRASS 3/410 us , it is necessary to satisfy tRPS. 32. XXX: H or L ( H : VIH(min)<=VIN<=VIH(max), L: VIH(min)<=VIN<=VIH(max)) ///////: Invalid Dout When the address, clock and input pins are not described on timing waveforms, their pins must be applied VIH or VIL. 9 LG Semicon Timing Waveforms tRC tRAS RAS GM71V65163A GM71VS65163AL tRP tCSH tRCD tT UCAS LCAS tCRP tRSH tCAS tRAD tASR ADDRESS tRAH ROW tASC tRAL tCAL tCAH COLUMN tRCHR tRCS WE tRRH tRCH tCAC tAA tCLZ High-Z tOFF DOUT tWEZ DOUT tRAC tOH tOEZ tOHO tDZC DIN High-Z tOFR tRDD tOHR tWDD tCDD tDZO OE tOAC tODD FIGURE 1. READ CYCLE*32 10 LG Semicon GM71V65163A GM71VS65163AL tRC tRAS RAS tRP tT tRSH tRCD tCSH tCAS tCRP UCAS LCAS tASR ADDRESS tRAH ROW tASC tCAH COLUMN tWCS WE tWCH tDS DIN DIN tDH High-Z DOUT > * tWCS = tWCS (min) FIGURE 2. EARLY WRITE CYCLE 11 LG Semicon GM71V65163A GM71VS65163AL tRC tRAS RAS tRP tT tRSH tRCD tCSH tCAS tCRP UCAS LCAS tASR ADDRESS tRAH ROW tASC tCAH COLUMN tCWL tRCS WE tRWL tWP tDZC High-Z tDS tDH DIN DIN tDZO tODD tOEP tOEH OE tOEZ tCLZ High-Z DOUT INVALID OUTPUT FIGURE 3. DELAYED WRITE CYCLE*18 12 LG Semicon GM71V65163A GM71VS65163AL tRWC tRAS RAS tRP tT tRCD tCAS tCRP UCAS LCAS tRAD tASR ADDRESS ROW tRAH tASC tCAH COLUMN tRCS tRWD WE tCWD tAWD tCWL tRWL tWP tAA tRAC tDZC tCAC High-Z tDS tDH DIN DIN tCLZ High-Z DOUT tODD tOEH DOUT tOAC tDZO OE tOEZ tOHO tOEP FIGURE 4. READ MODIFY WRITE CYCLE*18 13 LG Semicon tRC tRAS RAS GM71V65163A GM71VS65163AL tRP tCRP UCAS LCAS tT tRPC tCRP tASR ADDRESS ROW tRAH tOFR tOFF High-Z DOUT FIGURE 5. RAS ONLY REFRESH CYCLE tRC tRP RAS tRC tRP tRAS tRP tRAS tRPC tCP CAS tT tCSR tCHR tRPC tCP tCSR tCHR tCRP tWRP tWRH tWRP tWRH WE ADDRESS tOFR tOFF High-Z DOUT FIGURE 6. CAS BEFORE RAS REFRESH CYCLE 14 LG Semicon GM71V65163A GM71VS65163AL tRC tRAS RAS tRC tRP tRAS tRP tRAS tRC tRP tT tRCD UCAS LCAS tRSH tCHR tCAS tCRP tRAD tASR ADDRESS ROW tRAL tCAH COLUMN tRAH tASC tRCS WE tRCH tRRH tDZC High-Z DIN tWDD tCDD tRDD tDZO OE tOAC tODD tRAC tCLZ DOUT tCAC tAA tOEZ tWEZ tOHO tOFF tOH DOUT tOFR tOHR FIGURE 7. HIDDEN REFRESH CYCLE 15 LG Semicon GM71V65163A GM71VS65163AL tRASP tRP RAS tHPC tT tCSH tCP tCAS tRCHR tRCS tRCH tRAL tWDD tASR tRAH tASC ROW tHPC tCP tCAS tCAS tRHCP tCP tRSH tCAS tRCHP tCRP UCAS LCAS tRRH tRCH WE tCAH tWPE tASC tCAH tASC tCAH tASC COLUMN tCAH COLUMN ADDRESS COLUMN COLUMN tCAL tDZC tCAL High-Z tCAL tCAL tRDD tCDD DIN tDZO tCOL tOEP tCOP tOEP tODD OE tOAC tCAC tAA tRAC DOUT tOEZ tOHO tCAC tAA tWEZ tACP DOUT 2 tACP tAA tCAC tOAC tOEZ tDOH DOUT 2 tACP tAA tCAC tOAC tOHR tOFR tOEZ tOHO tOFF tOH tOHO DOUT 3 DOUT 4 High-Z DOUT 1 FIGURE 8. EXTENDED DATA OUT PAGE MODE READ CYCLE 16 LG Semicon GM71V65163A GM71VS65163AL tRASP tRP RAS tCSH tT tCP LCAS tHPC tCP tCAS tHPC tHPC tCP tRSH tCAS tCRP tCAS UCAS tCAS tRCS tRCHP tRRH tRCH tRAL tWDD tASR tRAH tASC tCAH COLUMN WE tASC tCAH COLUMN tCAH tASC COLUMN tASC tCAH COLUMN ADDRESS ROW tCAL tDZC tCAL tCAL High-Z tCAL tRDD tCDD DIN tDZO tCOL tOEP tCOP tOEP tODD OE tOAC tCAC tAA tRAC LDOUT tACP tAA tCAC tOEZ tOHO tOAC tOEZ tOHO DOUT 2 tACP tAA tCAC DOUT 4 tDOH DOUT 1 DOUT 2 tOFR tOHR tOEZ tOHO tOFF tOH tACP tAA UDOUT DOUT 1 tCAC DOUT 3 tOAC DOUT 4 FIGURE 9. EXTENDED DATA OUT MODE READ CYCLE (2CAS CONTROL) 17 LG Semicon GM71V65163A GM71VS65163AL tRP tRASP RAS tT tRCD tCSH tCAS tCP tHPC tCAS tCP tRSH tCAS tCRP UCAS LCAS tASR tRAH tASC tCAH tASC tCAH tASC tCAH ADDRESS ROW COLUMN 1 COLUMN 2 COLUMN N tWCS WE tWCH tWCS tWCH tWCS tWCH tDS DIN DIN 1 tDH tDS DIN 2 tDH tDS DIN N tDH High-Z* DOUT *tWCS >=tWCS (min) FIGURE 10. EXTENDED DATA OUT MODE EARLY WRITE CYCLE 18 LG Semicon GM71V65163A GM71VS65163AL tRASP RAS tRP tT tRCD UCAS LCAS tCP tCSH tCAS tHPC tCAS tCP tRSH tCAS tCRP tASR tASC tRAD tRAH tCAH COLUMN 1 tASC tCAH COLUMN 2 tASC tCAH COLUMN N ADDRESS ROW tCWL tRCS WE tCWL tRCS tRCS tCWL tRWL tWP tDZC tDS tDH DIN DIN 1 tWP tDZC tDS tDH DIN 2 tWP tDZC tDS tDH DIN N tDZO tODD tOEH OE tDZO tODD tOEH tOEP tCLZ tOEZ tCLZ tOEZ INVALID DOUT tDZO tODD tOEH tOEP tCLZ tOEZ INVALID DOUT High-Z DOUT INVALID DOUT FIGURE 11. EXTENDED DATA OUT MODE DELAYED WRITE CYCLE*18 19 LG Semicon GM71V65163A GM71VS65163AL tRASP RAS tRP tT tCP tRCD UCAS LCAS tHPRWC tRSH tCAS tCP tCAS tCAS tCRP tRAD tASR tRAH tASC tCAH COLUMN 1 tASC tCAH COLUMN 2 tASC tCAH COLUMN N ADDRESS ROW tRCS WE tRWD tAWD tCWD tCWL tCPW tAWD tRCS tCWD tCWL tRCS tCPW tAWD tCWD tCWL tRWL tWP tDZC tDS tDH DIN DIN 1 tWP tDZC tDS tDH DIN 2 tWP tDZC tDS tDH DIN N High-Z tDZO tOEP tDZO tODD tOEH tOEZ tOAC tCAC tAA tOHO tDZO tOEP tODD tOEH tOEZ tOHO tOAC tCAC tAA tCLZ tOEZ tOAC tCAC tAA tCLZ DOUT 2 tOEP tODD tOEH tOHO OE tRAC tCLZ DOUT tACP DOUT 1 tACP DOUT N High-Z FIGURE 12. EXTENDED DATA OUT MODE READ MODIFY WRITE CYCLE*18 20 LG Semicon GM71V65163A GM71VS65163AL tRASP RAS tRP tT tRCD tCSH tWCS tWCH WE tCP tCAS tCAS tCP tCAS tCP tCAS tCRP UCAS LCAS tRCS tCPW tAWD tWP tRSH tRAL tASC tRRH tRCH tRAH tASR ADDRESS ROW tASC tCAH COLUMN 1 tASC tCAH COLUMN 2 tASC tCAH COLUMN 3 tCAH COLUMN 4 tDS Din tDH DIN 1 tCAL High - Z tDS tDH DIN 3 tCAL tRDD tCDD tODD tOEP OE tWDD tCAC tOAC tAA tACP Dout tDOH tAA tACP DOUT 2 tCAC tOEZ tOHO DOUT 3 tCAC tAA tOAC tACP tOFR tOFF tOH DOUT 4 tWEZ tOEZ High - Z FIGURE 13. EXTENDED DATA OUT MODE MIX CYCLE (1)*25 21 LG Semicon GM71V65163A GM71VS65163AL tRASP RAS tRP tT tRCD tCSH tCAS tCP tCAS tCP tCAS tCP tCAS tRSH tRAL tASC tCAH tCAH COLUMN 4 tCRP UCAS LCAS tRCHR tRCS tRCH tWCH tWCS tCPW tASC tCAH COLUMN 1 tWP tRRH tRCH WE tRAH tASR ADDRESS ROW tASC tCAH COLUMN 2 tASC COLUMN 3 tCAL Din tCAL tDS tDH DIN 2 tDS tCAL tDH DIN 3 tCAL tRDD tCDD High - Z tODD tOEP OE tCOL tODD tOEP tCOP tOEZ tWDD tCAC tAA tOAC tRAC Dout tOEZ tOHO DOUT 1 tCAC tAA tACP tOAC tCAC tAA tOAC tACP tOFF tOH tOFR DOUT 4 tWEZ tOEZ High - Z DOUT 3 tOHO FIGURE 14. EXTENDED DATA OUT MODE MIX CYCLE (2)*25 22 LG Semicon GM71V65163A GM71VS65163AL tRP RAS tRASS tRPS tRPC tCP LCAS UCAS tT tCSR tCHS tCRP tWRP WE tWRH tOFR tOFF High-Z DOUT FIGURE 15. SELF REFRESH CYCLE*28,29,30,31 23 LG Semicon SOJ 50 PIN Package Dimension GM71V65163A GM71VS65163AL TSOP 50 PIN Package Dimension 0.40 MIN 0.60 MAX 20.95 MIN 21.35 MAX 0~5 Unit: mm 1.20 MAX 0.145 0.125 0.80 0.30 0.28 0.10 0.08 0.80 0.08 MIN 0.18 MAX 0.10 Dimension including the plating thickness Base material dimension 0.68 1.15 MAX 11.56 MIN 0.05 0.04 11.96 MAX 10.16 24 |
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