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| 20-24 GHz Low Noise Amplifier AA022N1-65 Features I 3.2 dB Noise Figure I 17 dB Gain I +9 dBm Output Power I Hermetic Package with Solderable Leads I Single Voltage Operation I 100% RF and DC Testing Description The AA022N1-65 is a broadband millimeterwave amplifier in a hermetic package. The amplifier is designed for use in millimeterwave communication and sensor systems as the receiver front-end, transmitter gain stage, or local oscillator gain stage when high gain, wide dynamic range, and low noise figure are required. The solder-sealed hermetic package provides excellent electrical performance, excellent thermal performance, and complete environmental protection for long-term reliability. A single supply voltage simplifies bias requirements. All amplifiers are screened at the operating frequencies prior to shipment for guaranteed performance. The amplifier is targeted for millimeterwave point-to-point and point-tomultipoint wireless communications systems. Pin Out N/C N/C AA022N1-65 RF In RF In RF Out RF Out YYWW VDD VD Electrical Specifications at 25C (VD = 5.5 V) RF Parameter Bandwidth Small Signal Gain Noise Figure Input Return Loss Output Return Loss Output Power at 1 dB Gain Compression Temperature Coefficient of Gain Symbol BW G NF RLI RLO P1 dB dG/dT Min. 20 15 Typ. 19-25 17 3.2 8 11 9 -0.028 3.9 Max. 24 Unit GHz dB dB dB dB dBm dB/C DC Parameter Drain Current Symbol ID Min. Typ. 60 Max. 90 Unit mA Alpha Industries, Inc. [781] 935-5150 * Fax [617] 824-4579 * Email sales@alphaind.com * www.alphaind.com Specifications subject to change without notice. 2/00A 1 20-24 GHz Low Noise Amplifier AA022N1-65 Typical Performance Data 25 0 S11 Return Loss (dB) 20 Gain (dB) -55C 15 +85C 10 5 0 10 15 20 25 30 +25C -5 S22 -10 -15 -20 10 15 20 25 30 Frequency (GHz) Frequency (GHz) Gain vs. Frequency 6 Return Loss vs. Frequency Absolute Maximum Ratings Characteristic Value -55C to +90C -65C to +150C 6 VDC 13 dBm Operating Temperature (TC) Storage Temperature (TST) Bias Voltage (VD) Power In (PIN) Noise Figure (dB) 5 4 3 2 20 21 22 23 24 Frequency (GHz) Noise Figure vs. Frequency Outline 0.388 (9.86 mm) 0.115 (2.92 mm) 0.002 0.164 (4.16 mm) 0.328 (8.33 mm) 0.075 (1.91 mm) 0.010 0.194 (4.92 mm) 0.065 (1.65 mm) MAX. 0.070 (1.78 mm) KOVAR 0.010 (0.25 mm) 0.001 0.378 (9.60 mm) 0.003 0.005 (0.13 mm) 0.001 0.053 (1.35 mm) 0.445 (11.30 mm) 0.002 0.272 (6.91 mm) 0.002 0.318 (8.08 mm) 0.002 CERAMIC 0.010 (0.25 mm) 0.002 0.015 (0.38 mm) 0.053 CW-10 (1.35 mm) MATERIAL 0.106 (2.69 mm) 2 Alpha Industries, Inc. [781] 935-5150 * Fax [617] 824-4579 * Email sales@alphaind.com * www.alphaind.com Specifications subject to change without notice. 2/00A 20-24 GHz Low Noise Amplifier AA022N1-65 Typical S-Parameters at 25C (VD = 5.5 V) Frequency (GHz) 5.0 7.0 9.0 11.0 12.0 13.0 14.0 15.0 16.0 17.0 18.0 19.0 20.0 21.0 22.0 23.0 24.0 25.0 26.0 27.0 28.0 29.0 30.0 32.0 34.0 36.0 38.0 40.0 S11 Mag. -0.23 -0.23 -0.08 -0.65 -0.99 -0.51 -0.10 -0.67 -0.63 -0.10 -0.83 -4.28 -5.74 -6.01 -9.01 -19.60 -9.00 -5.49 -5.53 -8.00 -9.41 -2.80 -2.33 -2.61 -1.05 -5.37 -2.11 -2.85 Ang. 154.65 -111.06 13.10 104.53 -48.85 166.36 55.47 -55.35 156.89 18.10 -83.22 152.57 -61.50 -179.42 88.52 48.18 -41.19 147.20 -9.75 -45.79 -22.84 -165.39 100.83 -97.59 62.48 -174.78 -176.06 -79.93 Mag. -43.85 -37.45 -8.78 8.89 15.42 15.79 16.34 15.16 16.13 15.92 15.81 17.65 17.80 16.90 16.55 16.75 18.64 17.87 19.57 17.63 19.14 11.16 6.39 -0.47 -4.75 -2.17 -16.06 -11.61 S21 Ang. 86.28 56.97 102.07 152.07 -26.69 157.28 -5.38 -139.82 84.35 -48.83 -169.31 60.67 -95.05 133.41 14.42 -110.63 127.32 -32.70 -165.11 87.22 -81.69 135.62 21.60 151.84 -49.44 42.82 -112.92 5.61 Mag. -45.99 -51.79 -44.05 -37.56 -47.14 -49.08 -47.31 -37.37 -40.46 -44.76 -43.32 -36.37 -35.20 -35.38 -34.87 -31.84 -30.18 -32.94 -36.65 -35.32 -28.71 -25.82 -28.49 -29.33 -42.31 -37.64 -48.35 -31.46 S12 Ang. 85.59 -104.35 66.64 -114.12 130.43 37.53 112.82 -47.11 -161.21 90.70 6.41 -126.11 98.48 -12.60 -115.99 151.62 33.65 -79.66 -80.66 98.43 77.45 -63.56 -164.40 -9.95 -155.10 -35.81 -143.83 -46.85 Mag. -0.02 -0.05 -0.61 -1.01 -0.42 -9.57 -10.10 -27.18 -14.25 -10.82 -21.13 -25.24 -12.39 -11.58 -16.93 -15.07 -12.31 -16.74 -8.81 -20.32 -0.46 -2.14 -5.02 -2.70 -2.59 -8.87 -2.90 -1.07 S22 Ang. 64.98 159.26 -116.95 -40.73 168.72 22.43 24.64 -136.61 51.89 -54.46 -167.32 -155.34 -88.92 144.87 44.72 -156.77 56.67 109.43 -38.71 -13.38 -21.58 -149.84 115.71 -119.75 74.44 -99.71 44.51 -108.06 Alpha Industries, Inc. [781] 935-5150 * Fax [617] 824-4579 * Email sales@alphaind.com * www.alphaind.com Specifications subject to change without notice. 2/00A 3 20-24 GHz Low Noise Amplifier AA022N1-65 Leaded Millimeterwave Package Handling and Mounting The leaded millimeterwave package requires careful mounting design to maintain optimal performance. Handling The leaded millimeterwave package is extremely rugged. Care should be exercised when handling with metal tools. Only personnel trained in both ESD precautions and handling precautions should be allowed to handle these packages. package to minimize the gap between package and printed circuit board. The gap should be no more than 0.005" (0.127 mm). The base of the package should be mounted directly to a surface that provides a good ground plane for the printed circuit board and provides a good thermal ground. Mounting the Package The leaded millimeterwave package should be attached to its mounting surface using a silver-filled conductive paste epoxy or solder. Care should be taken to ensure that there are no voids or gaps in the epoxy or solder underfill so that a good ground contact is maintained. Screw hardware attachment should be used in addition to epoxy or solder in situations where additional mechanical integrity is desired. Care should be exercised when tightening screws because over-tightening could deform the package base. Package Construction The construction of the leaded millimeterwave package consists of a metal base and ceramic walls. The package is topped by a solder-sealed metal lid. All metal parts are gold-plated. Mounting Design The leaded millimeterwave package is mounted by placing it in a hole cut in a printed circuit board. The bottom of the package leads should be in the same plane as the top surface of the printed circuit board traces. The hole should be cut as close as possible to the outer dimensions of the Connecting the Package Connection of the package leads to the printed circuit board traces is accomplished with solder. Attached leads should lie flat upon the printed circuits board traces. Package leads can be trimmed if desired. Soldered Leads Printed Circuit Board Rogers 4003 0.008" (0.20 mm) Thick RF Out Minimize RF Gap Widths 0-80 Screw RF In Electrically & Thermally Conductive Ground Plane DC Connection Leaded Millimeterwave Package Mounting 4 Alpha Industries, Inc. [781] 935-5150 * Fax [617] 824-4579 * Email sales@alphaind.com * www.alphaind.com Specifications subject to change without notice. 2/00A |
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