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| DATA SHEET MOS FIELD EFFECT TRANSISTOR PA2510 P-CHANNEL MOS FIELD EFFECT TRANSISTOR FOR SWITCHING DESCRIPTION The PA2510, which has a heat spreader, is P-channel applications of notebook computers. 0.65 TYP. PACKAGE DRAWING (Unit: mm) MOS Field Effect Transistor designed for power management FEATURES spreader. The land size is same as 8-pin TSSOP. * Low on-state resistance RDS(on)1 = 10.1 m MAX. (VGS = -10.0 V, ID = -9.0 A) RDS(on)2 = 14.0 m MAX. (VGS = -4.5 V, ID = -9.0 A) * Low Ciss: 3000 pF TYP. (VDS = -10.0 V, VGS = 0 V) +0.05 0.25 -0.05 0.10 M * PA2510 has a thin surface mount package with a heat +0.1 1 2 3 4 5.8 0.1 6.4 0.1 8 7 6 5 3.15 0.15 3 0.1 0.17 0.05 0.8 MAX. 0.10 S ORDERING INFORMATION PART NUMBER PACKAGE 8PIN HWSON 0 -0 PA2510TM 0.75 0.15 2.2 0.2 1, 2, 3 : Source 4 : Gate 5, 6, 7, 8: Drain 4.15 0.2 0.85 0.15 ABSOLUTE MAXIMUM RATINGS (TA = 25C) Drain to Source Voltage (VGS = 0 V) Gate to Source Voltage (VDS = 0 V) Drain Current (DC) Note1 Note2 Note1 VDSS VGSS ID(DC) ID(pulse) PT Tch Tstg -30.0 m20.0 m18.0 m72.0 2.7 150 -55 to +150 -18.0 32.4 V V A A W C C A mJ Gate Protection Diode Source Gate Body Diode Drain Current (pulse) EQUIVALENT CIRCUIT Drain Total Power Dissipation Channel Temperature Storage Temperature Single Avalanche Current Note3 IAS EAS Single Avalanche Energy Note3 2 Notes 1. Mounted on FR-4 board of 25 cm x 1.6 mm, PW 10 sec 2. PW 10 s, Duty Cycle 1% 3. Starting Tch = 25C, VDD = -30 V, RG = 25 , VGS = -20.0 0 V Remark The diode connected between the gate and source of the transistor serves as a protector against ESD. When this device actually used, an additional protection circuit is externally required if a voltage exceeding the rated voltage may be applied to this device. The information in this document is subject to change without notice. Before using this document, please confirm that this is the latest version. Not all products and/or types are available in every country. Please check with an NEC Electronics sales representative for availability and additional information. Document No. G16683EJ1V0DS00 (1st edition) Date Published December 2003 NS CP(K) Printed in Japan 2003 PA2510 ELECTRICAL CHARACTERISTICS (TA = 25C) CHARACTERISTICS Zero Gate Voltage Drain Current Gate Leakage Current Gate Cut-off Voltage Forward Transfer Admittance Note Note SYMBOL IDSS IGSS VGS(off) | yfs | RDS(on)1 RDS(on)2 TEST CONDITIONS VDS = -30.0 V, VGS = 0 V VGS = m20.0 V, VDS = 0 V VDS = -10.0 V, ID = -1.0 mA VDS = -10.0 V, ID = -9.0 A VGS = -10.0 V, ID = -9.0 A VGS = -4.5 V, ID = -9.0 A VDS = -10.0 V VGS = 0 V f = 1.0 MHz VDD = -15.0 V, ID = -9.0 A VGS = -10.0 V RG = 10 MIN. TYP. MAX. -1.0 m10.0 UNIT A A V S -1.0 12 7.5 9.5 3000 940 500 12 18 270 170 -2.5 Drain to Source On-state Resistance 10.1 14.0 m m pF pF pF ns ns ns ns nC nC nC V ns nC Input Capacitance Output Capacitance Reverse Transfer Capacitance Turn-on Delay Time Rise Time Turn-off Delay Time Fall Time Total Gate Charge Gate to Source Charge Gate to Drain Charge Body Diode Forward Voltage Reverse Recovery Time Reverse Recovery Charge Note Ciss Coss Crss td(on) tr td(off) tf QG QGS QGD VF(S-D) trr Qrr VDD = -24.0 V VGS = -10.0 V ID = -18.0 A IF = 18.0 A, VGS = 0 V IF = 18.0 A, VGS = 0 V di/dt = 100 A/s 70 8 22 0.85 80 68 Note Pulsed: PW 350 s, Duty Cycle 2% TEST CIRCUIT 1 AVALANCHE CAPABILITY D.U.T. RG = 25 PG. VGS = -20 0 V - ID VDD 50 L VDD PG. BVDSS VDS VGS(-) 0 Starting Tch = 1 s Duty Cycle 1% VDS Wave Form TEST CIRCUIT 2 SWITCHING TIME D.U.T. RL RG VDD VDS(-) 90% 10% 10% 90% VGS(-) VGS Wave Form 0 10% VGS 90% IAS VDS 0 td(on) ton tr td(off) toff tf TEST CIRCUIT 3 GATE CHARGE D.U.T. IG = -2 mA PG. 50 RL VDD 2 Data Sheet G16683EJ1V0DS PA2510 TYPICAL CHARACTERISTICS (TA = 25C) DERATING FACTOR OF FORWARD BIAS SAFE OPERATING AREA dT - Percentage of Rated Power - % 120 100 80 60 40 20 0 0 25 50 75 100 125 150 175 TOTAL POWER DISSIPATION vs. AMBIENT TEMPERATURE 3 PT - Total Power Dissipation - W 2.5 2 1.5 1 0.5 0 0 25 Mounted on FR-4 board of 25 cm2 x 1.6 mm, PW 10 sec 50 75 100 125 150 175 TA - Ambient Temperature - C TA - Ambient Temperature - C FORWARD BIAS SAFE OPERATING AREA -1000 -100 -10 -1 -0.1 Single pulse 10 ms 30 ms RDS(on) Limited (at VGS = -10 V) ID(pulse) ID(DC) PW = 1 ms ID - Drain Current - A 10 s Mounted on FR-4 board of 25 cm x 1.6 mm 2 -0.01 -0.1 -1 -10 -100 VDS - Drain to Source Voltage - V TRANSIENT THERMAL RESISTANCE vs. PULSE WIDTH rth(ch-A) - Transient Thermal Resistance - C/W 1000 100 10 1 Single pulse Mounted on FR-4 board of 25 cm2 x 1.6 mm 0.1 1m 10 m 100 m 1 10 PW - Pulse Width - s 100 1000 Data Sheet G16683EJ1V0DS 3 PA2510 DRAIN CURRENT vs. DRAIN TO SOURCE VOLTAGE FORWARD TRANSFER CHARACTERISTICS -80 Pulsed VGS = -10.0 V ID - Drain Current - A -100 -10 -1 -0.1 -0.01 V DS = - 10.0 V Pulsed TA = 125C 75C 25C - 25C ID - Drain Current - A -60 -4.5 V -40 -20 0 0 -0.2 -0.4 -0.6 -0.8 -1 VDS - Drain to Source Voltage - V -0.001 -0.5 -1 -1.5 -2 -2.5 -3 -3.5 VGS - Gate to Source Voltage - V GATE CUT-OFF VOLTAGE vs. CHANNEL TEMPERATURE | yfs | - Forward Transfer Admittance - S FORWARD TRANSFER ADMITTANCE vs. DRAIN CURRENT -2 VGS(off) - Gate Cut-off Voltage - V 100 -1.8 -1.6 -1.4 -1.2 -1 -0.8 -50 0 50 VDS = -10.0 V ID = -1.0 mA VDS = -10.0 V Pulsed 10 TA = -25C 25C 75C 125C 1 0.1 100 150 0.01 -0.01 -0.1 -1 -10 -100 Tch - Channel Temperature - C ID - Drain Current - A RDS(on) - Drain to Source On-state Resistance - m RDS(on) - Drain to Source On-state Resistance - m DRAIN TO SOURCE ON-STATE RESISTANCE vs. DRAIN CURRENT DRAIN TO SOURCE ON-STATE RESISTANCE vs. GATE TO SOURCE VOLTAGE 25 Pulsed 20 15 10 5 0 -0.1 25 20 15 10 5 0 0 -5 -10 -15 -20 VGS - Gate to Source Voltage - V ID = -9.0 A Pulsed VGS = -4.5 V -10.0 V -1 -10 -100 ID - Drain Current - A 4 Data Sheet G16683EJ1V0DS PA2510 DRAIN TO SOURCE ON-STATE RESISTANCE vs. CHANNEL TEMPERATURE CAPACITANCE vs. DRAIN TO SOURCE VOLTAGE RDS(on) - Drain to Source On-state Resistance - m 25 20 15 10 5 0 -50 0 50 100 150 Tch - Channel Temperature - C Ciss, Coss, Crss - Capacitance - pF 10000 ID = -9.0 A Pulsed VGS = 0 V f = 1.0 MHz Ciss VGS = -4.5 V -10.0 V 1000 Coss Crss 100 -0.1 -1 -10 -100 VDS - Drain to Source Voltage - V SWITCHING CHARACTERISTICS DYNAMIC INPUT CHARACTERISTICS 1000 VGS - Gate to Source Voltage - V td(on), tr, td(off), tf - Switching Time - ns -10 td(off) 100 tf -8 -6 -4 -2 0 0 VDD = -24.0 V ID = -18.0 A tr 10 td(on) VDD = -15.0 V VGS = -10.0 V RG = 10 1 -0.1 -1 -10 -100 10 20 30 40 50 60 70 80 ID - Drain Current - A QG - Gate Charge - nC SOURCE TO DRAIN DIODE FORWARD VOLTAGE SINGLE AVALANCHE CURRENT vs. INDUCTIVE LOAD 100 IAS - Single Avalanche Current - A IF - Diode Forward Current - A -100 VGS = 0 V Pulsed 10 IAS = -18.0 A -10 EAS = 32.4 mJ 1 -1 0.1 VDD = -15.0 V RG = 25 VGS = -20.0 0 V Starting Tch = 25C 0.1 1 10 0.01 0.4 0.6 0.8 1 1.2 VF(S-D) - Source to Drain Voltage - V -0.1 0.01 L - Inductive Load - mH Data Sheet G16683EJ1V0DS 5 PA2510 EXAMPLE OF THE LAND PATTERN Please optimize the land pattern in consideration of density, appearance of solder fillets, common difference, etc in an actual design. l3 e1: 0.65 b2: 0.35 b3: 2.7 l1: 1.3 l2: 3.7 l3: 7.1 (Unit: mm) l1 l2 e1 b3 b2 6 Data Sheet G16683EJ1V0DS PA2510 * The information in this document is current as of December, 2003. The information is subject to change without notice. For actual design-in, refer to the latest publications of NEC Electronics data sheets or data books, etc., for the most up-to-date specifications of NEC Electronics products. Not all products and/or types are available in every country. Please check with an NEC Electronics sales representative for availability and additional information. * No part of this document may be copied or reproduced in any form or by any means without the prior written consent of NEC Electronics. NEC Electronics assumes no responsibility for any errors that may appear in this document. * NEC Electronics does not assume any liability for infringement of patents, copyrights or other intellectual property rights of third parties by or arising from the use of NEC Electronics products listed in this document or any other liability arising from the use of such products. No license, express, implied or otherwise, is granted under any patents, copyrights or other intellectual property rights of NEC Electronics or others. * Descriptions of circuits, software and other related information in this document are provided for illustrative purposes in semiconductor product operation and application examples. The incorporation of these circuits, software and information in the design of a customer's equipment shall be done under the full responsibility of the customer. NEC Electronics assumes no responsibility for any losses incurred by customers or third parties arising from the use of these circuits, software and information. * While NEC Electronics endeavors to enhance the quality, reliability and safety of NEC Electronics products, customers agree and acknowledge that the possibility of defects thereof cannot be eliminated entirely. To minimize risks of damage to property or injury (including death) to persons arising from defects in NEC Electronics products, customers must incorporate sufficient safety measures in their design, such as redundancy, fire-containment and anti-failure features. * NEC Electronics products are classified into the following three quality grades: "Standard", "Special" and "Specific". The "Specific" quality grade applies only to NEC Electronics products developed based on a customerdesignated "quality assurance program" for a specific application. The recommended applications of an NEC Electronics product depend on its quality grade, as indicated below. Customers must check the quality grade of each NEC Electronics product before using it in a particular application. "Standard": Computers, office equipment, communications equipment, test and measurement equipment, audio and visual equipment, home electronic appliances, machine tools, personal electronic equipment and industrial robots. "Special": Transportation equipment (automobiles, trains, ships, etc.), traffic control systems, anti-disaster systems, anti-crime systems, safety equipment and medical equipment (not specifically designed for life support). "Specific": Aircraft, aerospace equipment, submersible repeaters, nuclear reactor control systems, life support systems and medical equipment for life support, etc. The quality grade of NEC Electronics products is "Standard" unless otherwise expressly specified in NEC Electronics data sheets or data books, etc. If customers wish to use NEC Electronics products in applications not intended by NEC Electronics, they must contact an NEC Electronics sales representative in advance to determine NEC Electronics' willingness to support a given application. (Note) (1) "NEC Electronics" as used in this statement means NEC Electronics Corporation and also includes its majority-owned subsidiaries. (2) "NEC Electronics products" means any product developed or manufactured by or for NEC Electronics (as defined above). M8E 02. 11-1 |
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