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| SD1891-03 RF & MICROWAVE TRANSISTORS 1.6 GHz SATCOM APPLICATIONS .1. .28 .GOLD .POLYSI .OVERLAY .HI .P 65 GHz VOLTS METALLIZED SYSTEM LICON SITE BALLASTING DIE GEOMETRY GH RELIABILITY AND RUGGEDNESS OUT = 5.0 W MIN. WITH 14.0 dB GAIN .230 2LFL (M151) hermetically sealed ORDER CODE SD1891-03 BRANDING 1891-03 PIN CONNECTION DESCRIPTION The SD1891-03 is a 28 V silicon NPN transistor designed for INMARSAT and other 1.6 GHz SATCOM applications. This device utilizes polysilicon site ballasting with a gold metallized die to achieve high reliability and ruggedness. ABSOLUTE MAXIMUM RATINGS (T case = 25 C) Symbol Parameter Value Unit 1. Collector 2. Emitter 3. Base VCBO VCEO VEBO IC PDISS TJ T STG Collector-Base Voltage Collector-Emitter Voltage Emitter-Base Voltage Device Current Power Dissipation Junction Temperature Storage Temperature 45 15 3.5 1.1 8.8 +200 - 65 to +200 V V V A W C C THERMAL DATA RTH(j-c) March 1993 Junction-Case Thermal Resistance 20.0 C/W 1/5 SD1891-03 ELECTRICAL SPECIFICATIONS (T case = 25 C) STATIC Symbol Test Conditions Value Min. Typ. Max. Unit BVCBO BVEBO I CBO hFE IC = 1mA IE = 1mA VCB = 24V VCE = 5V IE = 0mA IC = 0mA IE = 0mA IC = 100mA 45 3.5 -- 15 -- -- -- -- -- -- 0.5 150 V V mA -- DYNAMIC Symbol Test Conditions Value Min. Typ. Max. Unit POUT GP c COB f = 1.65 GHz f = 1.65 GHz f = 1.65 GHz f = 1 MHz PIN = 200 mW PIN = 200 mW PIN = 200 mW VCB = 28 V VCE = 28 V VCE = 28 V VCE = 28 V 5.0 14 45 -- -- -- -- 2.5 -- -- -- -- W dB % pF TYPICAL PERFORMANCE POWER OUTPUT vs POWER INPUT 2/5 SD1891-03 IMPEDANCE DATA ZCL 1.5 GHz 1.7 GHz 1.7 GHz ZIN 1.5 GHz FREQ. 1.5 GHz 1.6 GHz 1.7 GHz ZIN () 6.5 + j 8.5 6.0 + j 9.5 6.5 + j 11.5 ZCL () 8.5 + j 18.5 6.5 + j 18.0 5.5 + j 15.0 3/5 SD1891-03 TEST CIRCUIT C1, C2 : .4 - 2.5pF Johandson Capacitor #27283 C3 : 100pF ATC Chip Capacitor ATC100 A101KCA 150 C4 : 15,000pF EMI Filter Murata/Erie 9900-381-6004 L1, L2 : 4 Turns, Choke #28 AWG .080" I.D. S1 : Epsilam 10 Er = 10.2, Height .050" 1 Oz. Cu. SMA Launcher CD1 (2 pieces) .230" Fixture Housing Heatsink 4/5 SD1891-03 PACKAGE MECHANICAL DATA Ref.: Dwg. No.12-0151 Information furnished is believed to be accurate and reliable. However, SGS-THOMSON Microelectronics assumes no responsability for the consequences of use of such information nor for any infringement of patents or other rights of third parties which may results from its use. No license is granted by implication or otherwise under any patent or patent rights of SGS-THOMSON Microelectronics. Specifications mentioned in this publication are subject to change without notice. This publication supersedes and replaces all information previously supplied. SGS-THOMSON Microelectronics products are not authorized for use ascritical components in life support devices or systems without express written approval of SGS-THOMSON Microelectonics. (c) 1994 SGS-THOMSON Microelectronics - All Rights Reserved SGS-THOMSON Microelectronics GROUP OF COMPANIES Australia - Brazil - France - Germany - Hong Kong - Italy - Japan - Korea - Malaysia - Malta - Morocco - The Netherlands Singapore - Spain - Sweden - Switzerland - Taiwan - Thailand - United Kingdom - U.S.A 5/5 |
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