 |
|
| If you can't view the Datasheet, Please click here to try to view without PDF Reader . |
|
|
|
| If you can't view the Datasheet, Please click here to try to view without PDF Reader . |
|
|
| Datasheet File OCR Text: |
| HI-SINCERITY MICROELECTRONICS CORP. Spec. No. : HE6515 Issued Date : 1993.03.15 Revised Date : 2002.01.15 Page No. : 1/4 HSD1609S NPN EPITAXIAL PLANAR TRANSISTOR Description The HSD1609S is designed for low frequency high voltage amplifier applications, complementary pair with HSB1109S. Absolute Maximum Ratings TO-92 * Maximum Temperatures Storage Temperature ............................................................................................ -50 ~ +150 C Junction Temperature ...................................................................................... 150 C Maximum * Maximum Power Dissipation Total Power Dissipation (Ta=25C) ................................................................................ 900 mW * Maximum Voltages and Currents (Ta=25C) VCBO Collector to Base Voltage ....................................................................................... 160 V VCEO Collector to Emitter Voltage .................................................................................... 160 V VEBO Emitter to Base Voltage .............................................................................................. 5 V IC Collector Current........................................................................................................ 100 mA Characteristics (Ta=25C) Symbol BVCBO BVCEO BVEBO ICBO *VCE(sat) VBE(on) *hFE1 *hFE2 fT Cob Min. 160 160 5 60 30 Typ. 140 3.8 Max. 10 2 1.5 320 Unit V V V uA V V Test Conditions IC=10uA, IE=0 IC=1mA, IB=0 IE=10uA, IC=0 VCB=140V, IE=0 IC=30mA, IB=3mA VCE=5V, IC=10mA VCE=5V, IC=10mA VCE=5V, IC=1mA VCE=5V, IC=10mA IE=0, VCB=10V, f=1MHZ *Pulse Test : Pulse Width 380us, Duty Cycle2% MHz pF Classification of hFE1 Rank Range B 60-120 C 100-200 D 160-320 HSD1609S HSMC Product Specification HI-SINCERITY MICROELECTRONICS CORP. Characteristics Curve Current Gain & Collector Current 10000 1000 Spec. No. : HE6515 Issued Date : 1993.03.15 Revised Date : 2002.01.15 Page No. : 2/4 Saturation Voltage & Collector Current 125 C 75 C o hFE 25 C 100 o Saturation Voltage (mV) 1000 o 100 125 C o 75 C o 10 hFE @ VCE=5V 1 0.1 1 10 100 1000 25 C VCE(sat) @ IC=10IB o 10 0.1 1 10 100 1000 Collector Current IC (mA) Collector Current IC (mA) Saturation Voltage & Collector Current 10000 1000 ON Voltage & Collector Current 25 C o Saturation Voltage (mV) ON Voltage (mV) 1000 125 C o 75 C o 100 125 C 75 C 25 C VCE(sat) @ IC=20IB o o o VBE(ON) @ IC=5V 10 0.1 1 10 100 1000 10000 100 0.1 1 10 100 1000 Collector Current IC (mA) Collector Current IC (mA) Cutoff Frequency & Ic 1000 10 Capacitance & Reverse-Biased Voltage Cutoff Frequency (MHz). . fT 100 Capacitance (PF) Cob 10 1 10 100 1000 1 0.1 1 10 100 1000 Collector Current (mA) Reverse Biased Voltage (V) HSD1609S HSMC Product Specification HI-SINCERITY MICROELECTRONICS CORP. Spec. No. : HE6515 Issued Date : 1993.03.15 Revised Date : 2002.01.15 Page No. : 3/4 Safe Operating Area 10 PT=1ms Power Derating 1000 900 Collector Current (mA) 1 PT=1s Power Dissipation-PD(mW) PT=100ms 800 700 600 500 400 300 200 100 0.1 0.01 0.001 1 10 100 1000 0 0 20 40 60 80 100 o 120 140 160 Forward Voltage (V) Ambient Temperature-Ta( C) HSD1609S HSMC Product Specification HI-SINCERITY MICROELECTRONICS CORP. TO-92 Dimension A B 1 2 3 Spec. No. : HE6515 Issued Date : 1993.03.15 Revised Date : 2002.01.15 Page No. : 4/4 2 Marking: HSMC Logo Part Number Date Code Rank Product Series 3 Laser Mark HSMC Logo Product Series C D Part Number H I E F G Ink Mark 1 3-Lead TO-92 Plastic Package HSMC Package Code: A Style: Pin 1.Emitter 2.Collector 3.Base *: Typical DIM A B C D E F Inches Min. Max. 0.1704 0.1902 0.1704 0.1902 0.5000 0.0142 0.0220 *0.0500 0.1323 0.1480 Millimeters Min. Max. 4.33 4.83 4.33 4.83 12.70 0.36 0.56 *1.27 3.36 3.76 DIM G H I 1 2 3 Inches Min. Max. 0.0142 0.0220 *0.1000 *0.0500 *5 *2 *2 Millimeters Min. Max. 0.36 0.56 *2.54 *1.27 *5 *2 *2 Notes: 1.Dimension and tolerance based on our Spec. dated Apr. 25,1996. 2.Controlling dimension: millimeters. 3.Maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material. 4.If there is any question with packing specification or packing method, please contact your local HSMC sales office. Material: * Lead: 42 Alloy; solder plating * Mold Compound: Epoxy resin family, flammability solid burning class: UL94V-0 Important Notice: * All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of HSMC. * HSMC reserves the right to make changes to its products without notice. * HSMC semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems. * HSMC assumes no liability for any consequence of customer product design, infringement of patents, or application assistance. Head Office And Factory: * Head Office (Hi-Sincerity Microelectronics Corp.): 10F.,No. 61, Sec. 2, Chung-Shan N. Rd. Taipei Taiwan R.O.C. Tel: 886-2-25212056 Fax: 886-2-25632712, 25368454 * Factory 1: No. 38, Kuang Fu S. Rd., Fu-Kou Hsin-Chu Industrial Park Hsin-Chu Taiwan. R.O.C Tel: 886-3-5983621~5 Fax: 886-3-5982931 HSD1609S HSMC Product Specification |
Price & Availability of HSD1609S
 |
|
|
|
|
All Rights Reserved © IC-ON-LINE 2003 - 2022 |
| [Add Bookmark] [Contact Us] [Link exchange] [Privacy policy] |
|
Mirror Sites : [www.datasheet.hk]
[www.maxim4u.com] [www.ic-on-line.cn]
[www.ic-on-line.com] [www.ic-on-line.net]
[www.alldatasheet.com.cn]
[www.gdcy.com]
[www.gdcy.net] |