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INFRA-RED EMITTING DIODES AP3216F3C AP3216SF4C Features ! WATER Description F3 Made with Gallium Arsenide Infrared Emitting diodes. SF4 Made with Gallium Aluminum Arsenide Infrared Emitting diodes. CLEAR LENS AVAILABLE. ! 3.2mmx1.6mm SMT LED, 1.1mm THICKNESS. ! HIGH POWER OUTPUT. ! PACKAGE: 2000PCS/REEL. Package Dimensions Notes: 1. All dimensions are in millimeters (inches). 2. Tolerance is 0.2(0.0079") unless otherwise noted. 3. Lead spacing is measured where the lead emerge package. 4. Specifications are subject to change without notice. D i g i t a l l y s i g n e d b y Y A N G S H O U F E N c n = Y A N G S H O U F E N , o u = K I N G B R I H G T , o = 4 2 , c = U S D a t e : 2 0 0 1 . 1 1 . 1 2 1 3 : 5 7 : 5 4 + 0 8 '0 0 'R e a s o n : D o c u m e n t i s c e r t i f i e d SPEC NO: CDA0510 APPROVED: J.LU REV NO: V.1 CHECKED: DATE: NOV/12/2001 DRAWN: M.F.CAI PAGE: 1 OF 5 Selection Guide Par t No . Dic e L en s Ty p e Po = (mW/s r ) @20mA Mi n . AP3216F3C AP3216SF4C GaAs GaAlAs WATER CLEAR WATER CLEAR 0.5 0.5 Ty p . 1.2 1 Viewin g An g le 21/2 120 120 Note: 1. 1/2 is the angle from optical centerline where the luminous intensity is 1/2 the optical centerline value. Electrical / Optical Characteristics at T)=25C It em Forward Voltage Reverse Current Junction Capacitance Peak Spectral Wavelength Spectral Bandwidth P/N F3 S F4 F3 S F4 F3 S F4 F3 S F4 F3 S F4 Sy m b o l VF IR C P Ty p . 1.2 1.3 90 90 940 880 50 50 Max . 1.5 1.7 10 10 Un it V uA pF nm nm Co n d it io n IF=20mA VR=5V V=0 f=1MHz IF=20mA IF=20mA Absolute Maximum Ratings at T)=25C It em Power Dissipation Forward Current Peak Forward Current Reverse Voltage Operating Temperature Storage Temperature Note: 1.1/100 Duty Cycle, 10us Pluse Width. Sy m b o l PT IF i FS Max im u m Rat in g 100 50 1.2 5 -40~ +85 -40~ +85 Un it s mW mA A V C C VR TA TSTG SPEC NO: CDA0510 APPROVED: J.LU REV NO: V.1 CHECKED: DATE: NOV/12/2001 DRAWN: M.F.CAI PAGE: 2 OF 5 AP3216F3C SPEC NO: CDA0510 APPROVED: J.LU REV NO: V.1 CHECKED: DATE: NOV/12/2001 DRAWN: M.F.CAI PAGE: 3 OF 5 AP3216SF4C AP3216F3C,AP3216SF4C SMT Reflow Soldering Instructions Number of reflow process shall be less than 2 times and cooling process to normal temperature is required between first and second soldering process. SPEC NO: CDA0510 APPROVED: J.LU REV NO: V.1 CHECKED: DATE: NOV/12/2001 DRAWN: M.F.CAI PAGE: 4 OF 5 Recommended Soldering Pattern (Units : mm) Tape Specifications (Units : mm) .! 5." SPEC NO: CDA0510 APPROVED: J.LU REV NO: V.1 CHECKED: DATE: NOV/12/2001 DRAWN: M.F.CAI PAGE: 5 OF 5 |
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