 |
|
| If you can't view the Datasheet, Please click here to try to view without PDF Reader . |
|
|
|
| If you can't view the Datasheet, Please click here to try to view without PDF Reader . |
|
|
| Datasheet File OCR Text: |
| DISCRETE SEMICONDUCTORS DATA SHEET handbook, halfpage M3D168 BZG04 series Transient voltage suppressor diodes Preliminary specification Supersedes data of 1996 Jun 10 1996 Sep 19 Philips Semiconductors Preliminary specification Transient voltage suppressor diodes FEATURES * Glass passivated * High maximum operating temperature * Low leakage current * Excellent stability * UL 94V-O classified plastic package * Transient suppressor stand-off voltage range: 8.2 to 220 V for 32 types * Shipped in 12 mm embossed tape. DESCRIPTION DO-214AC surface mountable package with glass passivated chip. BZG04 series The well-defined void-free case is of a transfer-moulded thermo-setting plastic. handbook, 4 columns Fig.1 Simplified outline (DO-214AC; SOD106) and symbol. ,, ,, ,, k cathode band a Top view Side view MSA473 LIMITING VALUES In accordance with the Absolute Maximum Rating System (IEC 134). SYMBOL PRSM PARAMETER non-repetitive peak reverse power dissipation storage temperature junction temperature CONDITIONS 10/1000 s exponential pulse (see Fig.4); Tj = 25 C prior to surge; see also Fig.2 MIN. - MAX. 300 UNIT W Tstg Tj -65 -65 +175 +175 C C 1996 Sep 19 2 Philips Semiconductors Preliminary specification Transient voltage suppressor diodes ELECTRICAL CHARACTERISTICS Total series Tj = 25 C unless otherwise specified. SYMBOL VF PARAMETER forward voltage CONDITIONS IF = 0.5 A; see Fig.3 MIN. - BZG04 series MAX. 1.2 V UNIT Per type Tj = 25 C unless otherwise specified. REVERSE BREAKDOWN VOLTAGE V(BR)R (V) at Itest MIN. BZG04-8V2 BZG04-9V1 BZG04-10 BZG04-11 BZG04-12 BZG04-13 BZG04-15 BZG04-16 BZG04-18 BZG04-20 BZG04-22 BZG04-24 BZG04-27 BZG04-30 BZG04-33 BZG04-36 BZG04-39 BZG04-43 BZG04-47 BZG04-51 BZG04-56 BZG04-62 BZG04-68 BZG04-75 BZG04-82 BZG04-91 BZG04-100 9.4 10.4 11.4 12.4 13.8 15.3 16.8 18.8 20.8 22.8 25.1 28 31 34 37 40 44 48 52 58 64 70 77 85 94 104 114 TEMPERATURE COEFFICIENT SZ (%/K) at Itest MIN. 0.05 0.05 0.05 0.05 0.05 0.06 0.06 0.06 0.06 0.06 0.06 0.06 0.06 0.06 0.06 0.07 0.07 0.07 0.07 0.08 0.08 0.08 0.08 0.09 0.09 0.09 0.09 MAX. 0.09 0.10 0.10 0.10 0.10 0.11 0.11 0.11 0.11 0.11 0.11 0.11 0.11 0.11 0.11 0.12 0.12 0.12 0.12 0.13 0.13 0.13 0.13 0.13 0.13 0.13 0.13 TEST CURRENT Itest (mA) 50 50 50 50 50 25 25 25 25 25 25 25 25 10 10 10 10 10 10 10 10 10 10 5 5 5 5 CLAMPING VOLTAGE V(CL)R (V) at IRSM (A) note 1 MAX. 14.8 15.7 17.0 18.9 20.9 22.9 25.6 28.4 31.0 33.8 38.1 42.2 46.2 50.1 54.1 60.7 65.5 70.8 78.6 86.5 94.4 103.5 114 126 139 152 167 20.3 19.1 17.7 15.9 14.4 13.1 11.7 10.6 9.7 8.9 7.9 7.1 6.5 6.0 5.5 4.9 4.6 4.2 3.8 3.5 3.2 2.9 2.6 2.4 2.2 2.0 1.8 REVERSE CURRENT at STAND-OFF VOLTAGE IR (A) MAX. 20 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 8.2 9.1 10 11 12 13 15 16 18 20 22 24 27 30 33 36 39 43 47 51 56 62 68 75 82 91 100 at VR (V) TYPE NUMBER 1996 Sep 19 3 Philips Semiconductors Preliminary specification Transient voltage suppressor diodes BZG04 series TYPE NUMBER REVERSE BREAKDOWN VOLTAGE V(BR)R (V) at Itest MIN. 124 138 153 168 188 208 228 251 TEMPERATURE COEFFICIENT SZ (%/K) at Itest MIN. 0.09 0.09 0.09 0.09 0.09 0.09 0.09 0.09 MAX. 0.13 0.13 0.13 0.13 0.13 0.13 0.13 0.13 TEST CURRENT Itest (mA) 5 5 5 5 5 2 2 2 CLAMPING VOLTAGE V(CL)R (V) at IRSM (A) note 1 MAX. 185 204 224 249 276 305 336 380 1.6 1.5 1.3 1.2 1.1 1.0 0.9 0.8 REVERSE CURRENT at STAND-OFF VOLTAGE IR (A) MAX. 5 5 5 5 5 5 5 5 at VR (V) 110 120 130 150 160 180 200 220 BZG04-110 BZG04-120 BZG04-130 BZG04-150 BZG04-160 BZG04-180 BZG04-200 BZG04-220 Note 1. Non-repetitive peak reverse current in accordance with "IEC 60-1, Section 8" (10/1000 s pulse); see Fig.4. THERMAL CHARACTERISTICS SYMBOL Rth j-tp Rth j-a PARAMETER thermal resistance from junction to tie-point thermal resistance from junction to ambient note 1 note 2 Notes 1. Device mounted on an Al2O3 printed-circuit board, 0.7 mm thick; thickness of Cu-layer 35 m, see Fig.5. 2. Device mounted on an epoxy-glass printed-circuit board, 1.5 mm thick; thickness of Cu-layer 40 m, see Fig.5. For more information please refer to the "General Part of associated Handbook". CONDITIONS VALUE 25 100 150 UNIT K/W K/W K/W 1996 Sep 19 4 Philips Semiconductors Preliminary specification Transient voltage suppressor diodes GRAPHICAL DATA BZG04 series 104 handbook, halfpage PZSM (W) 103 MBH452 handbook, halfpage 3 MBH453 IF (A) 2 102 1 10 10-2 10-1 0 1 tp (ms) 10 0 1 VF (V) 2 Tj = 25 C prior to surge. Tj = 25 C. Fig.2 Maximum non-repetitive peak reverse power dissipation as a function of pulse duration (square pulse). Fig.3 Forward current as a function of forward voltage; typical values. IRSM handbook, halfpage (%) 100 90 50 4.5 50 2.5 10 t t1 t2 MGD521 50 1.25 MSB213 In accordance with "IEC 60-1, Section 8". t1 = 10 s. t2 = 1000 s. Dimensions in mm. Fig.4 Non-repetitive peak reverse current pulse definition. Fig.5 Printed-circuit board for surface mounting. 1996 Sep 19 5 Philips Semiconductors Preliminary specification Transient voltage suppressor diodes PACKAGE OUTLINE BZG04 series handbook, full pagewidth 5.5 5.1 4.5 4.3 2.3 2.0 0.05 2.8 1.6 2.4 1.4 , , , , 0.2 3.3 2.7 MSA414 Dimensions in mm. The marking band indicates the cathode. Fig.6 DO-214AC; SOD106. 1996 Sep 19 6 Philips Semiconductors Preliminary specification Transient voltage suppressor diodes DEFINITIONS Data sheet status Objective specification Preliminary specification Product specification Limiting values BZG04 series This data sheet contains target or goal specifications for product development. This data sheet contains preliminary data; supplementary data may be published later. This data sheet contains final product specifications. Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended periods may affect device reliability. Application information Where application information is given, it is advisory and does not form part of the specification. LIFE SUPPORT APPLICATIONS These products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. Philips customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such improper use or sale. 1996 Sep 19 7 |
Price & Availability of BZG04
 |
|
|
|
|
All Rights Reserved © IC-ON-LINE 2003 - 2022 |
| [Add Bookmark] [Contact Us] [Link exchange] [Privacy policy] |
|
Mirror Sites : [www.datasheet.hk]
[www.maxim4u.com] [www.ic-on-line.cn]
[www.ic-on-line.com] [www.ic-on-line.net]
[www.alldatasheet.com.cn]
[www.gdcy.com]
[www.gdcy.net] |