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| UG8JT, UGF8JT, UGB8JT Series New Product Vishay Semiconductors formerly General Semiconductor Reverse Voltage 500 to 600V Forward Current 8.0A Reverse Recovery Time 25ns Ultrafast Rectifiers ITO-220AC (UGF8 Series) 0.405 (10.27) 0.383 (9.72) 0.188 (4.77) 0.172 (4.36) 0.110 (2.80) 0.100 (2.54) 0.140 (3.56) DIA. 0.130 (3.30) 0.131 (3.39) DIA. 0.122 (3.08) TO-220AC (UG8 Series) 0.415 (10.54) MAX. 0.154 (3.91) 0.370 (9.40) 0.360 (9.14) 0.148 (3.74) 0.113 (2.87) 0.103 (2.62) 0.145 (3.68) 0.135 (3.43) 0.410 (10.41) 0.390 (9.91) PIN 1 0.160 (4.06) 0.140 (3.56) 2 1.148 (29.16) 1.118 (28.40) 0.110 (2.79) 0.100 (2.54) 0.560 (14.22) 0.530 (13.46) CASE 1 0.185 (4.70) 0.175 (4.44) DIA. 0.055 (1.39) 0.045 (1.14) 0.600 (15.5) 0.580 (14.5) 0.676 (17.2) 0.646 (16.4) 0.350 (8.89) 0.330 (8.38) PIN 2 0.635 (16.13) 0.625 (15.87) 0.350 (8.89) 0.330 (8.38) 0.603 (15.32) 0.573 (14.55) 0.560 (14.22) 0.530 (13.46) 0.191 (4.85) 0.171 (4.35) 0.060 (1.52) PIN 1 PIN 2 0.110 (2.80) 0.100 (2.54) PIN 1 PIN 2 0.205 (5.20) 0.195 (4.95) 0.037 (0.94) 0.027 (0.69) 0.022 (0.55) 0.014 (0.36) 0.105 (2.67) 0.095 (2.41) 0.205 (5.20) 0.195 (4.95) 0.037 (0.94) 0.027 (0.68) 0.022 (0.56) 0.014 (0.36) TO-263AB (UGB8 Series) 0.411 (10.45) 0.380 (9.65) 0.245 (6.22) MIN K 0.055 (1.40) 0.047 (1.19) 1 K 2 0.624 (15.85) 0.591 (15.00) 0-0.01 (0-0.254) 0.190 (4.83) 0.160 (4.06) 0.055 (1.40) 0.045 (1.14) Mounting Pad Layout TO-263AB 0.42 (10.66) 0.360 (9.14) 0.320 (8.13) 0.33 (8.38) 0.63 (17.02) Dimensions in inches and (millimeters) 0.110 (2.79) 0.090 (2.29) 0.027 (0.686) 0.037 (0.940) 0.105 (2.67) PIN 1 PIN 2 K - HEATSINK 0.021 (0.53) 0.014 (0.36) 0.140 (3.56) 0.110 (2.79) 0.08 (2.032) 0.24 (6.096) 0.095 (2.41) 0.12 (3.05) 0.205 (5.20) 0.195 (4.95) Features * Plastic package has Underwriters Laboratories Flammability Classification 94V-0 * Ideally suited for freewheeling diode and power factor correction applications * Soft recovery characteristics * Excellent high temperature switching * Optimized to reduce switching losses * High temperature soldering in accordance with CECC 802 / Reflow guaranteed * Glass passivated chip junction Document Number 88767 03-Jul-02 Mechanical Data Case: JEDEC TO-220AC, ITO-220AC & TO-263AB molded plastic body Terminals: Plated leads, solderable per MIL-STD-750, Method 2026 Polarity: As marked Mounting Position: Any Mounting Torque: 10 in-lbs maximum Weight: 0.08 oz., 2.24 g www.vishay.com 1 UG8JT, UGF8JT, UGB8JT Series Vishay Semiconductors formerly General Semiconductor Maximum Ratings Parameter (TC = 25C unless otherwise noted) Symbol VRRM VRWM VRMS VDC IF(AV) IFSM TJ, TSTG VISOL UG8HT 500 400 350 500 8.0 100 -55 to +150 4500 3500(2) 1500(3) (1) UG8JT 600 480 420 600 Unit V V V V A A C V Maximum repetitive peak reverse voltage Maximum working reverse voltage Maximum RMS voltage Maximum DC blocking voltage Maximum average forward rectified current Peak forward surge current 8.3ms single half sine-wave superimposed on rated load (JEDEC Method) at TC = 100C Operating junction and storage temperature range RMS Isolation voltage (UGF types only) from terminals to heatsink with t = 1.0 second, RH 30% Electrical Characteristics (TC = 25C unless otherwise noted) Parameter Maximum instantaneous forward voltage(4) Maximum DC reverse current at VRWM Maximum reverse recovery time at IF = 0.5A, IR = 1.0A, Irr = 0.25A Maximum reverse recovery time at IF = 1.0A, di/dt = 50A/s, VR = 30V, Irr = 0.1 IRM Typical softness factor (tb/ta) IF = 8.0A, di/dt = 240A/s, VR = 400V, Irr = 0.1 IRM Maximum reverse recovery current at IF = 8.0A, di/dt = 64A/s, VR = 400V, TC = 125C Maximum reverse recovery current at IF = 8.0A, di/dt = 240A/s, VR = 400V, TC = 125C Peak forward recovery time at IF = 8.0A, di/dt = 64A/s, VF = 1.1VF max IF = 8A, TJ = 25C IF = 8A, TJ = 125C TJ = 25C TJ = 100C TJ = 125C Symbol VF IR trr trr S IRM IRM tfr UG8HT 1.75 1.50 30 800 4.0 25 50 1.0 5.5 10 500 UG8JT Unit V A A mA ns ns -- A A ns Thermal Characteristics (TC = 25C unless otherwise noted) Parameter Typical thermal resistance from junction to case Symbol RJC UG8 2.2 UGF8 5.0 UGB8 2.2 Unit C/W Notes: (1) Clip mounting (on case), where lead does not overlap heatsink with 0.110" offset (3) Screw mounting with 4-40 screw, where washer diameter is 4.9 mm (0.19") (2) Clip mounting (on case), where leads do overlap heatsink (4) Pulse test: 300s pulse width, 1% duty cycle Ordering Information Product UG8 UGF8 UGB8 Case TO-220AC ITO-220AC TO-263AB Package Code 45 45 31 45 81 Package Option Anti-Static tube, 50/tube, 2K/carton Anti-Static tube, 50/tube, 2K/carton 13" reel, 800/reel, 4.8K/carton Anti-Static tube, 50/tube, 2K/carton Anti-Static 13" reel, 800/reel, 4.8K/carton www.vishay.com 2 Document Number 88767 03-Jul-02 UG8JT, UGF8JT, UGB8JT Series Vishay Semiconductors formerly General Semiconductor Ratings and Characteristic Curves (TA = 25C unless otherwise noted) Fig. 1 -- Maximum Forward Current Derating Curve 12.0 1,000 Fig. 2 -- Maximum Non-Repetitive Peak Forward Surge Current Peak Forward Surge Current (A) TJ = TJ max. 8.3ms Single Half Sine-Wave (JEDEC Method) Average Forward Rectified Current (A) Resistive or Inductive Load 10.0 8.0 UG8, UGB8 6.0 UG8F 4.0 2.0 100 0 25 50 75 100 125 150 175 10 1 10 100 Case Temperature (C) Number of Cycles at 60 HZ Fig. 3 -- Typical Instantaneous Forward Characteristics 100 10,000 Fig. 4 -- Typical Reverse Leakage Characteristics Instantaneous Reverse Current (A) Instantaneous Forward Current (A) 10 TJ = 25C max. Pulse Width = 300s 1% Duty Cycle 1,000 1 100 0.1 10 0.01 0.5 1 1.0 1.5 2.0 2.5 3.0 0 20 40 60 80 100 Instantaneous Forward Voltage (V) Percent of Rated Peak Reverse Voltage (%) Fig. 5 -- Typical Junction Capacitance Stored Charge/Reverse Recovery Time, (nC/ns) 100 350 300 250 200 150 100 50 0 25 Fig. 6 -- Reverse Switching Characteristics Qrr Trr IF = 8.0A Vr = 30V di/dt = Junction Capacitance (pF) 10 TJ = 25C f = 1.0MHZ Vsig = 50 mvp-p 1 0.1 1 10 100 50 75 100 125 150 Reverse Voltage (V) Document Number 88767 03-Jul-02 Junction Temperature (C) www.vishay.com 3 |
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