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PC3H2/PC3Q62
PC3H2/PC3Q62
s Features
1. Half pitch surface mount type for high density mounting (Lead pitch : 1.27 mm) 2. High resistance to noise due to high common mode rejection voltage (CMR : MIN.10kV/s) 3. Soldering reflow type (230C, for 30seconds) 4. High temperature tested model 5. Taping package PC3H2 (1ch) PC3Q62 (4ch) 6. Recognized by UL, file No. E64380
High Resistance to Noise, Half Pitch Photocoupler
s Outline Dimensions
PC3H2 2.60.3 Anode mark
1
(Unit : mm)
S 3H2
4.4
0.2
4
2
3
1.270.25
5.30.3 (1.7)
0.40.1
Epoxy resin 2.00.2 0.10.1
1 2 3 4 1 2 9 10 3 4 11 12 5 6 13 14 7 8 15 16
0.2
0.05
s Applications
1. Programmable controllers
7.0+0.2 -0.7
+0.4 0.5-0.2
Parting line
g ( ) : Reference dimensions Internal connection diagram
4 3
s Package Specifications
Model No. PC3H2 PC3Q62 Package specification Taping reel diameter 330mm (3 000pcs) Taping reel diameter 330mm (1 000pcs)
Anode Cathode Emitter Collector
s Absolute Maximum Ratings
Parameter Symbol Rating *1 Forward current IF 50 *2 Peak forward current 1 IFM Input VR 6 Reverse voltage *1 P 70 Power dissipation *1 Collector-emitter voltage VCEO 70 6 Emitter-collector voltage VECO IC 50 Output Collector current *1 Collector dissipation 150 PC *1 Total power dissipation 170 Ptot Operating temperature Topr -30 to +100 Tstg -40 to +125 Tstg Storage temperature *3 Viso Isolation voltage Viso 2.5 *4 Soldering temperature TSOL 260
1
2
(Ta=25C) Unit mA A V mW V V mA mW mW C C kVrms C
0.2mm or more PC3Q62 10.30.3 1.270.25 Anode Cathode Emitter Collector
16
9
0.40.1
1
4.40.2
Primary Side mark
S PC3Q62
C0.4 0.20.05 Epoxy resin
8
5.30.3
0.10.1 2.60.2
+0.4 0.5-0.2
6 Internal connection diagram
16 15 14 13 12 11 10
+0.2 7.0-0.7
*1 The derating factors of absolute maximum ratings due to ambient temperature are shown in Fig.2 to 5 *2 Pulse width<=100s, Duty ratio:0.01, Refer to Fig.6 *3 AC for 1min., 40 to 60% RH, f=60Hz *4 For 10s
9
1
2
3
4
5
6
7
8
Soldering area
Notice In the absence of confirmation by device specification sheets, SHARP takes no responsibility for any defects that may occur in equipment using any SHARP devices shown in catalogs, data books, etc. Contact SHARP in order to obtain the latest device specification sheets before using any SHARP device. Internet Internet address for Electronic Components Group http://www.sharp.co.jp/ecg/
PC3H2/PC3Q62 s Electro-optical Characteristics
Parameter Forward voltage Reverse current Terminal capacitance Collector dark current Output Collector-emitter breakdown voltage Emitter-collector breakdown voltage Collector current Collector-emitter saturation voltage Isolation resistance Floating capacitance Response time Rise time Fall time PC3H2 PC3Q62 Symbol VF IR Ct ICEO BVCEO BVECO IC VCE(sat) RISO Cf tr tf Conditions IF=20mA VR=4V V=0, f=1kHz VCE=50V, IF =0 VCE=20V, IF =0 IC=0.1mA IF =0 IE=10A, IF=0 IF=1mA VCE=5V IF=20mA IC=1mA DC500V 40 to 60%RH V=0, f=1MHz VCE=2V IC=2mA RL=100 Ta=25C, RL=470 VCM=1.5kV(peak) IF=0mA,VCC=9V, Vnp=100mV MIN. - - - - 70 6 0.2 - 5x1010 - - - 10 TYP. 1.2 - 30 - - - - 0.1 1x1011 0.6 4 3 - MAX. 1.4 10 250 100 - - 4.0 0.2 - 1.0 18 18 - (Ta=25C) Unit V A pF nA V V mA V pF s s kV/s
Input
Transfer characteristics
*5
Common mode rejection voltage
CMR
*5 Refer to Fig.1
Fig.1 Test Circuit for Common Mode Rejection Voltage
(dV/dt)
VCM RL Vnp VCC VCM : High wave pulse RL=470 VCC=9V VO 1) Vcp Vnp
VCM
(Vcp Nearly = dV/dtxCfxRL) 1) Vcp : Voltage which is generated by displacement current in floating capacitance between primary and secondary side.
PC3H2/PC3Q62 Fig.2 Forward Current vs. Ambient Temperature
50 Diode power dissipation P (mW) Forward current IF (mA)
Fig.3 Diode Power Dissipation vs. Ambient Temperature
100
40
80 70 60
30
20
40
10 0 -30
20 0 -30
0
25
50 55
75
100
125
0
25
50 55
75
100
125
Ambient temperature Ta (C)
Ambient temperature Ta (C)
Fig.4 Collector Power Dissipation vs. Ambient Temperature
250 Collector power dissipation PC (mW)
Fig.5 Total Power Dissipation vs. Ambient Temperature
250
200
Total power dissipation Ptot (mW) 0 25 50 75 100 125
200 170 150
150
100
100
50
50
0 -30
0 -30
0
25
50
75
100
125
Ambient temperature Ta (C)
Ambient temperature Ta (C)
Fig.6 Peak Forward Current vs. Duty Ratio
2000 1000 500 200 100 50 20 Pulse width<=100s Ta=25C
Fig.7 Forward Current vs. Forward Voltage
500 200
Ta=75C
50C 25C 0C
Peak forward current IFM (mA)
Forward current IF (mA)
100 50 20 10 5 2 1
-25C
10
5
10
-3
2
5 10
-2
2
5 10
-2
2
5
1
0
0.5
1.0
1.5
2.0
2.5
3.0
3.5
Duty ratio
Forward voltage VF (V)
PC3H2/PC3Q62 Fig.8 Current Transfer Ratio vs. Forward Current
300 VCE=5V Ta=25C 200 Collector current IC (mA)
Fig.9 Collector Current vs. Collector-emitter Voltage
50 PC (max) 40 Ta=25C
Current transfer ratio CTR (%)
30
IF=30mA 20mA
20
100
10mA
10
5mA 1mA 0 2 4 6 8 10
0 1 10 Forward current IF (mA) 100
0
Collector-emitter voltage VCE (V)
Fig.10 Relative Current Transfer Ratio vs. Ambient Temperature
150 IF=1mA VCE=5V 100
Fig.11 Collector-emitter Saturation Voltage vs. Ambient Temperature
0.20 0.18 0.16 Collector-emitter saturation voltage VCE (sat) (V) 0.14 0.12 0.10 0.08 0.06 0.04 0.02 IF=20mA IC=1mA
Relative current transfer ratio (%)
50
0 -40
-20
0
20
40
60
80
100
0.00 -40
-20
0
20
40
60
80
100
Ambient temperature Ta (C)
Ambient temperaturet Ta (C)
Fig.12 Collector Dark Current vs. Ambient Temperature
10-4 VCE=50V Collector dark current ICEO (A) 10-5
Fig.13 Response Time vs. Load Resistance
100.0 VCE=2V IC=2mA Ta=25C tf tr td ts
Response time (s) -20
10.0
10-6
10-7
1.0
10-8 10-9 -40
0
20
40
60
80
100
0.1 0.1
1 Load resistance RL (k)
10
Ambient temperature Ta (C)
PC3H2/PC3Q62 Fig.14 Test Circuit for Response Time
VCC RD Input RL Output Input Output 10% 90% Voltage gain AV (dB) 0
Fig.15 Voltage Gain vs Frequency
VCE=5V IC=2mA Ta=25C
RL=10k -10
1k
100
td tr
ts tf
-20 0.1
1
10
100
1000
Frequency Response f (kHz)
Fig.16 Collector-emitter Saturation Voltage vs. Forward Current
5 IC=0.5mA Collector-emitter saturation voltage VCE (sat) (V) 4 1mA 3mA 5mA 3 7mA Ta=25C
Fig.17 Reflow Soldering
Only one time soldering is recommended within the temperature profile shown below. 230C
200C
2
180C
1 25C 30s 0 0 3 6 9 12 15 Forward current IF (mA) 2min 1min 1.5min 1min
Application Circuits
NOTICE
qThe circuit application examples in this publication are provided to explain representative applications of SHARP devices and are not intended to guarantee any circuit design or license any intellectual property rights. SHARP takes no responsibility for any problems related to any intellectual property right of a third party resulting from the use of SHARP's devices. qContact SHARP in order to obtain the latest device specification sheets before using any SHARP device. SHARP reserves the right to make changes in the specifications, characteristics, data, materials, structure, and other contents described herein at any time without notice in order to improve design or reliability. Manufacturing locations are also subject to change without notice. qObserve the following points when using any devices in this publication. SHARP takes no responsibility for damage caused by improper use of the devices which does not meet the conditions and absolute maximum ratings to be used specified in the relevant specification sheet nor meet the following conditions: (i) The devices in this publication are designed for use in general electronic equipment designs such as: --- Personal computers --- Office automation equipment --- Telecommunication equipment [terminal] --- Test and measurement equipment --- Industrial control --- Audio visual equipment --- Consumer electronics (ii)Measures such as fail-safe function and redundant design should be taken to ensure reliability and safety when SHARP devices are used for or in connection with equipment that requires higher reliability such as: --- Transportation control and safety equipment (i.e., aircraft, trains, automobiles, etc.) --- Traffic signals --- Gas leakage sensor breakers --- Alarm equipment --- Various safety devices, etc. (iii)SHARP devices shall not be used for or in connection with equipment that requires an extremely high level of reliability and safety such as: --- Space applications --- Telecommunication equipment [trunk lines] --- Nuclear power control equipment --- Medical and other life support equipment (e.g., scuba). qContact a SHARP representative in advance when intending to use SHARP devices for any "specific" applications other than those recommended by SHARP or when it is unclear which category mentioned above controls the intended use. qIf the SHARP devices listed in this publication fall within the scope of strategic products described in the Foreign Exchange and Foreign Trade Control Law of Japan, it is necessary to obtain approval to export such SHARP devices. qThis publication is the proprietary product of SHARP and is copyrighted, with all rights reserved. Under the copyright laws, no part of this publication may be reproduced or transmitted in any form or by any means, electronic or mechanical, for any purpose, in whole or in part, without the express written permission of SHARP. Express written permission is also required before any use of this publication may be made by a third party. qContact and consult with a SHARP representative if there are any questions about the contents of this publication.
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