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| (R) STTH3R06 TURBO 2 ULTRAFAST HIGH VOLTAGE RECTIFIER Table 1: Main Product Characteristics IF(AV) VRRM IR (max) Tj VF (typ) trr (typ) FEATURES AND BENEFITS 3A 600 V 100 A 175C 1.0 V 35 ns A K Ultrafast switching Low forward voltage drop Low thermal resistance Low leakage current (platinium doping) DO-201AD STTH3R06 DESCRIPTION The STTH3R06, which is using ST Turbo 2 600V technology, is specially suited for use in switching power supplies, inverters and as a free wheeling diode. SMB STTH3R06U SMC STTH3R06S Table 2: Order Codes Part Number STTH3R06 STTH3R06RL STTH3R06U STTH3R06S Marking STTH3R06 STTH3R06 R06U R6S September 2004 REV. 2 1/9 STTH3R06 Table 3: Absolute Ratings (limiting values) Symbol Parameter VRRM Repetitive peak reverse voltage IF(RMS) IF(AV) RMS forward voltage Average forward current = 0.5 Surge non repetitive forward current Storage temperature range Maximum operating junction temperature DO-201AD SMB SMC DO-201AD SMB / SMC Tl = 80C Tl = 55C Tl = 80C tp = 10ms sinusoidal Value 600 10 3 Unit V A A IFSM Tstg Tj 55 45 -65 to + 175 175 A C C Table 4: Thermal Parameters Symbol Rth(j-l) Junction to lead Parameter DO-201AD SMB SMC Rth(j-a) Junction to ambient (see fig. 13) DO-201AD L = 10 mm L = 10 mm Maximum 20 25 20 75 C/W Unit C/W Table 5: Static Electrical Characteristics Symbol IR VF Parameter Reverse leakage current Test conditions Tj = 25C Tj = 150C Forward voltage drop Tj = 25C Tj = 150C To evaluate the conduction losses use the following equation: P = 1.03 x IF(AV) + 0.09 IF (RMS) Min. Typ Max. 3 Unit A VR = VRRM 15 IF = 3A 1.0 2 100 1.7 1.25 V Table 6: Dynamic Characteristics Symbol trr tfr VFP Parameter Reverse recovery time Forward recovery time Forward recovery voltage Tj = 25C Tj = 25C Test conditions IF = 0.5A IRR = 0.25A IR = 1A IF = 1A dIF/dt = -50 A/s VR =30V IF = 3A dIF/dt = 100 A/s VFR = 1.1 x VFmax IF = 3A dIF/dt = 100 A/s 35 100 10 ns V Min. Typ Max. Unit 30 ns 2/9 STTH3R06 Figure 1: Conduction losses versus average current P(W) 5.0 4.5 4.0 3.5 3.0 2.5 2.0 1.5 1.0 0.5 0.0 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 50 Figure 2: Forward voltage drop versus forward current IFM(A) = 0.05 = 0.1 = 0.2 = 0.5 =1 45 40 35 30 25 20 Tj=150C (typical values) Tj=25C (maximum values) Tj=150C (maximum values) T 15 10 IF(AV)(A) =tp/T tp 5 0 0.0 0.5 1.0 1.5 VFM(V) 2.0 2.5 3.0 3.5 4.0 Figure 3: Relative variation of thermal impedance junction ambient versus pulse duration (epoxy printed circuit FR4, Lleads = 10mm, SCU=1cm2) Zth(j-a)/Rth(j-a) 1.0 0.9 0.8 0.7 0.6 0.5 0.4 0.3 0.2 0.1 0.0 1.E-01 1.E+00 1.E+01 1.E+02 1.E+03 SMC SCu = 1cm2 SMB SCu = 1cm2 Single pulse Figure 4: Peak reverse recovery current versus dI F /dt (typical values) IRM(A) 13 12 11 10 9 8 7 6 5 IF=0.25 x IF(AV) IF=0.5 x IF(AV) IF=IF(AV) VR=400V Tj=125C IF=2 x IF(AV) DO-201AD Lleads = 10mm 4 3 2 tp(s) 1 0 0 50 100 150 dIF/dt(A/s) 200 250 300 350 400 450 500 Figure 5: Reverse recovery time versus dIF/dt (typical values) trr(ns) 160 150 140 130 120 110 100 90 80 70 60 50 40 30 20 10 0 0 50 100 Figure 6: Reverse recovery charges versus dIF/dt (typical values) Qrr(nC) 450 VR=400V Tj=125C IF=2 x IF(AV) VR=400V Tj=125C 400 350 300 IF=2 x IF(AV) IF=IF(AV) IF=0.5 x IF(AV) 250 200 IF=IF(AV) IF=0.5 x IF(AV) 150 100 50 dIF/dt(A/s) 0 150 200 250 300 350 400 450 500 dIF/dt(A/s) 0 50 100 150 200 250 300 350 400 450 500 3/9 STTH3R06 Figure 7: Softness factor versus dIF/dt (typical values) S factor 3.0 IF=IF(AV) VR=400V Tj=125C Figure 8: Relative variations of dynamic parameters versus junction temperature 1.0 0.9 0.8 0.7 IRM S factor 2.5 2.0 0.6 0.5 0.4 QRR 1.5 1.0 0.3 0.2 IF=IF(AV) VR=400V Reference: Tj=125C 0.5 0.1 Tj(C) 25 50 75 100 125 0.0 0 50 100 150 dIF/dt(A/s) 200 250 300 350 400 450 500 0.0 Figure 9: Transient peak forward voltage versus dIF/dt (typical values) VFP(V) 20 18 16 14 12 10 8 6 4 2 0 0 20 40 60 80 100 120 140 160 180 200 IF=IF(AV) Tj=125C Figure 10: Forward recovery time versus dIF/dt (typical values) tfr(ns) 200 180 160 140 120 100 80 60 40 IF=IF(AV) VFR=1.1 x VF max. Tj=125C dIF/dt(A/s) 20 0 0 20 40 60 dIF/dt(A/s) 80 100 120 140 160 180 200 Figure 11: Junction capacitance versus reverse voltage applied (typical values) C(pF) 100 F=1MHz VOSC=30mVRMS Tj=25C Figure 12: Thermal resistance junction to ambient versus copper surface under lead (epoxy FR4, eCU=35m) (DO-201AD) Rth(j-a)(C/W) 80 70 60 DO-201AD 50 10 40 30 20 10 VR(V) 1 1 10 100 1000 0 0 1 2 3 4 SCU(cm) 5 6 7 8 9 10 4/9 STTH3R06 Figure 13: Thermal resistance junction to ambient versus copper surface under lead (epoxy FR4, eCU=35m) (SMB / SMC) Rth(j-a)(C/W) 110 100 90 80 SMB Figure 14: Thermal resistance versus lead length Rth(C/W) 100 DO-201AD 90 80 70 60 SMC Rth(j-a) 70 60 50 40 30 20 10 0 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 50 40 Rth(j-l) 30 20 SCU(cm) 10 0 5 10 Llead(mm) 15 20 25 5/9 STTH3R06 Figure 15: SMB Package Mechanical Data DIMENSIONS E1 REF. Millimeters Min. Max. 2.45 0.20 2.20 0.41 5.60 4.60 3.95 1.60 Inches Min. 0.075 0.002 0.077 0.006 0.201 0.159 0.130 0.030 Max. 0.096 0.008 0.087 0.016 0.220 0.181 0.156 0.063 D A1 A2 b 1.90 0.05 1.95 0.15 5.10 4.05 3.30 0.75 E c A1 E E1 b C L A2 D L Figure 16: SMB Foot Print Dimensions (in millimeters) 2.3 1.52 2.75 1.52 6/9 STTH3R06 Figure 17: SMC Package Mechanical Data DIMENSIONS REF. E1 Millimeters Min. Max. 2.45 0.20 3.2 0.41 8.15 7.15 4.70 6.25 1.60 Inches Min. 0.075 0.002 0.114 0.006 0.305 0.260 0.173 0.218 0.030 Max. 0.096 0.008 0.126 0.016 0.321 0.281 0.185 0.246 0.063 A1 D 1.90 0.05 2.90 0.15 7.75 6.60 4.40 5.55 0.75 A2 b c E E A1 E1 E2 b C L A2 D L Figure 18: SMC Foot Print Dimensions (in millimeters) 3.3 2.0 4.2 2.0 7/9 STTH3R06 Figure 19: DO-201AD Package Mechanical Data DIMENSIONS B A B OC REF. Millimeters Min. Max. 9.50 25.40 5.30 1.30 1.25 Min. Inches Max. 0.374 1.000 0.209 0.051 0.049 note 1 E E note 1 OD OD A B C D E note 2 1 - The lead diameter o D is not controlled over zone E within the device NOTES 2 - The minimum axial lengthbent at whichangles is may be placed with its leads right 0.59"(15 mm) Table 7: Ordering Information Ordering type STTH3R06 STTH3R06-RL STTH3R06U STTH3R06S Marking STTH3R06 STTH3R06 3R6U R6S Package DO-201AD DO-201AD SMB SMC Weight 1.12 g 1.12 g 0.11 g 0.243 g Base qty 600 1900 2500 2500 Delivery mode Ammopack Tape & reel Tape & reel Tape & reel Epoxy meets UL94, V0 Band indicated cathode (DO-201AD) Bending method: see application note AN1471 (DO-201AD) Table 8: Revision History Date March-2003 07-Sep-2004 Revision 1 2 Description of Changes First issue SMB and SMC packages added 8/9 STTH3R06 Information furnished is believed to be accurate and reliable. However, STMicroelectronics assumes no responsibility for the consequences of use of such information nor for any infringement of patents or other rights of third parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of STMicroelectronics. Specifications mentioned in this publication are subject to change without notice. This publication supersedes and replaces all information previously supplied. STMicroelectronics products are not authorized for use as critical components in life support devices or systems without express written approval of STMicroelectronics. The ST logo is a registered trademark of STMicroelectronics. All other names are the property of their respective owners (c) 2004 STMicroelectronics - All rights reserved STMicroelectronics group of companies Australia - Belgium - Brazil - Canada - China - Czech Republic - Finland - France - Germany - Hong Kong - India - Israel - Italy - Japan Malaysia - Malta - Morocco - Singapore - Spain - Sweden - Switzerland - United Kingdom - United States of America www.st.com 9/9 |
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