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| PulseGuard (R) Suppressors Surface Mount Polymeric ESD Suppressors RoHS Pb PGB1 Series Lead-Free SOT23 ESD Suppressor Product Overview PulseGuard ESD Suppressors help protect sensitive electronic equipment against electrostatic discharge (ESD). They supplement the on-chip protection of integrated circuitry and are best suited for lowvoltage, high-speed applications where low capacitance is important. Data ports utilizing such high-speed protocols as USB 2.0, IEEE1394, HDMI, and DVI can benefit from this new technology. PulseGuard suppressors use polymer composite materials to suppress fast-rising ESD transients (as specified in IEC 61000-4-2 and MIL-STD-883E), while adding virtually no capacitance to the circuit. Features * Lead-Free * Ultra-low capacitance * Low leakage current * Fast response time * 2-lines of protection * Bi-directional * Withstands multiple ESD strikes * Standard JEDEC SOT23 outline * Compatible with pick-and-place processes * Available in 3,000 piece reels Reference Dimensions: 2.24 (.088") Reflow Solder 1.01 (.040") 1.01 (.040")* 2.29 (.090") 1.27 (.050") Sn 2.997 (.118") Typical Applications * * * * * * * HDTV Hardware Laptop/Desktop Computers Network Hardware Computer Peripherals Digital Cameras External Storage Set-Top Boxes 1.01 (.040") 1.27 (.050") 1.01 (.040") 2.032 (.080") 0.635 (.025") 2.032 (.080")* 0.51 (.020") 0.076 (.003") MIN (TYP) 0.762 (.030") 0.81 (.032") REF Note: For wave solder, increase the spacing in both the horizontal and vertical dimensions by 0.254 (.010") where denoted by an asterisk (*) Ordering Information CATALOG NUMBER PGB102ST23WR PIECES PER REEL 3,000 Equivalent Circuit 3 Design Consideration Because of the fast rise-time of the ESD transient, placement of PulseGuard suppressors is a key design consideration. To achieve optimal ESD suppression, the devices should be placed on the circuit board as close to the source of the ESD transient as possible. Install PulseGuard suppressors directly behind the connector so that they are the first board-level circuit component encountered by the ESD transient. They are connected from signal/data line to ground. 1 2 204 w w w. l i t t e l f u s e . c o m PulseGuard (R) Suppressors Surface Mount Polymeric ESD Suppressors RoHS Pb PGB1 Series Lead-Free SOT23 ESD Suppressor Capacitance vs. Frequency 70 ** Note: 1,000 fF = 1 pF Electrical Characteristics ESD Capability IEC 61000-4-2 Direct Discharge ....................................................8kV Trigger Voltage1 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 500V typical Clamping Voltage1 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 150V typical Rated Voltage. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24VDC max Capacitance2 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 0.055pF Response Time . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . <1ns 1 Capacitance (fF) IEC 61000-4-2 Air Discharge .......................................................15kV 60 50 Leakage Current3 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . <1nA ESD Pulse Withstand4 . . . . . . . . . . . . . . . . . . . . . . 1,000 pulses minimum 40 0.5 1.0 1.5 2.0 4 Frequency (GHz) PULSEGUARD(R) SUPPRESSORS + + Notes: 1. Trigger and clamping voltage measured per IEC 61000-4-2, 8kV direct discharge method. 2. Capacitance measured at 1MHZ. 3. Leakage current measured at 6VDC. 4. Pulse Withstand- some shifting in characteristics may occur when tested over multiple pulses at a very rapid rate. Carrier Tape Specifications Parts are delivered on 7" (178mm) reel, plastic carrier tape Tt Dd + + Environmental Specifications Operating Temperature: -65C to +125C. Moisture Resistance, steady state: MIL-STD-833, method 1004.7, 85% RH, 85C, 1000hrs. Ds + Thermal Shock: MIL-STD-202, Method 107G, -65C to 125C, 30 min cycle, 10 cycles. Vibration: MIL-STD-202F, Method 201A, (10 to 55 to 10Hz, 1 min. cycle, 2grs each in X-Y-Z) Tw Pd + + Ph Chemical Resistance: ASTM D-543, 4hrs @ 40C, 3 solutions (H2O, detergent solution, defluxer) Ps Pw Ct Solder leach resistance and terminal adhesion: Per EIA-576 test Physical Specifications Materials: Body: Glass Epoxy Terminations: 100% Copper/Nickel/Tin Solderability: MIL-STD-202, Method 208 (95% coverage) Soldering Parameters: Wave Solder - 260C, 10 seconds maximum. Reflow Solder - 260C, 30 seconds maximum. DESCRIPTION Ct - Cover tape thickness Dd - Drive hole diameter MEASUREMENT (MM) 0.06 1.50 4.00 1.02 3.23 4.00 2.46 0.30 8.00 Packaging Specifications 8mm Tape and Reel per EIA-RS481-1 (IEC 286, part3); 3,000 pieces per reel, add packaging suffix, WR. Ds - Drive hole spacing Pd - Pocket depth Ph - Pocket height Ps - Pocket spacing Pw - Pocket width Tt - Carrier tape thickness Tw - Carrier tape width w w w. l i t t e l f u s e . c o m 205 |
Price & Availability of PGB102ST23WR
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